CN111954391A - Circuit board packaging method, circuit board and electronic equipment - Google Patents
Circuit board packaging method, circuit board and electronic equipment Download PDFInfo
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- CN111954391A CN111954391A CN202010873223.4A CN202010873223A CN111954391A CN 111954391 A CN111954391 A CN 111954391A CN 202010873223 A CN202010873223 A CN 202010873223A CN 111954391 A CN111954391 A CN 111954391A
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- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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Abstract
The embodiment of the application provides a circuit board packaging method, a circuit board and electronic equipment. The method comprises the following steps: the end face of the preset structure is provided with a plugging piece, the plugging piece is used for plugging the preset structure, the preset structure comprises a hollow columnar structure, the preset structure provided with the plugging piece is arranged on a circuit board to obtain a preset circuit board, the preset circuit board is placed in an encapsulation mold, encapsulation materials are arranged in the encapsulation mold, the preset circuit board provided with the plugging piece is encapsulated through the encapsulation materials to obtain the encapsulated preset circuit board, the plugging piece in the encapsulated preset circuit board is removed, and the encapsulated circuit board is obtained. That is, in this application embodiment, after through encapsulating material to the predetermined circuit board encapsulation that is provided with the shutoff piece, only need get rid of the shutoff piece in the predetermined circuit board after the encapsulation, need not to punch in encapsulating material to can reduce the time of punching, thereby make when installing the circuit board after will encapsulating in electronic equipment, can improve the installation effectiveness.
Description
Technical Field
The present application relates to the field of communications technologies, and in particular, to a circuit board packaging method, a circuit board, and an electronic device.
Background
Currently, electronic devices are all mounted with circuit boards. Typically, the circuit board needs to be packaged before the electronic device is mounted on the circuit board.
In the related art, a circuit board is placed in a packaging mold, the circuit board is packaged by packaging materials in the packaging mold, and the packaging materials are fixed on the circuit board after the packaging is finished.
In the process of implementing the present application, the inventors found that at least the following problems exist in the related art: after the circuit board is packaged, holes need to be punched in the packaging material on the circuit board to mount the circuit board in the electronic device, so that the mounting efficiency of mounting the packaged circuit board in the electronic device is low.
Content of application
The embodiment of the application provides electronic equipment, and the problem that in the related art, the installation efficiency of a circuit board after being installed and packaged in the electronic equipment is low can be solved.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a circuit board packaging method, where the circuit board packaging method includes:
arranging a plugging piece on the end face of a preset structure, wherein the plugging piece is used for plugging the preset structure, and the preset structure comprises a hollow columnar structure;
arranging the preset structure provided with the plugging piece on a circuit board to obtain a preset circuit board;
placing the preset circuit board in a packaging mold, wherein a packaging material is arranged in the packaging mold, and packaging the preset circuit board provided with the plugging piece through the packaging material to obtain a packaged preset circuit board;
and removing the plugging piece in the packaged preset circuit board to obtain the packaged circuit board.
In a second aspect, an embodiment of the present application provides a circuit board, where the circuit board is packaged by the circuit board packaging method described in the first aspect.
In a third aspect, an embodiment of the present application provides an electronic device, which includes the circuit board described in the second aspect.
In this application embodiment, set up the shutoff piece at the terminal surface of predetermineeing the structure, the shutoff piece is used for the shutoff to predetermine the structure, it includes the hollow columnar structure to predetermine the structure, the predetermined structure that will be provided with the shutoff piece sets up on the circuit board, obtain predetermine the circuit board, will predetermine the circuit board and place in packaging mold, be provided with encapsulating material in the packaging mold, through encapsulating material to the predetermined circuit board encapsulation that is provided with the shutoff piece, obtain the predetermined circuit board after the encapsulation, get rid of the shutoff piece in the predetermined circuit board after the encapsulation, obtain the circuit board after the encapsulation. That is, in this application embodiment, after the predetermined circuit board that is provided with the shutoff piece is encapsulated through encapsulating material, only need get rid of the shutoff piece in the predetermined circuit board after the encapsulation, need not to punch in encapsulating material to can reduce the time of punching, thereby make when installing the circuit board after will encapsulating in electronic equipment, can improve the installation effectiveness.
