CN217082228U - LED lamp panel based on ceramic substrate - Google Patents

Abstract

The utility model discloses a LED lamp plate based on ceramic substrate, including ceramic substrate, sliding connection has the cushion in the ceramic substrate, sliding connection has the heat conduction pad in the cushion, the bottom fixedly connected with radiating fin of heat conduction pad, radiating fin and cushion sliding connection, fixedly connected with fixture block on the cushion, fixture block and ceramic substrate joint, sliding connection has the LED lamp plate in the ceramic substrate, the contact of LED lamp plate heat conduction pad, sliding connection has the locating pin in the ceramic substrate. Through set up locating pin and spring in ceramic substrate, the locating pin can stretch out and draw back in ceramic substrate through the spring, then sets up the locating hole that matches with the locating pin on the LED lamp plate, through locating hole and locating pin cooperation, can realize that the LED lamp plate is installed fast and is dismantled on ceramic substrate to compare in traditional mode of bonding, the more stability of installation.

Description

LED lamp panel based on ceramic substrate

Technical Field

The utility model relates to a LED lamp plate field especially relates to a LED lamp plate based on ceramic substrate.

Background

At present, a Light Emitting Diode (LED) lamp is characterized in that an electroluminescent semiconductor material chip is adopted as a basic structure, silver glue or white glue is solidified on a support, then the chip and a circuit board are connected by silver wires or gold wires, then the periphery of the chip and the circuit board are sealed by epoxy resin, the effect of protecting an internal core wire is achieved, and finally a shell is installed. But the encapsulation LED lamp based on ceramic substrate on the existing market has more defect in the in-process of using, for example, because ceramic substrate can install the more LED lamp plate of quantity to the LED lamp plate only with adopt the mode of bonding between the ceramic substrate to install, not only lead to the operation inconvenient when installing, and can't be quick demolish the LED lamp plate, and the heat dissipation problem of LED lamp plate also can not obtain fine solution.

SUMMERY OF THE UTILITY MODEL

The utility model provides a LED lamp plate based on ceramic substrate aims at solving the LED lamp plate and only installs with the mode that adopts the bonding between the ceramic substrate, and it is inconvenient not only to operate when leading to the installation, and can't be quick demolish the LED lamp plate to the heat dissipation problem of LED lamp plate also can not obtain the problem of fine solution.

According to a first aspect of the embodiments of the present application, there is provided a ceramic substrate-based LED lamp panel, including a ceramic substrate, the ceramic substrate is connected with a cushion block in a sliding way, the cushion block is connected with a heat conducting pad in a sliding way, the bottom of the heat conducting pad is fixedly connected with a radiating fin, the radiating fins are connected with the cushion block in a sliding way, a clamping block is fixedly connected on the cushion block and is clamped with the ceramic substrate, an LED lamp panel is connected in the ceramic substrate in a sliding way and is contacted with the heat conducting pad, the ceramic substrate is connected with a positioning pin in a sliding way, the positioning pin is connected with the LED lamp panel in a sliding way, the ceramic substrate is provided with a spring, one end of the spring is fixedly connected with a positioning pin, the other end of the spring is fixedly connected to the inner surface of the ceramic substrate, a shifting rod is fixedly connected to the positioning pin, and the shifting rod is connected with the ceramic substrate in a sliding mode.

The utility model discloses an in the LED lamp plate based on ceramic substrate, radiating fin's quantity is a plurality of, and is a plurality of radiating fin evenly distributed is in the bottom of heat conduction pad. Through the design of radiating fin, can increase the heat exchange capacity of heat conduction pad.

The utility model discloses an in the LED lamp plate based on ceramic substrate, the chip groove has been seted up to the bottom of cushion, chip groove and radiating fin sliding connection, the width in chip groove is greater than radiating fin's width. Through the design of the sheet groove, the circulation between the interior of the cushion block and the outside air is facilitated.

The utility model discloses an in the LED lamp plate based on ceramic substrate, the last draw-in groove of having seted up of ceramic substrate, draw-in groove and fixture block joint. Through the design of draw-in groove, with the fixture block cooperation, have limiting displacement to the cushion.

