WO2017093389A3 - Compact stacked power modules for minimizing commutating inductance and methods for making the same - Google Patents
Compact stacked power modules for minimizing commutating inductance and methods for making the same Download PDFInfo
- Publication number
- WO2017093389A3 WO2017093389A3 PCT/EP2016/079407 EP2016079407W WO2017093389A3 WO 2017093389 A3 WO2017093389 A3 WO 2017093389A3 EP 2016079407 W EP2016079407 W EP 2016079407W WO 2017093389 A3 WO2017093389 A3 WO 2017093389A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plate surface
- plate
- minimizing
- making
- methods
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49589—Capacitor integral with or on the leadframe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3512—Cracking
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Inverter Devices (AREA)
Abstract
A compact stacked power module (10) is described. The module (10) includes a negative direct-current-bus-voltage plate (110) having a negative-plate surface (112) and a positive direct-current-bus-voltage plate (120) having a positive-plate surface (122). The module (10) also includes an alternating-current output plate (100) having opposing first and second output-plate surfaces (102, 104), a first semiconductor switch (150) contacting the negative-plate surface (112) and the first output-plate surface (102), and a second semiconductor switch (160) contacting the positive-plate surface (122) and the second output-plate surface (104). The module (10) further includes a capacitor (130) contacting the negative-plate surface (112) and the positive-plate surface (122). The capacitor (130) is electrically connected in parallel with the first and second semiconductor switches (150, 160).
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16836200.2A EP3384528A2 (en) | 2015-12-02 | 2016-12-01 | Compact stacked power modules for minimizing commutating inductance and methods for making the same |
CN201680072402.XA CN108369934A (en) | 2015-12-02 | 2016-12-01 | Compact stack power module for making commutating inductance minimize and its manufacturing method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/956,825 | 2015-12-02 | ||
US14/956,825 US9681568B1 (en) | 2015-12-02 | 2015-12-02 | Compact stacked power modules for minimizing commutating inductance and methods for making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2017093389A2 WO2017093389A2 (en) | 2017-06-08 |
WO2017093389A3 true WO2017093389A3 (en) | 2017-08-24 |
Family
ID=58044002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2016/079407 WO2017093389A2 (en) | 2015-12-02 | 2016-12-01 | Compact stacked power modules for minimizing commutating inductance and methods for making the same |
Country Status (4)
Country | Link |
---|---|
US (1) | US9681568B1 (en) |
EP (1) | EP3384528A2 (en) |
CN (1) | CN108369934A (en) |
WO (1) | WO2017093389A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016103714B4 (en) * | 2016-03-02 | 2021-09-30 | Infineon Technologies Ag | Power semiconductor packages and multi-phase rectifiers with one power semiconductor package |
FR3078448B1 (en) * | 2018-02-27 | 2020-02-28 | Institut Vedecom | BUS ASSEMBLY FORMING A HOUSING AND A THERMAL DISSIPATOR FOR AN ELECTRONIC POWER DEVICE |
FR3078456B1 (en) * | 2018-02-27 | 2020-02-28 | Institut Vedecom | POWER SWITCHING MODULE AND ELECTRONIC POWER DEVICE INCORPORATING THE SAME |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006040926A (en) * | 2004-07-22 | 2006-02-09 | Honda Motor Co Ltd | Electronic circuit device |
JP2007234737A (en) * | 2006-02-28 | 2007-09-13 | Denso Corp | Connection structure of electronic component |
JP2008151792A (en) * | 2007-12-17 | 2008-07-03 | Hitachi Ltd | Pressure detector |
JP2010153527A (en) * | 2008-12-25 | 2010-07-08 | Denso Corp | Device for cooling semiconductor module |
WO2013115395A1 (en) * | 2012-01-31 | 2013-08-08 | Aisin Aw Co., Ltd. | Switching element unit |
