JP2008147512A - Light-emitting device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device having good light-emitting characteristics by improving heat dissipation properties. <P>SOLUTION: The surface mounting type LED (light-emitting device) includes a substrate 1 having a non-polarity electrode layer 6 formed thereon, an LED element 20 fixed on the non-polarity electrode layer 6 of the substrate 1 and a reflection frame 30 fixed on the substrate 1 and having an inner side surface 31a used as a reflection surface for reflecting a light from the LED element 20. Further, a convex portion 32 directly thermally contacting the non-polarity electrode layer 6 is integrally formed on a bottom surface 30a of the reflection frame 30 by press work. The reflection frame 30 is made of a metal material principally containing aluminum. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light emitting device and a method for manufacturing the same, and more particularly to a light emitting device including a reflective frame that reflects light from a light emitting element and a method for manufacturing the same.

2. Description of the Related Art Conventionally, a light emitting device including a reflection frame that reflects light from a light emitting element is known (see, for example, Patent Document 1). Patent Document 1 discloses a light-emitting device in which a reflective frame is made of a metal material in order to dissipate heat generated by light emission of an LED (Light Emitting Diode) element (light-emitting element) from the reflective frame. Is described. In this light emitting device, the reflective frame is fixed on the substrate via an adhesive layer.
JP 2005-229003 A

  In the light emitting device described in Patent Document 1, since the reflective frame is fixed on the substrate via the adhesive layer, the adhesive layer is interposed between the substrate and the reflective frame. Such an adhesive layer is generally made of a resin material such as an epoxy resin or an acrylic resin, and therefore has a low thermal conductivity. For this reason, in order to dissipate the heat generated by the light emission of the LED element from the reflection frame body, even if the reflection frame body is made of a metal material, the thermal resistance of the adhesive layer interposed between the substrate and the reflection frame body Therefore, it is difficult to efficiently transfer heat from the LED element to the reflection frame. This makes it difficult to efficiently dissipate heat from the LED element from the reflection frame, and thus it is difficult to keep the temperature of the LED element low. As a result, there is a problem that it is difficult to obtain good light emission characteristics.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a light-emitting device having good light-emitting characteristics by improving heat dissipation characteristics. .

  Another object of the present invention is to provide a method of manufacturing a light emitting device having good light emission characteristics by improving heat dissipation characteristics.

  In order to achieve the above object, a light emitting device according to a first aspect of the present invention includes a substrate on which a nonpolar electrode layer is formed, a light emitting element mounted on the nonpolar electrode layer of the substrate, and a fixing on the substrate. And a reflection frame body whose inner peripheral surface is a reflection surface that reflects light from the light emitting element. And the convex part which heat-contacts with a nonpolar electrode layer is provided in the predetermined area | region of the bottom face of the reflective frame. In addition, the thermal contact of this invention is a thermal contact which does not interpose air.

  In the light emitting device according to the first aspect, as described above, when the reflective frame is placed on the substrate, the bottom surface of the reflective frame is provided by providing a convex portion in a predetermined region of the bottom of the reflective frame. A gap can be formed between the substrate and the region other than the region where the convex portions are provided. For this reason, when the reflective frame is fixed on the substrate, the gap is filled with an adhesive layer so that the reflective frame can be a nonpolar electrode layer even when the reflective frame is fixed on the substrate by the adhesive layer. Can be in thermal contact. In this case, since there is no adhesive layer between the convex portion of the reflective frame and the nonpolar electrode layer, an adhesive (adhesive layer) made of a resin material having low thermal conductivity is applied to the adhesive layer. Even if it is used, it is possible to suppress the inconvenience that heat from the light emitting element is not efficiently transferred to the reflecting frame due to the thermal resistance of the adhesive layer. When the reflective frame is made of a metal material having high thermal conductivity, the heat from the light emitting element can be efficiently radiated from the reflective frame, so that the heat dissipation characteristics of the light emitting device can be improved. it can. As a result, even if the light emitting element generates heat due to light emission, the temperature of the light emitting element can be kept low, so that it is possible to suppress the inconvenience that the light emitting characteristics deteriorate due to the temperature rise of the light emitting element. Can do. As a result, good light emission characteristics can be obtained.

  Further, in the first aspect, by providing a convex portion in thermal contact with the nonpolar electrode layer on the bottom surface of the reflection frame body, the heat from the light emitting element can be reduced regardless of the type of substrate used. Since heat can be transferred to the reflecting frame through the conductive electrode layer, the thickness of the light-emitting device can be reduced by using a thin substrate. Thereby, size reduction of a light-emitting device can be achieved.

  In the light emitting device according to the first aspect, preferably, the convex portion is formed integrally with the reflection frame. If configured in this way, even if the convex portion is formed on the bottom surface of the reflective frame, the increase in the number of parts can be suppressed, and the convex portion is provided separately on the bottom surface of the reflective frame. Unlike the above, it is possible to suppress an increase in the number of manufacturing steps. Moreover, by suppressing the increase in manufacturing man-hours, it is also possible to suppress a decrease in yield due to the increase in manufacturing man-hours.

  Here, even when the reflective frame is fixed on the substrate by the adhesive layer, as a method of thermally contacting the reflective frame and the nonpolar electrode layer of the substrate, the thickness of the nonpolar electrode layer is increased and the top surface of the substrate is A method may be considered in which an adhesive layer is formed in a region where the nonpolar electrode layer is not formed so that the upper surface of the adhesive layer and the upper surface of the nonpolar electrode layer are flush with each other. However, in this case, in order to increase the thickness of the nonpolar electrode layer, it is necessary to form bumps with a conductive metal plating layer or the like. There is a disadvantage that increases. At this time, in order to secure a region for forming the adhesive layer on the substrate, it is necessary to form a resist layer as a mask layer in a region for forming the adhesive layer on the substrate. Including man-hours such as removal, the man-hours for production increase. Note that in the case where an adhesive layer is formed on the resist layer without removing the resist layer, the thickness of the light emitting device increases by the thickness of the resist layer, which makes it difficult to reduce the size of the light emitting device. is there.

