JP2008177186A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device in which the heat dissipation characteristics can be enhanced and evaluated conveniently. <P>SOLUTION: The surface mounting LED (light-emitting device) 100 comprises a substrate 1 on which a nonpolar electrode layer 6 is formed, an LED element 20 secured onto the nonpolar electrode layer 6 on the substrate 1, a reflective frame 30 secured onto the substrate 1 in direct contact with the nonpolar electrode layer 6 and having the inner side face 31a for reflecting the light from the LED element 20, and a first terminal 13 and a second terminal 14 for confirming electrical connection of the nonpolar electrode layer 6 and the reflective frame 30. The first terminal 13 is connected electrically with the reflective frame 30 not through the nonpolar electrode layer 6, and the second terminal 14 is connected electrically with the nonpolar electrode layer 6 not through the reflective frame 30. The reflective frame 30 is composed of a metallic material principally comprising aluminum. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light emitting device, and more particularly to a light emitting device including a reflective frame that reflects light from a light emitting element.

2. Description of the Related Art Conventionally, a light emitting device including a reflection frame that reflects light from a light emitting element is known (see, for example, Patent Document 1). Patent Document 1 discloses a light-emitting device in which a reflective frame is made of a metal material in order to dissipate heat generated by light emission of an LED (Light Emitting Diode) element (light-emitting element) from the reflective frame. Are listed. This light-emitting device includes a substrate on which an LED element is mounted and the above-described reflection frame, and the reflection frame is fixed on the substrate via an adhesive layer.
JP 2005-229003 A

  In the light emitting device described in Patent Document 1, since the reflective frame is fixed on the substrate via the adhesive layer, the adhesive layer is interposed between the substrate and the reflective frame. For this reason, when fixing the reflective frame on the substrate, if the thickness of the adhesive layer varies, there is a disadvantage that the heat dissipation characteristics of the light emitting device change. In spite of such inconvenience, there is a problem that it is difficult to confirm the heat dissipation characteristics.

  In the light emitting device described in Patent Document 1, an adhesive layer is interposed between the substrate and the reflection frame as described above. Since such an adhesive layer is generally made of a resin material such as an epoxy resin or an acrylic resin, its thermal conductivity is low. For this reason, in order to dissipate the heat generated by the light emission of the LED element from the reflection frame body, even if the reflection frame body is made of a metal material, the thermal resistance of the adhesive layer interposed between the substrate and the reflection frame body Therefore, it is difficult to efficiently transfer heat from the LED element to the reflection frame. Thereby, there is a problem that it is difficult to efficiently dissipate heat from the LED element from the reflection frame.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to improve the heat dissipation characteristics and to easily evaluate the heat dissipation characteristics. It is to provide a possible light emitting device.

  In order to achieve the above object, a light-emitting device according to one aspect of the present invention includes a substrate on which a first electrode layer is formed, a light-emitting element fixed on the first electrode layer of the substrate, A conductive reflective frame that is fixed so as to be in direct contact with one electrode layer or indirectly through a conductive member, and whose inner peripheral surface is a reflective surface that reflects light from the light emitting element; The terminal part for confirming the electrical connection of a 1st electrode layer and a reflective frame is provided.

  In the light emitting device according to this aspect, as described above, by providing the terminal portion for confirming the electrical connection between the first electrode layer and the reflection frame, for example, the electrode probe is brought into contact with the terminal portion. Thus, it can be confirmed whether or not the first electrode layer and the reflection frame are electrically connected. Here, when the electrical connection between the reflective frame and the first electrode layer is confirmed, it can be determined that the reflective frame and the first electrode layer are in contact with each other, By measuring the resistance value, the contact area between the reflective frame and the first electrode layer can be confirmed. That is, when the contact area between the reflective frame and the first electrode layer increases, the resistance value decreases, and when the contact area between the reflective frame and the first electrode layer decreases, the resistance value increases. By measuring the relationship between the contact area and the resistance value, the contact area between the reflective frame and the first electrode layer can be obtained from the resistance value measured using the terminal portion. In addition, since the board | substrate with which a reflective frame is fixed has fixed flatness, a reflective frame and a 1st electrode are confirmed by confirming the electrical connection of a reflective frame and a 1st electrode layer. It can also be determined that the layer is in contact with a certain contact area. Here, since the heat dissipation characteristics of the light emitting device vary depending on the contact area between the reflective frame and the first electrode layer, the manufactured light emitting device is obtained by checking the contact area between the reflective frame and the first electrode layer. It is possible to determine how much heat dissipation characteristic has. On the other hand, the measurement of the electrical connection state between the first electrode layer and the reflecting frame can be performed simultaneously with a normal characteristic inspection or the like without providing any additional equipment. In addition, since the measurement time is extremely short, even if measurement is performed on the total number of manufactured light emitting devices, it is possible to suppress an increase in measurement (inspection) time. Thereby, evaluation of a heat dissipation characteristic can be performed about all the light-emitting devices manufactured, suppressing the increase in manufacturing facilities. That is, the heat dissipation characteristics of the light emitting device can be easily evaluated. Note that the evaluation of the heat dissipation characteristics of the light-emitting device can be performed in a state in which the light-emitting device is incorporated in the final product, in addition to the normal characteristic inspection.