US20140131845A1 (en) * | 2012-11-14 | 2014-05-15 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
JP2014107341A (en) * | 2012-11-26 | 2014-06-09 | Toyota Motor Corp | Semiconductor module |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2592737A (en) | 1950-10-11 | 1952-04-15 | Raymond Rosen Engineering Prod | Multiplex telemetric system |
US3454833A (en) | 1967-08-16 | 1969-07-08 | Gen Electric | Current limiter device-thyristor current limiting static circuit breaker |
US3638095A (en) | 1969-07-14 | 1972-01-25 | Stuart P Jackson | Standby power circuit utilizing multiple pulse modulation for converting dc to ac electric power |
US3646394A (en) | 1970-11-19 | 1972-02-29 | Gen Electric | Acyclic generator with vacuum arc commutator for rapid generation of short, high-energy pulses |
US3644818A (en) | 1971-03-10 | 1972-02-22 | Gte Sylvania Inc | Electronic flashlamp power supply |
US4074939A (en) | 1973-12-19 | 1978-02-21 | Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V. | Apparatus for investigating fast chemical reactions by optical detection |
DE2363180C2 (en) | 1973-12-19 | 1984-05-10 | Max Planck Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen | Reaction kinetic measuring device |
US4054390A (en) | 1973-12-19 | 1977-10-18 | Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V. | Apparatus for investigating fast chemical reactions by optical detection |
US4459519A (en) | 1974-06-24 | 1984-07-10 | General Electric Company | Electronically commutated motor systems and control therefor |
US4514712A (en) | 1975-02-13 | 1985-04-30 | Mcdougal John A | Ignition coil |
EP0087528A1 (en) | 1982-02-26 | 1983-09-07 | Centro Corporation | Position sensing device |
US4859911A (en) | 1987-02-13 | 1989-08-22 | International Business Machines Corporation | Power supply for electroluminescent panel |
JPS63202888A (en) | 1987-02-13 | 1988-08-22 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | Electric source circuit for el panel |
US5278380A (en) | 1990-12-03 | 1994-01-11 | Westinghouse Electric Corp. | Superconducting magnet system with inductive quench heaters |
US5633306A (en) | 1992-12-03 | 1997-05-27 | Ransburg Corporation | Nonincendive rotary atomizer |
WO1996007947A1 (en) | 1994-08-31 | 1996-03-14 | Virtual I/O, Inc. | Personal display system |
US5991085A (en) | 1995-04-21 | 1999-11-23 | I-O Display Systems Llc | Head-mounted personal visual display apparatus with image generator and holder |
US6369952B1 (en) | 1995-07-14 | 2002-04-09 | I-O Display Systems Llc | Head-mounted personal visual display apparatus with image generator and holder |
US5668439A (en) | 1995-10-03 | 1997-09-16 | Xerox Corporation | High voltage power supply |
US5859383A (en) | 1996-09-18 | 1999-01-12 | Davison; David K. | Electrically activated, metal-fueled explosive device |
TR199902195T2 (en) | 1996-12-17 | 2000-01-21 | Abb Ab | Tools and methods for protecting an object against over-currents, including over-current reduction and current limit |
US20020034088A1 (en) * | 2000-09-20 | 2002-03-21 | Scott Parkhill | Leadframe-based module DC bus design to reduce module inductance |
US7387029B2 (en) | 2005-09-23 | 2008-06-17 | Velocomp, Llp | Apparatus for measuring total force in opposition to a moving vehicle and method of using |
CA2623498C (en) | 2005-09-23 | 2013-01-15 | Velocomp, Llp | Apparatus for measuring total force in opposition to a moving vehicle and method of using |
US9168054B2 (en) | 2009-10-09 | 2015-10-27 | Ethicon Endo-Surgery, Inc. | Surgical generator for ultrasonic and electrosurgical devices |
US20140230571A1 (en) | 2010-03-02 | 2014-08-21 | Velocomp, LLC. | Apparatus to measure the power expended in propelling a vessel on water |
KR20110135233A (en) * | 2010-06-10 | 2011-12-16 | 현대자동차주식회사 | Capacitor for inverter of vehicle |
US9824838B2 (en) | 2011-02-05 | 2017-11-21 | Alevo International, S.A. | Commutating circuit breaker |
RU2612847C2 (en) | 2011-03-30 | 2017-03-13 | ЭМБАЧЕР Инк. | Electrical, mechanical, computing and/or other devices formed from extremely low resistance materials |
