JP3407631B2 - Pressure sensor - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure sensor that converts pressure into an electric signal.

[0002]

2. Description of the Related Art Conventionally, various pressure sensors have been provided, but FIG. 5 is a side sectional view showing an example of a conventional pressure sensor for detecting the pressure of a fluid such as gas or liquid. This pressure sensor A ″ is a pressure introducing device that houses a sensor unit 10 for converting the pressure of a fluid to be detected into an electric signal into a body (package) 1 ″ and has a pressure introducing port 4a ″ for introducing the fluid. The tube 4 "is provided on the body 1".

The sensor portion 10 is a thin film diaphragm portion (not shown) formed by processing a semiconductor substrate, and a detection element (piezoresistor or the like) for detecting distortion of the diaphragm portion due to pressure.
Is formed on the sensor chip. The body 1 "is composed of a synthetic resin body 2" and a cover 3 ", and a pressure introducing pipe 4" having a substantially cylindrical shape is projected from the bottom of the body 2 "having a substantially box shape. In this body 2 ", a plurality of terminals (leads) 22 are implanted by insert molding in order to take out an electric signal from the sensor section 10 to the outside, and the base ends of these terminals 22 are made of gold, aluminum or the like. Is connected to the sensor unit 10 by a wire 12 composed of.
The wire 12 and the sensor unit 1 are provided on the surface of the sensor unit 10.
In order to protect the joint part of the 0 electrode (not shown) and the wire 12 itself, the JCR (Ju
nction Coat Resin: Junction protection resin 14 is applied and cured.

On the other hand, the sensor portion 10 is die-bonded to the end portion of the pressure introducing pipe 4 "by a pedestal 13 made of glass, for example, to detect pressure of gas or liquid introduced from the outside through the pressure introducing port 4a". Fluid pressure is applied to the diaphragm section. In order to facilitate mounting on a substrate, the body 1 ″ is of a DIP (Dual Inline Package) type in which a plurality of terminals 22 are projected in two directions from both side surfaces of the body 1 ″.

In such a DIP type pressure sensor A ", since the terminals 22 are projected laterally from the side surface of the body 1", when mounted on the printed circuit board 20 as shown in FIG. A mounting area (width dimension L ₂ ) larger than the width dimension L ₁ of the body 1 ″ was required.
Since the height of the JCR 14 applied to the surface of No. 0 must be secured in the body 1 ″, an area where a wire bond jig having a conical tip can enter the body 1 ″, and a cover. There is a problem that downsizing is difficult because the area for bonding and positioning the 3 "and the body 2" is required.

Therefore, the body is made into a three-dimensional three-dimensional circuit component (MI
D: Molded Interconnect Devices), the mounting area can be reduced. That is, as shown in FIGS. 7 to 11, a body 2 ′ having a storage recess 2 a ′ in which the sensor unit 10 is stored, and a sensor unit 1.
Configure the 'vessel body 1' the pressure sensor A de and 'cover 3 to be applied to' body 2 so as to cover the 0, to form a ～Pa ₆ '' conductive patterns Pa ₁ on both sides of 'the body 2 At the same time, the ends of the conductive patterns Pa ₁ ′ to Pa ₆ ′ are extended to the bottom surface of the body 2 ′ from which the pressure introducing pipe 4 projects to form terminals (see FIG. 9), and the body 2 ′ and the cover 3 ′ are joined together. A wire for connecting the electrode 11 of the sensor unit 10 to each conductive pattern Pa ₁ ′ to Pa ₆ ′ by the land 5 ′ formed on the surface, and for wire-bonding the electrode 11 of the sensor unit 10 and each land 5 ′. Since the bonding jig does not enter, the mounting area on the printed circuit board 20 can be reduced as compared with the above-mentioned DIP type pressure sensor A ″.

