JP2007192790A - Semiconductor pressure sensor - Google Patents

Semiconductor pressure sensor Download PDF

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JP2007192790A
JP2007192790A JP2006063442A JP2006063442A JP2007192790A JP 2007192790 A JP2007192790 A JP 2007192790A JP 2006063442 A JP2006063442 A JP 2006063442A JP 2006063442 A JP2006063442 A JP 2006063442A JP 2007192790 A JP2007192790 A JP 2007192790A
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pressure sensor
outer case
semiconductor pressure
terminal portion
semiconductor
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Hiroshi Nakagawa
宏史 中川
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Citizen Miyota Co Ltd
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Citizen Miyota Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor having an inexpensive mounting cost, diversifying mounting patterns, and improving reliability. <P>SOLUTION: Metallic pins 2 are pressed in an outer case 1, a semiconductor sensor chip 3 provided in the opening in the outer case and the top end face of the metallic pin 2 are conducted by a bonding wire 4, and then a protection member is filled in the opening. The seat at the low end of the metallic pin 2 is exposed to the side and the bottom. In addition, an adhesive is filled in a recess 5a surrounded by the outer case 1 and the inside of the low end of the metallic pin (terminal) 2 (Fig. 2), and thereby adhesive strength of the outer case 1 and the metallic pin 2 is improved. <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

本発明は、半導体圧力センサに関し、特に、実装形態の多様化に適した表面実装が可能で、低コスト化および信頼性の高い半導体圧力センサに関するものである。   The present invention relates to a semiconductor pressure sensor, and more particularly to a semiconductor pressure sensor that can be surface-mounted suitable for diversification of mounting forms, is low in cost, and has high reliability.

従来、腕時計や家電製品、さらには自動車、航空機等に至る幅広い分野において用いられる圧力センサがある。その一種としてシリコン結晶板の上面にピエゾ抵抗を形成し、これらのピエゾ抵抗を感圧部として圧力を検出する半導体圧力センサがある。この半導体圧力センサは、半導体製造プロセス技術をそのまま転用することができるため製造が容易で、構造が簡素にできるという利点がある。また、電圧感度が極めて大きく、簡単に増幅可能であるため精度の良い圧力センサが得られることから様々な分野で広く用いられている。   Conventionally, there are pressure sensors used in a wide range of fields such as wristwatches, home appliances, automobiles, airplanes, and the like. As one type, there is a semiconductor pressure sensor that forms piezoresistors on the upper surface of a silicon crystal plate and detects pressure using these piezoresistors as a pressure-sensitive portion. This semiconductor pressure sensor has the advantage that it can be easily manufactured and the structure can be simplified because the semiconductor manufacturing process technology can be used as it is. In addition, since the voltage sensitivity is extremely large and can be easily amplified, a pressure sensor with high accuracy can be obtained, so that it is widely used in various fields.

ここで、従来の半導体圧力センサについて、詳細に説明する。
図１５は、従来の半導体圧力センサを示す斜視図で、図１６は、図１５の対角断面図である。
図１５において、３はシリコン結晶基板からなる半導体圧力センサチップである（以下単にチップという）。該チップ３は受圧面を上面にし、外ケース１の底部所定位置に図示しない接着材により固定されている。金属ピン２が外ケース１を貫通する形態で埋設されており、前記外ケース１内部に位置する前記金属ピン２の端部と前記チップ３上に設けられたボンディングパッド６は、ボンディングワイヤー４によりそれぞれ接続されている。金属ピン２は圧入または接着固定される。前記外ケース１の外部底面方向に突出する前記金属ピン２の端部は、図示しない回路基板のスルーホールに挿入され半田付けにて接続される構成で実装されるものである。 Here, a conventional semiconductor pressure sensor will be described in detail.
FIG. 15 is a perspective view showing a conventional semiconductor pressure sensor, and FIG. 16 is a diagonal sectional view of FIG.
In FIG. 15, 3 is a semiconductor pressure sensor chip made of a silicon crystal substrate (hereinafter simply referred to as a chip). The chip 3 has a pressure-receiving surface as an upper surface and is fixed to a predetermined position on the bottom of the outer case 1 with an adhesive (not shown). A metal pin 2 is embedded in a form penetrating the outer case 1, and an end portion of the metal pin 2 located inside the outer case 1 and a bonding pad 6 provided on the chip 3 are connected by a bonding wire 4. Each is connected. The metal pin 2 is press-fitted or bonded and fixed. The end portion of the metal pin 2 protruding toward the outer bottom surface of the outer case 1 is mounted in a configuration in which it is inserted into a through hole of a circuit board (not shown) and connected by soldering.

外ケース１は、ＰＰＳ（ポリフェニレンサルファイド）、ＰＰＯ（ポリフェニレンオキサイド）、ＰＢＴ（ポリブチレンテレフタレート）、ＰＥＴ（ポリエチレンテレフタレート）等の樹脂を射出成形して形成したものやセラミック材から成るものが好適に用いられている。   The outer case 1 is preferably formed by injection molding of a resin such as PPS (polyphenylene sulfide), PPO (polyphenylene oxide), PBT (polybutylene terephthalate), PET (polyethylene terephthalate), or a ceramic material. It has been.

外ケース１内部にはゲル状のポッティング樹脂７が、チップ３の受圧面及びボンディングワイヤー４を覆うように充填され半導体圧力センサが構成される。該構成により、前記ゲル状ポッティング樹脂７を介してチップ３に圧力が加わると、その圧力に応じてピエゾ抵抗の抵抗値が変化し、この抵抗値に基づき圧力が測定される（例えば、特許文献１参照）。
特開平５−４００６８号公報 A gel-like potting resin 7 is filled in the outer case 1 so as to cover the pressure receiving surface of the chip 3 and the bonding wire 4 to constitute a semiconductor pressure sensor. With this configuration, when a pressure is applied to the chip 3 through the gel-like potting resin 7, the resistance value of the piezoresistor changes according to the pressure, and the pressure is measured based on this resistance value (for example, Patent Documents). 1).
Japanese Patent Laid-Open No. 5-40068

