CN102376867A - LED heat-conducting and radiating integrated forming device - Google Patents
LED heat-conducting and radiating integrated forming device Download PDFInfo
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- CN102376867A CN102376867A CN2011102480141A CN201110248014A CN102376867A CN 102376867 A CN102376867 A CN 102376867A CN 2011102480141 A CN2011102480141 A CN 2011102480141A CN 201110248014 A CN201110248014 A CN 201110248014A CN 102376867 A CN102376867 A CN 102376867A
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Abstract
The invention provides a LED heat-conducting and radiating integrated forming device which comprises a heat radiator and a heat conductor. In the LED heat-conducting and radiating integrated forming device, heat radiation is carried out, and heat conducting columns extend into the middle of the heat radiator, the contact area of the heat conductor and the heat radiator is increased and further heat conducting performance is improved, and the problem of poor heat radiation efficiency in the prior art is solved. In the specific application, LED chips are arranged on the upper surface of the heat radiator and the upper surface of the heat conducting plate through chip bases so that heat generated by the work of the LED chips enters the heat radiator through the upper surface of the heat radiator for heat radiation, and the heat is transmitted to a plurality of heat conducting columns contacted with the LED chips through the heat conducting plate, and then the heat is transmitted to the middle of the heat radiator through the plurality of heat conducting columns for heat radiation, thus the effect of rapidly radiating heat is realized, and the problem of poor heat radiation efficiency in the prior art is solved.
Description
Technical field
The present invention relates to a kind of heat abstractor, more specifically be meant LED heat conduction and heat radiation integrated molding device.
Background technology
Because characteristics such as light-emitting diode (LED) have low power consuming, long service life, volume is little, reaction is fast, replace conventional bulb gradually and use in the various light-emitting devices.For increasing LED range of exposures and brightness; Normally be combined into a led module by a plurality of LED; But along with the increase of LED quantity and the exploitation of high-capacity LED, the heat that is produced during the led module running is just progressively upwards soaring, if loss in time; To cause the LED lamp lost of life, and cause maintenance, use cost to increase.
High heat for loss LED lamp is produced needs the installing heat abstractor mostly on the LED lamp group, keep its normal operation with control LED working temperature; It is directly thermal source (led chip) to be abutted on the radiating appliance to dispel the heat mostly; Obviously thermal source (led chip) is the surface of at first heat transferred being arrived radiating appliance, because thermaltransmission mode is the contact conduction, heat is comparatively slow from its inner process of the surface of radiating appliance entering; For high-capacity LED, radiating efficiency is obviously not enough.
Summary of the invention
Main purpose of the present invention is to provide LED heat conduction and heat radiation integrated molding device; It is the heat transfer device and the graphite silicon heat sink material employing mould integrated injection molding of casting, utilizes heating column deeply to the medium position place of radiator, increases the contact area of heat transfer device and radiator; And then the conductive performance of raising heat; Simplify production process, reduce production costs, solve the not good problem of radiating efficiency that exists in the present technology.
The technical scheme that the present invention adopts is: LED heat conduction and heat radiation integrated molding device comprises radiator and heat transfer device, wherein; This radiator has heating surface and bottom surface; Wherein, this heating surface is concaved with recess certainly, and the diapire of this recess is concaved with a plurality of thermal conductive cavities.
This heat transfer device comprises heat-conducting plate and many heating columns outwards being convexly equipped with of this heat-conducting plate certainly, these many heating columns and this heat-conducting plate integrally casting moulding.
This heat-conducting plate is embedded in the recess of this radiator; This heat-conducting plate has upper surface and lower surface; And the upper surface of this heat-conducting plate and the heating surface of this radiator are with being on the horizontal plane; The lower surface of this heat-conducting plate and the diapire of this recess are fixed together, so that heat passes through this heat-conducting plate to this heat sink.
Each root heating column is embedded in a thermal conductive cavity; And each root heating column all contacts with the lower surface of this heat-conducting plate; Make this heat-conducting plate can be to each the root heating column that is in contact with it with heat transferred; Then pass through these many heating columns with the middle part of heat transferred to this radiator, then heat dispels the heat through this radiator.
