CN102376867B - LED heat-conducting and radiating integrated forming device - Google Patents
LED heat-conducting and radiating integrated forming device Download PDFInfo
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- CN102376867B CN102376867B CN201110248014.1A CN201110248014A CN102376867B CN 102376867 B CN102376867 B CN 102376867B CN 201110248014 A CN201110248014 A CN 201110248014A CN 102376867 B CN102376867 B CN 102376867B
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Abstract
The invention provides a LED heat-conducting and radiating integrated forming device which comprises a heat radiator and a heat conductor. In the LED heat-conducting and radiating integrated forming device, heat radiation is carried out, and heat conducting columns extend into the middle of the heat radiator, the contact area of the heat conductor and the heat radiator is increased and further heat conducting performance is improved, and the problem of poor heat radiation efficiency in the prior art is solved. In the specific application, LED chips are arranged on the upper surface of the heat radiator and the upper surface of the heat conducting plate through chip bases so that heat generated by the work of the LED chips enters the heat radiator through the upper surface of the heat radiator for heat radiation, and the heat is transmitted to a plurality of heat conducting columns contacted with the LED chips through the heat conducting plate, and then the heat is transmitted to the middle of the heat radiator through the plurality of heat conducting columns for heat radiation, thus the effect of rapidly radiating heat is realized, and the problem of poor heat radiation efficiency in the prior art is solved.
Description
Technical field
The present invention relates to a kind of heat abstractor, more specifically refer to LED heat conduction and heat radiation integrated molding device.
Background technology
Due to light-emitting diode (LED) have low power consuming, long service life, volume little, react the feature such as fast, replace conventional bulb gradually and apply in various light-emitting devices.For increasing LED range of exposures and brightness, normally be combined into a LED module by multiple LED, but along with the increase of LED quantity and the exploitation of high-capacity LED, the heat producing when LED module running is just progressively upwards soaring, if loss in time, to cause the LED lamp lost of life, and cause maintenance, use cost to increase.
The high heat producing for loss LED lamp, in LED lamp group, mostly need installing heat abstractor, maintain its normal operation to control LED working temperature, it is directly thermal source (LED chip) to be abutted on radiating appliance and dispelled the heat mostly, obviously thermal source (LED chip) is the surface that first heat is delivered to radiating appliance, because thermaltransmission mode is contact conduction, heat enters its inner process from the surface of radiating appliance comparatively slow, for high-capacity LED, radiating efficiency is obviously not enough.
Summary of the invention
Main purpose of the present invention is to provide LED heat conduction and heat radiation integrated molding device, it is by heat transfer device and the graphite silicon heat sink material of casting adopt mould integrated injection molding, utilize heating column to go deep into the medium position place to radiator, increase the contact area of heat transfer device and radiator, and then the conductive performance of raising heat, simplify production process, reduce production costs, solve the not good problem of radiating efficiency existing in current technology.
The technical solution used in the present invention is: LED heat conduction and heat radiation integrated molding device, comprises radiator and heat transfer device, wherein, this radiator has heating surface and bottom surface, wherein, this heating surface is concaved with recess certainly, and the diapire of this recess is concaved with multiple thermal conductive cavities.
This heat transfer device comprises heat-conducting plate and the many heating columns that this heat-conducting plate is outwards convexly equipped with certainly, these many heating columns and this heat-conducting plate integrally casting moulding.
This heat-conducting plate is embedded in the recess of this radiator, this heat-conducting plate has upper surface and lower surface, and the upper surface of this heat-conducting plate and the heating surface of this radiator are with being on a horizontal plane, the lower surface of this heat-conducting plate and the diapire of this recess are fixed together, so that heat passes through this heat-conducting plate to this heat sink.
Each root heating column is embedded in a thermal conductive cavity, and each root heating column all contacts with the lower surface of this heat-conducting plate, this heat-conducting plate can be delivered to heat on each the root heating column being in contact with it, the middle part that then by these many heating columns, heat is delivered to this radiator, then heat dispels the heat by this radiator.
It is by heat transfer device and the graphite silicon heat sink material of casting adopt mould integrated injection molding.
The heat-conductive characteristics such as this heat transfer device and the employing of this radiator copper, aluminium and alloy thereof preferably any one material are made.
This heat transfer device adopts pure red copper gold,platinized to be made.
This radiator is to adopt graphite silicon to be made.
The shape of the cross section of these many heating columns can be any one in circular, square, rhombus, triangle, regular hexagon.