  In one aspect, the adhesion state of the reflective frame can be determined by observing variations in the resistance value measured using the terminal portion, changes in the resistance value during measurement, and the like. That is, when the resistance value varies or the resistance value fluctuates during measurement, it can be determined that the adhesion between the reflective frame and the substrate is unstable and incomplete. For this reason, the defect detection of a light-emitting device can be performed by detecting the light-emitting device with the dispersion | variation in resistance value and the fluctuation | variation of resistance value. Further, when the electrical connection between the reflective frame and the first electrode layer is not confirmed, it can be determined that the reflective frame and the first electrode layer are not in contact with each other. Also in this case, it can be determined that the light emitting device is defective. In addition, when the adhesion between the reflective frame and the substrate is unstable or incomplete, the contact state (contact area) between the reflective frame and the first electrode layer varies, so the heat dissipation characteristics are unstable. Or the heat dissipation characteristics deteriorate over time.

  Furthermore, in one aspect, the light emitting element is fixed on the first electrode layer of the substrate, and the reflective frame is directly in contact with the first electrode layer or indirectly through the conductive member. Even if the reflective frame is fixed on the substrate by using an adhesive (adhesive layer) composed of a resin material having a low thermal conductivity by being fixed on the reflective frame and the first electrode layer, Since it is in direct contact or indirectly in contact via a conductive member, heat generated by light emission of the light emitting element can be efficiently transferred to the reflective frame via the first electrode layer. it can. For this reason, since the heat from a light emitting element can be efficiently radiated | emitted from a reflective frame, the thermal radiation characteristic of a light-emitting device can be improved. Note that by improving the heat dissipation characteristics of the light-emitting device, the temperature of the light-emitting element can be kept low, so that favorable light-emitting characteristics can be obtained.

  In the light-emitting device according to the above aspect, the first electrode layer can be configured as an electrically nonpolar electrode layer.

  In the light emitting device according to the above aspect, preferably, the terminal portion includes the first terminal portion electrically connected to the reflection frame body without the first electrode layer, and the first terminal portion without the reflection frame body. A second terminal portion electrically connected to the one electrode layer. If comprised in this way, since an electrode probe can be made to contact a 1st terminal part and a 2nd terminal part, respectively, since the conduction | electrical_connection and resistance value between terminal parts can be measured easily, it is 1st easily. The electrical connection state between the electrode layer and the reflecting frame can be confirmed. For this reason, since the contact area between the reflective frame and the first electrode layer can be easily confirmed, the heat dissipation characteristics of the manufactured light emitting device can be more easily evaluated, and light emission can be easily performed. Device failure detection can be performed.

  In the light-emitting device according to the above aspect, the reflecting frame is preferably made of a metal material. If comprised in this way, since a metal material has high heat conductivity, it can improve a heat dissipation characteristic compared with the case where a reflective frame is comprised from a resin material etc., and has electroconductivity. Therefore, the electrical connection between the reflective frame and the first electrode layer can be easily confirmed using the terminal portion.

  In the light emitting device according to the above aspect, a reflective coating that improves the reflection efficiency of light from the light emitting element can be formed on the surface of the reflective frame.

  In the light-emitting device according to the above aspect, the substrate is preferably further provided with a second electrode layer that is electrically polar and an electrode terminal that is electrically connected to the second electrode layer. The terminal is electrically connected to the reflection frame without passing through the first electrode layer. If comprised in this way, since an electrode terminal can be used as a 1st terminal part, an electrode probe was electrically connected with the electrode terminal electrically connected with the reflective frame, and the 1st electrode layer. By making contact with each of the second terminal portions, it is possible to confirm the electrical connection state between the reflective frame and the first electrode layer. For this reason, since the electrical connection state between the reflection frame and the first electrode layer can be confirmed without providing a first terminal portion that is electrically connected to the reflection frame separately, heat dissipation characteristics can be improved. The light emitting device can be reduced in size because it can be easily evaluated and the first terminal portion can be omitted.

  In the configuration in which the reflective film is formed on the surface of the reflective frame, preferably, the reflective film is an insulating film, and the surface of the reflective frame has a conductive region in which no insulating film is formed. Is provided. If comprised in this way, since an electroconductive area | region can be used as a 1st terminal part, a reflective frame body is made by contacting an electrode probe with the electroconductive area | region of a reflective frame body, and a 2nd terminal part, respectively. And an electrical connection state between the first electrode layer and the first electrode layer can be confirmed. For this reason, since the electrical connection state between the reflection frame and the first electrode layer can be confirmed without providing a first terminal portion that is electrically connected to the reflection frame separately, heat dissipation characteristics can be improved. The light emitting device can be reduced in size because it can be easily evaluated and the first terminal portion can be omitted, and the first terminal can be electrically connected to the reflecting frame body. Unlike the case where it is used instead of the part, the danger of an electrical short circuit can be avoided. In order to enable electrical connection between the reflective frame and the first electrode layer, no insulating coating is formed on the surface of the reflective frame that is in contact with the first electrode layer. In this case, in order to improve the electrical connection between the reflection frame and the first electrode layer, for example, the surface of the first electrode may be plated with gold.

