CN210986564U

CN210986564U - L ED packaging circuit board with half plug holes

Info

Publication number: CN210986564U
Application number: CN201921588731.7U
Authority: CN
Inventors: 陈建军; 石林国; 廖晓川; 柯雪丽; 蓝建明
Original assignee: Quzhou Shunluo Circuit Board Co ltd
Current assignee: Quzhou Shunluo Circuit Board Co ltd
Priority date: 2019-09-23
Filing date: 2019-09-23
Publication date: 2020-07-10
Anticipated expiration: 2029-09-23

Abstract

The utility model provides an L ED packaging circuit board of half consent, including the base plate that has the via hole and installing a plurality of L ED units on the base plate, the via hole is through the louvre that the heat dissipation glue filling is half consent form, just the via hole is towards the one end of base plate heating face for the form of windowing, and the one end packing that the heating face was kept away from to the via hole has the heat dissipation glue, the one side that the heating face was kept away from to the base plate still has the plane fin, just the plane fin passes through the heat dissipation glue is fixed on the base plate, the utility model discloses compare in the fin of prior art fin form, adopt the fin to occupy littleer space, just the utility model discloses constitute radiating component with fin and half consent for the heat dissipation together, can guarantee the radiating effect on the basis that occupies less space.

Description

L ED packaging circuit board with half plug holes

Technical Field

The utility model belongs to the technical field of L ED module support plate, especially, relate to a L ED packaging circuit board of half consent.

Background

The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.

The PCB plug hole is used for plugging part of plug holes of a part of PCB with an insulating material so as to prevent short circuit caused by tin flowing during welding, and can also prevent short circuit caused by oxidation or corrosion of non-part holes by the external environment so as to cause poor electrical property. In the actual production of the PCB, some customers have special requirements for the PCB jack: it is required that the insulating material is not completely filled even if the plug hole is in a half-plug hole state.

In addition, a large number of electronic components are generally integrated on the circuit board, so that more heat is generally generated in the working process, for example, L ED packaged circuit boards generate more heat in L ED working process, and poor heat dissipation can cause L ED service life to be greatly reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at the above-mentioned problem, provide an L ED encapsulated circuit board of half consent.

In order to achieve the above purpose, the utility model adopts the following technical proposal:

the utility model provides an L ED packaging circuit board of half consent, includes the base plate that has the via hole and installs a plurality of L ED units on the base plate, the via hole is the louvre of half consent form through the heat dissipation glue filling, just the via hole is the form of windowing towards the one end of base plate heating face, and the one end that the heating face was kept away from to the via hole is filled with the heat dissipation glue, the one side that the heating face was kept away from to the base plate still has the planar fin, just the planar fin passes through the heat dissipation glue is fixed on the base plate.

In the L ED package circuit board with half-plugs, the light emitting element of the L ED unit is located on the heat generating surface of the substrate, and the planar heat sink is located on the side of the substrate away from the light emitting element.

In the above-mentioned half-plugged L ED package circuit board, the planar heat sink is mounted on the substrate via the heat-dissipating adhesive in an empty space.

In the L ED package circuit board with half plug holes, the surface of the planar heat sink close to the substrate has a plurality of insertion posts corresponding to the heat dissipation holes, the insertion posts are inserted into the heat dissipation holes, and the planar heat sink is fixed on the substrate by the bonding effect of the heat dissipation glue on the insertion posts.

In the L ED package circuit board with half-plugs, the plug posts extend from the planar heat sink toward one side of the substrate, and the diameter of the plug posts is equal to or slightly smaller than that of the via holes, so that the plug posts can be inserted into the via holes.

In the L ED package circuit board with the half plug hole, the plug column is of a hollow structure or a solid structure, and when the plug column is of a hollow structure, the heat dissipation adhesive is filled in the gap structure of the plug column.

In the L ED package circuit board with half-plugs, the planar heat sink is made of copper, aluminum or thermally conductive silicone.

In the L ED package circuit board with the half plug holes, the main raw material of the heat dissipation glue is organic silicon rubber.

In the above-described half-plugged L ED package circuit board, the substrate is made of a black BT resin material.

In the above-mentioned semi-plugged L ED package circuit board, the via hole is also filled with ink in the middle.

The utility model has the advantages of, compare in the fin of prior art fin form, adopt the plane fin to occupy less space, just the utility model discloses constitute radiating component with the fin with half consent together with the heat dissipation, can guarantee the radiating effect on the basis that occupies less space.

Drawings

Fig. 1 is a schematic cross-sectional view of a package circuit board according to a first embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of a packaged circuit board according to a second embodiment of the present invention;

fig. 3 is a schematic cross-sectional view of a third embodiment of the present invention.

The reference numerals of the LED chip comprise a substrate 1, a through hole 11, L ED units 2, heat dissipation glue 3, a planar heat dissipation sheet 4, a plug column 41 and ink 5.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

Example one

As shown in fig. 1, the present embodiment discloses an L ED package circuit board with half plugs, which includes a substrate 1 having through holes 11 and a plurality of L ED units 2 mounted on the substrate 1, wherein the through holes 11 are filled with heat dissipation holes in the form of half plugs through heat dissipation glue 3, and one end of the through holes 11 facing to the heat emitting surface of the substrate 1 is in the form of a window, one end of the through holes 11 facing away from the heat emitting surface is filled with the heat dissipation glue 3, one surface of the substrate 1 facing away from the heat emitting surface is further provided with planar heat sinks 4, and the planar heat sinks 4 are fixed on the substrate 1 through the heat dissipation glue 3.