The heat transfer device and the graphite silicon heat sink material of casting adopt the mould integrated injection molding for they.
This heat transfer device and this radiator adopt any one preferable material of heat-conductive characteristic such as copper, aluminium and alloy thereof to form.
This heat transfer device adopts pure red copper to cross platinum or silvery forms.
This radiator is to adopt graphite silicon to be made.
The shape of the cross section of these many heating columns can be in circular, square, rhombus, triangle, positive six distortion any one.
Led chip is arranged on the upper surface of this radiator and the upper surface of this heat-conducting plate through chip pad; Making heat that led chip work the produces upper surface through this radiator get into radiator dispels the heat; The many heating columns that can also heat transferred be in contact with it through heat-conducting plate then dispel the heat heat transferred through these many heating columns to the middle part of radiator.
Beneficial effect of the present invention is: the present invention includes radiator and heat transfer device; It is the heat transfer device and the graphite silicon heat sink material employing mould integrated injection molding of casting, also utilizes heating column deeply to the medium position place of radiator, increases the contact area of heat transfer device and radiator; And then the conductive performance of raising heat; Simplify procedure, reduce production costs, solve the not good problem of radiating efficiency that exists in the present technology.In concrete the use; Led chip is arranged on the upper surface of this radiator and the upper surface of this heat-conducting plate through chip pad; Make heat that led chip work the produces upper surface through this radiator get into radiator and dispel the heat, the many heating columns that can also heat transferred be in contact with it through heat-conducting plate then dispel the heat heat transferred through these many heating columns to the middle part of radiator; Realize the effect of heat radiation rapidly, solve the not good problem of radiating efficiency that exists in the present technology.
Description of drawings
Fig. 1 is a cross-sectional view of the present invention.
Fig. 2 is the cross-sectional view of radiator of the present invention.
Embodiment
Extremely shown in Figure 2 like Fig. 1 is a kind of preferable practical implementation example of the present invention; A kind of LED heat conduction and heat radiation integrated molding device comprises radiator 10 and heat transfer device 20, wherein; This radiator 10 has heating surface 11 and bottom surface 12; Wherein, this heating surface 11 is concaved with recess 111 certainly, and the diapire of this recess 111 is concaved with a plurality of thermal conductive cavities 112.
This heat transfer device 20 comprises heat-conducting plate 21 and the many heating columns 22 that outwards are convexly equipped with of this heat-conducting plate 21 certainly, in the concrete process of making, and these many heating columns 22 and these heat-conducting plate 21 integrally casting moulding.
This heat-conducting plate 21 is embedded in the recess 111 of this radiator 10; This heat-conducting plate 21 has upper surface 211 and lower surface 212; And the upper surface 211 of this heat-conducting plate 21 is on the horizontal plane together with the heating surface of this radiator 10 11; These many heating columns 22 are that the lower surface 212 from this heat-conducting plate 21 outwards protrudes out and forms, and the lower surface 212 of this heat-conducting plate 21 is fixed together with the diapire of this recess 111, so that heat transmits to this radiator 10 through this heat-conducting plate 21.
Each root heating column 22 is embedded in a thermal conductive cavity 112; And each root heating column 22 all contacts with the lower surface 212 of this heat-conducting plate 21; Make this heat-conducting plate 21 can be to each the root heating column 22 that is in contact with it with heat transferred; Then pass through these many heating columns 22 with the middle part of heat transferred to this radiator 10, then heat dispels the heat through this radiator 10.
Further, this heat transfer device 20 adopts pure red copper to cross platinum or silvery forms.This radiator 10 is to adopt graphite silicon to be made.
In addition, this heat transfer device 20 can also adopt any one preferable material of heat-conductive characteristic such as copper, aluminium, gold to form.
Equally, this radiator 10 also can adopt any one preferable material of heat-conductive characteristic such as copper, aluminium, gold to form, and is not limited to above-mentioned graphite silicon of giving an example.