上記で説明した従来技術においては、次に説明するような問題点があった。
従来構成による半導体圧力センサは、外部回路基板との接続手段として金属ピン２が利用されることとなるため、外部回路基板側にピンの挿入穴等スルーホールの加工が必須となり、実装コストを増大させている。さらに、半田付けの状態の検査工程においては、半導体圧力センサ実装面とは反対側の裏面を検査することになり、後工程においても工数を増加させコストを増大させる要因となる。また、従来構成では表面実装に対応が難しく自動化の妨げとなり、結果的に製造コストを増大させてしまうという課題があった。また、実装形態も多様化してきており、半導体圧力センサの裏面側のみの半田付けに限らず、側面部からも半田付けするような複数方向からの半田実装が可能となる構成も望まれている。 The prior art described above has the following problems.
The semiconductor pressure sensor according to the conventional configuration uses the metal pin 2 as a connection means with the external circuit board, so it is necessary to process a through hole such as a pin insertion hole on the external circuit board side, which increases the mounting cost. I am letting. Further, in the inspection process of the soldering state, the back surface opposite to the semiconductor pressure sensor mounting surface is inspected, and this increases the man-hours and increases the cost in the post-process. Further, the conventional configuration has a problem that it is difficult to cope with surface mounting and hinders automation, resulting in an increase in manufacturing cost. In addition, mounting forms have been diversified, and not only soldering only on the back side of the semiconductor pressure sensor, but also a configuration that enables solder mounting from a plurality of directions such as soldering from the side surface is desired. .

本発明は、上記課題に鑑みてなされたもので、その目的は、半導体圧力センサの外部回路基板との接続手段を簡易化し実装コストが安価で低コスト化が図られた半導体圧力センサを提供することにある。また、他の目的として、半導体圧力センサの複数方向からの半田実装を可能とする、実装形態の多様化に対応した表面実装が可能な半導体圧力センサを提供することにある。   The present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor pressure sensor in which the means for connecting the semiconductor pressure sensor to the external circuit board is simplified, the mounting cost is low, and the cost is reduced. There is. Another object of the present invention is to provide a semiconductor pressure sensor capable of surface mounting corresponding to diversification of mounting forms, which enables solder mounting of the semiconductor pressure sensor from a plurality of directions.

また、他の目的として、圧力センサパッケージに埋設された接続端子となる導電部材と、圧力センサパッケージとの接合強度を増加させ、接続端子の脱落を防止することのできる半導体圧力センサを提供することにある。   Another object of the present invention is to provide a semiconductor pressure sensor capable of increasing the bonding strength between a conductive member serving as a connection terminal embedded in a pressure sensor package and the pressure sensor package and preventing the connection terminal from falling off. It is in.

外部からの圧力を検出する半導体圧力センサにおいて、 両端面に開口部を有し、それぞれの断面が凹型形状に形成された外ケースと、 前記外ケース内に充填し、前記外部からの圧力を伝達する保護部材と、その一部が前記外ケースの外部底面と外部側面に露出して埋設される端子部と、その受圧面と前記外ケースの一端面の開口部面とが一致する方向に前記外ケース内部に搭載され、前記保護部材から伝達された外部圧力の検知レベルに応じた電気信号を生成する半導体圧力センサチップと、前記半導体圧力センサチップと前記端子部とを導通させるボンディングワイヤーとを備える半導体圧力センサである。   In a semiconductor pressure sensor for detecting pressure from the outside, an outer case having openings at both end faces and each section having a concave shape, and filling the outer case to transmit the pressure from the outside The protective member, a terminal part of which is exposed and embedded on the outer bottom surface and the outer side surface of the outer case, and the pressure receiving surface and the opening surface of the one end surface of the outer case are aligned with each other. A semiconductor pressure sensor chip that is mounted inside the outer case and generates an electrical signal corresponding to a detection level of the external pressure transmitted from the protective member, and a bonding wire that electrically connects the semiconductor pressure sensor chip and the terminal portion. A semiconductor pressure sensor is provided.

さらに、前記外ケースは、その裏面における前記開口部の中央部にその断面が凹型形状に形成され、接着剤を充填させるための凹部を備えた半導体圧力センサである。   Furthermore, the outer case is a semiconductor pressure sensor having a recess formed in the center of the opening on the back surface and having a concave shape for filling with an adhesive.

前記端子部は、前記半導体圧力センサチップと導通させる前記ボンディングワイヤーとの接続端となり、前記外ケースから露出するピン端子部と、前記ピン端子部の下部に設けられ、前記外ケースに埋設されて、前記外ケースの外部底面と外部側面に露出する台座とを備え、前記台座は、その形状が円柱もしくは角柱であって、前記円柱もしくは角柱の、前記ピン端子部側の平面部に溝および／または前記円柱もしくは角柱の周囲にローレットが形成されている半導体圧力センサである。   The terminal portion serves as a connection end with the bonding wire to be electrically connected to the semiconductor pressure sensor chip, is provided at a pin terminal portion exposed from the outer case, and below the pin terminal portion, and is embedded in the outer case. And an outer bottom surface of the outer case and a pedestal exposed to the outer side surface, and the pedestal has a shape of a cylinder or a prism, and a groove and / or a flat surface on the pin terminal portion side of the cylinder or the prism Alternatively, a semiconductor pressure sensor in which knurls are formed around the cylinder or the prism.

前記外ケースの内側に露出する、前記端子部のボンディングワイヤーとの接続端面は、前記半導体チップの受圧面と平行であり、前記外ケースの開口部端面より底面方向に位置する半導体圧力センサである。   The connection end surface of the terminal portion that is exposed to the inside of the outer case and the bonding wire is parallel to the pressure receiving surface of the semiconductor chip, and is a semiconductor pressure sensor that is located in the bottom direction from the opening end surface of the outer case. .

前記端子部は、その形状が円柱もしくは角柱であって、前記円柱もしくは角柱の周囲にローレットが形成されている半導体圧力センサである。   The terminal portion is a semiconductor pressure sensor whose shape is a cylinder or a prism, and knurls are formed around the cylinder or the prism.

