CN102832321A - Surface-mounted laser packaging structure - Google Patents
Surface-mounted laser packaging structure Download PDFInfo
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- CN102832321A CN102832321A CN2012103100002A CN201210310000A CN102832321A CN 102832321 A CN102832321 A CN 102832321A CN 2012103100002 A CN2012103100002 A CN 2012103100002A CN 201210310000 A CN201210310000 A CN 201210310000A CN 102832321 A CN102832321 A CN 102832321A
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- laser
- encapsulating structure
- packaging structure
- base plate
- smd
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- Semiconductor Lasers (AREA)
Abstract
The invention discloses a surface-mounted laser packaging structure. The surface-mounted laser packaging structure is characterized in that the structure is provided with a conductive bracket; a laser chip is adhered to a bracket bottom plate with the bottom negative electrode of the conductive bracket through a heat conduction material or a metal alloy; more than two-thirds of the bottom plate is a negative bottom plate; a heat conduction carrier connected with the bottom plate is arranged at the bottom of the packaging structure; and a laser mirror is arranged on an open light inlet window of the packaging structure. The laser chip is packaged in a surface mounted form, and is low in construction cost, the conventional production technology is simplified, the production efficiency of the product is improved, a good radiation effect is achieved, the service power of the product is effectively improved, and the service life of the product is prolonged.
Description
Technical field
The present invention relates to the light fixture production field, specifically is a kind of SMD laser encapsulating structure.
Background technology
Existing wall emission laser all adopts the encapsulation of ripe title to-can; This form that is encapsulated as two pins of a kind of straight cutting; Its bottom is a slice corronil sheet base plate, and being used for derives the temperature of wall emission laser chip, and this kind encapsulating structure has used many decades; One sleeve is arranged on the base plate, and the top is provided with a laser mirror so that laser beam is more concentrated.And along with the progress of modern science and technology, more than half part has changed paster (SMD) kenel into, Gu need design one novel encapsulated that the wall emission laser is made the paster kenel.And be example with present top series paster LED, it is to be conducting bracket with copper sheet through drawing, puts into mould again to penetrate with clamping and only stay the space of ccontaining chip, reflector and electrode, so can only bear less power.
Summary of the invention
Technical purpose of the present invention provides that a kind of cost is low, the SMD laser encapsulating structure of good heat dissipation effect, simple and easy existing production technology.
Technical scheme of the present invention is:
A kind of SMD laser encapsulating structure; It is characterized in that; Be provided with conducting bracket, the laser chip sticks together on the support base plate at negative pole place, conducting bracket bottom through Heat Conduction Material or metal alloy, and said base plate is the negative pole base plate more than 2/3rds; The bottom of encapsulating structure is provided with the heat conduction carrier that is connected with said base plate, on the opening light inlet window of encapsulating structure the laser mirror is installed.
Further, be provided with the plastic insulation dividing plate between the negative pole of conducting bracket and the positive pole.
As preferably, said plastic insulation dividing plate adopts the PPA plastics.
Said laser chip is connected with the positive pole of conducting bracket through gold thread.
Said laser chip is a wall emission laser chip.
The present invention with the laser chip with paster form encapsulation, simple and easy existing production technology, it is low to improve production efficiency of products and product cost, makes product be more suitable for large-scale batch process, and also can use the automation equipment of present SMD to carry out and produce.The present invention has increased the heat radiation contact-making surface of led chip in the encapsulating structure, makes chip have better radiating effect, effectively improves the use power bracket of product, prolongs product useful life.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Embodiment
In order to illustrate technical scheme of the present invention and technical purpose, the present invention is done further introduction below in conjunction with accompanying drawing and embodiment.
Conducting bracket is processed in the copper sheet punching press, increased the area of its negative pole base plate, conducting bracket is put into mould penetrate the outside that the PPA plastic cement is processed encapsulating structure with clamping.As shown in Figure 1, laser chip 2 sticks together on the support base plate at negative pole place, conducting bracket bottom through Heat Conduction Material or metal alloy, and is connected with negative pole.Said base plate at least three/be set to the negative pole base plate more than two, to increase the area of dissipation that contacts with chip.