  In the light emitting device according to the above aspect, the light emitting element can be a light emitting diode element.

  As described above, according to the present invention, it is possible to obtain a light emitting device that can improve heat dissipation characteristics and can easily evaluate the heat dissipation characteristics.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings. In the first to third embodiments, a case where the present invention is applied to a surface-mounted LED that is an example of a light-emitting device will be described.

(First embodiment)
FIG. 1 is an overall perspective view of a surface-mounted LED according to a first embodiment of the present invention. FIG. 2 is a plan view of the surface-mounted LED according to the first embodiment of the present invention shown in FIG. FIG. FIG. 3 is a perspective view showing a substrate and a reflective frame of the surface-mounted LED according to the first embodiment of the present invention shown in FIG. 4 to 8 are views for explaining the structure of the surface-mounted LED according to the first embodiment of the present invention shown in FIG. With reference to FIGS. 1-8, the structure of the surface-mounted LED 100 by 1st Embodiment of this invention is demonstrated.

  As shown in FIGS. 1 to 3, the surface-mounted LED 100 according to the first embodiment includes a substrate 1 (see FIG. 1) made of glass epoxy, liquid crystal polymer (Liquid Crystal Polymer: LCP), and the like on the substrate 1. A fixed light emitting diode element (LED element) 20, a reflection frame 30 fixed on the substrate 1 so as to surround the LED element 20, and a translucent member 40 filled inside the reflection frame 30. I have. The LED element 20 is an example of the “light emitting element” in the present invention.

  Moreover, the board | substrate 1 is comprised from the double-sided board | substrate with which the electrode layer was each formed on the upper surface and lower surface of the insulation base material 2. FIG. As shown in FIGS. 4 and 5, the substrate 1 has a length of about 3.5 mm in the arrow X direction when viewed in a plan view, and also in the arrow Y direction orthogonal to the arrow X direction. It is formed in a square shape having a length of about 3.5 mm. The substrate 1 has a thickness of about 0.1 mm.

  Moreover, the electrode layer formed on the upper surface of the insulating base 2 has a plurality of (three) polar electrode layers 3 having a positive polarity and a negative polarity, as shown in FIGS. A plurality of (three) polar electrode layers 4 and a nonpolar (neutral) electrode layer 6 having no polarity electrically separated through the polar electrode layers 3 and 4 and the insulating groove 5 Has been. The nonpolar electrode layer 6 is an example of the “first electrode layer” in the present invention, and the polar electrode layers 3 and 4 are examples of the “second electrode layer” in the present invention.

  Further, the polar electrode layers 3 and 4 are formed on the upper surface of the insulating base 2 and are formed in regions located inside the openings 31 of the reflection frame 30 described later, as shown in FIG. Yes. Further, as shown in FIGS. 3 and 4, the nonpolar electrode layer 6 is formed in a circular shape when viewed in plan so as to surround the polar electrode layers 3 and 4. Further, an adhesive layer forming region 2 a on which the adhesive layer 10 is formed is provided in a region on the insulating base 2 located outside the nonpolar electrode layer 6. The polar electrode layers 3 and 4 and the nonpolar electrode layer 6 are formed on the upper surface of the adhesive layer 10 and the upper surfaces of the polar electrode layers 3 and 4 when the adhesive layer 10 is formed in the adhesive layer forming region 2a. The nonpolar electrode layer 6 is formed to have a predetermined thickness so as to be flush with the upper surface.

  Further, as shown in FIG. 5, the electrode layer formed on the lower surface of the insulating base 2 is mainly composed of the electrode layers 7 and 8 used for wiring and the electrode layer 9 used mainly for heat dissipation. It is configured. Also, a plurality of electrode layers 7 and 8 used for wiring are formed so as to correspond to the plurality of polar electrode layers 3 and 4, respectively, and as shown in FIGS. 2 are respectively electrically connected to the polar electrode layers 3 and 4 through connection portions 2c (see FIG. 6) formed in the two through holes 2b. In addition, electrode terminals 7a and 8a are electrically connected to electrode layers 7 and 8 used for wiring, respectively. Further, as shown in FIG. 6, the electrode layer 9 used for heat dissipation is thermally and electrically connected to the nonpolar electrode layer 6 through connection portions 2e formed in the through holes 2d of the insulating base material 2, respectively. It is connected to the. The heat radiation electrode layer 9 is an example of the “terminal portion” and the “second terminal portion” in the present invention.

  Here, in the first embodiment, as shown in FIG. 3 and FIG. 4, the predetermined thickness of the adhesive layer formation region 2 a has substantially the same thickness as the polar electrode layers 3 and 4 and the nonpolar electrode layer 6. A first conductive layer 11 and a second conductive layer 12 are formed. The first conductive layer 11 is electrically separated from the nonpolar electrode layer 6, and the second conductive layer 12 is electrically connected to the nonpolar electrode layer 6 through a connection layer extending from the nonpolar electrode layer 6. It is connected to the.