Drawings
Fig. 1 is a flowchart illustrating a circuit board packaging method according to an embodiment of the present disclosure;
FIG. 2 illustrates an exploded view of a default configuration provided by an embodiment of the present application;
FIG. 3 is a schematic view of a plug member according to an embodiment of the present invention bonded to an end face of a hollow cylindrical structure;
fig. 4 is a top view of a circuit board according to an embodiment of the present disclosure;
fig. 5 is a schematic diagram illustrating a preset structure provided with a blocking piece and arranged on a circuit board according to an embodiment of the present application;
fig. 6 is a cross-sectional view of a preset structure provided with a blocking member, which is provided on a circuit board according to an embodiment of the present application;
FIG. 7 is an exploded view of another default configuration provided by an embodiment of the present application;
fig. 8 is a schematic view of a plugging member provided in an embodiment of the present application, which is disposed on an end surface of a predetermined structure;
fig. 9 is a schematic view of a package mold according to an embodiment of the present disclosure;
FIG. 10 is a schematic diagram of another package mold according to an embodiment of the present disclosure;
fig. 11 is a schematic view illustrating an electronic component package with a packaging material according to an embodiment of the present disclosure;
fig. 12 is a schematic diagram of a packaged circuit board according to an embodiment of the present application;
fig. 13 is a schematic diagram illustrating a shielding layer disposed on a packaged circuit board according to an embodiment of the present application;
fig. 14 is a schematic diagram illustrating a mounting of a packaged circuit board to a mounting member according to an embodiment of the present application;
fig. 15 is a schematic view illustrating a mounting of a packaged circuit board to a mounting member according to an embodiment of the present application.
Reference numerals:
10: a circuit board; 11: an electronic component; 12: a mechanical aperture; 20: presetting a structure; 21: a hollow columnar structure; 22: a base; 30: a blocking member; 31: an adhesive member; 41: a first front mold; 42: a first rear mold; 50: packaging materials; 61: a second front mold; 62: a second rear mold; 70: a shielding layer; 80: a bolt; 90: and (4) a mounting piece.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Referring to fig. 1, a flowchart of a circuit board packaging method provided in an embodiment of the present application is shown, and as shown in fig. 1, the circuit board packaging method includes:
step 101: and arranging a plugging piece on the end face of the preset structure.
Wherein, the shutoff piece is used for the shutoff to predetermine the structure, predetermines the structure and includes hollow columnar structure.
In some embodiments, the implementation of step 101 may be: the plugging piece is bonded on the end face of the preset structure through the bonding piece, so that the plugging piece blocks the preset structure.
For example, referring to fig. 2, an exploded view of a preset structure provided in the embodiment of the present application is shown, referring to fig. 3, a schematic view of a plugging member provided in the embodiment of the present application being bonded to an end face of a hollow columnar structure is shown, and as shown in fig. 2 and 3, a plugging member 30 may be bonded to an end face of a hollow columnar structure 21 by a bonding member 31. In the bonding process, the adhesive 31 and the plug 30 may be bonded first, and then the plug 30 bonded with the adhesive 31 may be bonded to the end face of the hollow columnar structure 21. Of course, the adhesive 31 may be bonded to the end face of the hollow columnar structure 21 first, and then the closing member 30 may be bonded to the adhesive 31, which is not limited herein in the embodiment of the present application.
It should be noted that, when the end face of the preset structure is provided with the plugging piece, the plugging piece may be provided on one end face of the preset structure, and the plugging pieces may also be provided on two end faces of the two ends of the preset structure.
In addition, because it includes the hollow column structure to predetermine the structure, consequently, after the terminal surface of predetermineeing the structure sets up the shutoff piece, the shutoff piece alright with the shutoff of hollow column structure for when subsequently encapsulating the circuit board, encapsulating material gets into in the cavity of hollow column structure.
It should be noted that, in the embodiment of the present application, the adhesive member may be a double-sided tape, of course, the adhesive member may also be of another type, and the embodiment of the present application is not limited herein.
In addition, in this application embodiment, a material of the blocking element may be polyester resin (PET), and certainly, the material of the blocking element may also be other types, and this application embodiment is not limited herein.
