CN101630668B - Compound semiconductor element, packaging structure of optoelectronic element and manufacturing method of optoelectronic element - Google Patents
Compound semiconductor element, packaging structure of optoelectronic element and manufacturing method of optoelectronic element Download PDFInfo
- Publication number
- CN101630668B CN101630668B CN200810133910.1A CN200810133910A CN101630668B CN 101630668 B CN101630668 B CN 101630668B CN 200810133910 A CN200810133910 A CN 200810133910A CN 101630668 B CN101630668 B CN 101630668B
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- 230000005693 optoelectronics Effects 0.000 title claims abstract description 13
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- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 3
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- 238000005476 soldering Methods 0.000 description 2
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
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- 238000007772 electroless plating Methods 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN200810133910.1A CN101630668B (en) | 2008-07-15 | 2008-07-15 | Compound semiconductor element, packaging structure of optoelectronic element and manufacturing method of optoelectronic element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810133910.1A CN101630668B (en) | 2008-07-15 | 2008-07-15 | Compound semiconductor element, packaging structure of optoelectronic element and manufacturing method of optoelectronic element |
Publications (2)
Publication Number | Publication Date |
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CN101630668A CN101630668A (en) | 2010-01-20 |
CN101630668B true CN101630668B (en) | 2011-09-28 |
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Family Applications (1)
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CN200810133910.1A Active CN101630668B (en) | 2008-07-15 | 2008-07-15 | Compound semiconductor element, packaging structure of optoelectronic element and manufacturing method of optoelectronic element |
Country Status (1)
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CN (1) | CN101630668B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103824929A (en) * | 2014-03-24 | 2014-05-28 | 武汉和光照明科技有限公司 | Formula for fabricating transparent substrate, transparent substrate and light-emitting diode (LED) light-emitting module and lamp |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102332522A (en) * | 2010-07-15 | 2012-01-25 | 展晶科技(深圳)有限公司 | Packaging structure of light emitting diode and packaging method thereof |
CN102339925B (en) * | 2010-07-22 | 2015-11-18 | 赛恩倍吉科技顾问(深圳)有限公司 | Packaging method of light-emitting elements |
TWI449138B (en) * | 2011-01-19 | 2014-08-11 | Subtron Technology Co Ltd | Package carrier |
CN102931162A (en) * | 2011-08-10 | 2013-02-13 | 群丰科技股份有限公司 | Packaging structure and manufacturing method thereof |
CN102832321A (en) * | 2012-08-29 | 2012-12-19 | 苏州金科信汇光电科技有限公司 | Surface-mounted laser packaging structure |
WO2016074300A1 (en) | 2014-11-10 | 2016-05-19 | 李德龙 | High power vcsel laser treatment device with skin cooling function and packaging structure thereof |
CN104362510A (en) * | 2014-11-10 | 2015-02-18 | 李德龙 | VCSEL array packaging structure based on optical encapsulation process and high-power VCSEL laser device of VCSEL array packaging structure |
CN109244025A (en) * | 2017-07-10 | 2019-01-18 | 中芯国际集成电路制造(上海)有限公司 | A kind of manufacturing method and semiconductor devices of semiconductor devices |
TWI689105B (en) * | 2017-12-19 | 2020-03-21 | 優顯科技股份有限公司 | Optoelectronic semiconductor stamp and manufacturing method thereof, and optoelectronic semiconductor device |
CN111492546A (en) * | 2018-11-26 | 2020-08-04 | 深圳市大疆创新科技有限公司 | Laser diode packaging module, distance detection device and electronic equipment |
CN117119708A (en) * | 2023-09-07 | 2023-11-24 | 泗阳群鑫电子有限公司 | Method for manufacturing surface-mounted diode, capacitor and resistor by using circuit board as carrier |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008147512A (en) * | 2006-12-12 | 2008-06-26 | Sanyo Electric Co Ltd | Light-emitting device and manufacturing method thereof |
-
2008
- 2008-07-15 CN CN200810133910.1A patent/CN101630668B/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008147512A (en) * | 2006-12-12 | 2008-06-26 | Sanyo Electric Co Ltd | Light-emitting device and manufacturing method thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103824929A (en) * | 2014-03-24 | 2014-05-28 | 武汉和光照明科技有限公司 | Formula for fabricating transparent substrate, transparent substrate and light-emitting diode (LED) light-emitting module and lamp |
Also Published As
Publication number | Publication date |
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CN101630668A (en) | 2010-01-20 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: RONGCHUANG ENERGY TECHNOLOGY CO., LTD. Owner name: ZHANJING TECHNOLOGY (SHENZHEN) CO., LTD. Free format text: FORMER OWNER: ADVANCED DEVELOPMENT PHOTOELECTRIC CO., LTD. Effective date: 20101117 |
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Free format text: CORRECT: ADDRESS; FROM: HSINCHU COUNTY, TAIWAN PROVINCE, CHINA TO: NO. 2, E. RING ROAD 2, INDUSTRY ZONE 10, YOUSONG, LONGHUA SUBDISTRICT OFFICE, BAO'AN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE |
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Effective date of registration: 20101117 Address after: No. two, No. 2, East Ring Road, Pinus tabulaeformis Industrial Zone, Longhua, Baoan District, Shenzhen, Guangdong, Applicant after: Zhanjing Technology (Shenzhen) Co., Ltd. Co-applicant after: Advanced Optoelectronic Technology Inc. Address before: Hsinchu County, Taiwan, China Applicant before: Advanced Development Photoelectric Co., Ltd. |
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Effective date of registration: 20201104 Address after: No.88, Liaohe West Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee after: SU Normal University Semiconductor Materials and Equipment Research Institute (Pizhou) Co.,Ltd. Address before: No. two, No. 2, East Ring Road, Pinus tabulaeformis Industrial Zone, Longhua, Baoan District, Shenzhen, Guangdong, Patentee before: ZHANJING Technology (Shenzhen) Co.,Ltd. Patentee before: Rongchuang Energy Technology Co.,Ltd. |
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Effective date of registration: 20220512 Address after: 221300 506, block B, electronic industrial park, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee after: Xuzhou Bochuang Construction Development Group Co.,Ltd. Address before: No.88 Liaohe West Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee before: SU Normal University Semiconductor Materials and Equipment Research Institute (Pizhou) Co.,Ltd. |