CN202082883U - Integral high-power LED heat pipe heat dissipation device - Google Patents
Integral high-power LED heat pipe heat dissipation device Download PDFInfo
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- CN202082883U CN202082883U CN2011201482094U CN201120148209U CN202082883U CN 202082883 U CN202082883 U CN 202082883U CN 2011201482094 U CN2011201482094 U CN 2011201482094U CN 201120148209 U CN201120148209 U CN 201120148209U CN 202082883 U CN202082883 U CN 202082883U
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- heat
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- fin
- power led
- heat pipe
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- 230000017525 heat dissipation Effects 0.000 title abstract description 8
- 239000000758 substrate Substances 0.000 claims description 32
- 238000001149 thermolysis Methods 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Abstract
An integral high-power LED heat pipe heat dissipation device includes a base plate adhered onto the bottom surface of an LED light source and used for heat conduction, wherein first fins used for heat dissipation are arranged on the base plate; heat pipes with ultrahigh heat conduction performance are arranged on the base plate, the bottoms of the heat pipes are embedded into the base plate and form a smooth plane with the lower surface of the base plate, and the upper ends of the heat pipes are exposed above the base plate; and second fins used for heat dissipation are arranged at the upper ends of the heat pipes. The integral high-power LED heat pipe heat dissipation device has the advantages of simple structure, safety in use, and high heat dissipation efficiency.
Description
Technical field
The utility model relates to a kind of lighting device, particularly a kind of integrated high power LED heat-pipe radiating apparatus.
Background technology
Along with improving constantly of LED luminous efficiency, led light source is just demonstrating application prospects with its remarkable advantages, as road lighting, tunnel illumination and Landscape Lighting etc.Great power LED has very high luminous efficiency in theory, but owing to be subjected to the restriction of semiconductor manufacturing and encapsulation technology, present photoelectric transformation efficiency is about 20%～30%, promptly has 70%～80% electric energy to change into heat energy.Led chip is owing to small-sized, so heat flow density is very high.If heat can not pass timely and effectively, will greatly reduce luminous efficiency and the luminous intensity of LED, quicken the aging of led chip, even cause the LED device to burn.Therefore, heat radiation is the technical barrier that great power LED needs when being applied to lighting field emphasis to solve.
Realize that at present great power LED mainly contains two kinds of ways, a kind of is combined high-power LED, promptly makes up many low-power LED light sources, generally reaches up to a hundred even hundreds of, complex circuit designs.Another kind is directly to use integrated packaged type high-power LED light source.These two kinds all inevitably will be with heat dissipation design and functional reliability as main design consideration.At present common LED heat abstractor is mainly at combined high-power LED.Because be to adopt the array combination mode, what produced is equally distributed low-power thermal source, so Design of for heat sinks is comparatively simple, satisfy radiating and cooling easily to desired scope.Integrated packaged type great power LED becomes LED application and development trend owing to have advantages such as light efficiency height, volume are little, flexible.But integrated packaged type great power LED can produce a large amount of heats when therefore working, and heat is very concentrated because power is big, and general single LEDs light source can reach 50W, 75W, 100W even bigger, and therefore heat radiation requires higher.
Summary of the invention
The utility model will solve the heat dissipation problem of integrated high power LED, provide a kind of have the super-high heat-conductive performance, the uniform integrated high power LED heat-pipe radiating apparatus of exothermic temperature.
The utility model adopts following technical scheme:
The integrated high power LED heat-pipe radiating apparatus comprises the substrate that is used for heat conduction that is covered on the led light source bottom surface, and described substrate has been provided with first fin of thermolysis; Described substrate is provided with the heat pipe of super-high heat-conductive performance, it is characterized in that: described heat pipe bottom is to be embedded in the substrate, and forms a smooth flat with the lower surface of substrate, and described heat pipe upper end is exposed at the substrate top and has been provided with second fin of thermolysis.
Further, the both sides of described substrate are provided with and are used for and the lamp body connection structure connecting.
Further, described first fin is the sheet type fin, and its setting is arranged on the substrate, and and substrate be integrative-structure.
Further, described second fin is the sheet type fin, and it is set in parallel in the heat pipe upper end.