In addition, in this application embodiment, when predetermineeing the structure and including hollow column structure, predetermineeing and can also be provided with the screw thread on the inner wall of structure, be convenient for follow-up after finishing circuit board encapsulation, pass through the bolt with the circuit board after the encapsulation and install in electronic equipment.
Step 102: and arranging the preset structure provided with the plugging piece on the circuit board to obtain the preset circuit board.
The implementation manner of step 102 may be: and arranging the preset structure provided with the plugging piece on the circuit board through a welding process to obtain the preset circuit board.
In addition, in the embodiment of the present application, when the structures of the circuit boards are different, the preset structures may also be different, and further, the implementation manner of step 102 may also be different, and specifically there may be the following two types:
(1) the circuit board is provided with a mechanical hole. The implementation of step 102 is: and arranging the preset structure provided with the plugging piece on the circuit board, and embedding the preset structure into the mechanical hole.
When the circuit is provided with a mechanical hole, the preset structure provided with the plugging piece can be embedded into the mechanical hole when being arranged on the circuit board, and the preset structure is welded with the circuit board through a welding process. Due to the fact that the embedded mechanical hole is preset, when the circuit board is packaged and preset, the mechanical hole of the circuit board can provide certain supporting force for the preset structure, and the problem that the preset structure is inclined possibly is avoided.
For example, referring to fig. 4, a top view of a circuit board provided in an embodiment of the present application is shown, referring to fig. 5, a schematic diagram of a preset structure provided with a blocking element provided in an embodiment of the present application is shown on the circuit board, referring to fig. 6, a cross-sectional diagram of a preset structure provided with a blocking element provided in an embodiment of the present application is shown on the circuit board, as shown in fig. 4, 5 and 6, when a mechanical hole 12 is provided on the circuit board 10, a hollow cylindrical structure 21 provided with a blocking element 30 may be inserted into the mechanical hole 12 on the circuit board 10.
As shown in fig. 4, the circuit board 10 is generally provided with an electronic component 11.
(2) The circuit board is not provided with a mechanical hole, and at the moment, the preset structure can further comprise a base which is connected with the hollow columnar structure. The implementation of step 102 may be: the base is arranged on the circuit board, and the columnar structure is far away from the circuit board.
Because the circuit board is not provided with the mechanical hole, if the structure of predetermineeing that will only include the columnar structure directly sets up on the circuit board, predetermines the easy problem that the incline appears in the structure, at this moment, predetermine the structure and can also include the base, the base is connected with cavity columnar structure, at this moment, can pass through welding process with the base and weld on the circuit board, and cavity columnar structure keeps away from the circuit board. Because the welding area of base and circuit board welded is great, and the base is connected with hollow columnar structure, consequently, after with the base welding on the circuit, the base can form comparatively firm connection with between the circuit board, avoids hollow columnar structure to appear the problem of incline.
For example, referring to fig. 7, which shows an exploded view of another preset structure provided in the embodiment of the present application, and referring to fig. 8, which shows a schematic diagram that a blocking member provided in the embodiment of the present application is disposed on an end surface of the preset structure, as shown in fig. 7 and 8, the preset structure 20 may include a base 22, the base 22 and a hollow columnar structure 21, where, when the preset structure 20 is disposed on the circuit board 10, the base 22 may be disposed on the circuit board 10, and the hollow columnar structure 21 is away from the circuit board 10.
In addition, in the embodiment of the present application, after step 102, that is, after the preset structure provided with the blocking piece is disposed on the circuit board, the preset circuit board may be further detected to determine whether the preset structure is shifted.
For the above mode (1), Automatic Optical Inspection (AOI) equipment may be used to perform automatic Optical Inspection on the preset circuit board, so as to determine whether the central axis of the preset structure is collinear with the central line of the mechanical hole on the circuit board. If the central axis of the preset structure is collinear with the central line of the mechanical hole in the circuit board, the preset structure is not deviated, after the circuit board is packaged, when the circuit board is installed in the electronic equipment, the bolt penetrates through the preset structure, the preset structure cannot block the bolt, and the packaged circuit board is conveniently installed in the electronic equipment. If the central axis of the preset mechanism is not collinear with the central line on the circuit board, it is indicated that the preset structure is deviated, after the circuit board is packaged, when the circuit board is installed in the electronic equipment, when the bolt penetrates through the preset structure, because the deviation of the preset mechanism causes the preset structure to block the bolt, when the bolt is forced to penetrate through the preset structure, the damage to the circuit board may be caused, and the efficiency of installing the packaged circuit board in the electronic equipment is low, at this moment, the position of the preset structure on the circuit needs to be adjusted, so that the central axis of the preset structure is collinear with the central line of the mechanical hole on the circuit board.