請求項１に記載の半導体圧力センサの構成によれば、端子部の一端が外ケースの外部底面と外部側面に露出する構成を採用しているので、面実装が容易になり、又、外部底面と外部側面の両方向に導電性を有する端子部の一部を露出させた構成であるので両方向から半田実装することができ、表面実装等の実装形態の多様化に対応できるという効果がある。   According to the configuration of the semiconductor pressure sensor according to claim 1, since one end of the terminal portion is exposed to the outer bottom surface and the outer side surface of the outer case, surface mounting becomes easy, and the outer bottom surface In this configuration, a part of the terminal portion having conductivity is exposed in both directions of the external side surface, so that solder mounting can be performed from both directions, and there is an effect that it is possible to cope with diversification of mounting forms such as surface mounting.

請求項２に記載の半導体圧力センサの構成によれば、裏面の中央部に設けた、断面が凹型形状に形成された開口部に接着剤を充填することにより、この接着剤が端子部の下部（台座）に絡まるように塗布され、端子部の固定強化を図ることができるという効果がある。   According to the configuration of the semiconductor pressure sensor according to claim 2, the adhesive is filled in the opening formed in the center of the back surface and having a concave cross section, so that the adhesive is placed under the terminal portion. It is applied so as to be entangled with the (pedestal), and there is an effect that the terminal portion can be fixed and strengthened.

請求項３に記載の半導体圧力センサの構成によれば、細いピン端子部が太い台座上に形成した構造を採ることにより、接続用のピン端子の安定強化を図ることができるという効果がある。   According to the configuration of the semiconductor pressure sensor according to the third aspect, there is an effect that it is possible to enhance the stability of the connecting pin terminal by adopting a structure in which the thin pin terminal portion is formed on the thick pedestal.

請求項４に記載の半導体圧力センサの構成によれば、入力端子となる端子部の下部にある、接着剤が付着する台座の平面部に溝及び／または台座の周囲にローレットを設けるので、接着面が増加し、外ケースとの接合強度をさらに高め、半導体圧力センサの超小型化を実現できるという効果がある。   According to the configuration of the semiconductor pressure sensor according to claim 4, the knurls are provided around the groove and / or the pedestal in the flat portion of the pedestal to which the adhesive adheres at the lower portion of the terminal portion serving as the input terminal. There is an effect that the surface is increased, the bonding strength with the outer case is further increased, and the semiconductor pressure sensor can be miniaturized.

請求項５に記載の半導体圧力センサの構成によれば、ボンディングワイヤーが形成するループ高さより高い位置まで、外ケースの側壁が全周にわたり設けられる結果、ポッティング樹脂でボンディングワイヤーを保護出来るまで充填しても、ポッティング樹脂が外ケースの外へ流れ出るのを防止できるという効果がある。   According to the structure of the semiconductor pressure sensor of claim 5, the side wall of the outer case is provided over the entire circumference up to a position higher than the loop height formed by the bonding wire, so that the bonding wire can be filled with the potting resin until it can be protected. However, there is an effect that the potting resin can be prevented from flowing out of the outer case.

請求項６に記載の半導体圧力センサの構成によれば、端子部の周囲にローレットを設けることにより、凹部に設けられる接着剤との接着面が増加し、外ケースとの接合強度を高めることができるという効果がある。   According to the configuration of the semiconductor pressure sensor according to claim 6, by providing the knurling around the terminal portion, the adhesive surface with the adhesive provided in the concave portion is increased, and the bonding strength with the outer case is increased. There is an effect that can be done.

外部からの圧力を検出する半導体圧力センサにおいて、両端面に開口部を有し、それぞれの断面が凹型形状に形成された外ケースと、前記外ケース内に充填し、外部からの圧力を伝達する保護部材と、その一端が前記外ケースに埋設され、他端が前記外ケースから露出する端子部と、前記保護部材からの外部圧力の検知レベルに応じた電気信号を生成する半導体圧力センサチップと、その前記半導体圧力センサチップの受圧面と前記外ケースの一端面の開口部面とが一致する方向に前記半導体圧力センサチップが前記外ケース内部に搭載され、前記半導体圧力センサチップと前記端子部とを導通させるワイヤーを備え、露出した端子部と外ケースによってできた凹部に接着剤を塗布した半導体圧力センサである。
以下、本発明の半導体圧力センサの実施例について、図面を参照して詳細に説明する。 In a semiconductor pressure sensor for detecting pressure from the outside, an outer case having openings on both end faces and each section being formed in a concave shape, filling the outer case, and transmitting pressure from the outside A protective member; a terminal portion having one end embedded in the outer case and the other end exposed from the outer case; and a semiconductor pressure sensor chip that generates an electrical signal corresponding to a detection level of external pressure from the protective member; The semiconductor pressure sensor chip is mounted inside the outer case in a direction in which the pressure receiving surface of the semiconductor pressure sensor chip and the opening surface of the one end surface of the outer case coincide with each other, and the semiconductor pressure sensor chip and the terminal portion Is a semiconductor pressure sensor in which an adhesive is applied to a recessed portion formed by an exposed terminal portion and an outer case.
Hereinafter, embodiments of the semiconductor pressure sensor of the present invention will be described in detail with reference to the drawings.

図１乃至図４は、本発明に係る半導体圧力センサの実施例１の構成を示す。図１は半導体圧力センサの上面側から見た外観斜視図、図２はその下面側から見た外観斜視図、図３はその正面からみた断面図、図４は、半導体圧力センサの端子部である金属ピンを示す斜視図である。   1 to 4 show a configuration of a first embodiment of a semiconductor pressure sensor according to the present invention. 1 is an external perspective view of the semiconductor pressure sensor as viewed from the upper surface side, FIG. 2 is an external perspective view of the semiconductor pressure sensor as viewed from its lower surface side, FIG. 3 is a cross-sectional view as viewed from the front, and FIG. It is a perspective view which shows a certain metal pin.