  Moreover, in 1st Embodiment, as shown in FIG. 5, the 1st terminal part 13 and the 2nd terminal part 14 which were electrically isolate | separated from the electrode layers 7-9 are formed on the lower surface of the insulating base material 2, respectively. Has been. Specifically, as shown in FIG. 7, the first terminal portion 13 is electrically separated from the electrode layers 7 to 9 in a region on the lower surface of the insulating base material 2 corresponding to the first conductive layer 11. It is formed in a state. Moreover, the 2nd terminal part 14 is formed in the area | region on the lower surface of the insulating base material 2 corresponding to the 2nd conductive layer 12, in the state electrically separated from the electrode layers 7-9, as shown in FIG. Has been. Each of the first terminal portion 13 and the second terminal portion 14 is an example of the “terminal portion” in the present invention. Moreover, the 1st terminal part 13 is electrically connected with the 1st conductive layer 11 via the connection part 2g formed in the through-hole 2f of the insulating base material 2, as shown in FIG. Moreover, the 2nd terminal part 14 is electrically connected with the 2nd conductive layer 12 through the connection part 2i formed in the through-hole 2h of the insulating base material 2, as shown in FIG.

  The polar electrode layers 3 and 4, the nonpolar electrode layer 6, the electrode layers 7 to 9, the electrode terminals 7a and 8a, the first conductive layer 11, the second conductive layer 12, the first terminal portion 13, and the second The terminal portions 14 are each made of copper, which is a conductive material with excellent thermal conductivity.

  As shown in FIGS. 1 and 2, the three LED elements 20 are located on the upper surface of the nonpolar electrode layer 6 and in the region located inside the opening 31 of the reflection frame 30 described later. It is fixed with an adhesive 21 (see FIG. 6) or the like. The LED element 20 is arranged and fixed on the upper surface of the nonpolar electrode layer 6 between the positive polar electrode layer 3 and the negative polar electrode layer 4 at a predetermined interval. The LED elements 20 each have a function of emitting red, green, and blue light. When these LED elements 20 emit light at the same time, the colors are mixed and emitted. . In this case, only the LED element 20 that emits blue light is mounted, and the phosphor is dispersed in the translucent member 40 so that the emitted light from the surface-mounted LED 100 becomes white light. You may comprise.

  Further, the upper surface of the positive polar electrode layer 3 and the electrode portion of the LED element 20 are electrically connected via the bonding wires 22 respectively, and the upper surface of the negative polar electrode layer 3 The electrode portions of the LED elements 20 are electrically connected via bonding wires 23, respectively. For this reason, as shown in FIG. 6, by applying a voltage between the electrode terminal 7a of the electrode layer 7 and the electrode terminal 8a of the electrode layer 8, a current is supplied to the LED element 20 via the bonding wires 22 and 23. And each LED element 20 emits light at a unique wavelength. The bonding wires 22 and 23 are made of fine metal wires such as Au, Ag, and Al.

  Further, the heat generated by the light emission of the LED element 20 is radiated by the nonpolar electrode layer 6 formed on the upper surface of the insulating base 2 as shown in FIGS. 1 to 3, 5, and 6. In addition, heat is dissipated in the heat dissipating electrode layer 9 that is thermally connected to the nonpolar electrode layer 6 through the connection portion 2e formed in the through hole 2d of the insulating base 2. The heat generated by the light emission of the LED element 20 is also dissipated by the later-described reflecting frame 30 that is in direct contact with the nonpolar electrode layer 6. Further, when the electrode layer 9 is in thermal contact with the heat sink portion of the circuit board, the heat dissipation effect is further promoted. As described above, the surface-mounted LED 100 according to the first embodiment is configured to be able to efficiently dissipate the heat generated in the LED element 20, so that the light emission efficiency is reduced due to the temperature rise of the LED element 20. In addition to being suppressed, high luminance proportional to the amount of current is obtained, and the effects of improving the functionality and life of the surface-mounted LED 100 are obtained.

  The reflection frame 30 is made of a metal material mainly composed of aluminum having excellent heat dissipation characteristics, and is formed in a planar shape that is substantially the same size as the substrate 1 as shown in FIGS. Has been. Specifically, as shown in FIG. 2, the reflection frame 30 has a length of about 3.5 mm in the arrow X direction as viewed in a plan view, and is also about 3.5 mm in the arrow Y direction. It is formed in the square shape which has the length of. The reflective frame 30 has a thickness of about 0.6 mm.

  As shown in FIG. 3, an opening 31 is formed in the central portion of the reflection frame 30, and an inner side surface 31 a of the opening 31 reflects a light emitted from the LED element 20. Is configured to function as In addition, a reflective coating is formed on the surface of the reflective frame 30 including the surface of the inner side surface 31a of the opening 31 by a silver plating process, an alumite process, or the like. When the reflective coating is an insulating coating, the reflective coating is formed on the surface of the reflective frame 30 except the bottom surface. As shown in FIGS. 1 and 2, the opening 31 has an inner surface 31 a formed in a circular shape when seen in plan view in order to uniformly collect the light emitted from the LED element 20. As shown in FIG. 6, it is formed so as to expand in a tapered shape upward of the opening 31. As described above, the inner side surface 31a of the opening 31 is configured to be able to efficiently reflect the light emitted from the LED element 20 upward. The inner side surface 31a is an example of the “inner peripheral surface” and “reflective surface” in the present invention.