For the above mode (2), Automatic Optical Inspection (AOI) equipment may also be used to perform automatic Optical Inspection on the preset circuit board, so as to determine whether the middle frame columnar structure is perpendicular to the circuit board. If the hollow columnar structure is perpendicular to the circuit board, the hollow columnar structure is not deflected, after the circuit board is packaged, when the circuit board is installed in the electronic equipment, the bolt penetrates through the hollow columnar structure, the hollow columnar structure cannot block the bolt, and the packaged circuit board is conveniently installed in the electronic equipment. If the hollow columnar structure is not perpendicular to the circuit board, it indicates that the hollow columnar structure is deflected, after the circuit board is packaged, when the circuit board is installed in the electronic device and the bolt passes through the hollow columnar structure, the hollow columnar structure may obstruct the bolt due to the deflection of the hollow columnar structure, and when the bolt is forced to pass through the hollow columnar structure, the circuit board may be damaged and the efficiency of installing the packaged circuit board in the electronic device is low.
It should be noted that, in this embodiment of the application, step 102 may be further performed first, and then step 101 is performed, that is, the preset structure is first disposed on the circuit board, and then the blocking piece is disposed on the preset structure, so that the blocking piece blocks the preset structure, and the preset circuit board is obtained. The embodiments of the present application are not limited herein.
Step 103: the method comprises the steps of placing a preset circuit board in an encapsulation mold, arranging an encapsulation material in the encapsulation mold, and encapsulating the preset circuit board provided with a plugging piece through the encapsulation material to obtain the encapsulated preset circuit board. Wherein, the packaging material is a thermosetting material.
The properties of the thermosetting material are that the thermosetting material can be melted into a liquid state when the thermosetting material is heated for the first time, and the continuous heating can be changed into a solid state from the liquid state. After the first heating, the thermosetting material is heated again and does not change from a solid state to a liquid state.
In the embodiment of the present application, when the packaging molds are different, the implementation manner of step 103 is also different, and specifically there may be the following two manners:
(a) referring to fig. 9, which shows a schematic diagram of a package mold provided in an embodiment of the present application, as shown in fig. 9, the package mold includes a first front mold 41 and a first rear mold 42 that are matched with each other, the first rear mold 42 has a groove thereon, and a package material 50 is disposed in the groove. At this time, the implementation manner of step 103 may be: fixing a preset circuit board on the first front mold, attaching the first front mold to the first rear mold, heating the packaging mold to a preset temperature to cure the packaging material, and packaging the preset circuit board through the cured packaging material.
It should be noted that the packaging material disposed in the groove may be in a liquid state or a solid state. At this time, the encapsulation material being provided in the groove means that the encapsulation material is placed in the groove. The preset temperature may be a temperature corresponding to a solidification point of the encapsulation material.
Since the encapsulating material is a thermosetting material and the preset temperature is a temperature corresponding to a solidification point of the encapsulating material, when the encapsulating mold is heated to the preset temperature, the encapsulating material is solidified, that is, the encapsulating material is changed from a liquid state to a solid state. Because the preset circuit board is fixed on the first front mold, after the first front mold is attached to the first rear mold, the first front mold and the first rear mold can be heated simultaneously, so that the packaging material in the packaging mold is heated, when the temperature in the packaging mold reaches the preset temperature, the packaging material is cured, and the cured packaging material is fixed on the circuit board to package the preset circuit board.
It should be noted that, encapsulating the preset circuit board refers to encapsulating the electronic components on the preset circuit board, that is, encapsulating the electronic components on the preset circuit board by using an encapsulating material.
In addition, in this application embodiment, when laminating first front mould with first back mould, can make the encapsulating material in the recess of presetting electronic components on the circuit board orientation first back mould for the encapsulation can be to this electronic components encapsulation.