  In addition, when bumps are formed by a metal plating layer, it is difficult to control the height (thickness) of the bumps with high accuracy, and there is an inconvenience that the height of the bumps varies. When this variation in bump height occurs, it is difficult to ensure that the reflective frame and the nonpolar electrode layer are in thermal contact with each other, resulting in variations in product quality and a decrease in yield. Further, when a substrate having a small thickness is used in order to reduce the thickness of the light emitting device, there is a disadvantage that the yield decreases significantly as the number of manufacturing steps increases by forming bumps. As described above, when the method of increasing the thickness of the nonpolar electrode layer is used to thermally contact the reflective frame and the nonpolar electrode layer of the substrate, various disadvantages as described above occur. By forming the convex part integrally on the bottom surface of the reflective frame body, when the convex part of the reflective frame body and the nonpolar electrode layer are brought into thermal contact with each other, it is possible to avoid the above-mentioned various problems. it can. That is, by integrally forming the convex portion on the bottom surface of the reflection frame, it is possible to suppress an increase in the number of parts, an increase in manufacturing man-hours, and a decrease in yield, and also suppress variations in product quality. And the size of the light emitting device can be reduced. In addition, when a method such as press working is used to integrally form the convex portion on the bottom surface of the reflective frame body, the shape and dimensions of the convex portion of the reflective frame body can be controlled with high accuracy. In addition, the reflective frame and the nonpolar electrode layer can be reliably brought into thermal contact, and variations in product quality and a decrease in yield can be suppressed.

  In the light emitting device according to the first aspect, preferably, the reflection frame is made of a metal material. If comprised in this way, since a metal material has high heat conductivity, compared with the case where the reflective frame of a light-emitting device is comprised from a resin material etc., the light-emitting element heat-transmitted via the nonpolar electrode layer Can be easily and efficiently dissipated from the reflecting frame. For this reason, since the heat dissipation characteristics of the light-emitting device can be easily improved, even if the light-emitting element generates heat due to light emission, the temperature of the light-emitting element can be easily kept low. Accordingly, it is possible to easily suppress the disadvantage that the light emission characteristics are deteriorated due to the temperature rise of the light emitting element, so that good light emission characteristics can be easily obtained.

  In the light emitting device according to the first aspect, preferably, the convex portion of the reflection frame is in direct contact with the nonpolar electrode layer of the substrate. With this configuration, since the thermal resistance between the convex portion of the reflecting frame and the nonpolar electrode layer can be reduced, the heat generated by the light emission of the light emitting element can be more easily transferred to the nonpolar electrode. Heat can be transferred to the reflecting frame through the layer.

  A method for manufacturing a light emitting device according to a second aspect of the present invention includes a step of forming a plurality of openings having an inner peripheral surface as a reflection surface, and a step of forming a convex portion in a predetermined region of the bottom surface. A step of fixing the reflective frame on the upper surface of the substrate so that the nonpolar electrode layer of the substrate and the convex portion of the reflective frame are in thermal contact with each other, and on the nonpolar electrode layer of the substrate And a step of mounting the light emitting element in a region located inside the opening of the reflective frame. In addition, the thermal contact of this invention is a thermal contact which does not interpose air.

  In the method of manufacturing the light emitting device according to the second aspect, as described above, when the reflecting frame is manufactured, the reflecting frame is formed into a substrate by forming a convex portion in a predetermined region on the bottom surface of the reflecting frame. When placed on the upper surface of the substrate, a gap can be formed between the region other than the region where the convex portion on the bottom surface of the reflection frame is provided and the upper surface of the substrate. For this reason, when the reflective frame is fixed on the upper surface of the substrate, the gap is filled with an adhesive layer, so that the reflective frame can be made non-polar even when the reflective frame is fixed on the upper surface of the substrate by the adhesive layer. The conductive electrode layer can be brought into thermal contact. In this case, since there is no adhesive layer between the convex portion of the reflective frame and the nonpolar electrode layer, an adhesive (adhesive layer) made of a resin material having low thermal conductivity is applied to the adhesive layer. Even if it is used, it is possible to suppress the inconvenience that heat from the light emitting element is not efficiently transferred to the reflecting frame due to the thermal resistance of the adhesive layer. When the reflective frame is made of a metal material having high thermal conductivity, the heat from the light emitting element can be efficiently radiated from the reflective frame, so that the heat dissipation characteristics of the light emitting device can be improved. it can. As a result, even if the light emitting element generates heat due to light emission, the temperature of the light emitting element can be kept low, so that it is possible to suppress the inconvenience that the light emitting characteristics deteriorate due to the temperature rise of the light emitting element. Can do. As a result, a light emitting device having good light emission characteristics can be manufactured.

  In addition, in the second aspect, by providing a convex portion that is in thermal contact with the nonpolar electrode layer in a predetermined region of the bottom surface of the reflection frame, it is possible to remove any light source from the light emitting element. Since heat can be transferred to the reflecting frame through the nonpolar electrode layer, the thickness of the light emitting device can be reduced by using a thin substrate. Thereby, size reduction of a light-emitting device can be achieved.

  In the method for manufacturing the light emitting device according to the second aspect, preferably, the step of manufacturing the reflection frame includes a step of integrally forming the convex portion on the reflection frame by pressing. When configured in this way, even if the convex portion is formed on the bottom surface of the reflective frame, it is possible to suppress an increase in the number of parts, and when the convex portion is provided separately on the bottom surface of the reflective frame Unlike this, it is possible to suppress an increase in the number of manufacturing steps. Moreover, by suppressing the increase in manufacturing man-hours, it is also possible to suppress a decrease in yield due to the increase in manufacturing man-hours. In addition, by forming the convex portions integrally with the reflective frame body by pressing, the shape and dimensions of the convex portions of the reflective frame body can be controlled with high precision, so that the reflective frame body and the nonpolar electrode layer Can be reliably brought into thermal contact with each other, and variations in product quality and a decrease in yield can be suppressed.

