JP2008151792A - Pressure detector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem wherein a thermal stress and crack must be restrained from being generated caused by the difference between linear expansion coefficients generated between respective materials, in an electronic device required to mount an electronic component for the purpose of electrostatic charge countermeasure. <P>SOLUTION: The crack generated in a connecting material 14 is restrained from progressing, by combining positioning recesses 12, 13 with a connecting material thickness securing recess 16, a connecting material thickness securing protrusion 17 or the like, in electronic component mounting parts 7, 8 of lead materials 9, 10, 11, and reliability is enhanced thereby. The electronic component mounting parts are further sealed and restricted closely with a sealant 6 to restrain the crack generated in the connecting material from progressing, and the reliability of a connection part is secured as its effect. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to general electronic devices such as an air flow rate detection device, a rotation signal detection device, an angle detection device, and an ignition device, in addition to a pressure detection device. Specifically, an output signal is output to an outer case integrally formed with a lead material. The present invention relates to a structure for mounting an electronic circuit having an electronic component and an electronic component that reduces electrical disturbance.

  In the conventional technique, as described in Patent Document 1, a method of providing a recess for positioning an electronic component to be mounted and preventing positional deviation has been employed.

  As another conventional technique, a capacitor with a lead wire or the like is used as an electronic component for reducing electrical disturbance, but the shape is large and cannot be reduced in size. It is desirable to use small elements such as small chip capacitors and chip inductors because the lead wire becomes an antenna and is susceptible to electrical disturbance.

JP-A-11-145180

  The prior art described above is a depression for positioning electronic components to be mounted, and the thickness of the connecting member is not taken into consideration, and there is a problem that the thickness of the connecting member varies.

  According to experiments, when electronic components are mounted between lead materials that are integrally molded in a resin outer case, cracks may occur in the connecting member due to thermal stress generated by the difference in the linear expansion coefficient of each material. It has been confirmed. Since the progress speed of the crack is related to the thickness of the connecting member, it is important to manage the thickness of the connecting member in order to ensure reliability against the crack.

  In addition, when connecting an electronic component using solder, which is one of the connecting members, after connecting the detection unit to the exterior case, the melting point of the solder to be used tends to increase due to lead-free solder, etc. The reflow method has become difficult. Furthermore, since there is a risk of damage to the detection unit due to heat during reflow, a connection process that does not cause thermal damage to the detection unit and the outer case is necessary.

  An object of the present invention is to improve the reliability with respect to cracks generated from thermal stress in a connection part by ensuring the thickness of the connection member while preventing the displacement of electronic components to be mounted.

  A further object is to improve reliability against cracks and prevent short circuits between wirings.

  The above object is achieved by setting the thickness of the connecting member for connecting the electronic component to 70 μm or more in the electronic device.

  Further, the object is to provide a pressure detection means, a case where the pressure detection means is installed, a terminal for outputting a signal from the pressure detection means to the outside, an electronic component, the terminal, and the electronic component. A conductive material for connecting the conductive material, wherein the conductive material is formed with a thick portion and a small portion depending on the shape of adjacent members, and at least the large portion is the electronic component and the terminal. Achieved by connecting with.

  Further, the object is to provide a pressure detection means, a resin case in which the pressure detection means is installed, a terminal that is integrally molded with the case and outputs a signal from the pressure detection means to the outside, the terminal, A conductive material for connecting the electronic component, wherein the terminal is provided with a recess having a bottom surface having a different depth, and the positioning of the electronic component and the connection in the recess Is achieved by

  ADVANTAGE OF THE INVENTION According to this invention, the reliability with respect to a crack can be improved, and the short circuit between wiring can be prevented.

  Hereinafter, an embodiment and a configuration of the present invention will be described with reference to FIGS.

  FIG. 1 is a longitudinal sectional view of the pressure detection device. FIG. 2 is a front view of the pressure detection device.

  The detection unit 1 is configured by forming a diaphragm and a circuit on silicon and anodically bonding the glass pedestal.

  The detector case 4 is made of a thermosetting resin such as epoxy resin or a thermoplastic resin such as PPS resin, and the detector terminal 3 is made of phosphor bronze with nickel plating.

  The detection unit 1 is bonded and fixed to the detection unit case 4. The detection unit terminal 3 insert-molded in the detection unit case 4 and the detection unit 1 are connected by a connection wire 2 made of aluminum or gold, and are electrically connected.

  The outer case 5 is composed of a resin material such as PBT or PPS and metal lead materials 9, 10, and 11, and is opened to mount the detection unit case 4 and the electronic components 7 and 8, and the outside is a connector. The structure is such that a signal is output to the outside.

  The detection unit case 4 is mounted in the opening of the outer case 5, the detection unit terminal 3 and the lead members 9, 10, 11 are connected by welding, and further, the lead members 9, 10, 11 are straddled. After securing the electrical connection of the electronic parts 7 and 8 with the connecting member 14 made of solder or conductive paste, the sealing material 6 such as epoxy or silicone resin is injected and cured in the opening of the outer case without any gap. The pressure detection device is completed.