The heat that the center of integrated high power LED produces is the most concentrated, so substrate is provided with first fin, a preliminary thermolysis; The heat pipe bottom is pressed into the base lower surface center and forms a smooth flat, to guarantee that led light source is abundant with heat pipe, closely to contact, helps heat pipe heat is transmitted to second fin fast.
Described heat-pipe radiator as the part of lamp body, unifies to carry out the shape-designing of light fixture.First fin directly contacts with air with second fin and helps taking away of heat.
The quantity of described heat pipe quantity, first fin and second fin is that the moulded of the individual shapes of fin and radiator determines according to light fitting shape according to the decision of the power of led light source.The shape of heat pipe meets the layout requirement of heat pipe quick conductive.
Advantage of the present utility model:
1, by heat-conducting substrate and heat pipe the heat that led light source produces is transmitted on the fin apace, reaches the purpose of heat radiation, it is simple in structure, safe in utilization, radiating efficiency is high.
2, the efficient layout of heat pipe meets the operation principle of heat pipe condenser section, evaporator section etc. and the basic demand of quick conductive, helps bringing into play the heat pipe superconductivity, takes away heat fast.
3, heat pipe bottom is pressed into base lower surface and forms a smooth flat, guaranteed led light source and heat pipe, substrate fully, closely contact.
4, the efficient layout aerodynamic principle of fin helps the quick heat exchange of fin and air, has improved radiating rate and radiating efficiency.
5, moulding is heat-radiating integrated.Heat abstractor has not only played the quick heat radiating effect, and forms an integral body by syndeton and lamp body assembly, has played the effect of lamp housing.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is a vertical view of the present utility model.
The specific embodiment
With reference to Fig. 1-2, the integrated high power LED heat-pipe radiating apparatus comprises the substrate that is used for heat conduction 2 that is covered on led light source 1 bottom surface, and described substrate 2 has been provided with first fin 3 of thermolysis; Described substrate 2 is provided with the heat pipe 4 of super-high heat-conductive performance, and described heat pipe 4 bottoms are to be embedded in the substrate 2, and forms a smooth flat with the lower surface of substrate 2, and described heat pipe 4 upper ends are exposed at substrate 2 tops and have been provided with second fin 5 of thermolysis.
The both sides of described substrate 2 are provided with and are used for and lamp body connection structure connecting 6.
Described first fin 3 is sheet type fins, and its setting is arranged on the substrate 2, and and substrate 2 are integrative-structures.
Described second fin 5 is sheet type fins, and it is set in parallel in heat pipe 4 upper ends.
The heat that the center of integrated high power LED produces is the most concentrated, so substrate 2 is provided with first fin 3, a preliminary thermolysis; Heat pipe 4 bottoms are pressed into substrate 2 lower surface centers and form a smooth flat, to guarantee that led light source 1 and heat pipe 4 fully, closely contact, help heat pipe 4 heat is transmitted to second fin 5 fast.
Described heat-pipe radiator as the part of lamp body, unifies to carry out the shape-designing of light fixture.First fin 3 directly contacts with air with second fin 4 and helps taking away of heat.
The quantity of described heat pipe 4 quantity, first fin 3 and second fin 5 is that the moulded of the individual shapes of fin and radiator determines according to light fitting shape according to the decision of the power of led light source.The shape of heat pipe meets the layout requirement of heat pipe quick conductive.
The described content of this specification embodiment only is enumerating the way of realization of utility model design; protection domain of the present utility model should not be regarded as only limiting to the concrete form that embodiment states, protection domain of the present utility model also reach in those skilled in the art according to the utility model design the equivalent technologies means that can expect.
Claims (4)
1. the integrated high power LED heat-pipe radiating apparatus comprises the substrate that is used for heat conduction that is covered on the led light source bottom surface, and described substrate has been provided with first fin of thermolysis; Described substrate is provided with the heat pipe of super-high heat-conductive performance, it is characterized in that: described heat pipe bottom is to be embedded in the substrate, and forms a smooth flat with the lower surface of substrate, and described heat pipe upper end is exposed at the substrate top and has been provided with second fin of thermolysis.
