CN104421905A - LED (light emitting diode) lamp with radiating heat tube - Google Patents
LED (light emitting diode) lamp with radiating heat tube Download PDFInfo
- Publication number
- CN104421905A CN104421905A CN201310399959.2A CN201310399959A CN104421905A CN 104421905 A CN104421905 A CN 104421905A CN 201310399959 A CN201310399959 A CN 201310399959A CN 104421905 A CN104421905 A CN 104421905A
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- led
- light source
- heat
- led light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
An LED (light emitting diode) lamp with a radiating heat tube comprises an LED light source subassembly, a back plate, the heat tube and radiating fins, wherein the LED light source subassembly comprises an LED light source and is arranged on the front surface of the back plate; the LED light source is fixedly adhered to the surface of the back plate; a heat tube mounting groove is formed in the back surface of the back plate; an evaporating section of the heat tube is inlaid in the heat tube mounting groove; and the radiating fins are arranged on a condensation section of the heat tube. Heat which is generated by the LED light source can be rapidly transmitted to the condensation section of the heat tube and then is dissipated; requirements on heat dissipation of the high-power LED lamp can be met; the junction temperature of the LED lamp is reduced; the service life of the LED lamp is prolonged; a connection mode of the heat tube is quite simple; and the heat tube is convenient to mount and maintain.
Description
Technical field
The present invention relates to technical field of LED illumination, particularly relate to a kind of LED adopting heat pipe heat radiation.
Background technology
Luminous efficiency is the major technology bottleneck that semiconductor lighting devices large-power light-emitting diodes (LED) faces, and the luminous efficiency of current LED only can reach 20%-30%, also has the power conversion of 80%-70% to become heat.In general, LED junction temperature is higher, and the life-span of product is shorter, and in order to ensure the life-span of device, General Requirements junction temperature is below 110 DEG C.Therefore, heat dissipation design is the emphasis of Lighting Design.At present, the mode of passive heat radiation is generally all applied in heat dissipation technology, the passive heat radiation of Aluminium Alloys in Common Use radiator, but along with illuminating product is miniaturized, the power density of product is increasing, this mode can not meet the requirement of high-power illumination design, explores the key that advanced heat dissipation technology becomes heat dissipation design.
At present, the LED that some power are larger has started to adopt heat pipe to dispel the heat, but mostly structure comparison is responsible for, and, major part adopts the LED lamp of heat pipe heat radiation, and the normally not easily detachable connected mode of its heat pipe and LED light source heat transfer piece, is unfavorable for installation and maintenance.
Summary of the invention
The technical problem to be solved in the present invention is to overcome the deficiency that above-mentioned prior art exists, and propose that a kind of structure is simple, good heat dissipation effect be convenient to heat pipe module installation and maintenance LED.
For solving the problems of the technologies described above, the present invention proposes a kind of LED adopting heat pipe heat radiation, comprise LED light source component, it comprises LED light source, described LED also comprises: a backboard, described LED light source component is arranged on the front of described backboard, and described LED light source amplexiforms the surface being fixed on described backboard, and the back side of described backboard is provided with heat pipe mounting groove; Heat pipe, the evaporator section of described heat pipe embeds in described heat pipe mounting groove; Fin, is installed in the condensation segment of described heat pipe.
The LED of described employing heat pipe heat radiation, wherein, the evaporator section of described heat pipe embeds in described heat pipe mounting groove in an interference fit.
The LED of described employing heat pipe heat radiation, wherein, the material of described backboard is aluminum alloy materials.
The LED of described employing heat pipe heat radiation, wherein, the number of the condensation segment of described heat pipe is two, and stretch out from the two ends of described backboard respectively, described fin is divided into two groups, each condensation segment correspondence installing one group.
The LED of described employing heat pipe heat radiation, wherein, often organizes fin and comprises four and be parallel to each other and the aluminium flake through oxidation processes of condensation segment perpendicular to described heat pipe.
The LED of described employing heat pipe heat radiation, wherein, scribbles heat-conducting cream between the contact surface of described backboard and described heat pipe.
The LED of described employing heat pipe heat radiation, wherein, a part at least described heat pipe mounting groove projects with LED light source fixed position and overlaps.
The LED of described employing heat pipe heat radiation, wherein, the number of described LED light source component is multiple, and corresponding each LED light source component is provided with a heat pipe mounting groove and is installed in a heat pipe in heat pipe mounting groove.