  In the method for manufacturing a light emitting device according to the second aspect, preferably, the reflection frame is made of a metal material. If comprised in this way, since a metal material has high heat conductivity, compared with the case where the reflective frame of a light-emitting device is comprised from a resin material etc., the light-emitting element heat-transmitted via the nonpolar electrode layer Can be easily and efficiently dissipated from the reflecting frame. For this reason, since the heat dissipation characteristics of the light-emitting device can be easily improved, even if the light-emitting element generates heat due to light emission, the temperature of the light-emitting element can be easily kept low. Accordingly, it is possible to easily suppress the disadvantage that the light emission characteristics are deteriorated due to the temperature rise of the light emitting element, and thus it is possible to easily manufacture a light emitting device having good light emission characteristics. .

  In the method for manufacturing a light emitting device according to the second aspect, preferably, in the step of fixing the reflective frame, the reflective frame is mounted on the substrate so that the convex portion of the reflective frame is in direct contact with the nonpolar electrode layer of the substrate. Fixing on the upper surface of the substrate. With this configuration, since the thermal resistance between the convex portion of the reflecting frame and the nonpolar electrode layer can be reduced, the heat generated by the light emission of the light emitting element can be more easily transferred to the nonpolar electrode. Heat can be transferred to the reflecting frame through the layer.

  As described above, according to the present invention, it is possible to obtain a light emitting device having good light emission characteristics by improving heat dissipation characteristics.

  Further, according to the manufacturing method of the present invention, it is possible to manufacture a light emitting device having good light emission characteristics by improving the heat dissipation characteristics.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings. In the present embodiment, a case where the present invention is applied to a surface-mounted LED that is an example of a light-emitting device will be described.

  FIG. 1 is an overall perspective view of a surface-mounted LED according to an embodiment of the present invention. FIG. 2 is a plan view of the surface-mounted LED according to the embodiment of the present invention shown in FIG. is there. 3 is a plan view of the surface-mounted LED according to the embodiment of the present invention shown in FIG. 1 as viewed from below, and FIG. 4 is a cross-sectional view taken along the line 100-100 in FIGS. It is. 5-8 is a figure for demonstrating the structure of surface mount type LED by one Embodiment of this invention shown in FIG. First, the structure of a surface-mounted LED according to an embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1 and FIG. 2, a surface-mount LED according to an embodiment is fixed on a substrate 1 (see FIG. 1) made of glass epoxy, liquid crystal polymer (LCP), or the like. A light emitting diode element (LED element) 20, a reflection frame 30 fixed on the substrate 1 so as to surround the LED element 20, and a translucent member 40 filled inside the reflection frame 30. ing. The LED element 20 is an example of the “light emitting element” in the present invention.

  Moreover, the board | substrate 1 is comprised from the double-sided board | substrate with which the electrode layer was each formed on the upper surface and lower surface of the insulation base material 2, as shown in FIG. Further, as shown in FIG. 3, the substrate 1 has a length of about 3.5 mm in the direction of the arrow X as viewed in a plan view, and is about 3 in the direction of the arrow Y perpendicular to the direction of the arrow X. It is formed in a square shape having a length of 5 mm. The substrate 1 has a thickness of about 0.2 mm.

  Moreover, as shown in FIG. 2, the electrode layer formed on the upper surface of the insulating substrate 2 includes a plurality of (three) polar electrode layers 3 having a positive polarity, and a plurality ( 3) polar electrode layers 4, and polar electrode layers 3 and 4 and nonpolar (neutral) electrode layers 6 that are electrically separated through insulating grooves 5 and have no polarity. . Further, as shown in FIGS. 1 and 2, the polar electrode layers 3 and 4 are on the upper surface of the insulating base material 2 and in regions located inside the openings 31 of the reflection frame 30 described later, respectively. Is formed. The nonpolar electrode layer 6 is formed on a region other than the region where the polar electrode layers 3 and 4 are formed, on the upper surface of the insulating base 2. Specifically, as shown in FIGS. 1, 2, and 4, the nonpolar electrode layer 6 includes polar electrode layers 3 and 4, insulating grooves 5 around the polar electrode layers 3 and 4, and These are formed in regions other than the region where the adhesive layer 10 formed on the outer peripheral portion of the upper surface of the substrate 1 is formed.

  Also, as shown in FIG. 3, the electrode layer formed on the lower surface of the insulating base 2 is mainly composed of electrode layers 7 and 8 used for wiring and an electrode layer 9 used mainly for heat dissipation. It is configured. Also, a plurality of electrode layers 7 and 8 used for wiring are formed so as to correspond to the plurality of polar electrode layers 3 and 4, respectively, and as shown in FIGS. The polar electrode layers 3 and 4 are electrically connected to each other through a connection portion 2b (see FIG. 4) formed in the two through holes 2a. The electrode layers 7 and 8 used for wiring are electrically provided with terminal portions 7a and 8a formed on one end side (arrow X1 direction side) and the other end side (arrow X2 direction side) of the substrate 1, respectively. It is connected to the.

  In addition, the electrode layer 9 used for heat dissipation is thermally connected to the nonpolar electrode layer 6 via connection portions 2 d formed in the plurality of through holes 2 c of the insulating base 2. The polar electrode layers 3 and 4, the nonpolar electrode layer 6, the electrode layers 7 to 9, and the terminal portions 7a and 8a are made of a conductive material having excellent thermal conductivity such as copper.

  As shown in FIGS. 1 and 2, the three LED elements 20 are bonded to a region located on the upper surface of the nonpolar electrode layer 6 and inside the opening 31 of the reflection frame 30. It is fixed by an agent 21 (see FIG. 4) or the like. The LED element 20 is arranged and fixed on the upper surface of the nonpolar electrode layer 6 between the positive polar electrode layer 3 and the negative polar electrode layer 4 at a predetermined interval. The LED elements 20 each have a function of emitting red, green, and blue light. When these LED elements 20 emit light at the same time, the colors are mixed and emitted. .