  The features of the present invention will be described with reference to FIGS.

  FIG. 3 is a diagram in which only the lead materials 9, 10, and 11 in FIG. 2 are extracted.

  In the lead members 9, 10, and 11, the recesses 12 and 13 for mounting the electronic components 7 and 8 and the recess 16 for securing the connecting member thickness are formed inside thereof.

  FIG. 4 is a detailed front view and a side view of the electronic component 8 mounted in the recess 13 in the B part of FIG.

  A positioning recess 13 is formed so as to surround the electronic component 8 at a position where the electronic component 8 is to be mounted on the lead material 11, and has a width narrower than that of the electronic component 8 and is made of solder or conductive paste. A recess 16 for securing the thickness of the connecting member 14 is formed. As a result, when the electronic component 8 is mounted, positional displacement is prevented by the positioning recess 13 and the minimum thickness of the connection member 14 can be secured by the recess 16 for securing the connection member thickness.

  FIG. 5 shows an example in which the recess 16 for securing the thickness of the connecting member is formed in a shape that leaves the corners of the positioning recess 13 with respect to FIG. In this case, since the corners of the electronic component 8 are supported by the bottom surface of the positioning recess 13, the same effect as the embodiment of FIG. 4 can be obtained.

  FIG. 6 is an example in which a projection 17 for securing the thickness of the connecting member is provided with respect to FIG. In this case, since the projection 17 for securing the thickness of the connecting member supports the electronic component 8, the same effect as the embodiment of FIG. 4 can be obtained.

  A plurality of projections 13 for securing the connecting member thickness may be formed.

  FIG. 7 shows an example in which the positioning recess 13 is formed deeper than the required thickness of the connecting member 14 and the conductive solid 15 having a size corresponding to the required thickness is mixed and connected to the connecting member 14 with respect to FIG. It is. In this case, since the conductive solid material 15 mixed in the connection member 14 supports the electronic component 8, the same effect as the embodiment of FIG. 4 can be obtained.

  FIG. 8 is an example in which a recess 13 for securing a connection member thickness is formed by etching or the like on the connection surface side of the electronic component 8 to be mounted, as compared to FIG. Also, as in the other embodiments, the effect can be obtained by forming the protrusions.

  FIG. 9 shows an example in which only the positioning recess 13 of the prior art is formed and the electronic component 8 is connected using the connection member 14. In this case, the thickness of the connecting member 14 is determined by the surface tension when the connecting member 14 is melt-cured. However, since the variation is large, it is difficult to manage only with the working conditions.

  FIG. 10 is a graph illustrating the relationship between the thickness T of the solder after the thermal cycle endurance test and the rate of occurrence of cracks generated in the solder when the solder is used for the connection member 14 in this embodiment. It is.

  Thermal stress is generated due to the difference in coefficient of linear expansion of each constituent material, and cracks are generated and progressed by being repeated.

  According to the result of the experiment, the higher the solder thickness T, the smaller the crack generation rate after durability. Further, as the electronic component length L becomes longer, the solder thickness T becomes necessary. In the case of the present embodiment, in the specification in which the lengths of the electronic components 7 and 8 are the longest, the solder thickness capable of preventing cracks after the durability test is required to be 70 μm or more.

  According to the present embodiment, it is possible to manage the thickness of the connection member 14 that affects the reliability of the connection portion, and there is an effect of ensuring the reliability.

  11 is a cross-sectional view taken along line AA in FIG. An electronic component 7 made of a chip capacitor is connected to the lead members 9 and 11 integrally molded in the outer case 5 using a connecting member 14. These component parts are mold-sealed with a sealing material 6 having a linear expansion coefficient smaller than that of the outer case 5 and larger than that of the electronic component 7 without any gap, thereby restraining displacement due to heat and generating cracks in the connecting member 14. Is suppressed, and the reliability of the connection portion can be ensured. In addition, when solder is used for the connection member 14, each component and the sealant 6 are joined by using the sealant 6 having a property of dissolving the flux deposited on the surface of the connection member 14, thereby restraining displacement due to heat. It becomes possible to do. Furthermore, by sealing the space between the adjacent lead materials 9, 10, and 11 with the sealing material 6 without a gap, it is possible to prevent a short circuit due to deformation and growth of the connection member 14 due to aging.

  FIG. 12 is a cross-sectional view taken along line AA in FIG. 2 in the process of connecting the electronic component 7 to the connection member 14 using solder. As a method for connecting the solder which is the connecting member 14, light 18 is irradiated. By irradiating the light 18 only within the range indicated by the portion C in FIG. 2, it is possible to melt the solder without causing thermal damage to the outer case 5 and the detection unit 1. Further, by uniformly irradiating the light 18 to the portion C in FIG. 2 including the electronic components 7 and 8, damage to the electronic components 7 and 8 due to local overheating generated at the time of spot irradiation such as a laser is caused. While avoiding this, it becomes possible to connect the solder stably.