In addition, in the embodiment of the present application, an implementation manner of heating the package mold to the preset temperature may be: the packaging mold is placed in the heating device, the packaging mold is heated through the heating device, and in the heating process, the temperature can be controlled, so that the heating temperature can reach the preset temperature, and the packaging mold is heated to the preset temperature.
(b) Referring to fig. 10, a schematic diagram of another package mold provided in the embodiment of the present application is shown, and as shown in fig. 10, the package mold includes a second front mold 61 and a second rear mold 62 that are matched with each other, and a through hole is provided in the second rear mold 62. At this time, the implementation manner of step 103 may be: fixing a preset circuit board on the second rear mold; attaching the second front mold and the second rear mold; injecting a packaging material into the packaging mold through the through hole; applying a preset pressure to the encapsulation mold to flow the encapsulation material; heating the packaging mold to a preset temperature to cure the packaging material; and encapsulating the preset circuit board by the cured encapsulating material.
Note that, by injecting the encapsulating material into the encapsulating mold, the encapsulating material is in a liquid state at this time.
As shown in fig. 10, since the predetermined circuit board is fixed to the second rear mold 62, after the second front mold 61 and the second rear mold 62 are attached, the predetermined circuit board is located in a space surrounded by the second front mold 61 and the second rear mold 62. Since the second rear mold 62 is provided with the through hole, after the second front mold 61 and the second rear mold 62 are attached to each other, the liquid encapsulating material 50 can be injected into the space surrounded by the second front mold 61 and the second rear mold 62 through the through hole, and during the process of injecting the encapsulating material 50, the encapsulating material 50 can be injected into the space at a certain pressure, so that the encapsulating material 50 can flow in the space, and the electronic component on the preset circuit is covered by the encapsulating material 50 after flowing. Or after injecting the encapsulating material 50 into the space, applying a predetermined pressure to the encapsulating mold, wherein the liquid encapsulating material 50 in the space flows in the space under the action of the pressure, and then the liquid encapsulating material 50 can cover the electronic component 11 on the predetermined circuit board. And then heating the packaging mold to a preset temperature, curing the liquid packaging material, and fixing the cured packaging material on the circuit board to package the circuit board.
For example, referring to fig. 11, a schematic diagram of an electronic component packaged by a packaging material provided in an embodiment of the present application is shown. As shown in fig. 11, the electronic component 11 is covered by the cured encapsulating material 50, so as to form an encapsulation of the circuit board 10 by the encapsulating material 50.
In addition, in the embodiment of the present application, an implementation manner of heating the package mold to the preset temperature may be: the packaging mold is placed in the heating device, the packaging mold is heated through the heating device, and in the heating process, the temperature can be controlled, so that the heating temperature can reach the preset temperature, and the packaging mold is heated to the preset temperature.
In addition, in the embodiment of the present application, the encapsulation mold may include a second front mold and a second rear mold that are matched with each other, and the second front mold may be provided with a through hole.
Step 104: and removing the sealing piece in the packaged preset circuit board to obtain the packaged circuit board.
In the embodiment of the present application, when the adopted processes are different, the implementation manner of step 104 is also different, and specifically there may be the following two types:
the first method comprises the following steps: and grinding the plugging piece in the packaged preset circuit board by adopting a grinding process to remove the plugging piece so as to obtain the packaged circuit board.
When the grinding process is adopted to grind the plugging piece in the packaged preset circuit board, the grinding piece with the strength greater than that of the plugging piece can be selected to grind the plugging piece, so that the grinding piece can remove the plugging piece, and after the plugging piece is removed, the plugging piece cannot block the preset structure. When the packaged circuit board needs to be installed in the electronic device, a bolt can be embedded in the preset structure, and the packaged circuit board can be installed in the electronic device through the bolt.
It should be noted that the polishing member may be made of a metal material, and of course, the polishing member may also be made of other materials, which is not limited herein in this embodiment of the application.
And the second method comprises the following steps: and burning the plugging piece in the packaged circuit board by adopting laser to remove the plugging piece, thereby obtaining the packaged circuit board.
When the laser is used for burning the plugging piece in the packaged circuit board, the packaged preset circuit board can be fixed on the laser emitting device, then the laser emitting device emits laser, and the laser can burn the plugging piece in the packaged circuit board, so that the plugging piece is not in a plugging preset structure.