  In addition, as shown in FIGS. 1 and 6, the reflective frame 30 is provided via the adhesive layer 10 formed in the adhesive layer forming region 2 a so as to surround the LED element 20 by the inner surface 31 a of the opening 31. It is fixed on the substrate 1.

  Here, in the first embodiment, as shown in FIGS. 2 and 6, the reflection frame 30 has a minimum diameter of the opening 31 (a diameter of the bottom-side opening edge 31 b) smaller than that of the nonpolar electrode layer 6. By being formed, when the reflective frame 30 is placed on the substrate 1, a part of the bottom surface of the reflective frame 30 and the nonpolar electrode layer 6 are in direct contact with each other.

  In the first embodiment, as shown in FIGS. 2 and 3, the first conductive layer 11 and the second conductive layer 12 are connected to the reflection frame 30 in a state where the reflection frame 30 is fixed on the substrate 1. It is comprised so that it may contact directly with the bottom face. Thus, the 1st terminal part 13 is electrically connected with the reflective frame 30 without passing through the nonpolar electrode layer 6, and the 2nd terminal part 14 without passing through the reflective frame 30, It is electrically connected to the nonpolar electrode layer 6.

  Further, as shown in FIGS. 1 and 6, the translucent member 40 is made of a resin material such as an epoxy resin or a silicon resin, and the LED element 20 and the bonding are formed in the opening 31 of the reflective frame 30. It is provided to seal the wires 22 and 23. The translucent member 40 has a function of suppressing the LED element 20 and the bonding wires 22 and 23 from coming into contact with air or moisture by sealing the LED element 20 and the bonding wires 22 and 23. Yes.

  In the first embodiment, as described above, the LED element 20 is fixed on the nonpolar electrode layer 6 of the substrate 1 and the reflection frame 30 is fixed on the substrate 1 so as to be in direct contact with the nonpolar electrode layer 6. Thus, even if the reflective frame 30 is fixed on the substrate 1 using an adhesive (adhesive layer 10) made of a resin material having a low thermal conductivity, the reflective frame 30 and the nonpolar electrode layer 6 are used. , The heat generated by the light emission of the LED element 20 can be efficiently transferred to the reflective frame 30 via the nonpolar electrode layer 6. For this reason, since the heat from the LED element 20 can be efficiently radiated from the reflecting frame 30, the heat radiation characteristics of the surface-mounted LED 100 can be improved. In addition, since the temperature of the LED element 20 can be kept low by improving the heat dissipation characteristics of the surface-mounted LED 100, good light emission characteristics can be obtained thereby.

  Moreover, in 1st Embodiment, the 1st terminal part 13 is provided by providing the 1st terminal part 13 and the 2nd terminal part 14 for confirming the electrical connection of the nonpolar electrode layer 6 and the reflective frame 30. It is possible to confirm whether or not the nonpolar electrode layer 6 and the reflection frame 30 are electrically connected by bringing an electrode probe into contact with each of the second terminal portions 14. Here, when the electrical connection between the reflective frame 30 and the nonpolar electrode layer 6 is confirmed, it is determined that the reflective frame 30 and the nonpolar electrode layer 6 are in contact with each other. In addition, the contact area between the reflective frame 30 and the nonpolar electrode layer 6 can be confirmed by measuring the resistance value. That is, when the contact area between the reflective frame 30 and the nonpolar electrode layer 6 increases, the resistance value decreases, and when the contact area between the reflective frame 30 and the nonpolar electrode layer 6 decreases, the resistance value increases. Therefore, by measuring the relationship between the contact area and the resistance value in advance, the reflecting frame 30 and the nonpolar electrode layer 6 are determined from the resistance values measured using the first terminal portion 13 and the second terminal portion 14. The contact area can be determined. Thus, by confirming the contact area between the reflective frame 30 and the nonpolar electrode layer 6, it is possible to determine how much heat dissipation characteristics the manufactured surface-mounted LED 100 has. On the other hand, the measurement of the electrical connection state between the reflection frame 30 and the nonpolar electrode layer 6 can be performed simultaneously with a normal characteristic inspection or the like without providing a separate facility. Moreover, since the measurement time is very short, even if measurement is performed for all the manufactured surface-mounted LEDs 100, it is possible to suppress an increase in measurement (inspection) time. Thereby, evaluation of a heat dissipation characteristic can be performed about the total number of manufactured surface mount type LED100, suppressing the increase in manufacturing facilities. That is, the heat dissipation characteristics of the surface mount LED 100 can be easily evaluated.

  Moreover, in 1st Embodiment, the adhesion state of the reflective frame 30 is observed by observing the dispersion | variation in the resistance value measured using the 1st terminal part 13 and the 2nd terminal part 14, the fluctuation | variation of the resistance value under measurement, etc. Can be judged. That is, when the resistance value varies or the resistance value fluctuates during measurement, it can be determined that the adhesion between the reflective frame 30 and the substrate 1 is unstable and incomplete. For this reason, it is possible to detect a defect in the surface-mounted LED 100 by detecting the surface-mounted LED 100 having a variation in resistance value or a variation in resistance value. Further, when the electrical connection between the reflective frame 30 and the nonpolar electrode layer 6 is not confirmed, it is determined that the reflective frame 30 and the nonpolar electrode layer 6 are not in contact with each other. In this case, it can be determined that the surface-mounted LED 100 is defective.