  By providing the electronic component mounting portion with a recess or protrusion in addition to the positioning recess, the thickness of the connection member can be managed, and the reliability of the connection portion can be ensured.

  Furthermore, by sealing and restraining the electronic component mounting portion with a sealing material without any gap, the progress of cracks occurring in the connection member is suppressed, and a short circuit between the lead materials due to deformation and growth of the connection member is prevented. There is an effect of ensuring the reliability of the connecting portion.

  Further, when solder is used for the connection member, the light irradiation method can be used to connect the detection unit and the outer case without damaging them.

It is a longitudinal cross-sectional view of the pressure detection apparatus which is one Example of this invention. It is a front view of the pressure detection apparatus which is one Example of this invention. It is the figure which extracted only the lead material of FIG. It is the detailed front view and side view of an electronic component mounting part which are one Example of this invention. It is the detailed front view and side view of an electronic component mounting part which are one Example of this invention. It is the detailed front view and side view of an electronic component mounting part which are one Example of this invention. It is the detailed front view and side view of an electronic component mounting part which are one Example of this invention. It is the detailed front view and side view of an electronic component mounting part which are one Example of this invention. It is the detailed front view and side view of an electronic component mounting part in a prior art. It is the graph which showed the relationship between the thickness of a connection member and the crack generation rate which generate | occur | produces in a connection member after the endurance test in one Example of this invention. It is detailed sectional drawing of the electronic component mounting part which is one Example of this invention. It is a detailed sectional view at the time of electronic component connection which is one embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Detection part, 2 ... Connection wire, 3 ... Detection part terminal, 4 ... Detection part case, 5 ... Outer case, 6 ... Sealing material, 7, 8 ... Electronic component.

Claims (14)

  One lead material that becomes a connector terminal for electrical connection to the outside, and an electronic circuit having a signal output is connected to the inside of an exterior case integrally molded with the lead material, and the lead material between the electronic circuit and the connector terminal An electronic device in which electronic components are electrically connected to each other, wherein a thickness of a connecting member used as means for electrically connecting the electronic components is 70 μm or more.   2. The electronic device according to claim 1, wherein a recess is provided on the lead material so as to surround an electronic component to be mounted, and further, a recess having two or more steps is provided inside the recess so as to have a smaller area than the electronic component. An electronic device characterized by that.   2. The electronic device according to claim 1, wherein a depression is provided on the lead material so as to surround an electronic component to be mounted, and one or more protrusions are provided on a bottom surface of the depression.   2. The electronic device according to claim 1, wherein a recess is provided on the lead material so as to surround an electronic component to be mounted, and a conductive solid having a size corresponding to a necessary thickness is mixed with a connection member for ensuring electrical connection. An electronic device characterized by being used.   The electronic device according to claim 1, wherein an electronic component having a recess or a protrusion provided on a connection surface is mounted on a lead material.   2. The electronic device according to claim 1, wherein the electronic component mounted on the lead material is mold-sealed and restrained with a resin having a linear expansion coefficient smaller than that of the exterior case and larger than that of the electronic component without any gap. Electronic equipment.   7. The electronic device according to claim 6, wherein when solder is used as the connecting member, the electronic device is sealed and constrained in combination with a mold resin having a property of dissolving the deposited solder flux.   2. The electronic device according to claim 1, wherein a solder is used for the connection member, and the entire electronic component and a range including the lead material are irradiated and irradiated with uniform light. Pressure detecting means;
A case where the pressure detection means is installed;
A terminal for outputting a signal from the pressure detection means to the outside;
Electronic components,
A conductive material connecting the terminal and the electronic component;
A pressure sensing device comprising:
The pressure detecting device is characterized in that a portion having a large thickness and a portion having a small thickness are formed depending on the shape of adjacent members, and at least the large portion connects the electronic component and the terminal. In claim 9,
The adjacent member includes at least the terminal, the conductive material, or the case. In claim 10,
The pressure detecting device, wherein the terminal is molded in a resin constituting the case. In claim 11,
The pressure detection device, wherein the electronic component is a chip capacitor. Pressure detecting means;
A resin case in which the pressure detecting means is installed;
A terminal that is integrally molded with the case and outputs a signal from the pressure detection means;
A conductive material connecting the terminal and the electronic component;
A pressure sensing device comprising:
The terminal is provided with a recess having a bottom surface having a different depth,
The pressure detecting device, wherein the electronic component is positioned and connected in the recess. In claim 13,
The pressure detecting device according to claim 1, wherein the bottom surfaces having different depths are formed by a convex portion or a second concave portion provided in the concave portion.

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