図１及び図２に示すように、外ケース１は、両端面に開口部を有し、それぞれの断面が凹型形状に形成され、その材質はセラミック製で、該外ケース１に導電性部材である金属ピン２が埋設されている。該金属ピン２は外ケース１を貫通した形態で圧入されて固定してあり、さらに金属ピン２の一部が外ケース１の外部底面と外部側面に露出している。そして、図３に示すように、その外ケース１の裏面側における中央部の開口部に凹型形状の接着剤充填凹部５ａを設け、該凹部５ａに接着剤５を充填する。接着剤充填凹部５ａの反対側に半導体圧力センサチップ３を搭載するための開口部８が設けてあり、半導体圧力センサチップ３の受圧面を外ケース１の開口方向に向け、接着剤５により固定設置されている(接着剤不図示)。半導体圧力センサチップ３の受圧面上にボンディングパッド６が設けられている。   As shown in FIGS. 1 and 2, the outer case 1 has openings at both end faces, each of which has a concave shape, and is made of ceramic. The outer case 1 is made of a conductive member. A certain metal pin 2 is embedded. The metal pin 2 is press-fitted and fixed in a form penetrating the outer case 1, and a part of the metal pin 2 is exposed to the outer bottom surface and the outer side surface of the outer case 1. And as shown in FIG. 3, the concave-shaped adhesive filling recessed part 5a is provided in the opening part of the center part in the back surface side of the outer case 1, The adhesive agent 5 is filled into this recessed part 5a. An opening 8 for mounting the semiconductor pressure sensor chip 3 is provided on the opposite side of the adhesive filling recess 5 a, and the pressure receiving surface of the semiconductor pressure sensor chip 3 is directed to the opening direction of the outer case 1 and fixed by the adhesive 5. Installed (adhesive not shown). A bonding pad 6 is provided on the pressure receiving surface of the semiconductor pressure sensor chip 3.

又、図４に示すように、金属ピン２は、ボンディングワイヤー４との接続端となるピン端子部２ａと、外ケース１に埋設され、ピン端子部２ａの下部に設けられる、外ケース１の外部底面と外部側面に露出する台座２ｂとを備える。そして、前記金属ピン２は金メッキにて表面処理されており、上端面にボンディングワイヤー４にて前記ボンディングパッド６と接続され、半導体圧力センサチップ３は外ケース１の外部と導通となる。前記開口部にゲル状ポッティング樹脂７を充填して半導体圧力センサが完成となる。ここで、半導体圧力センサチップ３は、ゲル状ポッティング樹脂７から伝達された外部圧力の検知レベルに応じた電気信号を生成する。尚、図４に示した端子ピン２の台座２ｂはその形状が円柱をなしているが、角柱であってもよい。   Further, as shown in FIG. 4, the metal pin 2 is embedded in the pin terminal portion 2 a serving as a connection end with the bonding wire 4 and the outer case 1, and provided in the lower portion of the pin terminal portion 2 a. An outer bottom surface and a base 2b exposed on the outer side surface are provided. The metal pin 2 is surface-treated by gold plating, and is connected to the bonding pad 6 by a bonding wire 4 on the upper end surface, so that the semiconductor pressure sensor chip 3 is electrically connected to the outside of the outer case 1. A semiconductor pressure sensor is completed by filling the opening with the gel-like potting resin 7. Here, the semiconductor pressure sensor chip 3 generates an electrical signal corresponding to the detection level of the external pressure transmitted from the gel-like potting resin 7. The pedestal 2b of the terminal pin 2 shown in FIG. 4 has a cylindrical shape, but may be a prism.

前記構成によれば、金属ピン２下端の台座２ｂが外ケース１の外部底面と外部側面に露出する構成としたので面実装が容易になる。また、外部底面と外部側面の両方向に金属ピン２下端の台座２ｂを露出させた構成であるので両方向から半田実装することができ、表面実装等の実装形態の多様化に対応できる。また、接着剤充填凹部５ａを設けることにより、外ケース１と金属ピン２下端の台座２ｂに接着剤５が付着することで、外ケース１と金属ピン２の接合について強度を高めることができる。この結果、金属ピン２が外ケース１から脱落することを防止できる。   According to the said structure, since the base 2b of the metal pin 2 lower end was exposed to the external bottom face and external side surface of the outer case 1, surface mounting becomes easy. Further, since the base 2b at the lower end of the metal pin 2 is exposed in both directions of the outer bottom surface and the outer side surface, it can be solder-mounted from both directions, and can cope with diversification of mounting forms such as surface mounting. Further, by providing the adhesive filling recess 5a, the adhesive 5 adheres to the pedestal 2b at the lower end of the outer case 1 and the metal pin 2, so that the strength of the joint between the outer case 1 and the metal pin 2 can be increased. As a result, the metal pin 2 can be prevented from dropping from the outer case 1.

次に、本発明に係る半導体圧力センサの実施例２について説明する。実施例２において、実施例１と異なる点についてのみ説明し、図において同一のブロックには同一の符号を付し、その同一のブロックについての詳細な説明は省略する。図５は、本発明の実施例２における半導体圧力センサの端子部である金属ピンの詳細を説明する斜視図である。図６は、その金属ピンを半導体圧力センサのパッケージに組み込んだ場合の断面を示す図である。
図５に示すように、実施例１と異なる点は導電性部材である金属ピン２において台座２ｃ上面に溝２ｅが設けた点にある。そして、図６に示すように、図５の金属ピン２をセラミック製の外ケース１に圧入し、該金属ピン２の台座２ｃが外部側面と外部底面に露出されている。台座２ｃと外ケース１によって形成された接着剤充填凹部５ａに接着剤５を充填すると、その溝２ｅに接着剤５が入り込み台座２ａが強固に固定されることになる。
尚、図６では、接着剤５が充填されない溝２ｅが図示されているが、接着剤５が充填される溝２ｅに限り、充填されない溝は省略することもできる。実施例１と同様に半導体圧力センサチップを搭載することで半導体圧力センサの完成となる。 Next, a second embodiment of the semiconductor pressure sensor according to the present invention will be described. In the second embodiment, only differences from the first embodiment will be described. In the figure, the same blocks are denoted by the same reference numerals, and detailed description of the same blocks will be omitted. FIG. 5 is a perspective view illustrating details of a metal pin that is a terminal portion of the semiconductor pressure sensor according to the second embodiment of the present invention. FIG. 6 is a view showing a cross section when the metal pin is incorporated in a package of a semiconductor pressure sensor.
As shown in FIG. 5, the difference from the first embodiment is that a groove 2e is provided on the upper surface of the base 2c in the metal pin 2 which is a conductive member. As shown in FIG. 6, the metal pin 2 of FIG. 5 is press-fitted into the ceramic outer case 1, and the pedestal 2c of the metal pin 2 is exposed on the outer side surface and the outer bottom surface. When the adhesive 5 is filled into the adhesive filling recess 5a formed by the pedestal 2c and the outer case 1, the adhesive 5 enters the groove 2e and the pedestal 2a is firmly fixed.
In FIG. 6, the groove 2 e that is not filled with the adhesive 5 is illustrated, but only the groove 2 e that is filled with the adhesive 5 can be omitted. A semiconductor pressure sensor is completed by mounting a semiconductor pressure sensor chip as in the first embodiment.