The utility model discloses an in the LED lamp plate based on ceramic substrate, the locating hole has been seted up on the LED lamp plate, locating hole and locating pin sliding connection. Through the design of locating hole, with the locating pin cooperation, have limiting displacement to the LED lamp plate.

The utility model discloses an in the LED lamp plate based on ceramic substrate, the spout has been seted up on the ceramic substrate, sliding connection has the driving lever in the spout. Through the design of spout, the slip of driving lever is convenient for.

The technical scheme provided by the embodiment of the application can have the following beneficial effects: the application designs a LED lamp plate based on ceramic substrate, through set up locating pin and spring in ceramic substrate, the locating pin can stretch out and draw back in ceramic substrate through the spring, then sets up the locating hole that matches with the locating pin on the LED lamp plate, through locating hole and locating pin cooperation, can realize that the LED lamp plate installs fast and dismantles on ceramic substrate to compare in traditional mode of bonding, the more stability of installation.

Through set up the cushion that can dismantle in ceramic substrate, then set up the heat conduction pad on the cushion, and the bottom of heat conduction pad sets up radiating fin, radiating fin runs through the cushion, and the bottom contact of heat conduction pad and LED lamp plate, can realize the heat exchange with the LED lamp plate through heat conduction pad and radiating fin like this, the heat dissipation of the LED lamp plate of being convenient for, and the inside cavity that sets up of cushion, make like this near the air of chip on the high LED lamp plate of production of heat begin to freely flow to the direction of chip on the low LED lamp plate of production of heat, thereby realize making the circulation of air in the cavity circulate, and discharge from the chip inslot, further make things convenient for the heat dissipation of LED lamp plate.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged view of the structure of portion A of FIG. 1;

FIG. 3 is an enlarged view of the structure of the portion B in FIG. 1;

FIG. 4 is a bottom view of FIG. 1;

fig. 5 is a top view of fig. 1.

1, a ceramic substrate; 2. cushion blocks; 3. a thermally conductive pad; 4. a heat dissipating fin; 5. a sheet groove; 6. a clamping block; 7. a card slot; 8. an LED lamp panel; 9. positioning pins; 10. positioning holes; 11. a spring; 12. a deflector rod; 13. a chute.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be further understood that the term "and/or" as used in the specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items and includes such combinations.

Please refer to fig. 1, fig. 4, the utility model discloses a LED lamp plate based on ceramic substrate, including ceramic substrate 1, sliding connection has cushion 2 in ceramic substrate 1, sliding connection has heat conduction pad 3 in cushion 2, the bottom fixedly connected with radiating fin 4 of heat conduction pad 3, radiating fin 4's quantity is a plurality of, a plurality of radiating fin 4 evenly distributed are in the bottom of heat conduction pad 3, through radiating fin 4's design, can increase heat exchange capacity of heat conduction pad 3, radiating fin 4 and cushion 2 sliding connection.

Please refer to fig. 1, fig. 2, and fig. 4, a sheet groove 5 is formed at the bottom of the cushion block 2, the sheet groove 5 is slidably connected with the heat dissipating fin 4, the width of the sheet groove 5 is greater than the width of the heat dissipating fin 4, the inside of the cushion block 2 is convenient to circulate with the external air by the design of the sheet groove 5, a fixture block 6 is fixedly connected to the cushion block 2, the fixture block 6 is made of rubber, the fixture block 6 is clamped with the ceramic substrate 1, a clamping groove 7 is formed in the ceramic substrate 1, the clamping groove 7 is clamped with the fixture block 6, and the cushion block 2 is limited by the design of the clamping groove 7 and the fixture block 6.

Please refer to fig. 1, fig. 3, fig. 5, sliding connection has LED lamp plate 8 in ceramic substrate 1, LED lamp plate 8 contacts with heat conduction pad 3, sliding connection has locating pin 9 in ceramic substrate 1, locating pin 9 and LED lamp plate 8 sliding connection, locating hole 10 has been seted up on LED lamp plate 8, locating hole 10 and locating pin 9 sliding connection, design through locating hole 10, cooperate with locating pin 9, have limiting displacement to LED lamp plate 8, be provided with spring 11 in ceramic substrate 1, the one end fixedly connected with locating pin 9 of spring 11, the other end fixed connection of spring 11 is in ceramic substrate 1's internal surface, fixedly connected with driving lever 12 on locating pin 9, driving lever 12 and ceramic substrate 1 sliding connection, spout 13 has been seted up on ceramic substrate 1, sliding connection has driving lever 12 in spout 13. The sliding of the shift lever 12 is facilitated by the design of the sliding slot 13.