For example, referring to fig. 12, a schematic diagram of a packaged circuit board provided in an embodiment of the present application is shown, and as shown in fig. 12, a plugging member in a preset circuit board after packaging may be removed, so that the plugging member no longer plugs the hollow columnar structure 21, and a packaged circuit board is obtained.
In addition, after step 104, the circuit board packaging method provided in the embodiment of the present application may further include: and arranging a shielding layer on the packaged circuit board.
When the shielding layer is arranged on the packaged circuit board, the shielding layer can shield the electronic components on the packaged circuit board, and the electronic components are prevented from being interfered by other devices in the electronic equipment. The shielding layer may contain a metal.
It should be noted that, when the shielding layer is disposed on the packaged circuit board, the shielding layer can avoid the preset structure, and prevent the shielding layer from plugging the preset structure, which is disadvantageous to the problem of installing the packaged circuit board in the electronic device.
For example, referring to fig. 13, a schematic diagram of providing a shielding layer on an encapsulated circuit board according to an embodiment of the present application is shown, as shown in fig. 13, a shielding layer 80 may be provided on the encapsulated circuit board, and the shielding layer 80 avoids the hollow columnar structure 21, so as to avoid blocking the hollow columnar structure 21.
In addition, in the embodiment of the present application, the predetermined structure may be made of a metal material. When the preset structure is made of metal, when the bolt is embedded into the preset structure to install the packaged circuit board in the electronic equipment, the metal in the shielding layer can be conducted with the electronic equipment through the bolt, so that the packaged circuit board and the shielding layer are grounded better, and the electronic equipment with the packaged circuit board is more stable in operation.
In addition, in the embodiment of the present application, the mounting manner of the packaged circuit board is also different when the circuit board is mounted on the mounting member in the electronic device according to whether the mechanical hole is provided in the circuit board. If the circuit board is provided with mechanical holes, when the packaged circuit board is mounted on the mounting component, the packaged circuit board can be penetrated through by bolts and then embedded in the mounting component. If the circuit board is not provided with mechanical holes, when the packaged circuit board is mounted on the mounting piece, the mounting piece can be penetrated through by bolts and then embedded in the packaged circuit board.
For example, referring to fig. 14, which shows a schematic diagram of mounting the packaged circuit board on the mounting member according to an embodiment of the present application, and referring to fig. 15, which shows another schematic diagram of mounting the packaged circuit board on the mounting member according to an embodiment of the present application, as shown in fig. 14, a mechanical hole is provided on the circuit board 10, and when the packaged circuit board is mounted, a bolt may be inserted through the hollow cylindrical structure 21 and embedded in the mounting member 90, so that the packaged circuit board is mounted on the mounting member 90. As shown in fig. 15, the circuit board 10 is not provided with a mechanical hole, and when the packaged circuit board is mounted, a bolt may be inserted through the mounting member 90 so as to be embedded in the hollow cylindrical structure 21. Wherein, the inner wall of the hollow cylindrical structure 21 may be provided with screw threads.
In this application embodiment, set up the shutoff piece at the terminal surface of predetermineeing the structure, the shutoff piece is used for the shutoff to predetermine the structure, it includes the hollow columnar structure to predetermine the structure, the predetermined structure that will be provided with the shutoff piece sets up on the circuit board, obtain predetermine the circuit board, will predetermine the circuit board and place in packaging mold, be provided with encapsulating material in the packaging mold, through encapsulating material to the predetermined circuit board encapsulation that is provided with the shutoff piece, obtain the predetermined circuit board after the encapsulation, get rid of the shutoff piece in the predetermined circuit board after the encapsulation, obtain the circuit board after the encapsulation. That is, in this application embodiment, after the predetermined circuit board that is provided with the shutoff piece is encapsulated through encapsulating material, only need get rid of the shutoff piece in the predetermined circuit board after the encapsulation, need not to punch in encapsulating material to can reduce the time of punching, thereby make when installing the circuit board after will encapsulating in electronic equipment, can improve the installation effectiveness.
The embodiment of the application provides a circuit board, and the circuit board is obtained by packaging with the circuit board packaging method in the embodiment.