  Further, the upper surface of the positive polar electrode layer 3 and the electrode portion of the LED element 20 are electrically connected via the bonding wires 22 respectively, and the upper surface of the negative polar electrode layer 3 The electrode portions of the LED elements 20 are electrically connected via bonding wires 23, respectively. For this reason, as shown in FIG. 4, by applying a voltage between the terminal portion 7a of the electrode layer 7 and the terminal portion 8a of the electrode layer 8, a current is supplied to the LED element 20 via the bonding wires 22 and 23. And each LED element 20 emits light at a unique wavelength. The bonding wires 22 and 23 are made of fine metal wires such as Au, Ag, and Al.

  In addition, as shown in FIGS. 1 to 4, the heat generated by the light emission of the LED element 20 is radiated by the nonpolar electrode layer 6 formed on the upper surface of the insulating base 2, and the heat of the insulating base 2 Heat is dissipated also in the electrode layer 9 for heat dissipation thermally connected to the nonpolar electrode layer 6 through the connection portion 2d formed in the through hole 2c. Further, the reflection frame 30 described later that is in thermal contact with the nonpolar electrode layer 6 is also configured to dissipate heat generated by light emission of the LED element 20. Further, when the electrode layer 9 is in thermal contact with the heat sink portion of the circuit board, the heat dissipation effect is further promoted. As described above, the surface-mounted LED according to the embodiment is configured to be able to efficiently dissipate the heat generated in the LED element 20, thereby suppressing a decrease in light emission efficiency due to a temperature rise of the LED element 20. In addition, high luminance proportional to the amount of current is obtained, and the effects of improving the functionality and life of the surface-mounted LED are obtained.

  Moreover, the reflection frame 30 shown in FIGS. 6 to 8 is made of a metal material mainly composed of aluminum having excellent heat dissipation characteristics, and is formed in a planar shape substantially the same size as the substrate 1. . Specifically, as shown in FIG. 7, the reflection frame 30 has a length of about 3.5 mm in the arrow X direction as viewed in a plan view, and is also about 3.5 mm in the arrow Y direction. It is formed in the square shape which has the length of. Moreover, the reflective frame 30 has a thickness t of about 0.6 mm as shown in FIG.

  As shown in FIGS. 1, 2, and 7, an opening 31 is formed at the center of the reflection frame 30, and an inner surface 31 a of the opening 31 is emitted from the LED element 20. It is comprised so that it may function as a reflective surface which reflects light. Further, the surface of the inner side surface 31a of the opening 31 is subjected to a silver plating process, an alumite process, or the like. In addition, as shown in FIGS. 1, 2, and 4, the opening 31 has a circular shape when the inner side surface 31a is viewed in plan view in order to uniformly collect the light emitted from the LED element 20. In addition to being formed, it is formed so as to expand in a tapered shape toward the upper portion of the opening 31. As described above, the inner side surface 31a of the opening 31 is configured to be able to efficiently reflect the light emitted from the LED element 20 upward. The inner side surface 31a is an example of the “inner peripheral surface” and “reflective surface” in the present invention.

  Here, in the present embodiment, as shown in FIGS. 6 and 8, a convex portion 32 having a predetermined height is formed on the bottom surface 30 a of the reflective frame 30. The convex portion 32 is integrally formed with the reflecting frame 30 by pressing in a region near the center portion of the bottom surface 30a. Moreover, the convex part 32 is formed in the ring shape so that the circumference | surroundings of the opening part 31 of the reflective frame 30 may be enclosed.

  Further, a corner portion constituted by the bottom surface 30a and the one end face 30b (surface on the arrow X1 direction side) of the reflection frame 30, and the bottom surface 30a and the other end face 30c (surface on the arrow X2 direction side) of the reflection frame body 30. A cutout portion 33 having an arcuate cross section is formed at each corner portion formed by As shown in FIGS. 4 and 5, the notch 33 is covered with an insulating member 11, and the insulating member 11 allows the one end face 30 b and the other end of the reflecting frame 30 to be cut in a manufacturing process described later. Generation of cutting burrs along the edge of the end face 30c is suppressed. Further, since the notch 33 makes it possible to secure a wide insulation distance between the terminal portions 7a and 8a of the substrate 1 and the reflection frame 30, even when a cut burr occurs in the reflection frame 30, It is possible to suppress contact between the terminal portions 7a and 8a of the substrate 1 and the cutting burr and to prevent an electrical short circuit. The notch 33 may be formed in a cross-sectional shape other than the arc shape.

  Moreover, in this embodiment, as shown in FIG.4 and FIG.5, as for the reflective frame 30, the convex part 32 and the nonpolar electrode layer 6 of the board | substrate 1 are in direct contact (direct thermal contact), The adhesive layer is placed on the substrate 1 and in a gap formed between the outer peripheral portion of the upper surface of the substrate 1 and the region other than the region where the convex portion 32 of the bottom surface 30a of the reflection frame 30 is formed. 10 (adhesive) is filled. The reflective frame 30 is fixed on the substrate 1 by the adhesive layer 10. In addition, the reflection frame 30 has the notch 33 positioned above the terminal portions 7a and 8a of the substrate 1, and the LED element 20 by the inner side surface 31a of the opening 31 as shown in FIGS. Is fixed on the substrate 1 so as to surround the.

  Moreover, the translucent member 40 is comprised from resin materials, such as an epoxy resin and a silicone resin, as shown in FIG.1, FIG.2, and FIG.4, In the opening part 31 of the reflective frame 30, The LED element 20 and the bonding wires 22 and 23 are provided to be sealed. The translucent member 40 has a function of suppressing the LED element 20 and the bonding wires 22 and 23 from coming into contact with air or moisture by sealing the LED element 20 and the bonding wires 22 and 23. Yes.