以上説明したように、上記実施例１で得られたと同様の効果が得られるとともに、次に説明するような新たな効果が得られる。
入出力端子となる金属ピン２の下部の、接着剤５が付着する台座２ｃの上面に溝２ｅを設けることにより、接着剤５との接着面が増加し、外ケース１との接合についてさらなる強度を高めることができ、半導体圧力センサの金属ピン２の強化を実現できる。
尚、半導体圧力センサをさらに小型化する場合、溝２を設けることで接着面が確保され、外ケース１との接合についての強度を保持することができる。 As described above, the same effect as that obtained in the first embodiment can be obtained, and a new effect as described below can be obtained.
By providing the groove 2e on the upper surface of the base 2c to which the adhesive 5 adheres, below the metal pin 2 serving as the input / output terminal, the adhesive surface with the adhesive 5 is increased, and the strength of the joint with the outer case 1 is increased. It is possible to enhance the metal pin 2 of the semiconductor pressure sensor.
When the semiconductor pressure sensor is further reduced in size, the bonding surface is secured by providing the groove 2, and the strength for joining with the outer case 1 can be maintained.

次に、本発明に係る半導体圧力センサの実施例３について、説明する。実施例３において、実施例１と異なる点についてのみ説明し、図において同一ブロックには同一の符号を付し、その同一ブロックについての説明は省略する。図７は、本発明の実施例３における半導体圧力センサの端子部である金属ピン２の詳細を説明する斜視図である。図８は、図７に示した金属ピン２を半導体圧力センサのパッケージである外ケース１に組み込んだ場合の下面を示す図である。   Next, a third embodiment of the semiconductor pressure sensor according to the present invention will be described. In the third embodiment, only differences from the first embodiment will be described. In the figure, the same blocks are denoted by the same reference numerals, and description of the same blocks will be omitted. FIG. 7 is a perspective view illustrating details of the metal pin 2 that is a terminal portion of the semiconductor pressure sensor according to the third embodiment of the present invention. FIG. 8 is a view showing a lower surface when the metal pin 2 shown in FIG. 7 is incorporated in an outer case 1 which is a package of a semiconductor pressure sensor.

図７に示すように、実施例１と異なる点は導電性部材である金属ピンの台座２dの周囲にローレット(ぎざぎざ)２ｆを設けた点にある。そして、図８に示すように、図７の金属ピン２をセラミック製の外ケース１に圧入し、台座２ｄと外ケース１によって形成された接着剤充填凹部５ａに接着剤５を充填すると、そのローレット２ｆに接着剤５が入り込み台座２ｄが強固に固定されることになる。尚、図８では、接着剤５が充填されないローレット２ｆが図示されているが、接着剤５が充填されるローレット２ｆに限り、充填されないローレット２ｆは省略することもできる。実施例１、実施例２と同様に半導体圧力センサチップを搭載することで半導体圧力センサの完成となる。   As shown in FIG. 7, the difference from the first embodiment is that a knurl 2f is provided around a base 2d of a metal pin which is a conductive member. Then, as shown in FIG. 8, when the metal pin 2 of FIG. 7 is press-fitted into the ceramic outer case 1 and the adhesive filling recess 5a formed by the base 2d and the outer case 1 is filled with the adhesive 5, The adhesive 5 enters the knurl 2f and the pedestal 2d is firmly fixed. In FIG. 8, the knurl 2 f that is not filled with the adhesive 5 is illustrated, but only the knurl 2 f that is filled with the adhesive 5 can be omitted. A semiconductor pressure sensor is completed by mounting a semiconductor pressure sensor chip in the same manner as in the first and second embodiments.

以上、説明したように、上記実施例１と同様の効果が得られるとともに、次に説明するような新たな効果が得られる。
入出力端子となる金属ピン２の台座２ｄの接着剤が付着する部分にローレット(ぎざぎざ)を設けることにより、接着剤５との接着面が増加し、外ケース１との接合についてさらなる強度を高めることができるので、実施例１と実施例２と同様の半導体圧力センサ構成にすることで、半導体圧力センサの金属ピン２の強化を実現できる。
尚、半導体圧力センサをさらに小型化する場合、ローレット２ｆを設けることで接着面が確保され、外ケース１との接合についての強度を保持することができる。 As described above, the same effects as those of the first embodiment can be obtained, and new effects as described below can be obtained.
By providing knurls on the part of the pedestal 2d of the pedestal 2d of the metal pin 2 serving as the input / output terminal, the adhesive surface with the adhesive 5 is increased and the strength of the joint with the outer case 1 is further increased. Therefore, by using the same semiconductor pressure sensor configuration as in the first and second embodiments, the metal pin 2 of the semiconductor pressure sensor can be strengthened.
When the semiconductor pressure sensor is further reduced in size, the knurled surface 2f is provided to secure the bonding surface and to maintain the strength for joining with the outer case 1.