The LED of described employing heat pipe heat radiation, wherein, the LED of described employing heat pipe heat radiation is street lamp.
Compared with prior art, the present invention has following beneficial effect: the heat that in the present invention, LED light source produces can be transmitted to heat pipe condenser section rapidly, then distributes, can support the cooling requirements of high-capacity LED lamp, reduce the junction temperature of LED, extend the life-span of LED; In addition the connected mode of heat pipe is extremely simple, is convenient to install and go along with sb. to guard him.
Accompanying drawing explanation
Fig. 1 is the stereogram of LED in the embodiment of the present invention.
Fig. 2 is the top view of LED in the embodiment of the present invention.
Fig. 3 is the side-looking explosive view of heat pipe in the embodiment of the present invention.
Fig. 4 is the upward view of embodiment of the present invention dorsulum.
Fig. 5 is the side view of embodiment of the present invention dorsulum.
Fig. 6 is the stereogram of heat pipe in the embodiment of the present invention.
Fig. 7 is the stereogram of LED in the embodiment of the present invention.
Wherein, description of reference numerals is as follows: 1:LED light source assembly; 11:LED light source; 12: lens; 13: pressing plate; 2: backboard; 21: heat pipe mounting groove; 22: alar part; 3: heat pipe; 31: aluminium flake; 32: evaporator section; 33: condensation segment.
Detailed description of the invention
In order to further illustrate principle of the present invention and structure, existing by reference to the accompanying drawings to a preferred embodiment of the present invention will be described in detail.
The LED of the employing heat pipe heat radiation in the present embodiment is the LED street lamp of a 40W, and as depicted in figs. 1 and 2, it mainly includes LED light source component 1, backboard 2 and heat pipe 3 to its overall structure.
As shown in Figure 3, LED light source component 1 comprises LED light source 11, lens 12 and pressing plate 13.Backboard 2 is rectangular plate-like structures of 6063 Aluminum alloy tensile, and its relative two ends have the alar part 22 being upwards slightly upturned and being formed.LED light source 11 is COB LED of 40W, and it amplexiforms the surface in the front being fixed on backboard 2, and lens 12 are placed in the top of institute's LED light source 11; Pressing plate 13 edge is provided with 6 installing holes, pressing plate 13 and lens 12 is fixed on backboard 2 with screw.Optical lens can redistribute light, the light launched is redistributed on the road surface illuminated according to the mode of brightness uniformity from LED light source 11.The material of backboard 2 also can select the other materials meeting heat conductivility.
As shown in Figure 4 and Figure 5, the back side of backboard 2 is provided with heat pipe mounting groove 21, and heat pipe mounting groove 21 is straight trough, and its cross section is the circle of the center of circle in mounting groove, and its diameter is more bigger than the diameter of section of heat pipe 3.
As shown in Figure 6, heat pipe 3 is straight copper heat pipes of diameter 6 millimeters, and its thermal conductivity can reach 20000W/MK in theory.The condensation segment of heat pipe 3 has two, the two ends of the heat pipe 3 namely stretched out from the two ends of backboard 2, two condensation segment places of heat pipe 3 are respectively equiped with one group of fin, specifically respectively be welded with four parallel and aluminium flakes 31 of vertical heat pipe 3, the surface of aluminium flake 31 is through oxidation processes, and surface has good thermal emissivity rate.The material of certain fin also can select the material that other surface heat radiances are high.
Evaporator section in the middle part of heat pipe 3 directly embeds in heat pipe mounting groove 21 by pressure, with backboard 2 interference fit.For reducing the thermal resistance of contacting section between heat pipe 3 and backboard 2, before heat pipe 3 is pressed in heat pipe mounting groove 21, coated with thermally conductive cream (such as silicone grease) in present heat pipe mounting groove.
During LED work, the heat that LED light source 11 produces is passed to backboard 2 and heat pipe 3 successively, and the aluminium flake 31 finally by heat pipe 3 condensation segment is dispersed in air.Because backboard 2 and heat pipe 3 are interference fit, extremely low to the thermal resistance of aluminium flake 31 from LED light source 11, and heat pipe 3 has high thermal conductivity, and (in the present embodiment, the thermal conductivity of the copper heat pipe of diameter 6 millimeters can reach 20000W/MK in theory.), like this, heat can be transmitted to above aluminium flake 31 from LED light source 11 rapidly, compares with the aluminium radiator of the passive radiating mode of tradition, can effectively reduce LED junction temperature 15 to 20 DEG C.