Shape that it should be noted that the cross section of these many heating columns 22 can be in circular, square, rhombus, triangle, positive six distortion any one.
In concrete the use; Led chip 30 is arranged on the heating surface 11 of this radiator 10 and the upper surface 211 of this heat-conducting plate 21 by chip pad 31; Making heat that led chip 30 work the produces heating surface 11 through this radiator 10 get into radiators 10 dispels the heat; The many heating columns 22 that can also heat transferred be in contact with it through heat-conducting plate 21 then dispel the heat heat transferred through these many heating columns 22 to the middle part of radiator 10.
What deserves to be mentioned is that the power of this led chip 30 is that 1W is to 200W.
Also need to prove, this graphite silicon heat sink material 10 and the heat transfer device 20 of casting adopt the mould integrated injection moldings.
Embodiments of the invention and accompanying drawing are just in order to show design concept of the present invention, and protection scope of the present invention should not be confined to this embodiment.
Can find out that through top narration purpose of design of the present invention can effectively implement.The part of embodiment has been showed the object of the invention and has been implemented function and structural themes, and comprised other the replacement that is equal to.
Therefore, right of the present invention constitutes the equivalence that comprises other to be implemented, and the concrete right scope is with reference to claim.
Claims (8)
1. a LED heat conduction and heat radiation integrated molding device is characterized in that: comprise radiator and heat transfer device, wherein; This radiator has heating surface and bottom surface; Wherein, this heating surface is concaved with recess certainly, and the diapire of this recess is concaved with a plurality of thermal conductive cavities;
This heat transfer device comprises heat-conducting plate and many heating columns outwards being convexly equipped with of this heat-conducting plate certainly, these many heating columns and this heat-conducting plate integrally casting moulding;
This heat-conducting plate is embedded in the recess of this radiator; This heat-conducting plate has upper surface and lower surface; And the upper surface of this heat-conducting plate and the heating surface of this radiator are with being on the horizontal plane; The lower surface of this heat-conducting plate and the diapire of this recess are fixed together, so that heat passes through this heat-conducting plate to this heat sink;
Each root heating column is embedded in a thermal conductive cavity; And each root heating column all contacts with the lower surface of this heat-conducting plate; Make this heat-conducting plate can be to each the root heating column that is in contact with it with heat transferred; Then pass through these many heating columns with the middle part of heat transferred to this radiator, then heat dispels the heat through this radiator.
2. a kind of LED heat conduction and heat radiation integrated molding device as claimed in claim 1 is characterized in that, any one material forms in this heat transfer device and the employing of this radiator copper, aluminium and the alloy thereof.
3. a kind of LED heat conduction and heat radiation integrated molding device as claimed in claim 1 is characterized in that, this heat transfer device adopts pure red copper to cross platinum or silvery forms.
4. a kind of LED heat conduction and heat radiation integrated molding device as claimed in claim 1 is characterized in that, this radiator is to adopt graphite silicon to be made.
5. a kind of LED heat conduction and heat radiation integrated molding device as claimed in claim 1 is characterized in that, the shape of the cross section of these many heating columns can be in circular, square, rhombus, triangle, positive six distortion any one.
6. a kind of LED heat conduction and heat radiation integrated molding device as claimed in claim 1; It is characterized in that; Led chip is arranged on the upper surface of this radiator and the upper surface of this heat-conducting plate through chip pad; Make heat that led chip work the produces upper surface through this radiator get into radiator and dispel the heat, the many heating columns that can also heat transferred be in contact with it through heat-conducting plate then dispel the heat heat transferred through these many heating columns to the middle part of radiator.
7. a kind of LED heat conduction and heat radiation integrated molding device as claimed in claim 6 is characterized in that the power of this led chip is that 1W is to 200W.
