JP2008151792A5 - - Google Patents
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- Publication number
- JP2008151792A5 JP2008151792A5 JP2007324161A JP2007324161A JP2008151792A5 JP 2008151792 A5 JP2008151792 A5 JP 2008151792A5 JP 2007324161 A JP2007324161 A JP 2007324161A JP 2007324161 A JP2007324161 A JP 2007324161A JP 2008151792 A5 JP2008151792 A5 JP 2008151792A5
- Authority
- JP
- Japan
- Prior art keywords
- lead material
- electronic component
- pressure detection
- lead
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000001514 detection method Methods 0.000 claims 14
- 239000000463 material Substances 0.000 claims 12
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 229910000679 solder Inorganic materials 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
Claims (9)
前記圧力検出手段が設置される樹脂ケースと、
前記樹脂ケースに一体モールドされ、一方が外部との電気的接続用コネクタ端子となり、前記圧力検出手段からの信号を前記端子を介して出力するための複数のリード材とを備えた圧力検出装置において、
前記樹脂ケースの開口部で、前記第１のリード材と前記第２のリード材とに接続部材により接続面が各々に接続された電子部品を備え、
前記第１のリード材と前記第２のリード材の前記電子部品の接続面に対向する所に、異なった深さを有する窪みが各々に設けられたことを特徴とする圧力検出装置。 Pressure detecting means;
A resin case in which the pressure detection means is installed;
In a pressure detection device comprising a plurality of lead members for integrally molding the resin case, one of which serves as a connector terminal for electrical connection to the outside, and for outputting a signal from the pressure detection means via the terminal ,
In the opening of the resin case, the first lead material and the second lead material are provided with electronic components each having a connection surface connected by a connection member ,
Wherein the first place facing the connecting surface of the electronic component of the lead member second lead member, a pressure detecting device recesses have different depths, characterized in that was found is provided in each.
前記圧力検出手段が、ダイアフラムと回路とを形成するシリコン、前記シリコンが固定された検出部ケース、前記検出部ケースにインサート成形された検出部端子と、前記検出部端子と前記回路とを電気的に接続する接続ワイヤとから形成され、
前記開口部で、前記検出部端子と前記リード材とが接続されたことを特徴とする圧力検出装置。 In claim 1,
The pressure detection means electrically connects the silicon forming the diaphragm and the circuit, the detection unit case to which the silicon is fixed, the detection unit terminal insert-molded in the detection unit case, and the detection unit terminal and the circuit. A connecting wire that connects to the
The pressure detection device, wherein the detection unit terminal and the lead material are connected to each other through the opening.
前記開口部を封止する封止部材を備えたことを特徴とする圧力検出装置。 In claim 1 or 2,
A pressure detection device comprising a sealing member for sealing the opening.
前記第１のリード材と前記第２のリード材との間に延在し、かつ、前記電子部品の下を横切り、前記電子部品に接続されない第３のリード材を備えたことを特徴とする圧力検出装置。 In claim 1,
A third lead material is provided that extends between the first lead material and the second lead material, crosses under the electronic component, and is not connected to the electronic component. Pressure detection device.
前記第１のリード材と前記第２のリード材とに設けられた前記窪みには、前記電子部品を包囲するように設けられた位置決め用窪みと、前記位置決め用窪みよりも内側に設けられた厚み確保用窪みとが形成されたことを特徴とする圧力検出装置。 In claim 1,
In the recesses provided in the first lead material and the second lead material, a positioning recess provided so as to surround the electronic component and an inner side than the positioning recess are provided. A pressure detection device having a thickness securing recess.
前記第１のリード材と前記第２のリード材とに設けられた前記窪みには、前記電子部品を包囲するように設けられた位置決め用窪みと、底面に設けられた突起とが形成されたことを特徴とする圧力検出装置。 In claim 1,
A positioning recess provided to surround the electronic component and a protrusion provided on the bottom surface are formed in the recess provided in the first lead material and the second lead material. A pressure detection device characterized by that.
前記接続部材ははんだであって、
前記封止部材は、線膨張係数が前記樹脂ケースよりも小さく、かつ前記電子部品よりも大きく、かつ、前記はんだから析出したはんだフラックスを溶かす性質を持つ樹脂であることを特徴とする圧力検出装置。 In claim 1,
The connecting member is solder,
The pressure detecting device, wherein the sealing member is a resin having a linear expansion coefficient smaller than that of the resin case, larger than that of the electronic component, and having a property of melting a solder flux deposited from the solder. .
前記第１のリード材と前記電子部品との間、および、前記第２のリード材と前記電子部品との間の接続部材には、その厚みが７０μｍ以上の部分が形成されたことを特徴とする圧力検出装置。 In claim 1 ,
The connection member between the first lead material and the electronic component and between the second lead material and the electronic component is formed with a portion having a thickness of 70 μm or more. Pressure detector.
前記接続部材ははんだであって、前記電子部品はチップコンデンサであることを特徴とする圧力検出装置。The pressure detecting device, wherein the connecting member is solder and the electronic component is a chip capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007324161A JP4969430B2 (en) | 2007-12-17 | 2007-12-17 | Pressure detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007324161A JP4969430B2 (en) | 2007-12-17 | 2007-12-17 | Pressure detection device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003154273A Division JP2004356494A (en) | 2003-05-30 | 2003-05-30 | Electronic equipment and pressure detection device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008151792A JP2008151792A (en) | 2008-07-03 |
| JP2008151792A5 true JP2008151792A5 (en) | 2010-07-29 |
| JP4969430B2 JP4969430B2 (en) | 2012-07-04 |
Family
ID=39654071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007324161A Expired - Lifetime JP4969430B2 (en) | 2007-12-17 | 2007-12-17 | Pressure detection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4969430B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5712799B2 (en) * | 2011-06-03 | 2015-05-07 | 株式会社デンソー | Sensor and manufacturing method thereof |
| JP2014195039A (en) * | 2013-02-26 | 2014-10-09 | Tokai Rika Co Ltd | Connection structure of electronic component |
| EP3109897A1 (en) * | 2015-06-23 | 2016-12-28 | Nxp B.V. | A lead frame assembly |
| US9681568B1 (en) * | 2015-12-02 | 2017-06-13 | Ge Energy Power Conversion Technology Ltd | Compact stacked power modules for minimizing commutating inductance and methods for making the same |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01105565A (en) * | 1987-10-17 | 1989-04-24 | Matsushita Electric Ind Co Ltd | Lead frame for hybrid integrated circuit |
| JPH06268120A (en) * | 1993-03-16 | 1994-09-22 | Hitachi Ltd | Heat sink for power switching module |
| JP4117807B2 (en) * | 1997-06-24 | 2008-07-16 | 松下電工株式会社 | Electronic component soldering method |
| JP2000165042A (en) * | 1998-11-30 | 2000-06-16 | Nec Corp | Thin film multilayer wiring board |
| JP2002124616A (en) * | 2000-10-13 | 2002-04-26 | Aisan Ind Co Ltd | Chip-component mounting structure on lead frame |
| JP2002151612A (en) * | 2000-11-10 | 2002-05-24 | Sumitomo Metal Electronics Devices Inc | Package for optical communication and its manufacturing method |
| JP3791403B2 (en) * | 2000-12-04 | 2006-06-28 | 富士電機ホールディングス株式会社 | No-clean flux for lead-free solder and solder composition containing the same |
| JP3752444B2 (en) * | 2001-11-16 | 2006-03-08 | 株式会社日立製作所 | Pressure detection device |
-
2007
- 2007-12-17 JP JP2007324161A patent/JP4969430B2/en not_active Expired - Lifetime
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