For the LED of high power requirements, can be realized with increase LED light source component 1 and heat pipe 3 by the length extending backboard 2.Such as another embodiment of the present invention structure as shown in Figure 7: the front of the backboard 2 of lengthening is provided with three LED light source component 1, and at backboard 2 back side each LED light source component 1 corresponding position be provided with heat pipe mounting groove 21, be embedded with heat pipe 3 in each heat pipe mounting groove 21.
Obviously, for strengthening heat transfer efficiency, preferably a part for heat pipe 3 should be placed in the positive back side of LED light source 11, that is a part at least described heat pipe mounting groove projects with LED light source fixed position and overlaps.
According to LED watt level, and radiating requirements, within the scope of prior art, suitable selection can be carried out by opposite heat tube.
Structure possible in some LED practical applications is have ignored in above embodiment, such as waterproof fitting, but this does not affect the realization of technical solution of the present invention and technique effect, those skilled in the art can according to the actual requirements, select to install suitable structure within the scope of prior art.
These are only better possible embodiments of the present invention, not limit the scope of the invention, all utilizations description of the present invention and the change of the equivalent structure done by accompanying drawing content, be all included in protection scope of the present invention.
Claims (10)
1. one kind adopts the LED of heat pipe heat radiation, comprise LED light source component, it comprises LED light source, it is characterized in that, described LED also comprises: a backboard, described LED light source component is arranged on the front of described backboard, and described LED light source amplexiforms the surface being fixed on described backboard, and the back side of described backboard is provided with heat pipe mounting groove;
Heat pipe, the evaporator section of described heat pipe embeds in described heat pipe mounting groove;
Fin, is installed in the condensation segment of described heat pipe.
2. the LED adopting heat pipe heat radiation as claimed in claim 1, it is characterized in that, the evaporator section of described heat pipe embeds in described heat pipe mounting groove in an interference fit.
3. the LED adopting heat pipe heat radiation as claimed in claim 1, it is characterized in that, the material of described backboard is aluminum alloy materials.
4. the LED adopting heat pipe heat radiation as claimed in claim 1, it is characterized in that, the number of the condensation segment of described heat pipe is two, and stretch out from the two ends of described backboard respectively, described fin is divided into two groups, each condensation segment correspondence installing one group.
5. the as claimed in claim 4 LED adopting heat pipe heat radiation, is characterized in that, often organizes fin and comprises four and be parallel to each other and the aluminium flake through oxidation processes of condensation segment perpendicular to described heat pipe.
6. the LED adopting heat pipe heat radiation as claimed in claim 1, is characterized in that, scribble heat-conducting cream between the contact surface of described backboard and described heat pipe.
7. the LED adopting heat pipe heat radiation as claimed in claim 1, it is characterized in that, a part at least described heat pipe mounting groove projects with LED light source fixed position and overlaps.
8. the LED adopting heat pipe heat radiation as claimed in claim 1, it is characterized in that, described LED light source component also comprises lens and lens is fixedly mounted on the pressing plate in described backboard front.
9. the LED adopting heat pipe heat radiation as claimed in claim 1, it is characterized in that, the number of described LED light source component is multiple, and corresponding each LED light source component is provided with a heat pipe mounting groove and is installed in a heat pipe in heat pipe mounting groove.
