CN101334150B - LED lamp - Google Patents
LED lamp Download PDFInfo
- Publication number
- CN101334150B CN101334150B CN200710076265XA CN200710076265A CN101334150B CN 101334150 B CN101334150 B CN 101334150B CN 200710076265X A CN200710076265X A CN 200710076265XA CN 200710076265 A CN200710076265 A CN 200710076265A CN 101334150 B CN101334150 B CN 101334150B
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- Prior art keywords
- heat
- radiator
- led lamp
- light emitting
- conducting plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000010276 construction Methods 0.000 claims description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 230000005494 condensation Effects 0.000 description 6
- 238000009833 condensation Methods 0.000 description 6
- 239000003570 air Substances 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to an LED lamp, which comprises an LED module, a base and at least a heat radiating device, wherein the LED module is fixed on the base, at least a heat conducting component is extended out from the base side, and the heat radiating device and the heat conducting component are connected and fixed, thereby the heat radiating device and the heat conducting component are arranged around the LED module. The heat generated by the LED module is conducted onto the heat radiating device positioned on identical horizontal surface with the heat conducting component by the LED lamp through the heat conducting component, thus the horizontal space around the LED module is fully used, to reduce the product thickness. Therefore, the LED lamp can be conveniently installed on the buildings, such as the roof or the wall with limited installing space and used for illuminating.
Description
Technical field
The present invention relates to a kind of led lamp, particularly relates to a kind of led lamp that is combined with radiator structure.
Background technology
Light emitting diode (Light Emitting Diode, be called for short LED), it is a kind of light emitting semiconductor device, it is to utilize semiconductor chip as luminescent device, by carrier compound energy of emitting surplus taking place causes photo emissions in semiconductor, directly send red, yellow, blue, green, blue or green, orange, purple light, the led lighting product utilizes light emitting diode as the produced ligthing paraphernalia of light source exactly, is widely used in fields such as communication, illumination, traffic, billboards.But, high brightness, High Power LED then can Yin Wendu rising and cause luminous efficiency obviously to descend, even cause the damage of assembly, therefore, how the operating temperature with led lamp keeps within the specific limits to avoid the generation of above-mentioned phenomenon, is the present urgent problems of people.At present, the common way of industry is sticked radiator with distribute heat below LED circuitboard, as U.S. Pat 6,517, shown in 218B2 number, yet but increase like this thickness of led lamp, be not easy to the installation and the application of this led lamp.
Summary of the invention
In view of this, be necessary to provide a kind of and have, be convenient to install and dispel the heat good led lamp than minimal thickness.
A kind of led lamp, comprise a light emitting diode module, a pedestal and at least one radiator, this light emitting diode module is fixed on this pedestal, at least one heat conducting element from this base side to extending, thereby this radiator and heat conducting element be connected and fixed be arranged at this light emitting diode module around.
A kind of led lamp, comprise a light emitting diode module and a radiator structure, this light emitting diode module is fixed on this radiator structure, at least one heat conducting element that this radiator structure comprises a heat-conducting plate, contacts with heat-conducting plate, and some radiators, this light emitting diode module is located on this heat-conducting plate; The part of this heat conducting element is located at the outside of heat-conducting plate, and outer part is connected and fixed the side periphery that is arranged at this light emitting diode module thereby these radiators and heat conducting element are positioned at heat-conducting plate.
This led lamp conducts to the heat that light emitting diode module produces on the radiator that is positioned at this light emitting diode module side by heat conducting element, makes full use of this light emitting diode module horizontal space on every side, thereby reduces the thickness of product.Thus, this led lamp can be easily installed on the buildings such as roof that installing space is restricted or wall, realizes illumination functions.
Description of drawings
Fig. 1 is the three-dimensional combination figure of led lamp one embodiment of the present invention.
Fig. 2 is the three-dimensional exploded view of Fig. 1.
Fig. 3 is Fig. 2 unit assembly drawing.
The specific embodiment
See also Fig. 1, be an embodiment of led lamp of the present invention.It is square that this led lamp roughly is lengthwise, and it comprises a light-source structure 10, a radiator structure 30 and a supporting construction 50.This light-source structure 10 is in order to provide light source, and this radiator structure 30 is in order to conduct, to distribute the heat that this light-source structure 10 produces in the course of the work; This supporting construction 50 is in order to supporting, to connect this light-source structure 10 and radiator structure 30, and light-source structure 10, radiator structure 30 can be fixed on the building (figure does not show).