ここで、実施例４は、実施例１の図４に示す台座２ｂの形状が円柱もしくは角柱であって、円柱もしくは角柱の、ピン端子部２ａ側の平面部に溝２ｅを、および前述の円柱もしくは角柱の周囲にローレット２ｆを形成したものである。その他の点については、実施例１と同じである。
図９は、金属ピン２の台座２ｇの上面部に溝２ｅ、および台座２ｇの周囲にローレット２ｆが形成されていることを示す斜視図である。該金属ピン２をセラミック製の外ケース１に埋設し、実施例１と同様に半導体圧力センサを構成する。 Here, in the fourth embodiment, the shape of the pedestal 2b shown in FIG. 4 of the first embodiment is a cylinder or a prism, and the groove 2e is formed in the plane portion of the cylinder or the prism on the pin terminal portion 2a side, and the above-described cylinder. Alternatively, knurling 2f is formed around the prism. The other points are the same as in the first embodiment.
FIG. 9 is a perspective view showing that the groove 2e is formed on the upper surface of the base 2g of the metal pin 2 and the knurl 2f is formed around the base 2g. The metal pin 2 is embedded in a ceramic outer case 1 to constitute a semiconductor pressure sensor as in the first embodiment.

上記実施例１で得られたと同様の効果が得られるとともに、接着剤５との接着面が大きく増加し、外ケース１との接合についてさらなる強度を高めることができるので、半導体圧力センサの金属ピン２の強化を実現できる。また、半導体圧力センサをさらに小型化する場合、溝２ｅとローレット２ｆを設けることで接着面が確保され、外ケース１との接合についての強度を保持することができる。   Since the same effect as that obtained in the first embodiment can be obtained, the adhesion surface with the adhesive 5 can be greatly increased, and the strength of the joint with the outer case 1 can be further increased. Therefore, the metal pin of the semiconductor pressure sensor 2 enhancements can be realized. Further, when the semiconductor pressure sensor is further reduced in size, the bonding surface is secured by providing the groove 2e and the knurling 2f, and the strength for bonding with the outer case 1 can be maintained.

次に、本発明に係る半導体圧力センサの実施例５について、説明する。実施例５において、実施例１と異なる点についてのみ説明し、図において同一ブロックには同一の符号を付し、その同一ブロックについての説明は省略する。図１０は、本発明に係る半導体圧力センサの構造を示す外観斜視図、図１１は、その下面側から見た外観斜視図、図１２は、正面から見た断面図である。
図１０において、実施例１と異なる点は、該外ケース１の角部付近に、導電性部材である端子部９が円柱形状をなし、実施例１のピン端子部をなくして端子部９の上端面をボンディングワイヤー４との接続端面としたものである。そして、図１１に示すように、外ケース１を貫通した形態で、その内側より外部底面部および外部側面部に端子部９の一部面が現れるように、配置されている。尚、ケース１の裏面に凹部５が形成されていることは、実施例１と同様である。 Next, a semiconductor pressure sensor according to a fifth embodiment of the present invention will be described. In the fifth embodiment, only differences from the first embodiment will be described. In the figure, the same block is denoted by the same reference numeral, and the description of the same block is omitted. 10 is an external perspective view showing the structure of the semiconductor pressure sensor according to the present invention, FIG. 11 is an external perspective view seen from the lower surface side, and FIG. 12 is a cross-sectional view seen from the front.
In FIG. 10, the difference from the first embodiment is that the terminal portion 9, which is a conductive member, has a cylindrical shape near the corner of the outer case 1, and the pin terminal portion of the first embodiment is eliminated. The upper end surface is a connection end surface with the bonding wire 4. And as shown in FIG. 11, it arrange | positions so that the partial surface of the terminal part 9 may appear in the external bottom face part and the external side face part from the inner side in the form which penetrated the outer case 1. Note that the concave portion 5 is formed on the back surface of the case 1 as in the first embodiment.

又、図１２に示すように、端子部９の露出部は、外ケース１の外部底面および外部側面とほぼ同一面と成るように配置され、又、この端子部９の上端は外ケース１の内部に向かい大きくせり出し、その接続端面９ａはボンディングワイヤー４の一端が接続される。ここで、ボンディングワイヤー４は金線が利用されているので、その接続強度を得るために、端子部９の少なくとも上端面のボンディングワイヤー４との接続端面９ａは、金メッキにて表面処理されている。   As shown in FIG. 12, the exposed portion of the terminal portion 9 is disposed so as to be substantially flush with the outer bottom surface and the outer side surface of the outer case 1, and the upper end of the terminal portion 9 is the same as that of the outer case 1. One end of the bonding wire 4 is connected to the connection end surface 9a. Here, since the bonding wire 4 uses a gold wire, in order to obtain the connection strength, at least the upper end surface of the terminal portion 9 and the connection end surface 9a with the bonding wire 4 are surface-treated by gold plating. .

図１２において、半導体圧力センサチップ３の受圧面（検知部）は、端子部９のボンディングワイヤー４との接続端面９ａとは平行で、外ケース１の開口部端面より底面方向に位置し、半導体圧力センサチップ３の上端面にあるボンディングパッド６の高さと、端子部９のボンディングワイヤー４との接続端面９ａはほぼ一致した構成である。ボンディングパッド６と接続端面９ａのそれぞれの位置を一致させることにより、ボンディングワイヤー４の接続が容易になり、ボンディング精度がよくなる。さらに、ボンディングワイヤー４が形成するループ高さより高い位置まで、外ケース１の側壁が全周にわたり設けられているので、ポッティング樹脂７でボンディングワイヤー４を保護出来るまで充填しても、ポッティング樹脂が外ケース１の外へ流れ出ることを防止できる。
前記構成によれば、実施例１で説明した効果が得られるとともに、導電性部材である端子部９全体が円柱形状をなすことにより、外ケースの外部側面がさらに広く取れるので、さらなる側面における半田実装が可能となる。 In FIG. 12, the pressure receiving surface (detecting portion) of the semiconductor pressure sensor chip 3 is parallel to the connection end surface 9 a of the terminal portion 9 to the bonding wire 4, and is positioned in the bottom direction from the opening end surface of the outer case 1. The height of the bonding pad 6 on the upper end surface of the pressure sensor chip 3 and the connection end surface 9a of the terminal portion 9 to the bonding wire 4 are substantially the same. By matching the positions of the bonding pad 6 and the connection end surface 9a, the bonding wire 4 can be easily connected and the bonding accuracy is improved. Furthermore, since the side wall of the outer case 1 is provided all the way up to a position higher than the loop height formed by the bonding wire 4, even if the bonding wire 4 can be protected with the potting resin 7, the potting resin is not removed. It can prevent flowing out of case 1.
According to the above configuration, the effects described in the first embodiment can be obtained, and the outer side surface of the outer case can be made wider by forming the entire terminal portion 9 as a conductive member into a cylindrical shape. Implementation is possible.