8. a kind of LED heat conduction and heat radiation integrated molding device as claimed in claim 1 is characterized in that, with the heat transfer device and the graphite silicon heat sink material of casting adopt the mould integrated injection molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110248014.1A CN102376867B (en) | 2011-08-26 | 2011-08-26 | LED heat-conducting and radiating integrated forming device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110248014.1A CN102376867B (en) | 2011-08-26 | 2011-08-26 | LED heat-conducting and radiating integrated forming device |
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| Publication Number | Publication Date |
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| CN102376867A true CN102376867A (en) | 2012-03-14 |
| CN102376867B CN102376867B (en) | 2014-06-25 |
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| CN201110248014.1A Active CN102376867B (en) | 2011-08-26 | 2011-08-26 | LED heat-conducting and radiating integrated forming device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102628569A (en) * | 2012-03-28 | 2012-08-08 | 潍坊歌尔光电有限公司 | Direct type light-emitting diode (LED) mining lamp |
| CN107450692A (en) * | 2017-07-18 | 2017-12-08 | 陕西理工大学 | A kind of radiating structure of computer |
| CN109346448A (en) * | 2018-09-30 | 2019-02-15 | 西安微电子技术研究所 | A kind of compound cold plate of graphene and preparation method thereof |
| CN110430717A (en) * | 2019-06-30 | 2019-11-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The preparation method of highly reliable heterogeneous heat dissipation cold plate |
| CN114531829A (en) * | 2022-02-28 | 2022-05-24 | 安徽碳华新材料科技有限公司 | Be applied to heat conduction structure based on artificial graphite of unmanned aerial vehicle control chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201652038U (en) * | 2010-04-03 | 2010-11-24 | 黄海斌 | Large-power LED project lamp |
| KR20110061698A (en) * | 2009-12-02 | 2011-06-10 | (주)비스로 | A radiatior heighten efficiency for conducting heat for l.e.d device |
| CN202303268U (en) * | 2011-08-26 | 2012-07-04 | 珠海市远康企业有限公司 | Moulding device with integrated heat conduction and heat radiation for LED (light-emitting diode) |
-
2011
- 2011-08-26 CN CN201110248014.1A patent/CN102376867B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110061698A (en) * | 2009-12-02 | 2011-06-10 | (주)비스로 | A radiatior heighten efficiency for conducting heat for l.e.d device |
| CN201652038U (en) * | 2010-04-03 | 2010-11-24 | 黄海斌 | Large-power LED project lamp |
| CN202303268U (en) * | 2011-08-26 | 2012-07-04 | 珠海市远康企业有限公司 | Moulding device with integrated heat conduction and heat radiation for LED (light-emitting diode) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102628569A (en) * | 2012-03-28 | 2012-08-08 | 潍坊歌尔光电有限公司 | Direct type light-emitting diode (LED) mining lamp |
| CN102628569B (en) * | 2012-03-28 | 2015-11-18 | 潍坊歌尔光电有限公司 | Straight-down negative LED bay light |
| CN107450692A (en) * | 2017-07-18 | 2017-12-08 | 陕西理工大学 | A kind of radiating structure of computer |
| CN107450692B (en) * | 2017-07-18 | 2019-07-05 | 陕西理工大学 | A kind of radiating structure of computer |
| CN109346448A (en) * | 2018-09-30 | 2019-02-15 | 西安微电子技术研究所 | A kind of compound cold plate of graphene and preparation method thereof |
| CN110430717A (en) * | 2019-06-30 | 2019-11-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The preparation method of highly reliable heterogeneous heat dissipation cold plate |
| CN114531829A (en) * | 2022-02-28 | 2022-05-24 | 安徽碳华新材料科技有限公司 | Be applied to heat conduction structure based on artificial graphite of unmanned aerial vehicle control chip |
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| CN102376867B (en) | 2014-06-25 |
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Effective date of registration: 20201113 Address after: 226000 No.20 Fuxing Road, Yuelai Town, Haimen City, Nantong City, Jiangsu Province Patentee after: NANTONG YOUYUAN ART PATTERN DESIGN Co.,Ltd. Address before: Xiangzhou District 519000 of Guangdong province Zhuhai City Huayu Road No. 611613 Patentee before: ZHUHAI YUANKANG ENTERPRISE Co.,Ltd. |
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