Specifically, the L ED unit 2 has its light emitting element located on the heat generating surface of the substrate 1, the planar heat sink 4 located on the side of the substrate 1 away from the light emitting element, and the planar heat sink 4 is fixed to the substrate 1 via the heat dissipating adhesive 3 in an overhead manner, so that a certain heat dissipating space is left between the substrate 1 and the planar heat sink 4.

Preferably, one surface of the planar heat sink 4 close to the substrate 1 is provided with a plurality of insertion posts 41 corresponding to the heat dissipation holes, the insertion posts 41 are inserted into the heat dissipation holes, and the planar heat sink 4 is fixed on the substrate 1 by the adhesion of the heat dissipation glue 3 to the insertion posts 41. when the package circuit board is manufactured, firstly, the basic circuit including L ED is installed on the substrate 1, then the heat dissipation glue 3 is injected into the via holes 11, the insertion posts 41 are inserted into the via holes 11 in a one-to-one correspondence manner before the heat dissipation glue 3 is cured, the insertion posts 41 can be adhered to the via holes after the heat dissipation glue is cured, and the heat dissipation glue 11 and the insertion posts 41 are in mutual contact, thereby improving the heat transfer effect.

Specifically, the plug column 41 is a solid structure, and the plug column 41 is formed by extending the planar heat sink 4 to one side of the substrate 1, and the planar heat sink 4 may be made of copper, aluminum, or thermally conductive silicone. The diameter of the plugging column 41 is slightly smaller than the diameter of the via hole 11, so that the plugging column 41 can be plugged into the via hole 11, the diameter of the via hole is determined by the diameter of the via hole, and the plugging column 41 is only required to be as large as possible and can be plugged into the via hole 11.

Further, the main raw material of the heat dissipation rubber 3 is silicone rubber, for example, TC series silicone rubber for heat dissipation has good electrical insulation performance and heat dissipation performance.

Further, the L ED package circuit board requires the substrate to have sufficient light shielding and cannot affect the L ED light emission color, so the substrate 1 is made of black BT resin material.

This embodiment adopts planar fin, occupies less space for the fin of fin form, just the utility model discloses constitute radiating component with fin and heat dissipation with half consent together, guarantee the radiating effect

Example two

As shown in fig. 2, the plug post 41 of the present embodiment is a hollow structure, the heat dissipation glue 3 is filled in the void structure of the plug post 41, and the heat dissipation glue in the void structure and the heat dissipation glue in the heat dissipation holes are a continuous structure, when manufacturing the package circuit board, the basic circuit including L ED may be mounted on the substrate 1, then the plug posts 41 are inserted into the via holes 11 in a one-to-one correspondence manner, and finally the heat dissipation glue 3 is driven into the via holes 11 from one end of the via holes 11 far away from the planar heat dissipation plate 4, and the plug posts 41 can be bonded in the via holes after the heat dissipation glue is cured.

EXAMPLE III

As shown in fig. 3, the present embodiment is similar to the embodiment, except that the middle of the via hole of the present embodiment is further filled with ink 5 to improve the light-tight property of the via hole and ensure L ED light-emitting effect.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Although the terms substrate 1, via 11, L ED unit 2, thermal paste 3, planar heat sink 4, stud 41, ink 5, etc. are used more often herein, the possibility of using other terms is not excluded.

Claims

1. The utility model provides an L ED packaging circuit board of half consent, includes base plate (1) that has via hole (11) and installs a plurality of L ED unit (2) on base plate (1), its characterized in that, via hole (11) fill for half consent form louvre through heat dissipation glue (3), just via hole (11) are the form of windowing towards the one end of base plate (1) heating face, and the one end that heating face was kept away from in via hole (11) is filled has heat dissipation glue (3), the one side that heating face was kept away from in base plate (1) still has fin (4), just plane fin (4) pass through heat dissipation glue (3) are fixed on base plate (1).

2. The L ED package circuit board of half-tap hole of claim 1, wherein the light emitting element of the L ED unit (2) is located on the heat generating surface of the substrate (1), and the planar heat sink (4) is located on the side of the substrate (1) away from the light emitting element.

3. L ED package circuit board of half-tap hole according to claim 2, characterized in that the planar heat sink (4) is fixed overhead on the base board (1) by the heat dissipation glue (3).

4. The L ED package circuit board of half plug hole of claim 3, wherein the planar heat sink (4) has a plurality of insertion posts (41) corresponding to the heat dissipation holes on a surface thereof near the substrate (1), the insertion posts (41) are inserted into the heat dissipation holes, and the planar heat sink (4) is fixed on the substrate (1) by the adhesion of the heat dissipation adhesive (3) to the insertion posts (41).

5. The L ED package circuit board of half-tap hole of claim 4, wherein the plugging column (41) is extended from the planar heat sink (4) to one side of the substrate (1), and the diameter of the plugging column (41) is equal to or slightly smaller than that of the via hole (11) so that the plugging column (41) can be plugged into the via hole (11).

6. The L ED package circuit board of half-tap hole as claimed in claim 5, wherein the plug posts (41) are hollow or solid, and when the plug posts (41) are hollow, the heat dissipation adhesive (3) is filled in the void structure.

7. The L ED package circuit board of half-tap of any one of claims 1-6, wherein the planar heat sink (4) is made of copper material, aluminum material or thermally conductive silicone.

8. The L ED package circuit board of half-tap hole of any one of claims 1-6, wherein the main raw material of the heat dissipation glue (3) is silicone rubber.

9. The L ED package circuit board of half-tap hole of any one of claims 1-6, wherein the substrate (1) is made of a BT resin material with black color.

10. The L ED package circuit board of half-tap hole according to claim 9, wherein the via hole is also filled with ink (5) in the middle.