次に、端子部にローレットを設けた実施例６について、図１３、図１４を参照して説明する。図１３は、実施例６における端子部９の構造を示す図で、（ａ）は円柱形状の端子部９を、（ｂ）は角柱形状の端子部１０を示す斜視図である。図１４は、図１３（ａ）に示す端子部９を用いた半導体圧力センサの裏面側から見た断面図である。
図１３（ａ）に示す端子部９は、円柱の周囲にローレット９ｂを、（ｂ）の端子部１０は、角柱の周囲にローレット１０ｂを設けたもので、それぞれの上面は、半導体圧力センサチップ３との接続用ボンディングワイヤー４の接続端面９ａ，１０ａとなる。図１４に示すように、このローレット９ｂを、又、図示していないが角柱の場合のローレット１０ｂ設けることにより、凹部５ｂに設けられる接着剤５との接着面が増加し、外ケース１との接合強度を高めることができるのは、実施例３の場合と同様である。
尚、図１４は、円柱もしくは角柱の周囲の全面にローレットを設けているが、一部であってもよい。 Next, Example 6 in which a knurling is provided in the terminal portion will be described with reference to FIGS. 13 and 14. FIGS. 13A and 13B are diagrams illustrating the structure of the terminal portion 9 according to the sixth embodiment. FIG. 13A is a perspective view illustrating the cylindrical terminal portion 9, and FIG. 13B is a perspective view illustrating the prismatic terminal portion 10. FIG. 14 is a cross-sectional view of the semiconductor pressure sensor using the terminal portion 9 shown in FIG.
The terminal portion 9 shown in FIG. 13 (a) has a knurl 9b around the cylinder, and the terminal portion 10 in FIG. 13 (b) has a knurl 10b around the prism. Each upper surface is a semiconductor pressure sensor chip. 3 are connection end faces 9a and 10a of the bonding wire 4 for connection to the wire 3. As shown in FIG. 14, the knurling 9b is provided with a knurling 10b (not shown) in the case of a prism, thereby increasing the bonding surface with the adhesive 5 provided in the recess 5b. The bonding strength can be increased as in the case of Example 3.
In FIG. 14, knurls are provided on the entire surface around the cylinder or prism, but a part of the knurls may be used.

ここで、本発明に係る実施例の変形例について、説明する。
上記で本発明の実施例について説明したが、セラミック製の角形器状の外ケース１は絶縁部材であれば良く樹脂材で構成することが、又、ボンディングワイヤー４はボンディング方法を変えるとアルミ線でも可能である。そして、アルミ線を用いる場合には、金属ピン２のピン端子部２ａの少なくとも上端面（ボンディングワイヤー４を接続する面）の金メッキが不要となる。
以上説明したように、本発明の精神を逸脱しない範囲で改変を実施することが可能である。 Here, the modification of the Example which concerns on this invention is demonstrated.
Although the embodiment of the present invention has been described above, the ceramic rectangular outer case 1 may be made of a resin material as long as it is an insulating member, and the bonding wire 4 is an aluminum wire when the bonding method is changed. But it is possible. And when using an aluminum wire, the gold plating of the at least upper end surface (surface which connects the bonding wire 4) of the pin terminal part 2a of the metal pin 2 becomes unnecessary.
As described above, modifications can be made without departing from the spirit of the present invention.

本発明に係る半導体圧力センサの実施例１の構成を示し、半導体圧力センサの上面側から見た外観斜視図である。（実施例１）BRIEF DESCRIPTION OF THE DRAWINGS It is the external appearance perspective view which showed the structure of Example 1 of the semiconductor pressure sensor which concerns on this invention, and was seen from the upper surface side of the semiconductor pressure sensor. Example 1 半導体圧力センサの下面側から見た外観斜視図である。（実施例１）It is the external appearance perspective view seen from the lower surface side of the semiconductor pressure sensor. Example 1 正面からみた断面図である。（実施例１）It is sectional drawing seen from the front. Example 1 半導体圧力センサの端子部を示す斜視図である。（実施例１）It is a perspective view which shows the terminal part of a semiconductor pressure sensor. Example 1 半導体圧力センサの端子部を示す斜視図である。（実施例２）It is a perspective view which shows the terminal part of a semiconductor pressure sensor. (Example 2) 図５を外ケースに組み込んだ断面図である。（実施例２）It is sectional drawing which integrated FIG. 5 in the outer case. (Example 2) 半導体圧力センサの端子部を示す斜視図である。（実施例３）It is a perspective view which shows the terminal part of a semiconductor pressure sensor. (Example 3) 図７を外ケースに組み込み下面側から見た正面図である。（実施例３）FIG. 8 is a front view of FIG. 7 assembled into the outer case and viewed from the lower surface side. (Example 3) 金属ピン２の台座２ｇの上面部に溝２ｅ、および台座２ｇの周囲にローレット２ｆが形成されていることを示す斜視図である。（実施例４）It is a perspective view which shows that the groove | channel 2e is formed in the upper surface part of the base 2g of the metal pin 2, and the knurl 2f is formed around the base 2g. (Example 4) 本発明に係る半導体圧力センサの構造を示す外観斜視図である。（実施例５）1 is an external perspective view showing a structure of a semiconductor pressure sensor according to the present invention. (Example 5) 図１０の半導体圧力センサの下面側から見た外観斜視図である。（実施例５）It is the external appearance perspective view seen from the lower surface side of the semiconductor pressure sensor of FIG. (Example 5) 図１０の半導体圧力センサの正面から見た断面図である。（実施例５）It is sectional drawing seen from the front of the semiconductor pressure sensor of FIG. (Example 5) 実施例６における端子部９の構造を示す図で、（ａ）は円柱形状の端子部９を、（ｂ）は角柱形状の端子部１０を示す斜視図である。（実施例６）It is a figure which shows the structure of the terminal part 9 in Example 6, (a) is a perspective view which shows the cylindrical terminal part 9 and (b) shows the prism-shaped terminal part 10. FIG. (Example 6) 図１３（ａ）に示す端子部９を用いた半導体圧力センサの裏面側から見た断面図である。（実施例６）It is sectional drawing seen from the back surface side of the semiconductor pressure sensor using the terminal part 9 shown to Fig.13 (a). (Example 6) 従来の半導体圧力センサを示す外観斜視図である。It is an external appearance perspective view which shows the conventional semiconductor pressure sensor. 図１５の対角の断面図である。It is sectional drawing of the diagonal of FIG.