An embodiment of the present application provides an electronic device, which includes the circuit board in the above embodiment.
It should be noted that, in the embodiment of the present application, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer, and the like.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
While alternative embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, in this document, relational terms such as first and second, and the like may be used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or terminal apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or terminal apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or terminal device comprising the element.
The technical solutions provided in the present application are described in detail above, and the principles and embodiments of the present application are described herein by using specific examples, and meanwhile, for a person of ordinary skill in the art, according to the principles and implementation manners of the present application, changes may be made in the specific embodiments and application ranges.
Claims (10)
1. A circuit board packaging method is characterized by comprising the following steps:
arranging a plugging piece on the end face of a preset structure, wherein the plugging piece is used for plugging the preset structure, and the preset structure comprises a hollow columnar structure;
arranging the preset structure provided with the plugging piece on a circuit board to obtain a preset circuit board;
placing the preset circuit board in a packaging mold, wherein a packaging material is arranged in the packaging mold, and packaging the preset circuit board provided with the plugging piece through the packaging material to obtain a packaged preset circuit board;
and removing the plugging piece in the packaged preset circuit board to obtain the packaged circuit board.
2. The circuit board packaging method according to claim 1, wherein the circuit board is provided with a mechanical hole; the preset structure that will be provided with shutoff piece sets up on the circuit board, includes:
and arranging a preset structure provided with the plugging piece on the circuit board, wherein the preset structure is embedded into the mechanical hole.
3. The circuit board packaging method according to claim 1, wherein the predetermined structure further comprises a base, and the base is connected with the hollow columnar structure;
the preset structure that will be provided with shutoff piece sets up on the circuit board, includes:
and arranging the base on the circuit board, wherein the hollow columnar structure is far away from the circuit board.
4. The circuit board packaging method according to claim 1, wherein the packaging mold comprises a first front mold and a first rear mold which are matched with each other, the first rear mold has a groove thereon, and the groove is filled with the packaging material;
the preset circuit board is placed in a packaging mold, packaging materials are placed in the packaging mold, and the preset circuit board is packaged through the packaging materials, and the method comprises the following steps:
fixing the preset circuit board on the first front mold;
attaching the first front mold to the first rear mold;
heating the packaging mold to a preset temperature so as to cure the packaging material;
and encapsulating the preset circuit board by the solidified encapsulating material.
5. The circuit board packaging method according to claim 1, wherein the packaging mold comprises a second front mold and a second rear mold which are matched with each other, and the second rear mold is provided with a through hole;
the preset circuit board is placed in a packaging mold, packaging materials are placed in the packaging mold, and the preset circuit board is packaged through the packaging materials, and the method comprises the following steps:
fixing the preset circuit board on the second rear mold;
attaching the second front mold and the second rear mold;
injecting the encapsulation material into the encapsulation mold through the through hole;
applying a preset pressure to the encapsulation mold to flow the encapsulation material;
heating the packaging mold to the preset temperature to cure the packaging material;
and encapsulating the preset circuit board by the solidified encapsulating material.
6. The method for encapsulating a circuit board according to claim 1, wherein the removing the blocking member from the encapsulated predetermined circuit board to obtain the encapsulated circuit board comprises:
and grinding the plugging piece in the packaged preset circuit board by adopting a grinding process to remove the plugging piece so as to obtain the packaged circuit board.
7. The method for encapsulating a circuit board according to claim 1, wherein the removing the blocking member from the encapsulated predetermined circuit board to obtain the encapsulated circuit board comprises:
and burning the sealing piece in the packaged circuit board by adopting laser to remove the sealing piece, thereby obtaining the packaged circuit board.
8. The circuit board packaging method according to claim 1, wherein after removing the plugging member from the packaged predetermined circuit board to obtain a packaged circuit board, the method further comprises:
and arranging a shielding layer on the packaged circuit board.
9. A circuit board, wherein the circuit board is packaged by the circuit board packaging method according to any one of claims 1 to 8.
10. An electronic device, characterized in that the electronic device comprises the circuit board of claim 9.
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| CN202010873223.4A CN111954391B (en) | 2020-08-26 | 2020-08-26 | Circuit board packaging method, circuit board and electronic equipment |
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| CN111954391B (en) | 2021-09-14 |
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