LED chip is arranged on the upper surface of this radiator and the upper surface of this heat-conducting plate by chip pad, the heat that LED chip work is produced enters radiator by the upper surface of this radiator and dispels the heat, can also transfer heat to many heating columns that are in contact with it by heat-conducting plate, dispel the heat in the middle part that then by these many heating columns, heat is delivered to radiator.
Beneficial effect of the present invention is: the present invention includes radiator and heat transfer device, it is by heat transfer device and the graphite silicon heat sink material of casting adopt mould integrated injection molding, also utilize heating column to go deep into the medium position place to radiator, increase the contact area of heat transfer device and radiator, and then the conductive performance of raising heat, simplify procedure, reduce production costs, solve the not good problem of radiating efficiency existing in current technology.In concrete use, LED chip is arranged on the upper surface of this radiator and the upper surface of this heat-conducting plate by chip pad, the heat that LED chip work is produced enters radiator by the upper surface of this radiator and dispels the heat, can also transfer heat to many heating columns that are in contact with it by heat-conducting plate, dispel the heat in the middle part that then by these many heating columns, heat is delivered to radiator, realize the effect of heat radiation rapidly, solve the not good problem of radiating efficiency existing in current technology.
Brief description of the drawings
Fig. 1 is cross-sectional view of the present invention.
Fig. 2 is the cross-sectional view of radiator of the present invention.
Embodiment
Be preferably specific embodiment of one of the present invention as shown in Figure 1 to Figure 2, a kind of LED heat conduction and heat radiation integrated molding device, comprise radiator 10 and heat transfer device 20, wherein, this radiator 10 has heating surface 11 and bottom surface 12, wherein, this heating surface 11 is concaved with recess 111 certainly, and the diapire of this recess 111 is concaved with multiple thermal conductive cavities 112.
This heat transfer device 20 comprises heat-conducting plate 21 and the many heating columns 22 that this heat-conducting plate 21 is outwards convexly equipped with certainly, in the concrete process of manufacturing, and these many heating columns 22 and these heat-conducting plate 21 integrally casting moulding.
This heat-conducting plate 21 is embedded in the recess 111 of this radiator 10, this heat-conducting plate 21 has upper surface 211 and lower surface 212, and the upper surface 211 of this heat-conducting plate 21 is on a horizontal plane with the heating surface of this radiator 10 11 is same, these many heating columns 22 are outwards to protrude out and form from the lower surface 212 of this heat-conducting plate 21, the lower surface 212 of this heat-conducting plate 21 is fixed together with the diapire of this recess 111, so that heat transmits to this radiator 10 by this heat-conducting plate 21.
Each root heating column 22 is embedded in a thermal conductive cavity 112, and each root heating column 22 all contacts with the lower surface 212 of this heat-conducting plate 21, this heat-conducting plate 21 can be delivered to heat on each the root heating column 22 being in contact with it, the middle part that then by these many heating columns 22, heat is delivered to this radiator 10, then heat dispels the heat by this radiator 10.
Further, this heat transfer device 20 adopts pure red copper gold,platinized to be made.This radiator 10 is to adopt graphite silicon to be made.
In addition, this heat transfer device 20 can also adopt the heat-conductive characteristics such as copper, aluminium, gold preferably any one material be made.
Equally, this radiator 10 also can adopt the heat-conductive characteristics such as copper, aluminium, gold preferably any one material be made, be not limited to above-mentioned graphite silicon of giving an example.
Shape that it should be noted that the cross section of these many heating columns 22 can be any one in circular, square, rhombus, triangle, regular hexagon.
In concrete use, LED chip 30 is arranged on the heating surface 11 of this radiator 10 and the upper surface 211 of this heat-conducting plate 21 by chip pad 31, the heat that LED chip 30 work are produced enters radiator 10 by the heating surface 11 of this radiator 10 and dispels the heat, can also transfer heat to the many heating columns 22 that are in contact with it by heat-conducting plate 21, dispel the heat in the middle part that then by these many heating columns 22, heat is delivered to radiator 10.
It is worth mentioning that, the power of this LED chip 30 is that 1W is to 200W.
Also it should be noted that, the heat transfer device 20 of this graphite silicon heat sink material 10 and casting adopts mould integrated injection molding.
Embodiments of the invention and accompanying drawing are just in order to show design concept of the present invention, and protection scope of the present invention should not be confined to this embodiment.
Can find out that by narration above purpose of design of the present invention can effectively implement.The part of embodiment has been shown object of the present invention and has been implemented function and structure theme, and comprised other the replacement that is equal to.