符号の説明Explanation of symbols

１ 外ケース ２ 金属ピン (端子部) ２ａ ピン端子部
２ｂ、２ｃ、２ｄ 、２ｇ 台座 ２ｅ 溝 ２ｆ ローレット
３ 半導体圧力センサチップ
４ ボンディングワイヤー
５ 接着剤 ５ａ 凹部 ６ ボンディングパッド
７ ポッティング樹脂（保護部材） ８ 一端の開口部
９、１０ 端子部 ９ａ、１０ａ 接続端面 ９ｂ、１０ｂ ローレット。 DESCRIPTION OF SYMBOLS 1 Outer case 2 Metal pin (terminal part) 2a Pin terminal part 2b, 2c, 2d, 2g Base 2e Groove 2f Knurl 3 Semiconductor pressure sensor chip 4 Bonding wire 5 Adhesive 5a Recessed part 6 Bonding pad 7 Potting resin (protective member) 8 Opening part 9 at one end, terminal part 9a, 10a End face 9b, 10b Knurl.

Claims (6)

外部からの圧力を検出する半導体圧力センサにおいて、
両端面に開口部を有し、それぞれの断面が凹型形状に形成された外ケースと、
前記外ケース内に充填し、前記外部からの圧力を伝達する保護部材と、
その一部が前記外ケースの外部底面と外部側面に露出して埋設される端子部と、
その受圧面と前記外ケースの一端面の開口部面とが一致する方向に前記外ケース内部に搭載され、前記保護部材から伝達された外部圧力の検知レベルに応じた電気信号を生成する半導体圧力センサチップと、
前記半導体圧力センサチップと前記端子部とを導通させるボンディングワイヤーとを備えることを特徴とする半導体圧力センサ。 In semiconductor pressure sensors that detect external pressure,
An outer case having openings on both end faces, each of which has a concave cross section;
A protective member that fills the outer case and transmits pressure from the outside;
A terminal part of which is exposed and embedded in the outer bottom surface and the outer side surface of the outer case;
A semiconductor pressure that is mounted inside the outer case in a direction in which the pressure-receiving surface and the opening surface of one end surface of the outer case coincide with each other, and generates an electrical signal corresponding to the detection level of the external pressure transmitted from the protective member A sensor chip;
A semiconductor pressure sensor comprising: a bonding wire for conducting the semiconductor pressure sensor chip and the terminal portion. 前記外ケースは、その裏面における前記開口部の中央部にその断面が凹型形状に形成され、接着剤を充填させるための凹部を備えることを特徴とする請求項１に記載の半導体圧力センサ。   2. The semiconductor pressure sensor according to claim 1, wherein the outer case has a concave shape in a cross-sectional shape at a central portion of the opening on the back surface thereof and is filled with an adhesive. 前記端子部は
前記半導体圧力センサチップと導通させる前記ボンディングワイヤーとの接続端となり、前記外ケースから露出するピン端子部と、
前記ピン端子部の下部に設けられ、前記外ケースに埋設されて、前記外ケースの外部底面と外部側面に露出する台座とを備えることを特徴とする請求項１に記載の半導体圧力センサ。 The terminal portion becomes a connection end with the bonding wire to be electrically connected to the semiconductor pressure sensor chip, and a pin terminal portion exposed from the outer case,
The semiconductor pressure sensor according to claim 1, further comprising a pedestal provided at a lower portion of the pin terminal portion, embedded in the outer case, and exposed to an outer bottom surface and an outer side surface of the outer case. 前記台座は、その形状が円柱もしくは角柱であって、
前記円柱もしくは角柱の、前記ピン端子部側の平面部に溝および／または前記円柱もしくは角柱の周囲にローレットが形成されていることを特徴とする請求項３に記載の半導体圧力センサ。 The pedestal is cylindrical or prismatic in shape,
4. The semiconductor pressure sensor according to claim 3, wherein a groove and / or a knurl is formed around the cylinder or the prism in a plane portion of the cylinder or the prism on the pin terminal portion side. 前記外ケースの内側に露出する、前記端子部のボンディングワイヤーとの接続端面は、
前記半導体チップの受圧面と平行であり、前記外ケースの開口部端面より底面方向位置することを特徴とする請求項１に記載の半導体圧力センサ。 The connection end surface with the bonding wire of the terminal part exposed inside the outer case is
2. The semiconductor pressure sensor according to claim 1, wherein the semiconductor pressure sensor is parallel to a pressure receiving surface of the semiconductor chip and is positioned in a bottom direction from an end surface of the opening of the outer case. 前記端子部は、その形状が円柱もしくは角柱であって、
前記円柱もしくは角柱の周囲にローレットが形成されていることを特徴とする請求項１に記載の半導体圧力センサ。 The terminal part has a cylindrical or prismatic shape,
The semiconductor pressure sensor according to claim 1, wherein knurls are formed around the cylinder or the prism.
JP2006063442A 2005-12-22 2006-03-09 Semiconductor pressure sensor Pending JP2007192790A (en)

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JP2006063442A JP2007192790A (en) 2005-12-22 2006-03-09 Semiconductor pressure sensor

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009119349A1 (en) * 2008-03-24 2009-10-01 アルプス電気株式会社 Pressure sensor package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009119349A1 (en) * 2008-03-24 2009-10-01 アルプス電気株式会社 Pressure sensor package
JPWO2009119349A1 (en) * 2008-03-24 2011-07-21 アルプス電気株式会社 Pressure sensor package
JP5089767B2 (en) * 2008-03-24 2012-12-05 アルプス電気株式会社 Pressure sensor package

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