  Moreover, in 1st Embodiment, since the metal material which has aluminum as a main component has high heat conductivity by comprising the reflective frame 30 from the metal material which has aluminum as a main component, the reflection frame 30 Compared with the case where the material is made of a resin material or the like, the heat dissipation characteristics can be improved, and since it has electrical conductivity, the first terminal portion 13 and the second terminal portion 14 are used to form a reflective frame. The electrical connection between the non-polar electrode layer 6 and the electrode 30 can be easily confirmed.

(Second Embodiment)
FIG. 9 is a plan view of the surface-mounted LED according to the second embodiment of the present invention as viewed from above, and FIG. 10 shows the substrate of the surface-mounted LED according to the second embodiment of the present invention shown in FIG. It is the top view seen from the upper side. FIG. 11 is a plan view of the surface-mounted LED substrate according to the second embodiment of the present invention shown in FIG. 9 as viewed from below, and FIG. 12 is taken along the line 700-700 in FIGS. FIG. Next, the structure of the surface-mounted LED 200 according to the second embodiment will be described with reference to FIGS.

  In the surface-mounted LED 200 according to the second embodiment, as shown in FIGS. 9 and 10, only the first conductive layer 211 is formed in the adhesive layer forming region 2 a of the substrate 201. Specifically, as shown in FIGS. 11 and 12, the first conductive layer 211 is electrically connected to the nonpolar electrode layer 6 in a region on the upper surface of the insulating base 2 corresponding to one of the electrode terminals 8a. It is formed in a separated state. Moreover, the 1st conductive layer 211 is electrically connected with one of the electrode terminals 8a via the connection part 2k formed in the through-hole 2j of the insulating base material 2, as shown in FIG. The first conductive layer 211 has substantially the same thickness as the polar electrode layers 3 and 4 and the nonpolar electrode layer 6 as in the first embodiment. As described above, the first conductive layer 211 is configured to be electrically connected to the reflection frame 30 when the reflection frame 30 is fixed on the substrate 201. The first conductive layer 211 may be electrically connected to one of the electrode terminals 7a instead of the electrode terminal 8a.

  Also, in the surface-mounted LED 200 according to the second embodiment, as shown in FIG. 11, unlike the first embodiment, the first terminal portion 13 (see FIG. 5) and the second terminal portion 14 are formed on the back surface of the substrate 201. (See FIG. 5) is not formed.

  The remaining configuration of the surface-mounted LED 200 according to the second embodiment is the same as the configuration of the surface-mounted LED 100 according to the first embodiment.

  In the second embodiment, as described above, one of the electrode terminals 8a is electrically connected to the reflection frame 30 without passing through the nonpolar electrode layer 6, thereby allowing one of the electrode terminals 8a to be Since it can be used as a terminal part (first terminal part) for confirming the electrical connection between the reflective frame 30 and the nonpolar electrode layer 6, the electrode probe is electrically connected to the reflective frame 30. Electrical connection between the reflecting frame 30 and the nonpolar electrode layer 6 by bringing the electrode terminal 8a into contact with the heat dissipation electrode layer 9 electrically connected to the nonpolar electrode layer 6 respectively. The state can be confirmed. For this reason, the electrical connection between the reflective frame 30 and the nonpolar electrode layer 6 is provided without providing the terminal portions (first terminal portion, second terminal portion) electrically connected to the reflective frame 30 separately. Since the state can be confirmed, the heat dissipation characteristics can be easily evaluated, and the surface-mounted LED 200 can be reduced in size because it is not necessary to provide the terminal portions (first terminal portion, second terminal portion). be able to.

  The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

(Third embodiment)
13 is an overall perspective view of the surface-mounted LED according to the third embodiment of the present invention. FIG. 14 is a plan view of the surface-mounted LED according to the third embodiment of the present invention shown in FIG. FIG. FIG. 15 is a plan view of the surface-mounted LED substrate according to the third embodiment of the present invention shown in FIG. 13 as viewed from above, and FIG. 16 is according to the third embodiment of the present invention shown in FIG. It is the top view which looked at the board | substrate of surface mount type LED from the lower side. Next, the structure of the surface-mounted LED 300 according to the third embodiment will be described with reference to FIGS.

  In the surface-mounted LED 300 according to the third embodiment, an insulating reflective film by anodizing is formed on the surface of the reflective frame 30, and a predetermined region on the surface of the reflective frame 30 is shown in FIG. Thus, the electroconductive area | region 32 in which the reflecting film is not formed is provided. Further, as shown in FIGS. 14 and 15, the second conductive layer 12 electrically connected to the nonpolar electrode layer 6 is formed in the adhesive layer forming region 2 a of the substrate 301. Further, as shown in FIG. 16, the second terminal portion 14 electrically connected to the second conductive layer 12 is formed on the lower surface of the insulating base 2 as shown in FIG. 16.