[0007]

However, in the latter structure, the pressure introducing pipe 4 protruding from the bottom surface of the body 2 '.
Can be mounted only in a direction perpendicular to the printed circuit board 20. Therefore, for example, when a pipe (hose or the like) for introducing pressure is attached to the pressure introducing pipe 4, the pipe is mounted in the thickness direction of the substrate. It is necessary to secure a dimension that does not apply an excessive bending stress to the pressure introducing pipe 4 even when it is bent. Further, in such a mounting form, the through hole 21 through which the pressure introducing pipe 4 is inserted is required in the printed circuit board 20, and the through hole 2
Considering the diameter accuracy and the position accuracy of the drilling process of No. 1, it is necessary to secure a sufficient distance between the land of the printed circuit board 20 to which the terminal is soldered and the through hole, and as a result, the terminal of the body 1 ′. Therefore, there is a possibility that the effect of miniaturizing the body 1'cannot be used effectively.

For this reason, the pressure introducing pipe 4 can be mounted substantially parallel to the substrate (hereinafter referred to as "horizontal type", and the one mounted in a direction substantially orthogonal to the substrate is called "vertical type"). The pressure introducing pipe is substantially perpendicular to the body 1 ', even when the body 1'is formed on the substrate 1) or when the pressure receiving surface of the sensor unit 10 is formed to be substantially parallel to the board mounting surface. There is a problem that the whole volume is increased because it has to be bent to the end. Moreover, since the mold used to form the body 1 ′ is different between the vertical type and the horizontal type, naturally,
There is also the problem of increased costs.

An object of the present invention is to solve the above problems, and an object of the present invention is to provide a pressure sensor which can be mounted on a substrate in a plurality of directions having different pressure inlets.

[0010]

In order to achieve the above object, the invention of claim 1 houses a sensor unit for converting pressure into an electric signal in a body and introduces a pressure detection fluid. In a pressure sensor provided with a body, the body is formed by a body formed as a three-dimensional circuit component and a cover, and the plurality of electrodes included in the sensor unit are electrically connected to each other and at least part of the body is covered. Forming a plurality of conductive patterns on the body and the cover exposed on the body surface, at least the body side surface substantially parallel to the normal direction of the pressure inlet and the body side surface substantially orthogonal to the normal direction of the pressure inlet. Is characterized by arranging all conductive patterns electrically connected to each electrode on the same surface, and if the side surface of the body that is substantially parallel to the normal direction of the pressure inlet is mounted on the substrate, Based on the normal direction of the inlet It becomes a so-called horizontal type pressure sensor that is substantially parallel to, and if the side surface of the body that is substantially orthogonal to the normal direction of the pressure inlet is mounted on the substrate, the so-called vertical type in which the normal direction of the pressure inlet is substantially orthogonal to the substrate Since it will be a pressure sensor of, it is possible to support both vertical type and horizontal type with one pressure sensor,
It is possible to realize a pressure sensor that can be mounted in a plurality of directions in which the direction of the pressure inlet is different with respect to the substrate.

The invention of claim 2 is characterized in that, in the invention of claim 1, the joint between the body and the cover is made substantially flat, and the area of the joint can be increased to improve the joint strength. It is possible to secure the continuity reliability of the conductive patterns connected at the joint between the body and the cover. The invention of claim 3 is characterized in that, in the invention of claim 2, a conductive pattern is formed on at least one of the body side and the cover side of the joint portion, and the patterning dimensional accuracy of the conductive pattern is improved. The conduction reliability can be improved.

According to a fourth aspect of the invention, in the second or third aspect of the invention, a land for electrically connecting the electrode of the sensor section to the conductive pattern is formed on the same plane as the joint section on the body side. It is characterized in that it is possible to eliminate the routing area of the conductive pattern up to the land to achieve miniaturization and improve the accuracy of the patterning dimension.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects of the present invention, among the joints of the body and the cover, the joints where the conductive patterns are electrically connected to each other are bonded by an anisotropic conductive resin. It is characterized in that it does not require a special structure for preventing a short circuit between adjacent conductive patterns, and can be miniaturized. According to a sixth aspect of the present invention, in any one of the first to fifth aspects of the invention, among the joint portions of the body and the cover, the joint portions where the conductive patterns of the body and the cover are not conductive are bonded by an insulating adhesive. In addition, the mechanical strength of the joint and the joint reliability can be improved, the insulation can be secured, and the size can be reduced.

