JP2012251898A - Sensor and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor capable of preventing infiltration of moisture or the like to an electric connection part of a terminal and an electronic component just by molding of one time.SOLUTION: After electrically connecting a terminal 1 and an electronic component 2, the electronic component 2 is covered with a protective material 4 made of a resin to form a first component. Then, with the first component as an insert component, insert molding of a housing 5 is executed. At the time, by molding the housing 5 so as to seal the electronic component 2 and the protective material 4 with the housing 5, infiltration of moisture or the like to the electric connection part of the terminal 1 and the electronic component 2 is prevented.

Description

  The present invention relates to a sensor for detecting a physical quantity such as pressure and a method for manufacturing the same.

  Conventionally, there has been proposed a sensor that insert-molds a resin housing using a metal terminal as an insert part. A detection element for detecting pressure is disposed in the opening of the housing and electrically connected to the terminal, and an electronic component such as a chip capacitor is disposed in the opening of the housing and electrically connected to the terminal. A sealing material such as epoxy or silicone resin is injected into the opening of the film (for example, see Patent Document 1).

  In another conventional sensor, the terminal and electronic components that are electrically connected are molded with epoxy resin to form a primary molded product, and then secondary molded including the connector to produce a resin housing. (For example, refer to Patent Document 2).

JP 2008-151792 A JP 2004-301743 A

  However, in the former sensor, it is difficult to bond the interface between the housing and the sealing material, so moisture enters the electrical connection between the electronic component and the terminal from the interface, and the electrical connection is corroded. There is a risk of electrical open or short circuit.

  On the other hand, the latter sensor can prevent moisture and the like from entering the electrical connection between the terminal and the electronic component, but it has a complicated structure due to the first and second molding and the second molding. As a result, there has been a problem that the housing shape becomes large as a whole and the cost also increases.

  In view of the above points, an object of the present invention is to obtain a sensor that can prevent moisture and the like from entering an electrical connection portion between a terminal and an electronic component by only one molding.

  In order to achieve the above object, according to the first aspect of the present invention, after the terminal (1) and the electronic component (2) are electrically connected, the electronic component (2) is attached to the protective material (4) made of resin. A first part manufacturing process for covering and forming a first part, and using the first part as an insert part, exposing part of the terminal (1) and sealing the electronic part (2) and the protective material (4) A housing manufacturing process for insert-molding the resin housing (5) and a detection element connection process for electrically connecting the detection element (6) for detecting the physical quantity to the exposed portion of the terminal (1). Features.

  According to this, since the electronic component (2) and the protective material (4) are sealed by the housing (5), intrusion of moisture or the like into the electrical connection between the terminal (1) and the electronic component (2). Can be prevented. Moreover, since the molding is performed only once, the housing (5) can be reduced in size and cost.

  According to a second aspect of the present invention, in the method for manufacturing a sensor according to the first aspect, the protective material (4) is a thermosetting resin that cures at room temperature.

  By the way, when a thermosetting resin that cures in a temperature range higher than room temperature is used as the protective material (4), the viscosity of the protective material (4) is increased by heating when the protective material (4) is cured. Since it falls and softens once before reaching the curing temperature, the protective material (4) may flow out around the electronic component (2) at that time.

  On the other hand, when a thermosetting resin that cures at room temperature is used as the protective material (4), when the protective material (4) is cured, the temperature does not change because the temperature is at room temperature, so it does not soften. The protective material (4) can be prevented from flowing out around the electronic component (2).

  According to a third aspect of the present invention, in the method for manufacturing a sensor according to the first or second aspect, the terminal (1) includes a recess (11) for positioning the electronic component (2). .

  According to this, the electronic component (2) can be easily positioned at a predetermined position of the terminal (1).

  According to a fourth aspect of the present invention, in the method for manufacturing a sensor according to any one of the first to third aspects, the terminal (1) is a protrusion (12, 13) that suppresses the flow of the protective material (4). It is characterized by providing.

  According to this, since the flow of the protective material (4) is suppressed when the protective material (4) is cured or until the insert molding is completed, the amount of the protective material (4) used can be reduced. .