Therefore, right of the present invention forms the equivalence enforcement that comprises other, and concrete right scope is with reference to claim.
Claims (5)
1. a LED heat conduction and heat radiation integrated molding device, is characterized in that: comprise radiator and heat transfer device, wherein, this radiator has heating surface and bottom surface, wherein, this heating surface is concaved with recess certainly, and the diapire of this recess is concaved with multiple thermal conductive cavities;
This heat transfer device comprises heat-conducting plate and the many heating columns that this heat-conducting plate is outwards convexly equipped with certainly, these many heating columns and this heat-conducting plate integrally casting moulding;
This heat-conducting plate is embedded in the recess of this radiator, this heat-conducting plate has upper surface and lower surface, and the upper surface of this heat-conducting plate and the heating surface of this radiator are with being on a horizontal plane, the lower surface of this heat-conducting plate and the diapire of this recess are fixed together, so that heat passes through this heat-conducting plate to this heat sink;
Each root heating column is embedded in a thermal conductive cavity, and each root heating column all contacts with the lower surface of this heat-conducting plate, this heat-conducting plate can be delivered to heat on each the root heating column being in contact with it, the middle part that then by these many heating columns, heat is delivered to this radiator, then heat dispels the heat by this radiator;
This radiator is to adopt graphite silicon to be made;
By heat transfer device and the graphite silicon heat sink material of casting adopt mould integrated injection molding.
2. a kind of LED heat conduction and heat radiation integrated molding device as claimed in claim 1, is characterized in that, this heat transfer device adopts pure red copper gold,platinized to be made.
3. a kind of LED heat conduction and heat radiation integrated molding device as claimed in claim 1, is characterized in that, the shape of the cross section of these many heating columns can be any one in circular, square, rhombus, triangle, regular hexagon.
4. a kind of LED heat conduction and heat radiation integrated molding device as claimed in claim 1, it is characterized in that, LED chip is arranged on the upper surface of this radiator and the upper surface of this heat-conducting plate by chip pad, the heat that LED chip work is produced enters radiator by the upper surface of this radiator and dispels the heat, can also transfer heat to many heating columns that are in contact with it by heat-conducting plate, dispel the heat in the middle part that then by these many heating columns, heat is delivered to radiator.
5. a kind of LED heat conduction and heat radiation integrated molding device as claimed in claim 4, is characterized in that, the power of this LED chip is that 1W is to 200W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201110248014.1A CN102376867B (en) | 2011-08-26 | 2011-08-26 | LED heat-conducting and radiating integrated forming device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110248014.1A CN102376867B (en) | 2011-08-26 | 2011-08-26 | LED heat-conducting and radiating integrated forming device |
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| CN102376867A CN102376867A (en) | 2012-03-14 |
| CN102376867B true CN102376867B (en) | 2014-06-25 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102628569B (en) * | 2012-03-28 | 2015-11-18 | 潍坊歌尔光电有限公司 | Straight-down negative LED bay light |
| CN107450692B (en) * | 2017-07-18 | 2019-07-05 | 陕西理工大学 | A kind of radiating structure of computer |
| CN109346448B (en) * | 2018-09-30 | 2020-06-30 | 西安微电子技术研究所 | Graphene composite cold plate and preparation method thereof |
| CN110430717A (en) * | 2019-06-30 | 2019-11-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The preparation method of highly reliable heterogeneous heat dissipation cold plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201652038U (en) * | 2010-04-03 | 2010-11-24 | 黄海斌 | Large-power LED project lamp |
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| KR20110061698A (en) * | 2009-12-02 | 2011-06-10 | (주)비스로 | A radiatior heighten efficiency for conducting heat for l.e.d device |
| CN202303268U (en) * | 2011-08-26 | 2012-07-04 | 珠海市远康企业有限公司 | Moulding device with integrated heat conduction and heat radiation for LED (light-emitting diode) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201652038U (en) * | 2010-04-03 | 2010-11-24 | 黄海斌 | Large-power LED project lamp |
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Effective date of registration: 20201113 Address after: 226000 No.20 Fuxing Road, Yuelai Town, Haimen City, Nantong City, Jiangsu Province Patentee after: NANTONG YOUYUAN ART PATTERN DESIGN Co.,Ltd. Address before: Xiangzhou District 519000 of Guangdong province Zhuhai City Huayu Road No. 611613 Patentee before: ZHUHAI YUANKANG ENTERPRISE Co.,Ltd. |
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