The left side is a positive electrode contact 12 among Fig. 1, and the right side is a negative electrode contact 11.The bottom of encapsulating structure is provided with the heat conduction that is connected with said base plate heat sink 6.Be provided with the plastic insulation dividing plate 4 of PPA between the negative pole of conducting bracket and the positive pole, the laser chip is connected with the positive pole of conducting bracket through gold thread 5.Laser mirror 3 is installed on the light inlet window of encapsulating structure upper opening again, is promptly accomplished the encapsulation of a SMD wall emission laser.
More than show and described basic principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various changes and modifications, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection range to be defined by appending claims and equivalent thereof.
Claims (5)
1. SMD laser encapsulating structure; It is characterized in that; Be provided with conducting bracket, the laser chip sticks together on the support base plate at negative pole place, conducting bracket bottom through Heat Conduction Material or metal alloy, and said base plate is the negative pole base plate more than 2/3rds; The bottom of encapsulating structure is provided with the heat conduction carrier that is connected with said base plate, on the opening light inlet window of encapsulating structure the laser mirror is installed.
2. a kind of SMD laser encapsulating structure according to claim 1 is characterized in that, is provided with the plastic insulation dividing plate between the negative pole of conducting bracket and the positive pole.
3. a kind of SMD laser encapsulating structure according to claim 2 is characterized in that,
Said plastic insulation dividing plate is the PPA plastics.
4. according to claim 1,2 or 3 described a kind of SMD laser encapsulating structures, it is characterized in that said laser chip is connected with the positive pole of conducting bracket through gold thread.
5. a kind of SMD laser encapsulating structure according to claim 4 is characterized in that said laser chip is a wall emission laser chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103100002A CN102832321A (en) | 2012-08-29 | 2012-08-29 | Surface-mounted laser packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103100002A CN102832321A (en) | 2012-08-29 | 2012-08-29 | Surface-mounted laser packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102832321A true CN102832321A (en) | 2012-12-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103100002A Pending CN102832321A (en) | 2012-08-29 | 2012-08-29 | Surface-mounted laser packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102832321A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109036168A (en) * | 2018-10-12 | 2018-12-18 | 广东德豪锐拓显示技术有限公司 | LED transparent display screen and its SMD lamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007180059A (en) * | 2005-12-26 | 2007-07-12 | Toshiba Corp | Optical semiconductor device and manufacturing method therefor |
| CN101630668A (en) * | 2008-07-15 | 2010-01-20 | 先进开发光电股份有限公司 | Compound semiconductor element, packaging structure of photoelectric element and manufacturing method thereof |
| CN102097423A (en) * | 2009-11-17 | 2011-06-15 | Lg伊诺特有限公司 | Light emitting device package and lighting system |
| CN202797068U (en) * | 2012-08-29 | 2013-03-13 | 苏州金科信汇光电科技有限公司 | Patched type laser packaging structure |
-
2012
- 2012-08-29 CN CN2012103100002A patent/CN102832321A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007180059A (en) * | 2005-12-26 | 2007-07-12 | Toshiba Corp | Optical semiconductor device and manufacturing method therefor |
| CN101630668A (en) * | 2008-07-15 | 2010-01-20 | 先进开发光电股份有限公司 | Compound semiconductor element, packaging structure of photoelectric element and manufacturing method thereof |
| CN102097423A (en) * | 2009-11-17 | 2011-06-15 | Lg伊诺特有限公司 | Light emitting device package and lighting system |
| CN202797068U (en) * | 2012-08-29 | 2013-03-13 | 苏州金科信汇光电科技有限公司 | Patched type laser packaging structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109036168A (en) * | 2018-10-12 | 2018-12-18 | 广东德豪锐拓显示技术有限公司 | LED transparent display screen and its SMD lamp |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121219 |