Please consult Fig. 2 simultaneously, this light-source structure 10 comprises that a light emitting diode module 12 and covers at the lampshade 15 on this light emitting diode module 12.This light emitting diode module 12 comprises a rectangle circuit board 120, and the shape of this circuit board 120 is not limited to rectangle, can be also that other are square or have a shape of certain curved surface.Be distributed with some light emitting diodes 122 on this circuit board 120, these light emitting diodes 122 are distributed in regularly on this circuit board 120 and with this circuit board 120 and electrically connect.This lampshade 15 is a rectangle hollow structure, this lampshade 15 is hollow towards the bottom of circuit board 120 and is a bit larger tham this circuit board 120, the material of this lampshade 15 can adopt transparent material in the light transmission part, other parts adopt aluminium sheet or plastic material as reflector segment, and its surface is zinc-plated or silver-plated usually to strengthen reflecting rate.This lampshade 15 not only can be used for protecting light emitting diode module 12, also can be used to directing light.The light emitting diode 122 of this light emitting diode module 12 can radiate light under the state of energising, and outwards disperses after producing optically focused or astigmatism under the guiding of lampshade 15.Consider leaded light and beauty function, the top of this lampshade 15 is protruded in the middle of vertical two side direction and is formed an arc, and certainly, the shape of this lampshade 15 also can be designed to other shapes according to light conducting direction (being determined on a case-by-case basis) and needs attractive in appearance.15 4 jiaos of column constructions that extend internally out respectively of this lampshade (figure does not show), four fixing holes 157 run through by each column construction from these lampshade 15 tops and are communicated with the bottom.
This radiator structure 30 mainly comprises two heat-conducting plates 31, two parallel heat pipes 35 and second radiator 38, this two heat pipe 35 is held between this two heat-conducting plate 31 and extends this two heat-conducting plate 31, this second radiator 38 is positioned at the both sides of heat-conducting plate 31 and is sheathed on this two heat pipes, 35 two ends, and this two heat-conducting plate 31 and radiator 38 lay respectively at bottom and vertical both sides of described light-source structure 10.
This heat-conducting plate 31 can copper coin or aluminium sheet be made preferably by thermal conductivity, the shape of this heat-conducting plate 31 and circuit board 120 are similar to be dull and stereotyped rectangle, and it is bigger than these circuit board 120 areas, this two heat-conducting plate 31 is symmetrically distributed in the upper and lower of this two parallel heat pipes 35, wherein each heat-conducting plate 31 offers two parallel semi-circular recesses 312 towards a side of heat pipe 35, these two grooves, 312 spaces also extend longitudinally and run through this heat-conducting plate 31, during assembling, corresponding mutually merging of the groove 312 of this two heat-conducting plate 31 constitutes two circular channels, in order to this two parallel heat pipes 35 is accommodated wherein.Be provided with a top-down through hole 315 in the middle of each heat-conducting plate 31, this through hole 315 can be in order to wear electric wire; 31 4 jiaos of this heat-conducting plates are provided with four fixing holes 317 corresponding with the fixing hole 157 of lampshade 15.
This two heat pipe 35 is straight tubular heat pipe, and this two heat pipe 35 is parallel to each other and is positioned on the horizontal plane parallel with foregoing circuit plate 120, and the length that the length of this two heat pipe 35 is compared this two heat-conducting plate 31 is long.Each heat pipe 35 comprises that one is held on evaporator section 351 between this two heat-conducting plate 31 and two condensation segments 352 of both sides.The same length of these evaporator section 351 length and this two heat-conducting plate 31, and in order to be sheathed on by in the circular channel that the groove 312 of heat-conducting plate 31 constitutes up and down, these evaporator section 351 outer surfaces can scribble heat-conducting glue, can closely contact with the surface of heat-conducting plate 31 when making this two heat pipe 35 in this circular channel.The condensation segment 352 of this two heat pipe 35 protrudes in this two heat-conducting plates, 31 vertical both sides.The shape of this two heat pipe 35 is not limited to straight tube, also can be other bendings or curved shape, as L shaped or U-shaped or the like, this two heat pipe 35 also is not limited to be arranged in parallel, also can be and be staggered, but should make these heat pipes 35 be on the same horizontal plane as far as possible, thereby make full use of the heat-dissipating space around the heat-conducting plate 31.This two heat pipe 35 also can be the heat conducting element that other forms have high thermal conductivity or better syndeton, as plate shape heat pipe, solid copper bar or aluminium bar etc.