10. the LED adopting heat pipe heat radiation as claimed in claim 1, it is characterized in that, the LED of described employing heat pipe heat radiation is street lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310399959.2A CN104421905A (en) | 2013-09-05 | 2013-09-05 | LED (light emitting diode) lamp with radiating heat tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310399959.2A CN104421905A (en) | 2013-09-05 | 2013-09-05 | LED (light emitting diode) lamp with radiating heat tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104421905A true CN104421905A (en) | 2015-03-18 |
Family
ID=52971649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310399959.2A Pending CN104421905A (en) | 2013-09-05 | 2013-09-05 | LED (light emitting diode) lamp with radiating heat tube |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104421905A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104848085A (en) * | 2015-04-29 | 2015-08-19 | 韦政鸿 | Intelligent LED night light with high heat dispersion |
| CN107290915A (en) * | 2017-08-21 | 2017-10-24 | 青岛海信电器股份有限公司 | Projector equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070247853A1 (en) * | 2006-04-25 | 2007-10-25 | Dorogi Michael J | Lamp thermal management system |
| CN101315155A (en) * | 2008-05-21 | 2008-12-03 | 合肥格林兰特光电有限公司 | High power LED road lamp with heat pipe cooling mechanism |
| CN201490158U (en) * | 2009-09-04 | 2010-05-26 | 北京世纪卓克能源技术有限公司 | Improved electrodeless light and road light fitting for arranging the improved electrodeless light |
| CN201575378U (en) * | 2010-01-19 | 2010-09-08 | 郑州光华灯具有限公司 | High power LED street lamp structure |
| CN201844306U (en) * | 2010-10-12 | 2011-05-25 | 重庆万利达科技有限公司 | LED streetlamp |
| CN202082883U (en) * | 2011-05-11 | 2011-12-21 | 浙江工业大学 | Integral high-power LED heat pipe heat dissipation device |
| CN202284782U (en) * | 2011-09-16 | 2012-06-27 | 佛山市顺德区蚬华多媒体制品有限公司 | Heat tube radiator for LED lamp |
-
2013
- 2013-09-05 CN CN201310399959.2A patent/CN104421905A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070247853A1 (en) * | 2006-04-25 | 2007-10-25 | Dorogi Michael J | Lamp thermal management system |
| CN101315155A (en) * | 2008-05-21 | 2008-12-03 | 合肥格林兰特光电有限公司 | High power LED road lamp with heat pipe cooling mechanism |
| CN201490158U (en) * | 2009-09-04 | 2010-05-26 | 北京世纪卓克能源技术有限公司 | Improved electrodeless light and road light fitting for arranging the improved electrodeless light |
| CN201575378U (en) * | 2010-01-19 | 2010-09-08 | 郑州光华灯具有限公司 | High power LED street lamp structure |
| CN201844306U (en) * | 2010-10-12 | 2011-05-25 | 重庆万利达科技有限公司 | LED streetlamp |
| CN202082883U (en) * | 2011-05-11 | 2011-12-21 | 浙江工业大学 | Integral high-power LED heat pipe heat dissipation device |
| CN202284782U (en) * | 2011-09-16 | 2012-06-27 | 佛山市顺德区蚬华多媒体制品有限公司 | Heat tube radiator for LED lamp |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104848085A (en) * | 2015-04-29 | 2015-08-19 | 韦政鸿 | Intelligent LED night light with high heat dispersion |
| CN107290915A (en) * | 2017-08-21 | 2017-10-24 | 青岛海信电器股份有限公司 | Projector equipment |
| CN107290915B (en) * | 2017-08-21 | 2020-08-28 | 海信视像科技股份有限公司 | Projection device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20100309671A1 (en) | Led lamp heat dissipating module | |
| AU2012264336B2 (en) | Cooling of semiconductor devices | |
| US20100148652A1 (en) | Solid state lighting | |
| US20090316400A1 (en) | Light emitting diode street light | |
| US20130294070A1 (en) | High bay light | |
| CN102853405A (en) | LED (light-emitting diode) radiator and LED lamp | |
| JP2014135350A (en) | Heat sink | |
| US20120186798A1 (en) | Cooling module for led lamp | |
| CN103438411B (en) | A kind of LED radiator | |
| CN104421905A (en) | LED (light emitting diode) lamp with radiating heat tube | |
| CN104279536A (en) | Heat dissipation device applied to LED lamps | |
| CN202118606U (en) | Alloy heat radiating light-emitting diode (LED) lamp bulb | |
| CN202118574U (en) | LED lamp with radiating module | |
| CN101334150B (en) | LED lamp | |
| CN202132919U (en) | Radiation type LED (Light Emitting Diode) lamp cup | |
| CN202629693U (en) | High-power illuminating lamp with integrated semiconductor luminous sources | |
| CN202915187U (en) | High-power embedded light emitting diode (LED) down lamp | |
| CN214222827U (en) | LED light projector | |
| CN102720974A (en) | High-power light-emitting diode (LED) lamp | |
| CN220962114U (en) | Heat radiation structure for Micro LED projector | |
| CN208635073U (en) | A kind of free convection heat-pipe radiator | |
| CN213577315U (en) | High-heat-conduction LED car lamp structure | |
| CN201285012Y (en) | LED light projector | |
| CN209196582U (en) | A kind of high-powered LED lamp | |
| CN205002077U (en) | Radiating structure of light -emitting diode (LED) module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150318 |
|
| RJ01 | Rejection of invention patent application after publication |