  Further, in the surface-mounted LED 300 according to the third embodiment, as shown in FIGS. 15 and 16, unlike the first embodiment, the first conductive layer is formed on the upper surface and the lower surface of the insulating base 2, respectively. 11 (see FIG. 4) and the first terminal portion 13 (see FIG. 5) are not formed.

  The remaining configuration of the surface-mounted LED 300 according to the third embodiment is the same as that of the surface-mounted LED 100 according to the first embodiment.

  In the third embodiment, as described above, by providing the conductive region 32 where the insulating reflective coating is not formed on a part of the surface of the reflective frame 30, the conductive region 32 is made to reflect the reflective frame. Since it can be used as a terminal part (first terminal part) for confirming the electrical connection between the body 30 and the nonpolar electrode layer 6, the electrode probe is connected to the conductive region 32 of the reflective frame 30 and the first part. The electrical connection state between the reflection frame 30 and the nonpolar electrode layer 6 can be confirmed by making contact with the two terminal portions 14 respectively. For this reason, the electrical connection state of the reflective frame 30 and the nonpolar electrode layer 6 is confirmed without providing a terminal part electrically connected to the reflective frame 30 separately from the second terminal part 14. Therefore, it is possible to easily evaluate the heat dissipation characteristics, and to reduce the size of the surface-mounted LED 300 as long as it is not necessary to provide a terminal portion other than the second terminal portion 14. Unlike the case of using the terminal 8a in place of the terminal portion by electrically connecting the terminal 8a to the reflecting frame 30, the danger of an electrical short circuit can be avoided.

  Other effects of the third embodiment are the same as the effects of the first embodiment described above.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims for patent, and includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first to third embodiments, the example in which the present invention is applied to the surface-mounted LED has been described. However, the present invention is not limited to this, and the present invention is applied to light emitting devices other than the surface-mounted LED. You may do it.

  Moreover, in the said 1st-3rd embodiment, although the example which formed the reflective film for improving the reflective efficiency of the light from an LED element on the surface of the reflective frame body was shown, this invention is not limited to this. Further, a configuration may be adopted in which a reflective coating is not formed on the surface of the reflective frame.

  Moreover, in the said 1st-3rd embodiment, although the example comprised so that a reflective frame and a nonpolar electrode layer might contact directly was shown, this invention is not restricted to this, A reflective frame and a nonpolar electrode You may comprise so that a layer may contact indirectly through electroconductive members, such as an electrically conductive paste.

  Moreover, in the said 1st-3rd embodiment, although the example which comprised the reflective frame and the plate-shaped member from the metal material which has aluminum as a main component was shown, this invention is not limited to this, a reflective frame and The plate member may be composed of pure Al, magnesium, and other metal materials. Moreover, you may comprise a reflective frame and a plate-shaped member from materials other than a metal material. Examples of materials other than metal materials include resins and ceramics. Moreover, you may coat | cover a metal material on the surface of the reflective frame body comprised from resin, ceramics, etc. Furthermore, you may comprise a reflective frame and a plate-shaped member from the material etc. which disperse | distributed the metal to resin.

  Moreover, in the said 1st-3rd embodiment, although the polar electrode layer, the nonpolar electrode layer, the conductive layer, the electrode layer, the electrode terminal, and the terminal part showed the example comprised from copper, in this invention Not only this but a polar electrode layer, a nonpolar electrode layer, an electrode layer, and a terminal part may be constituted from Fe, Al, etc. other than copper. Further, Ni, Au, Ag, Pd, and Sn plating or plating in which a plurality of these are laminated may be performed on the surfaces of the polar electrode layer, the nonpolar electrode layer, the electrode layer, and the terminal portion.

  Moreover, in the said 1st-3rd embodiment, although the example which mounted three LED elements of red, green, and blue was shown, this invention is not limited to this, 1, 2, or Four or more LED elements may be mounted.

  Moreover, in the said 1st-3rd embodiment, although the example which fixed the LED element on the nonpolar electrode layer via the adhesive agent was shown, this adhesive agent has a conductive adhesive with high thermal conductivity. Etc. are also included.

  Moreover, although the example which provided the LED element in the light-emitting device as an example of a light emitting element was shown in the said 1st-3rd embodiment, this invention is not limited to this, and light-emitting elements other than an LED element are provided in a light-emitting device. You may do it.

  Moreover, although the example which provided only the 1st terminal part and the 2nd terminal part each was shown in the said 1st Embodiment, this invention is not limited to this, A 1st terminal part and a 2nd terminal part A plurality may be provided.

  In the first embodiment, the second terminal portion electrically connected to the nonpolar electrode layer is shown. However, the present invention is not limited to this, and the second terminal portion is not provided. May be. Even in such a configuration, the reflective frame and the nonpolar electrode layer can be obtained by bringing the electrode probe into contact with the first terminal portion and the heat dissipation electrode layer electrically connected to the nonpolar electrode layer. The electrical connection can be confirmed. Further, since the second terminal portion is not provided, the surface mount type LED can be reduced in size.