  In the present embodiment, as described above, the convex portion 32 is provided on the bottom surface 30a of the reflection frame body 30 so that the projection of the bottom surface 30a of the reflection frame body 30 is provided when the reflection frame body 30 is placed on the substrate 1. A gap can be formed between the substrate 1 and a region other than the region where the portion 32 is provided. For this reason, even when the reflective frame 30 is fixed on the substrate 1 by fixing the reflective frame 30 on the substrate 1 by filling the gap with the adhesive layer 10 (adhesive), the adhesive layer 10 fixes the reflective frame 30 on the substrate 1. The reflective frame 30 can be brought into thermal contact with the nonpolar electrode layer 6. In this case, since the adhesive layer 10 is not interposed between the convex portion 32 of the reflective frame 30 and the nonpolar electrode layer 6, an adhesive composed of a resin material having a low thermal conductivity or the like is used for the adhesive layer 10. Even if it is used, due to the thermal resistance of the adhesive layer 10, it is possible to suppress the inconvenience that the heat from the LED element 20 is not efficiently transferred to the reflecting frame 30. Thereby, since the heat from the LED element 20 can be efficiently radiated from the reflection frame 30 made of a metal material mainly composed of aluminum, the heat radiation characteristics of the surface-mounted LED can be improved. . As a result, even if the LED element 20 generates heat as a result of light emission, the temperature of the LED element 20 can be kept low, resulting in inconvenience that the light emission characteristics deteriorate due to the temperature increase of the LED element 20. It can be suppressed and good light emission characteristics can be obtained.

  Moreover, in this embodiment, by providing the convex part 32 which heat-contacts with the nonpolar electrode layer 6 in the bottom face 30a of the reflective frame 30, from what kind of board | substrate 1 is used, from LED element 20 This heat can be transferred to the reflecting frame 30 through the nonpolar electrode layer 6, and thus the thickness of the surface-mounted LED can be reduced by using the substrate 1 having a small thickness. Thereby, size reduction of surface mount type LED can be achieved.

  In the present embodiment, even if the convex portion 32 is formed on the bottom surface 30a of the reflective frame 30 by forming the convex portion 32 integrally with the bottom surface 30a of the reflective frame 30 by pressing, the number of parts Unlike the case where the convex part 32 is separately provided on the bottom surface 30a of the reflection frame 30, it is possible to suppress an increase in manufacturing man-hours. Moreover, by suppressing the increase in manufacturing man-hours, it is also possible to suppress a decrease in yield due to the increase in manufacturing man-hours.

  Here, even when the reflective frame 30 is fixed on the substrate 1 by the adhesive layer 10, the thickness of the nonpolar electrode layer 6 is set as a method of thermally contacting the reflective frame 30 and the nonpolar electrode layer 6 of the substrate 1. The adhesive layer 10 is formed in a region on the substrate 1 where the nonpolar electrode layer 6 is not formed so that the upper surface of the adhesive layer 10 and the upper surface of the nonpolar electrode layer 6 are flush with each other. A configuration method is conceivable. However, in this case, in order to increase the thickness of the nonpolar electrode layer 6, it is necessary to form bumps with a conductive metal plating layer or the like. At this time, in order to secure a region for forming the adhesive layer 10 on the substrate 1, it is necessary to form a resist layer as a mask layer in a region for forming the adhesive layer 10 on the substrate 1. Including man-hours such as the formation and removal of the resist layer, the increase in man-hours for production increases. Note that in the case where the adhesive layer 10 is formed on the resist layer without removing the resist layer, the thickness of the light emitting device increases by the thickness of the resist layer, which makes it difficult to reduce the size of the light emitting device. There is.

  In addition, when bumps are formed by a metal plating layer, it is difficult to control the height (thickness) of the bumps with high accuracy, and there is an inconvenience that the height of the bumps varies. When this variation in bump height occurs, it is difficult to ensure that the reflective frame 30 and the nonpolar electrode layer 6 are in thermal contact with each other, resulting in variations in product quality and a decrease in yield. Further, when the substrate 1 having a small thickness is used in order to reduce the thickness of the surface-mounted LED, there is a disadvantage that the yield decreases significantly as the number of manufacturing steps increases by forming bumps. . As described above, when the method of increasing the thickness of the nonpolar electrode layer 6 is used in order to bring the reflective frame 30 and the nonpolar electrode layer 6 of the substrate 1 into thermal contact with each other, there are various disadvantages as described above. On the other hand, by forming the convex portion 32 integrally on the bottom surface 30a of the reflective frame 30, the surface mount type according to an embodiment in which the convex portion 32 of the reflective frame 30 and the nonpolar electrode layer 6 are brought into thermal contact with each other. In the LED, it is possible to avoid the above-described various problems. That is, in the surface-mounted LED according to the embodiment, the convex portion 32 is integrally formed on the bottom surface 30a of the reflection frame 30, thereby suppressing an increase in the number of parts, an increase in manufacturing man-hours, and a decrease in yield. In addition, the variation in product quality can be suppressed, and the surface-mounted LED can be reduced in size. In addition, since the convex part 32 is integrally formed on the bottom surface 30a of the reflective frame 30 by pressing, the shape and dimensions of the convex part 32 of the reflective frame 30 can be controlled with high accuracy. The frame 30 and the nonpolar electrode layer 6 can be reliably brought into thermal contact, and variations in product quality and a decrease in yield can be suppressed.

  In the present embodiment, the reflective frame 30 is made of a metal material mainly composed of aluminum, and the metal material mainly composed of aluminum has high thermal conductivity. Compared with the case where the reflection frame 30 is made of a resin material or the like, the heat from the LED element 20 that has been transferred through the nonpolar electrode layer 6 can be easily and efficiently dissipated from the reflection frame 30. it can. For this reason, since the heat dissipation characteristics of the surface-mounted LED can be easily improved, even if the LED element 20 generates heat due to light emission, the temperature of the LED element 20 can be easily kept low. Thereby, it is possible to easily suppress the disadvantage that the light emission characteristics are deteriorated due to the temperature rise of the LED element 20, and thus it is possible to easily obtain good light emission characteristics.

  Moreover, in this embodiment, the convex part 32 of the reflective frame 30 is brought into direct contact with the nonpolar electrode layer 6 of the substrate 1 so that the convex part 32 of the reflective frame 30 and the nonpolar electrode layer 6 are in contact with each other. Therefore, the heat generated by the light emission of the LED element 20 can be more easily transferred to the reflecting frame 30 via the nonpolar electrode layer 6.