  According to a fifth aspect of the present invention, in the method of manufacturing a sensor according to the fourth aspect, a plurality of terminals (1) are provided, and the electronic component (2) extends between adjacent terminals (1). 1), the protrusion (12) is located below the electronic component (2) and extends from one terminal (1) to the other terminal (1) in the adjacent terminal (1). It is characterized by.

  According to this, the protrusion (12) can suppress the drop of the protective material (4) when the protective material (4) is cured or until the insert molding is completed.

  According to a sixth aspect of the present invention, in the sensor manufacturing method according to the fourth aspect, the electronic component (2) is mounted on the upper surface of the terminal (1), and the protrusion (13) is formed from the upper surface of the terminal (1). It is characterized by extending upward.

  According to this, the protrusion (13) can suppress the flow of the protective material (4) that covers the upper surface and the side surface of the electronic component (2).

  According to a seventh aspect of the present invention, in the sensor manufacturing method according to the sixth aspect, when the flow of the resin injected in the housing manufacturing process is the resin flow direction, the protrusion (13) is the electronic component (2). It is located in the upstream of resin flow direction rather than.

  According to this, since the resin injected at the time of insert molding is once received by the protrusion (13) and hits the electronic component (2), in other words, the force acting on the electronic component (2) is suppressed, After that, it is possible to reliably maintain the state in which the electronic component (2) is electrically connected to the terminal (1).

  In the invention according to claim 8, the detection element (6) for detecting the physical quantity and the electronic component (2) are electrically connected to the terminal (1), and the electronic component (2) is a protective material (4) made of resin. The electronic component (2) and the protective material (4) are sealed with a resin housing (5).

  According to this, since the electronic component (2) and the protective material (4) are sealed by the housing (5), intrusion of moisture or the like into the electrical connection between the terminal (1) and the electronic component (2). Can be prevented. Moreover, since molding can be performed only once, the housing (5) can be reduced in size and cost.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

It is sectional drawing of the sensor which concerns on 1st Embodiment of this invention. It is sectional drawing of the principal part in alignment with the AA of FIG. It is a B arrow line view which shows the state before shape | molding the housing 5 in FIG. It is a top view which shows the manufacturing process before shape | molding the housing 5 of the sensor of FIG. It is a figure which shows the state after shape | molding the housing 5 of the sensor of FIG. It is sectional drawing which follows the CC line of FIG. It is sectional drawing of the principal part of the sensor which concerns on 2nd Embodiment of this invention. It is a perspective view of the principal part of the sensor which concerns on 3rd Embodiment of this invention. It is D arrow line view of FIG. It is a perspective view of the principal part which shows the 1st modification of the sensor which concerns on 3rd Embodiment. It is a perspective view of an important section showing the 2nd modification of a sensor concerning a 3rd embodiment. It is a perspective view of the principal part which shows the 3rd modification of the sensor which concerns on 3rd Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
A first embodiment of the present invention will be described. 1 is a cross-sectional view of a sensor according to the first embodiment, FIG. 2 is a cross-sectional view of a main part taken along line AA in FIG. 1, and FIG. FIG.

  As shown in FIGS. 1 to 3, the sensor of this embodiment includes a plurality of electrical signal transmission terminals 1 formed of an elongated sheet metal. The terminal 1 is joined with an electronic component 2 such as a chip capacitor for preventing electrical disturbance. The terminal 1 and the electronic component 2 are electrically connected by a conductive paste 3.

  In order to protect the electronic component 2 from moisture, the electronic component 2 is covered with a protective material 4 made of resin. The protective material 4 is a thermosetting resin that cures at room temperature (for example, 40 ° C. or lower), and an epoxy resin or the like can be used.

  The terminal 1 and the electronic component 2 are disposed in a resin housing 5. The housing 5 is formed with an element accommodating portion 51 that accommodates a detection element 6 that detects a physical quantity such as pressure, and a connector portion 52 that is fitted to a mating connector. One end of the terminal 1 is exposed in the element housing portion 51, and the other end projects into the connector portion 52.