According to a seventh aspect of the present invention, in any one of the first to sixth aspects, all the conductive patterns are formed in substantially the same area on the side surface of the body in which all the conductive patterns are arranged on the same surface. It is characterized in that the bonding reliability between the terminal and the substrate pattern when mounted on the substrate can be improved.

[0015]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to FIGS. However, since the basic configuration of this embodiment is the same as that of the conventional example, common portions are denoted by the same reference numerals and description thereof is omitted, and only the characteristic portions of this embodiment will be described. In this embodiment, 3
Body 2 formed as a three-dimensional circuit component (MID)
The cover 1 and the cover 3 constitute the body 1, are electrically connected to a plurality of (six in the present embodiment) electrodes 11 included in the sensor unit 10, and at least a part thereof is exposed on the surface of the body 1. Multiple conductive patterns Pa _{1 to} Pa ₆ and Pb _{1 to} P
b ₃ is formed on the body 2 and the cover 3, and the side surface M _{1 of the} body 1 is substantially parallel to the normal direction of the pressure introduction port 4 a of the pressure introduction pipe 4.
When all of the conductive pattern Pa ₁ ~Pa ₆ which is electrically connected to the electrode 11 in the base 1 side (bottom) M ₂ Metropolitan substantially perpendicular to the normal direction of the pressure opening 4a (Pb ₁ ~
It is characterized in that Pb ₃ ) is formed on the same plane.

As shown in FIGS. 1 and 2, the body 2 made of synthetic resin has a storage recess 2a for accommodating the sensor portion 10 in the substantial center of the upper surface, and a cylindrical shape from the approximate center of the bottom surface M ₂ . A pressure introducing pipe 4 is projectingly provided, and a pressure introducing port 4a passing through the inside of the pressure introducing pipe 4 communicates with the storage recess 2a of the body 2 and is in the normal direction of the pressure introducing port 4a (the axis of the pressure introducing pipe 4). Direction) is substantially orthogonal to the bottom surface M _{2 of the} body 2.

Of the two sets of side surfaces of the body 2 that face each other with the storage recess 2a interposed therebetween, three strip-shaped conductive patterns Pa _{1 to} Pa ₆ are formed by metal plating on both side surfaces of one set. ing. In addition, a strip-shaped isolation portion 2b is formed on each side surface in order to insulate the individual conductive patterns Pa _{1 to} Pa ₆ from each other. Further, both end portions of each conductive pattern Pa _{1 to} Pa ₆ have a top surface and a bottom surface M of the body 2.
_2, and the portion extended to the upper surface serves as a land (so-called wire bond 2nd portion) 5 and is connected to the electrode 2a of the sensor portion 10 by the wire 12 by wire bonding. Further, the ends of the conductive patterns Pa _{1 to} Pa ₆ extended to the bottom surface M ₂ serve as terminals for mounting on the printed circuit board as in the conventional example (see FIG. 9).

On the other hand, a cover attached to the upper surface of the body 2.
3 has a lower surface made of synthetic resin as shown in FIGS.
It is formed in a substantially box shape with an opening, and its upper surface and the facing 1
Three strip-shaped conductive pads plated with metal over the sides of the set
Turn Pb₁~ Pb₃Are formed. In addition,
And individual conductive patterns Pb on each side surface.₁~ Pb ₃
A band-shaped isolation portion 3a is formed for the purpose of insulating between
It Here, each conductive pattern Pb₁~ Pb₃The end of the
By the way, one side M₁The end of the front side of the bottom edge of the cover 3.
Although it is only formed until the end of the other side is covered.
-It is formed by extending from the lower edge of 3 to the lower edge.
(See Figure 3). Also, the inner peripheral wall of the cover 3 faces the opening surface.
It is tilted outward.

Positioning projections 3b are vertically provided from the lower end edges of both sides of the cover 3 on which the conductive pattern 4 is not formed, and a fitting portion 2c for fitting with the projections 3b is formed.
The pair of side surfaces of the body 2 on which the conductive patterns 4 are not formed are recessed in the upper portions of the side surfaces. Then, as shown in FIG. 4, the cover 3 is attached to the upper surface of the body 2 by fitting the protruding pieces 3b of the cover 3 into the fitting portions 2c of the body 2.