2. integrated high power LED heat-pipe radiating apparatus according to claim 1 is characterized in that: the both sides of described substrate are provided with and are used for and the lamp body connection structure connecting.
3. integrated high power LED heat-pipe radiating apparatus according to claim 1 and 2 is characterized in that: described first fin is the sheet type fin, and its setting is arranged on the substrate, and and substrate be integrative-structure.
4. integrated high power LED heat-pipe radiating apparatus according to claim 3 is characterized in that: described second fin is the sheet type fin, and it is set in parallel in the heat pipe upper end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201482094U CN202082883U (en) | 2011-05-11 | 2011-05-11 | Integral high-power LED heat pipe heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201482094U CN202082883U (en) | 2011-05-11 | 2011-05-11 | Integral high-power LED heat pipe heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202082883U true CN202082883U (en) | 2011-12-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201482094U Expired - Fee Related CN202082883U (en) | 2011-05-11 | 2011-05-11 | Integral high-power LED heat pipe heat dissipation device |
Country Status (1)
| Country | Link |
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| CN (1) | CN202082883U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544344A (en) * | 2012-03-09 | 2012-07-04 | 陕西唐华能源有限公司 | Composite phase-change three-dimensional light emitting diode (LED) heat radiator |
| CN104421905A (en) * | 2013-09-05 | 2015-03-18 | 海洋王（东莞）照明科技有限公司 | LED (light emitting diode) lamp with radiating heat tube |
| CN105066078A (en) * | 2015-08-03 | 2015-11-18 | 特能传热科技（中山）有限公司 | LED lamp radiator |
| CN106288500A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | Heat abstractor and there is the semiconductor refrigerating box of this heat abstractor |
| WO2017173778A1 (en) * | 2016-04-06 | 2017-10-12 | 广州市浩洋电子股份有限公司 | Omni-directional, convectional, active heat sink and stage light using same |
| CN108105733A (en) * | 2018-01-30 | 2018-06-01 | 广东工业大学 | A kind of LED radiators |
| CN108534103A (en) * | 2018-06-28 | 2018-09-14 | 北京工业大学 | A kind of great power LED fin-super heat-conductive pipe integral heat dissipation device |
-
2011
- 2011-05-11 CN CN2011201482094U patent/CN202082883U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544344A (en) * | 2012-03-09 | 2012-07-04 | 陕西唐华能源有限公司 | Composite phase-change three-dimensional light emitting diode (LED) heat radiator |
| CN102544344B (en) * | 2012-03-09 | 2014-06-04 | 陕西唐华能源有限公司 | Composite phase-change three-dimensional light emitting diode (LED) heat radiator |
| CN104421905A (en) * | 2013-09-05 | 2015-03-18 | 海洋王（东莞）照明科技有限公司 | LED (light emitting diode) lamp with radiating heat tube |
| CN106288500A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | Heat abstractor and there is the semiconductor refrigerating box of this heat abstractor |
| CN105066078A (en) * | 2015-08-03 | 2015-11-18 | 特能传热科技（中山）有限公司 | LED lamp radiator |
| CN105066078B (en) * | 2015-08-03 | 2018-04-10 | 特能传热科技（中山）有限公司 | A kind of LED lamp heat sink |
| WO2017173778A1 (en) * | 2016-04-06 | 2017-10-12 | 广州市浩洋电子股份有限公司 | Omni-directional, convectional, active heat sink and stage light using same |
| US10962215B2 (en) | 2016-04-06 | 2021-03-30 | Guangzhou Haoyang Electronic Co., Ltd. | Active radiator with omnidirectional air convection and stage lighting fixture using the same |
| CN108105733A (en) * | 2018-01-30 | 2018-06-01 | 广东工业大学 | A kind of LED radiators |
| CN108105733B (en) * | 2018-01-30 | 2023-11-07 | 广东工业大学 | LED heat dissipation device |
| CN108534103A (en) * | 2018-06-28 | 2018-09-14 | 北京工业大学 | A kind of great power LED fin-super heat-conductive pipe integral heat dissipation device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111221 Termination date: 20140511 |