The utility model discloses the concrete implementation process as follows: when the LED lamp panel is used, the cushion block 2 is placed in the ceramic substrate 1, the clamping block 6 on the cushion block 2 is clamped in the clamping groove 7 of the ceramic substrate 1 to limit the cushion block 2, the heat conducting pad 3 is placed in the cushion block 2, the heat radiating fins 4 at the bottom of the heat conducting pad 3 penetrate through the cushion block 2 and are placed in the sheet grooves 5 on the cushion block 2, the shift lever 12 is shifted, the shift lever 12 drives the positioning pins 9 to slide in the ceramic substrate 1 and compress the springs 11 while sliding, the LED lamp panel 8 is placed in the ceramic substrate 1, the heat conducting pad 3 is contacted with the bottom of the LED lamp panel 8, the shift lever 12 is released, the springs 11 reset at the moment to push back the positioning pins 9 and reset the positioning pins 9 into the positioning holes 10 on the LED lamp panel 8, so as to limit the LED lamp panel 8, the installation of the LED lamp panel 8 is completed, and the LED lamp panel 8 can be detached and replaced at a later stage only by separating the positioning pins 9 from the positioning holes 10 through the shift lever 12, simple and convenient, and compare in traditional mode of bonding, the more stability of installation, LED lamp plate 8 during operation can produce the heat, and the heat carries out the heat exchange through heat conduction pad 3 and radiating fin 4, the heat dissipation of LED lamp plate 8 of being convenient for, and 2 inside cavities that set up of cushion, make like this that the air near the high chip of production heat begins to the direction free flow to the low chip of production heat on the LED lamp plate 8, thereby realize making the circulation of air in the cavity, and discharge from the sheet groove 5, further make things convenient for the heat dissipation of LED lamp plate 8.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (6)

1. The utility model provides a LED lamp plate based on ceramic substrate, includes ceramic substrate, its characterized in that, sliding connection has the cushion in the ceramic substrate, sliding connection has the heat conduction pad in the cushion, the bottom fixedly connected with radiating fin of heat conduction pad, radiating fin and cushion sliding connection, fixedly connected with fixture block on the cushion, fixture block and ceramic substrate joint, sliding connection has the LED lamp plate in the ceramic substrate, LED lamp plate and heat conduction pad contact, sliding connection has the locating pin in the ceramic substrate, locating pin and LED lamp plate sliding connection, be provided with the spring in the ceramic substrate, the one end fixedly connected with locating pin of spring, the other end fixed connection of spring is in ceramic substrate's internal surface, fixedly connected with driving lever on the locating pin, driving lever and ceramic substrate sliding connection.

2. The LED lamp panel based on the ceramic substrate according to claim 1, wherein the number of the heat dissipation fins is multiple, and the multiple heat dissipation fins are uniformly distributed at the bottom of the heat conduction pad.

3. The LED lamp panel based on the ceramic substrate according to claim 1, wherein a sheet groove is formed in the bottom of the cushion block, the sheet groove is connected with the radiating fins in a sliding mode, and the width of the sheet groove is larger than that of the radiating fins.

4. The LED lamp panel based on the ceramic substrate according to claim 1, wherein the ceramic substrate is provided with a clamping groove, and the clamping groove is clamped with the clamping block.

5. The LED lamp panel based on the ceramic substrate according to claim 1, wherein the LED lamp panel is provided with a positioning hole, and the positioning hole is slidably connected with the positioning pin.

6. The LED lamp panel based on the ceramic substrate according to claim 1, wherein a sliding groove is formed in the ceramic substrate, and a shift lever is connected in the sliding groove in a sliding manner.

Images