  The detection element 6 is disposed in the element accommodating portion 51 and bonded to the housing 5 with an adhesive. The detection element 6 and the terminal 1 are electrically connected by wire bonding, welding, or the like. In order to protect the detection element 6 from dirt, moisture, etc., after connecting the detection element 6 and the terminal 1, a protective resin such as gel is injected into the element housing portion 51 to seal the detection element 6. Also good. Furthermore, a lid that closes the opening of the element housing 51 may be bonded to the housing 5 with an adhesive.

  Next, a method for manufacturing the sensor of this embodiment will be described. 4 is a plan view showing a manufacturing process until the housing 5 is molded, FIG. 5 is a diagram showing a state after the housing 5 is molded, and FIG. 6 is a sectional view taken along the line CC in FIG. is there.

  First, in the first component manufacturing process, three terminals 1 are prepared (see FIG. 4A), and a conductive paste 3 is applied to the upper surface of the terminal 1 in the longitudinal direction (see FIG. 4B). ) Subsequently, the electronic component 2 is placed between the adjacent terminals 1 and placed on the portion of the upper surface of the terminal 1 where the conductive paste 3 is applied (see FIG. 4C). The electronic component 2 is electrically connected. Then, the protective material 4 is apply | coated to the electronic component 2, and the electronic component 2 is covered with the protective material 4 (refer FIG.4 (d)). And the protective material 4 is heated and hardened, and a 1st component manufacturing process is complete | finished. The parts obtained in the first part manufacturing process are hereinafter referred to as “first parts”.

  Subsequently, in the housing manufacturing process, the housing 5 is insert-molded using the first component as an insert component. In other words, the first part is set at a predetermined position of the mold, and the housing 5 is molded by injecting resin into the mold. At this time, the housing 5 is molded so that both ends of the terminal 1 are exposed from the housing 5 and the electronic component 2 and the protective material 4 are sealed by the housing 5 (see FIGS. 5 and 6).

  Subsequently, in the detection element connection step, the detection element 6 is bonded and fixed at a predetermined position in the element housing portion 51, and the detection element 6 and the terminal 1 are electrically connected (see FIG. 1). Thereby, a detection element connection process is completed and a sensor is completed.

  In the present embodiment, since the electronic component 2 and the protective material 4 are sealed by the housing 5, it is possible to prevent moisture and the like from entering the electrical connection portion between the terminal 1 and the electronic component 2. In addition, since molding is performed only once, the housing 5 can be reduced in size and cost.

  In addition, since a thermosetting resin that cures at room temperature is used as the protective material 4, when the protective material 4 is cured, the temperature does not change because the temperature is room temperature, and thus the protective material 4 is not softened. Can be prevented from flowing out around the electronic component 2.

(Second Embodiment)
A second embodiment of the present invention will be described. FIG. 7 is a cross-sectional view of a main part of a sensor according to the second embodiment. Only the parts different from the first embodiment will be described below.

  As shown in FIG. 7, a recess 11 is formed in a portion where the electronic component 2 is joined on the upper surface of the terminal 1. And the electronic component 2 is positioned in the terminal 1 using this hollow 11, and the terminal 1 and the electronic component 2 are joined. According to this, the electronic component 2 can be easily positioned at a predetermined position of the terminal 1.

(Third embodiment)
A third embodiment of the present invention will be described. FIG. 8 is a perspective view of the main part of the sensor according to the third embodiment, and FIG. 9 is a view taken in the direction of arrow D in FIG. Only the parts different from the first embodiment will be described below.

  As shown in FIGS. 8 and 9, a recess 11 is formed in a portion of the upper surface of the terminal 1 where the electronic component 2 is joined. And the electronic component 2 is positioned in the terminal 1 using this hollow 11, and the terminal 1 and the electronic component 2 are joined.

  Further, the terminal 1 is formed with a first protrusion 12 and a second protrusion 13 that suppress the flow of the protective material 4 (see FIG. 2).

  The first protrusion 12 is positioned below the electronic component 2 and extends from one terminal 1 to the other terminal 1 in the adjacent terminal 1. Further, a part of the first protrusion 12 is located in the projection plane of the electronic component 2 when viewed along the stacking direction of the terminal 1 and the electronic component 2 (the vertical direction in FIG. 9).