  9 to 19 are views for explaining a method of manufacturing the surface-mounted LED according to the embodiment shown in FIG. Next, with reference to FIG. 1, FIG. 2, FIG. 4, FIG. 6, and FIG. 9 to FIG.

  First, as shown in FIGS. 9 and 10, a plurality of openings 31 are formed by press working on a plate-like member 130 having aluminum as a main component and a thickness of about 0.6 mm. The plate-like member 130 in which the opening 31 is formed is an example of the “reflective frame” in the present invention. At this time, the opening 31 is formed in a circular shape when the inner side surface 31a is seen in a plan view, and is formed so as to expand in a tapered shape above the opening 31 as shown in FIG. Further, as shown in FIGS. 9 and 10, the openings 31 are formed in a matrix so as to be arranged in the arrow X direction and the arrow Y direction. In addition, the plate-like member 130 in which the opening 31 is formed is divided into the individual reflection frame bodies 30 by being cut along the planned cutting lines 132 in the arrow X direction and the arrow Y direction.

  Here, in this embodiment, as shown in FIG. 10 and FIG. 11, the lower surface 130 a of the plate-like member 130 (the reflecting frame 30 by cutting) is formed at the timing when the opening 31 is formed in the plate-like member 130 by pressing. Is formed on the surface of the reflection frame 30 by a pressing process. Thereby, even when forming the convex part 32 in the lower surface 130a of the plate-shaped member 130, the increase in a manufacturing man-hour is suppressed. At this time, as shown in FIG. 6, the convex portion 32 has a predetermined height and is formed in a ring shape so as to surround the periphery of the opening portion 31. In addition, in order to enlarge the contact area with the nonpolar electrode layer 6, it is preferable to form the convex part 32 so that a plane area may become as large as possible.

  As shown in FIGS. 10 and 11, the groove 131 is formed on the lower surface 130 a of the plate-like member 130 by press working at the timing of forming the opening 31 in the plate-like member 130 by press working. At this time, as shown in FIG. 9 and FIG. 10, the groove 131 is formed to have a predetermined depth wider than a later-described cutting width so as to coincide with the planned cutting line 132 in the arrow Y direction. In addition, the depth of the groove part 131 should just be the depth which does not penetrate the plate-shaped member 130. FIG.

  Subsequently, as shown in FIG. 12 and FIG. 13, after filling the insulating member 11 into the groove 131 formed on the lower surface 130 a of the plate member 130, the plate member 130 is bonded by the adhesive layer 10 (see FIG. 4). Then, it is fixed on the upper surface of the substrate 1. Specifically, when the plate-like member 130 is placed on the upper surface of the substrate 1 such that the convex portion 32 is in direct contact with the nonpolar electrode layer 6 of the substrate 1, the upper surface of the substrate 1 and the plate-like member The adhesive layer 10 is filled in a gap formed between the region other than the region where the convex portion 32 of the lower surface 130a of the 130 is formed. The adhesive layer 10 directly contacts the convex portion 32 of the plate member 130 and the nonpolar electrode layer 6 of the substrate 1, and polar electrode layers 3 and 4 formed on the substrate 1 (see FIG. 1 and FIG. 1). The plate member 130 is fixed on the upper surface of the substrate 1 so as to surround the opening 31 of the plate member 130 (reflective frame 30). When the plate member 130 is fixed on the upper surface of the substrate 1, the groove 131 of the plate member 130 is positioned above the terminal portions 7 a and 8 a formed on the back surface of the substrate 1.

  Next, as shown in FIG. 14, the three LED elements 20 are respectively fixed on the upper surface of the substrate 1 and inside the plurality of openings 31 formed in the plate-like member 130. Specifically, as shown in FIG. 2, three LED elements 20 are arranged and fixed in a predetermined region on the nonpolar electrode layer 6 via an adhesive 21 (see FIG. 4). Thereafter, as shown in FIGS. 2 and 15, the electrode portions of the LED element 20 and the polar electrode layers 3 and 4 on the substrate 1 are electrically connected by bonding wires 22 and 23, respectively.

  Next, as shown in FIG. 16, a plurality of openings 31 formed in the plate-like member 130 are filled with a light transmissive resin such as an epoxy resin or a silicone resin, and cured. Thereby, the translucent member 40 is provided in each of the plurality of openings 31 so as to seal the LED element 20 and the bonding wires 22 and 23. The translucent member 40 may be mixed with a phosphor or a diffusing agent.

  Next, as shown in FIG. 17, a dicing sticking sheet 61 is stuck on the back surface (lower surface) of the substrate 1 and fixed to the dicing apparatus with the substrate 1 facing down. Finally, by the dicing saw 60, along the planned cutting line 132 in the arrow X direction and the arrow Y direction (see FIG. 9, FIG. 10, and FIG. 12), the plate member 130 and The substrate 1 is cut and divided into individual surface-mounted LEDs. In this manner, the surface-mounted LED according to the embodiment shown in FIG. 1 is manufactured.

  The notch 33 is formed by cutting the groove 131 of the plate member 130. Since the notch 33 is covered with the insulating member 11, even when the substrate 1 and the plate-like member 130 are cut, cutting burrs are generated along the edges of the one side surface 30b and the other side surface 30c of the reflection frame 30. Can be suppressed. Further, even if a cut burr occurs, the cut notch 33 forms a wide insulation distance from the terminal portions 7a and 8a connected to the polar electrode layers 3 and 4, so the cut burr and the terminal It is possible to suppress an electrical short circuit due to the contact between the portions 7a and 8a.