  Moreover, in the said 3rd Embodiment, although the example which provided the 2nd terminal part electrically connected with the nonpolar electrode layer was shown, this invention is not limited to this, It is set as the structure which does not provide a 2nd terminal part. May be. Even when configured in this way, the electrode frame is brought into contact with the conductive region of the reflective frame and the heat dissipation electrode layer electrically connected to the nonpolar electrode layer, so that the reflective frame and nonpolar The electrical connection with the conductive electrode layer can be confirmed. Further, since the second terminal portion is not provided, the surface-mounted LED can be further downsized.

  Moreover, in the said 3rd Embodiment, although the example which formed the insulating reflective film in the surface of the reflective frame body was shown, this invention is not restricted to this, The structure which does not form a reflective film in the surface of a reflective frame body, Or you may make it the structure which forms a conductive reflective film in the surface of a reflective frame. With this configuration, the entire surface of the reflective frame can be used as the first terminal portion. Therefore, the reflective frame and the nonpolar electrode layer can be used regardless of the area of the reflective frame surface where the electrode probe is brought into contact. The electrical connection can be confirmed.

1 is an overall perspective view of a surface-mounted LED according to a first embodiment of the present invention. It is the top view which looked at the surface mount type LED by 1st Embodiment of this invention shown in FIG. 1 from the upper side. It is the perspective view which showed the board | substrate and reflection frame body of surface mount type LED by 1st Embodiment of this invention shown in FIG. It is the top view which looked at the board | substrate of the surface mount type LED by 1st Embodiment of this invention shown in FIG. 1 from the upper side. It is the top view which looked at the board | substrate of the surface mount type LED by 1st Embodiment of this invention shown in FIG. 1 from the lower side. FIG. 4 is a cross-sectional view taken along line 400-400 in FIG. 2. FIG. 6 is a cross-sectional view taken along line 500-500 in FIGS. 4 and 5. FIG. 6 is a cross-sectional view taken along line 600-600 in FIGS. 4 and 5. It is the top view which looked at the surface mount type LED by 2nd Embodiment of this invention from the upper side. It is the top view which looked at the board | substrate of the surface mount type LED by 2nd Embodiment of this invention shown in FIG. 9 from the upper side. It is the top view which looked at the board | substrate of the surface mount type LED by 2nd Embodiment of this invention shown in FIG. 9 from the lower side. FIG. 12 is a cross-sectional view taken along line 700-700 in FIGS. 10 and 11. It is the whole surface mount type LED perspective view by 3rd Embodiment of this invention. It is the top view which looked at the surface mount type LED by 3rd Embodiment of this invention shown in FIG. 13 from the upper side. It is the top view which looked at the board | substrate of the surface mount type LED by 3rd Embodiment of this invention shown in FIG. 13 from the upper side. It is the top view which looked at the board | substrate of the surface mount type LED by 3rd Embodiment of this invention shown in FIG. 13 from the lower side.

Explanation of symbols

1, 201, 301 Substrate 2 Insulating base 2a Adhesive layer forming region 3, 4 Polarized electrode layer (second electrode layer)
5 Insulating groove 6 Nonpolar electrode layer (first electrode layer)
7, 8 Electrode layer 7a, 8a Electrode terminal 9 Electrode layer (terminal portion, second terminal portion)
DESCRIPTION OF SYMBOLS 10 Adhesive layer 11, 211 1st conductive layer 12 2nd conductive layer 13 1st terminal part (terminal part)
14 Second terminal part (terminal part)
20 LED element (light emitting element)
21 Adhesive 22, 23 Bonding wire 30 Reflecting frame 31 Opening 31a Inner surface (inner peripheral surface, reflecting surface)
40 Translucent member 100, 200, 300 Surface mount type LED (light emitting device)

Claims (8)

A substrate on which a first electrode layer is formed;
A light emitting device fixed on the first electrode layer of the substrate;
Fixed on the substrate so as to be in direct contact with the first electrode layer or indirectly through a conductive member, and an inner peripheral surface is a reflective surface that reflects light from the light emitting element. A conductive reflective frame;
A light emitting device comprising: a terminal portion for confirming electrical connection between the first electrode layer and the reflective frame.   The light emitting device according to claim 1, wherein the first electrode layer is electrically nonpolar. The terminal portion is
Without passing through the first electrode layer, a first terminal portion electrically connected to the reflective frame,
3. The light-emitting device according to claim 1, further comprising a second terminal portion electrically connected to the first electrode layer without using the reflection frame. 4.   The light-emitting device according to claim 1, wherein the reflective frame is made of a metal material.   5. The light-emitting device according to claim 1, wherein a reflective film that improves a reflection efficiency of light from the light-emitting element is formed on a surface of the reflective frame. 6. The substrate is further provided with an electrically polar second electrode layer and an electrode terminal electrically connected to the second electrode layer,
6. The light-emitting device according to claim 3, wherein the electrode terminal is electrically connected to the reflective frame without passing through the first electrode layer. 7. The reflective coating is an insulating coating,
The light emitting device according to claim 5, wherein a conductive region where the insulating coating is not formed is provided on a surface of the reflection frame.   The light emitting device according to claim 1, wherein the light emitting element is a light emitting diode element.

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