  The second protrusion 13 extends upward from the upper surface of the terminal 1. When the resin flow injected in the housing manufacturing process is the resin flow direction E, the second protrusions 13 are located on the upstream side and the downstream side in the resin flow direction E with respect to the electronic component 2.

  According to the present embodiment, the first protrusion 12 can suppress the protection material 4 from dropping until the protection material 4 is cured or until the insert molding is completed. Further, the second protrusion 13 can suppress the flow of the protective material 4 until the protective material 4 is cured or until the insert molding is completed. Therefore, the usage amount of the protective material 4 can be reduced.

  Furthermore, since the resin injected at the time of insert molding hits the electronic component 2 after being temporarily received by the second protrusion 13 located upstream of the electronic component 2 in the resin flow direction E, in other words, it acts on the electronic component 2. Therefore, the electronic component 2 can be reliably maintained in the state of being electrically connected to the terminal 1 even after molding.

  In the present embodiment, a part of the first protrusion 12 is positioned within the projection plane of the electronic component 2 when viewed along the stacking direction of the terminal 1 and the electronic component 2. As shown in the first modification example, the entire area of the first protrusion 12 may be located outside the projection surface of the electronic component 2 when viewed along the stacking direction of the terminal 1 and the electronic component 2.

  Further, in the present embodiment, the first protrusions 12 are formed on any of the adjacent terminals 1. However, as in the second modification shown in FIG. One protrusion 12 may be formed.

  Further, in the present embodiment, the first protrusion 12 of one terminal 1 and the first protrusion 12 of the other terminal 1 in the adjacent terminals 1 are arranged at the same position in the resin flow direction E, as shown in FIG. As in the third modification, the first protrusion 12 of one terminal 1 in the adjacent terminal 1 is arranged upstream of the electronic component 2 in the resin flow direction E, and the first protrusion 12 of the other terminal 1 is disposed. Alternatively, the electronic component 2 may be disposed downstream of the resin flow direction E from the electronic component 2.

  In addition, each said embodiment can be arbitrarily combined in the range which can be implemented.

DESCRIPTION OF SYMBOLS 1 Terminal 2 Electronic component 4 Protective material 5 Housing 6 Detection element

Claims (8)

A first part manufacturing step of forming a first part by covering the electronic part (2) with a protective material (4) made of resin after electrically connecting the terminal (1) and the electronic part (2); ,
The first part is an insert part, and a resin housing (5) is insert-molded so that a part of the terminal (1) is exposed and the electronic part (2) and the protective material (4) are sealed. A housing manufacturing process,
A sensor manufacturing method comprising: a detection element connecting step of electrically connecting a detection element (6) for detecting a physical quantity to an exposed portion of the terminal (1).   The method for manufacturing a sensor according to claim 1, wherein the protective material (4) is a thermosetting resin that cures at room temperature.   The method for manufacturing a sensor according to claim 1 or 2, wherein the terminal (1) includes a recess (11) for positioning the electronic component (2).   The method for manufacturing a sensor according to any one of claims 1 to 3, wherein the terminal (1) includes protrusions (12, 13) for suppressing the flow of the protective material (4). A plurality of the terminals (1),
The electronic component (2) is mounted on the upper surface of the terminal (1) in a state of straddling between the adjacent terminals (1),
The protrusion (12) is located below the electronic component (2) and extends from one terminal (1) to the other terminal (1) in the adjacent terminal (1). The manufacturing method of the sensor of Claim 4. The electronic component (2) is mounted on the upper surface of the terminal (1),
The method for manufacturing a sensor according to claim 4, wherein the protrusion (13) extends upward from the upper surface of the terminal (1). When the resin flow injected in the housing manufacturing process is the resin flow direction,
The method of manufacturing a sensor according to claim 6, wherein the protrusion (13) is located upstream of the electronic component (2) in the resin flow direction.   A detection element (6) for detecting a physical quantity and an electronic component (2) are electrically connected to a terminal (1), and the electronic component (2) is covered with a protective material (4) made of resin. (2) The said protective material (4) is sealed with the resin-made housing (5), The sensor characterized by the above-mentioned.

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