JP5506740B2 (en) * | 2011-05-31 | 2014-05-28 | 日立オートモティブシステムズ株式会社 | Power converter |
US8711565B2 (en) | 2011-11-02 | 2014-04-29 | General Electric Company | System and method for operating an electric power converter |
JP5655846B2 (en) * | 2012-12-04 | 2015-01-21 | 株式会社デンソー | Power converter |
JP5960079B2 (en) * | 2013-03-11 | 2016-08-02 | 日立オートモティブシステムズ株式会社 | Power converter |
EP2968709B1 (en) | 2013-03-15 | 2019-10-02 | ClearMotion, Inc. | Active vehicle suspension improvements |
-
2015
- 2015-12-02 US US14/956,825 patent/US9681568B1/en not_active Expired - Fee Related
-
2016
- 2016-12-01 EP EP16836200.2A patent/EP3384528A2/en not_active Withdrawn
- 2016-12-01 CN CN201680072402.XA patent/CN108369934A/en active Pending
- 2016-12-01 WO PCT/EP2016/079407 patent/WO2017093389A2/en active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006040926A (en) * | 2004-07-22 | 2006-02-09 | Honda Motor Co Ltd | Electronic circuit device |
JP2007234737A (en) * | 2006-02-28 | 2007-09-13 | Denso Corp | Connection structure of electronic component |
JP2008151792A (en) * | 2007-12-17 | 2008-07-03 | Hitachi Ltd | Pressure detector |
JP2010153527A (en) * | 2008-12-25 | 2010-07-08 | Denso Corp | Device for cooling semiconductor module |
WO2013115395A1 (en) * | 2012-01-31 | 2013-08-08 | Aisin Aw Co., Ltd. | Switching element unit |
US20140131845A1 (en) * | 2012-11-14 | 2014-05-15 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
JP2014107341A (en) * | 2012-11-26 | 2014-06-09 | Toyota Motor Corp | Semiconductor module |
Also Published As
Publication number | Publication date |
---|---|
US9681568B1 (en) | 2017-06-13 |
US20170164497A1 (en) | 2017-06-08 |
WO2017093389A2 (en) | 2017-06-08 |
EP3384528A2 (en) | 2018-10-10 |
CN108369934A (en) | 2018-08-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3035516A3 (en) | Packaging of a control module for a brushless motor | |
CN106489211A8 (en) | Imbrication formula solar module | |
WO2012024537A3 (en) | Switching circuits for extracting power from an electric power source and associated methods | |
EP3110238A3 (en) | Assembly structure and electronic device having the same | |
IN2014DE03445A (en) | ||
WO2017076366A8 (en) | Five-voltage level inverter topology circuit, and three-phase and five-voltage level inverter topology circuit | |
EP2482438A3 (en) | Power converter | |
WO2016146086A3 (en) | Devices for overvoltage, overcurrent and arc flash protection | |
EP2765598A3 (en) | Integrated half-bridge circuit with low side and high side composite switches | |
WO2016069351A8 (en) | Photovoltaic module or array shutdown | |
WO2017093389A3 (en) | Compact stacked power modules for minimizing commutating inductance and methods for making the same | |
WO2017174102A8 (en) | Module for a multilevel converter | |
EA035682B9 (en) | Hybrid power pack | |
WO2009012008A3 (en) | Methods and apparatus for three-phase inverter with reduced energy storage | |
EP2651024A3 (en) | Multilevel power converter | |
EP2899870A3 (en) | A nestable single cell structure for use in a power conversion system | |
TW200718006A (en) | Electric element and electric circuit | |
MX2016004075A (en) | Semiconductor stack for converter with snubber capacitors. | |
WO2014108225A3 (en) | Voltage source converter comprising a chain-link converter | |
WO2014108257A3 (en) | Voltage source converter | |
WO2017139284A9 (en) | Capacitive energy storage cell, module and system | |
WO2018034711A3 (en) | System and method for integrating hybrid energy storage into direct current power systems | |
WO2012146792A3 (en) | Multilevel electronic power converter | |
EP2937992A3 (en) | Solar cell module | |
WO2015054146A3 (en) | Voltage regulator with charge pump for generating second voltage source |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16836200 Country of ref document: EP Kind code of ref document: A2 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2016836200 Country of ref document: EP |