  In the method for manufacturing the surface-mounted LED according to the present embodiment, when the plate member 130 is placed on the upper surface of the substrate 1 by forming the convex portion 32 on the lower surface 130a of the plate member 130 as described above. In addition, a gap can be formed between a region other than the region where the convex portion 32 of the lower surface 130 a of the plate member 130 is provided and the upper surface of the substrate 1. Therefore, when the plate member 130 is fixed on the upper surface of the substrate 1, even when the plate member 130 is fixed on the upper surface of the substrate 1 by the adhesive layer 10 by filling the gap with the adhesive layer 10. The plate member 130 can be brought into thermal contact with the nonpolar electrode layer 6. In this case, since the adhesive layer 10 is not interposed between the convex portion 32 of the plate-like member 130 and the nonpolar electrode layer 6, an adhesive composed of a resin material having a low thermal conductivity or the like is used for the adhesive layer 10. Even if it is used, it is possible to suppress the inconvenience that the heat from the LED element 20 is not efficiently transferred to the plate member 130 due to the thermal resistance of the adhesive layer 10. For this reason, by cutting the plate-like member 130, the heat from the LED element 20 can be efficiently dissipated from the reflection frame 30 when it is divided into the individual reflection frames 30, so that the surface-mounted LED It is possible to improve the heat dissipation characteristics. As a result, even if the LED element 20 generates heat due to light emission, the temperature of the LED element 20 can be kept low, resulting in a disadvantage that the light emission characteristics deteriorate due to the temperature increase of the LED element 20. Can be suppressed. As a result, it is possible to manufacture a surface-mounted LED having good light emission characteristics.

  Moreover, in this embodiment, even if the convex part 32 is formed in the lower surface 130a of the plate-shaped member 130 by forming the convex part 32 integrally by press work, it suppresses that a number of parts increases. Unlike the case where the convex portion 32 is provided separately on the lower surface 130a of the plate-like member 130, an increase in the number of manufacturing steps can be suppressed. Moreover, by suppressing the increase in manufacturing man-hours, it is also possible to suppress a decrease in yield due to the increase in manufacturing man-hours. In addition, by forming the convex portion 32 integrally with the plate-like member 130 by pressing, the shape and size of the convex portion 32 can be controlled with high accuracy, so that it is divided into individual surface mount LEDs. In this case, the reflective frame 30 and the nonpolar electrode layer 6 can be reliably brought into thermal contact with each other, and variations in product quality of surface-mounted LEDs and a decrease in yield can be suppressed.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims for patent, and includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above-described embodiment, the example in which the present invention is applied to the surface-mounted LED has been described. However, the present invention is not limited thereto, and the present invention may be applied to light emitting devices other than the surface-mounted LED. .

  Moreover, in the said embodiment, although the example which provided the convex part integrally in the bottom face of the reflective frame body by press work was shown, this invention is not restricted to this, One implementation shown to FIG. 18 and FIG. The convex part 232 provided in the bottom face 230a of the reflective frame 230 may be formed of a metal plating layer as in the reflective frame according to the modification of the embodiment. In addition, as a metal plating layer, Cu plating layer, Ni plating layer, Ag plating layer, etc. can be considered. Moreover, you may form the convex part 232 by laminating | stacking the above-mentioned metal plating layer by single layer or multiple. Moreover, you may form a convex part using members other than a metal plating layer.

  Moreover, in the said embodiment, although the example which formed the convex part provided in the bottom face of the reflective frame in the ring shape was shown, this invention does not restrict to this but forms a convex part in shapes other than a ring shape. Also good.

  Moreover, in the said embodiment, although the example which made the convex part of the reflective frame body and the nonpolar electrode layer of a board | substrate contact directly was shown, this invention is not restricted to this, Heat conductive members, such as a heat conductive sheet, etc. Therefore, the convex portion of the reflecting frame and the nonpolar electrode layer of the substrate may be indirectly in thermal contact with each other.

  Moreover, in the said embodiment, although the example which formed the convex part in the lower surface of the plate-shaped member by press work was shown at the timing which forms an opening part in a plate-shaped member by press work, this invention is not limited to this. First, the step of forming the convex portion on the lower surface of the plate-like member may be either before or after the step of forming the opening portion in the plate-like member.

  Moreover, in the said embodiment, although the example which formed the notch part in the corner | angular part of the bottom face and one end surface of a reflective frame and the corner | angular part of a bottom face and the other end surface was shown, this invention is not limited to this. First, as long as the position of the notch is above the terminal portion of the substrate, it may be formed at a position other than the above-described position. For example, you may make it form a notch in each of the corner | angular part of the bottom face and four side surfaces of a reflective frame.

  Moreover, although the example which formed the notch part in the reflective frame body was shown in the said embodiment, this invention is not restricted to this, You may make it the structure which does not form a notch part in a reflective frame body. At this time, by setting the thickness of the convex portion provided on the bottom surface of the reflection frame to a predetermined size, it is possible to obtain the same effect as when the notch is formed in the reflection frame. That is, by increasing the height of the convex portion, it is possible to ensure a wide insulation distance between the reflection frame body and the terminal portion of the substrate. In addition, the adhesive layer formed between the reflective frame and the substrate can suppress the occurrence of cutting burrs.

  Moreover, in the said embodiment, although the example which formed the convex part and the groove part in the bottom face of the plate-shaped member by press work was shown, this invention is not restricted to this, The plate-shaped member is processed by processing methods other than press work. You may make it form a convex part and a groove part in the bottom face of each. As a processing method other than press processing, for example, etching or the like can be considered.

  In the above embodiment, an example in which the planned cutting line in the arrow X direction and the planned cutting line in the arrow Y direction are orthogonal to each other is shown. However, the present invention is not limited to this, and the planned cutting in the arrow X direction is shown. The line and the planned cutting line in the arrow Y direction may be configured to intersect at a predetermined angle other than orthogonal.

  Moreover, in the said embodiment, although the example which comprised the reflective frame and the plate-shaped member from the metal material which has aluminum as a main component was shown, this invention is not restricted to this, A reflective frame and a plate-shaped member are shown. You may comprise from pure Al, magnesium, and another metal material. Moreover, you may comprise a reflective frame and a plate-shaped member from materials other than a metal material. Examples of materials other than metal materials include resins and ceramics. Moreover, you may coat | cover a metal material on the surface of the reflective frame body comprised from resin, ceramics, etc. Furthermore, you may comprise a reflective frame and a plate-shaped member from the material etc. which disperse | distributed the metal to resin.