This second radiator 38 combines for some square radiating fins 381 are spaced, and these radiating fins 381 can link into an integrated entity by welding or snapping.Corresponding two parallel heat pipes 35 offer two circular fixing holes 385 in the middle of each radiating fin 381, the condensation segment 352 of this two fixing hole 385 in order to accommodate heat pipe 35, thus make radiator 38 closely be connected with heat pipe 35.This second radiator 38 is not limited to the combination of radiating fin 381, it is one-body molded also to can be aluminium extruded, these radiator 38 shapes also are not limited to square, also can be circle or offer other shapes of fixing hole 385 or the radiator of form, these radiators should be convenient to along the extending laterally of level or heat-conducting plate 31, thereby make full use of the heat-dissipating space around the heat-conducting plate 31.
This supporting construction 50 is positioned at the bottom of below heat-conducting plate 31, this supporting construction 50 is the box body structure of a rectangular rectangle, its top is provided with an opening 51 towards this heat-conducting plate 31, the bottom lock of this supporting construction 50 constitutes a hemi-closure space, this hemi-closure space can be in order to install an electron rectifier (figure does not show), the electric wire of this electron rectifier electrically connects by the through hole 315 of heat-conducting plate 31 and the light emitting diode module 12 of top, thereby is light emitting diode 122 power supplies.This electron rectifier also can be arranged at outside this LED lamp structure, in the building as this led lamp embedding, as roof or wall.Four cylinders 52 are extended in these supporting construction 50 4 angle inboards, and these cylinders 52 are respectively equipped with a fixing hole 527 in order to support the heat-conducting plate 31 of its top in the middle of each cylinder 52, and these fixing holes 527 are corresponding with the fixing hole 317 of its top heat-conducting plate 31.Above-mentioned heat-conducting plate 31 and supporting construction 50 also can be replaced (figure does not show) by a pedestal, this circuit board 120 of this pedestal top braces is solid above this pedestal and be provided with two horizontal through hole runs through with heating tube 35, and this pedestal below is hollow can the connection with electron rectifier.
During assembling, at first two heat pipes 35 are sheathed in the groove 312 of a below heat-conducting plate 31, then heat-conducting plate 31 lids in top are located on this two heat pipe 35, and make that the groove 312 of this top heat-conducting plate 31 is corresponding with heat pipe 35, thereby make this two heat pipe 35 closely in the circular channel of these grooves 312 formations, simultaneously, these two heat-conducting plates, 31 opposite planar closely contact; Then, circuit board 120 is fixed on the top of top heat-conducting plate 31, lampshade 15 is located on this circuit board 120, the heat-conducting plate 31 of below is positioned over this supporting construction 50 tops, and make the fixing hole 157 of lampshade 15, the fixing hole 317 of heat-conducting plate 31 and the fixing hole of supporting construction 50 527 are corresponding mutually, run through by these fixing holes 157 by four fixtures (figure does not show), 317 and with fixing hole 527 locking, at last, be weldingly fixed on second radiator 38 on the condensation segment 352 of this two heat pipe 35 from both sides, and closely contact with heat pipe 35, at this moment, this second radiator 38 is positioned at vertical both sides of light-source structure 10, thereby finishes the assembling of this led lamp.The assembly method of this led lamp is not limited thereto, and also can adopt other effective assemble method.
During this led lamp work, the heat that light emitting diode 122 produces is directly absorbed by circuit board 120 following heat-conducting plates 31, then the heat on the heat-conducting plate 31 is absorbed by the evaporator section 351 of this two heat pipe 35 rapidly, and heat is transmitted to apace on the condensation segment 352 of both sides by the evaporation of condensed fluid in the evaporator section 351, these condensation segments 352 by with the contacting of radiator 38 around it, again heat is conducted on these radiators 38, because radiator 38 is bigger with the contact area of surrounding air, so, heat just can promptly be dispersed in the surrounding air and go, thereby improves the radiating efficiency of this led lamp.
The heat that this led lamp produces light emitting diode 122 by heat pipe 35 conducts to these light emitting diodes 122 and roughly is on the radiator 38 of same horizontal plane, thereby make full use of the horizontal space around this light-source structure 10, make the thickness of product reduce, so this led lamp can be easily installed on the buildings such as roof that installing space is restricted or wall and is used for illumination; Simultaneously also for this led lamp saves more space, can have the more more light-source structure 10 of complicated shape of large scale for designing.In addition, when this led lamp is installed on the roof, the heat that is distributed by this led lamp conducts to surrounding air, making ambient air temperature rise flies away to the top, roof, the cold air of this below, roof is because free convection just adds to this led lamp surrounding space automatically from the below, further improve this led lamp radiating efficiency, reach cooling effect.