  Moreover, in the said embodiment, although the polar electrode layer, the nonpolar electrode layer, the electrode layer, and the terminal part showed the example comprised from copper, in this invention, not only this but a polar electrode layer, non-polar The conductive electrode layer, the electrode layer, and the terminal portion may be made of Fe or Al other than copper. Further, Ni, Au, Ag, Pd, and Sn plating or plating in which a plurality of these are laminated may be performed on the surfaces of the polar electrode layer, the nonpolar electrode layer, the electrode layer, and the terminal portion.

  Moreover, in the said embodiment, although the example which mounted three LED elements of red, green, and blue was shown, this invention is not restricted to this, One, two, or four or more LED is shown. You may make it mount an element.

  Moreover, in the said embodiment, although the example which fixed the LED element on the nonpolar electrode layer via the adhesive agent was shown, this adhesive agent also contains a conductive adhesive agent etc. with high heat conductivity.

  Moreover, in the said embodiment, although the example using the reflective frame body and plate-shaped member which have a thickness of about 0.6 mm was shown, this invention is not restricted to this, The reflective frame which has thickness other than about 0.6 mm A body and a plate-like member may be used.

  Moreover, although the example which provided the LED element in the light-emitting device as an example of a light-emitting element was shown in the said embodiment, this invention is not limited to this, You may make it provide light-emitting elements other than an LED element in a light-emitting device. .

  Moreover, in the said embodiment, although the example which formed surface mount type LED in the square shape whose one side is about 3.5 mm seeing planarly was shown, this invention is not limited to this, Surface mount type LED is shown. You may form in the square shape of a magnitude | size other than about 3.5 mm on one side. Moreover, you may form surface mount type LED in shapes other than square shape seeing planarly. For example, it may be formed in a rectangular shape or the like, or may be formed in a shape other than a quadrangular shape.

  Moreover, in the said embodiment, although the example which attached the LED element after attaching the reflective frame body on the board | substrate was shown, this invention is not restricted to this, The attachment to the board | substrate of an LED element is a reflective frame body. It may be before attachment.

  Moreover, in the said embodiment, while showing the example which formed the inner surface of the opening part of the reflective frame in a circular shape, and it was formed so that it might taper up toward the upper part of an opening part, this invention shows this. Not limited to this, the opening of the reflective frame may be formed in a shape other than a circular inner surface. For example, the inner side surface of the opening of the reflection frame may be formed in a square shape. Moreover, you may form an opening part so that it may spread in a parabolic shape toward the upper direction of an opening part.

1 is an overall perspective view of a surface-mounted LED according to an embodiment of the present invention. It is the top view which looked at the surface mount type LED by one Embodiment of this invention shown in FIG. 1 from the upper side. It is the top view which looked at the surface mount type LED by one Embodiment of this invention shown in FIG. 1 from the lower side. FIG. 4 is a cross-sectional view taken along line 100-100 in FIGS. 2 and 3. It is sectional drawing which expanded and showed a part of surface mount type LED by one Embodiment of this invention shown in FIG. It is the whole perspective view which looked at the reflective frame of surface mount type LED by one Embodiment of this invention shown in FIG. 1 from the bottom face side. It is a top view of the reflective frame body of the surface mount type LED by one Embodiment of this invention shown in FIG. It is sectional drawing along the 200-200 line | wire of FIG. It is a perspective view for demonstrating the manufacturing method of the surface mount type LED by one Embodiment shown in FIG. It is a top view for demonstrating the manufacturing method of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing along the 300-300 line | wire of FIG. It is a perspective view for demonstrating the manufacturing method of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by one Embodiment shown in FIG. It is the whole perspective view which looked at the reflective frame of surface mount type LED by the modification of one Embodiment shown in FIG. 1 from the bottom face side. It is sectional drawing in alignment with line 400-400 of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Insulating base material 3, 4 Polarized electrode layer 5 Insulating groove 6 Nonpolar electrode layer 7, 8, 9 Electrode layer 7a, 8a Terminal part 10 Adhesive layer 11 Insulating member 20 LED element (light emitting element)
22, 23 Bonding wire 30 Reflective frame 30a Bottom surface 30b One side surface 30c The other side surface 31 Opening portion 31a Inner side surface (inner peripheral surface, reflection surface)
32 Convex part 33 Notch part 40 Translucent member 60 Dicing saw 130 Plate-shaped member (reflective frame)
130a Lower surface 131 Groove portion 132 Planned cutting line

Claims (8)

A substrate on which a nonpolar electrode layer is formed;
A light emitting element fixed on the nonpolar electrode layer of the substrate;
A reflective frame body fixed on the substrate and having an inner peripheral surface as a reflective surface that reflects light from the light emitting element;
The light emitting device according to claim 1, wherein a convex portion that is in thermal contact with the nonpolar electrode layer is provided in a predetermined region of the bottom surface of the reflective frame.   The light emitting device according to claim 1, wherein the convex portion is formed integrally with the reflective frame.   The light emitting device according to claim 1, wherein the reflective frame is made of a metal material.   The light-emitting device according to claim 1, wherein the convex portion of the reflective frame is in direct contact with the nonpolar electrode layer of the substrate. Producing a reflection frame including a step of forming a plurality of openings having an inner peripheral surface as a reflection surface, and a step of forming a convex portion in a predetermined region of the bottom surface;
Fixing the reflective frame on the upper surface of the substrate such that the nonpolar electrode layer of the substrate and the convex portion of the reflective frame are in thermal contact;
And a step of mounting a light emitting element in a region located on the nonpolar electrode layer of the substrate and positioned inside the opening of the reflective frame.   The method of manufacturing a light emitting device according to claim 5, wherein the step of manufacturing the reflection frame includes a step of forming the protrusions integrally with the reflection frame by pressing.   The method for manufacturing a light emitting device according to claim 5, wherein the reflection frame is made of a metal material.   The step of fixing the reflection frame includes a step of fixing the reflection frame on the upper surface of the substrate such that the convex portion of the reflection frame is in direct contact with the nonpolar electrode layer of the substrate. The manufacturing method of the light-emitting device according to claim 5, wherein

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