Claims (9)
1. led lamp, comprise a light emitting diode module, one pedestal, second radiator and at least one heat conducting element, this light emitting diode module is fixed on the end face of this pedestal, described second radiator is arranged at vertical both sides of described pedestal, described heat conducting element extends from the vertical both sides of this pedestal, thereby this second radiator and heat conducting element be connected and fixed be arranged at this light emitting diode module around, it is characterized in that: described second radiator is separate, each radiator is spaced by some radiating fins and combines, described heat conducting element is straight heat pipe, the both ends of this straight heat pipe are from straight the extending of vertical both sides of this pedestal side direction, and the radiating fin of described second radiator is set on the both ends of this straight heat pipe respectively.
2. led lamp as claimed in claim 1, it is characterized in that: described pedestal comprises two heat-conducting plates, the middle part of this straight heat pipe is held between this two heat-conducting plate, and the two ends of this straight heat pipe are extended laterally by this two heat-conducting plate and link to each other with second radiator respectively.
3. led lamp as claimed in claim 2 is characterized in that: described straight heat pipe is two.
4. led lamp as claimed in claim 3 is characterized in that: described second radiator is distributed in the vertical both sides of this heat-conducting plate and is connected with two straight heat pipes respectively.
5. led lamp as claimed in claim 3, it is characterized in that: described two heat-conducting plates are symmetrically distributed in this straight heat pipe upper and lower, two heat-conducting plates are provided with groove towards straight heat pipe side, and the groove of this two heat-conducting plate forms circular channel jointly in order to ccontaining straight heat pipe.
6. led lamp as claimed in claim 2 is characterized in that: the bottom of described heat-conducting plate is provided with a supporting construction in addition.
7. led lamp as claimed in claim 6 is characterized in that: described supporting construction top is provided with an opening towards this heat-conducting plate, and this supporting construction bottom lock constitutes a hemi-closure space.
8. led lamp as claimed in claim 1, it is characterized in that: described light emitting diode module comprises a circuit board and some light emitting diodes that is distributed on this circuit board, this led lamp also comprises a lampshade, and this lampshade is covered with light emitting diode module in it.
9. led lamp, comprise a light emitting diode module and a radiator structure, this light emitting diode module is fixed on this radiator structure, this radiator structure comprises a heat-conducting plate, at least one heat conducting element and the second radiator that contact with heat-conducting plate, and this light emitting diode module is located on the end face of this heat-conducting plate; The outside of heat-conducting plate is located at the both ends of this heat conducting element, thereby this second radiator and heat conducting element both ends are connected and fixed the side periphery that is arranged at this light emitting diode module, it is characterized in that: described second radiator is separate, each radiator is spaced by some radiating fins and combines, described heat conducting element is straight heat pipe, the both ends of this straight heat pipe are from straight the extending of vertical both sides of this heat-conducting plate side direction, and the radiating fin of described second radiator is set on the both ends of this straight heat pipe respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710076265XA CN101334150B (en) | 2007-06-29 | 2007-06-29 | LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710076265XA CN101334150B (en) | 2007-06-29 | 2007-06-29 | LED lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101334150A CN101334150A (en) | 2008-12-31 |
| CN101334150B true CN101334150B (en) | 2010-12-29 |
Family
ID=40196923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710076265XA Expired - Fee Related CN101334150B (en) | 2007-06-29 | 2007-06-29 | LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101334150B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102261580A (en) * | 2010-05-28 | 2011-11-30 | 利得全股份有限公司 | LED lamp and heat dissipation structure thereof |
| DE102019114885B3 (en) * | 2019-06-03 | 2020-08-13 | Karl Storz Se & Co. Kg | Device for dissipating heat from an endoscopic lighting device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1526504A (en) * | 2003-03-04 | 2004-09-08 | 奇f科技股份有限公司 | Machining method of heat dissipation device |
| CN2659096Y (en) * | 2003-11-17 | 2004-11-24 | 佶鸿电子股份有限公司 | Electronic component cooling module |
| CN1979822A (en) * | 2005-12-01 | 2007-06-13 | 富准精密工业(深圳)有限公司 | Radiating apparatus |
-
2007
- 2007-06-29 CN CN200710076265XA patent/CN101334150B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1526504A (en) * | 2003-03-04 | 2004-09-08 | 奇f科技股份有限公司 | Machining method of heat dissipation device |
| CN2659096Y (en) * | 2003-11-17 | 2004-11-24 | 佶鸿电子股份有限公司 | Electronic component cooling module |
| CN1979822A (en) * | 2005-12-01 | 2007-06-13 | 富准精密工业(深圳)有限公司 | Radiating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101334150A (en) | 2008-12-31 |
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