Here, in a state in which the cover 3 is attached to the body 2 to form the body 1, as shown in FIG. 4A, three pieces extending from one side surface of the cover 3 to the peripheral edge of the lower surface. the end 6 of the conductive pattern Pb ₁ ～Pb ₃ is, Yes in contact with the edge of the three lands 5 are formed in the body 2 top side, three of the conductive pattern Pb formed on the cover 3
_{1 to} Pb ₃ and the three conductive patterns Pa _{4 to} Pa ₆ formed on the body 2 are Pa ₄ and Pb ₃ , Pa ₅ and P ₅ , respectively.
There is conduction between b ₂ , Pa ₆ and Pb ₁ .

On the other hand, the other side surface of the cover 3
M₁Then, each conductive pattern Pb₁~ Pb₃Is near the bottom edge
Since it has only been formed,
Conductive pattern Pa on the di2 side₁~ Pa₃And on the cover 3 side
Conductive pattern Pb₁~ Pb₃Not in contact with and non-conducting
Has become. Therefore, the three formed on the cover 3
Conductive pattern Pb₁~ Pb₃Is one side of body 2
Of the three conductive patterns Pa formed on the_Four~ Pa₆When
As each is electrically connected, as shown in Fig. 4 (b)
The normal direction of the pressure introducing port 4a (the axial direction of the pressure introducing pipe 4)
Side surfaces M that are substantially parallel ₁Is connected to the electrode 11 of the sensor unit 10.
6 conductive patterns Pa₁~ Pa₃, Pb₁~ Pb₃
All of the edges will be on the same plane. And these
If you mount the end of the
A horizontal pressure sensor in which the inlet pipe 4 is parallel to the printed circuit board.
Can be used.

In this embodiment, the side surface M₁Formed in
6 conductive patterns Pa₁~ Pa ₃, Pb₁~ Pb₃
Since the ends (terminals) of are formed in the same area,
Wiring patterns formed on terminals and printed circuit boards when mounted
It is possible to improve the reliability of joining
There is a point. By the way, as shown in FIG. 1 and FIG.
Since the joint between 2 and cover 3 is formed to be substantially flat,
The area of the joint (the portion indicated by "S" in Fig. 1) increases and the joint
The combined strength can be improved and the body 2
Conducting communication of the conductive pattern 4 connected at the joint of the cover 3
There is an advantage that reliability can be secured. Also,
On the body 2 side, the joint S with the cover 3 has a conductive pattern.
Since it is formed on the same plane as the land 5 of 4, the land
It is possible to delete the wiring area of the conductive pattern 4 up to 5
Aiming to improve the accuracy of patterning size
There is an advantage that it can be improved.

Further, the conductive pattern Pa_Four~ Pa₆And P
b₁~ Pb₃Are shown in FIG.
As shown in (a), the body 2 and the cover 3 are made of an anisotropic conductive resin.
Since it is adhered with the oil adhesive 7,
Conductive pattern Pa on the body 2 side and the cover 3 side_FourAnd P
b₃, Pa_FiveAnd Pb₂, Pa₆And Pb₁Continuity between
And the isolated portions 2b and 3a of the body 2 and the cover 3
Conductive pattern Pa adjacent to each other across_Four~ Pa₆, Pb₁~
Pb₃It becomes a non-conduction state between. Therefore, with the body 2
Adjacent conductive patterns Pa at the joint of the cover 3_Four~
Pa₆, Pb₁~ Pb ₃Special features to prevent short circuit between them
The advantage that a separate structure is not required and miniaturization is possible
There is.

On the other hand, the side surface M on which the six conductive patterns 4 are lined up
_In FIG. ₁ , the body 2 and the cover 3 are adhered to each other with an insulating adhesive 8 as shown in FIG. 4 (b), and the insulation between the three conductive patterns 4 on the body 2 side at the joint is insulated by the insulating adhesive 8. It is secured by. That is, since the joint portion on the side surface on the opposite side is adhered by the anisotropic conductive resin adhesive 7, there is a fear that the adhesive force may be insufficient, or the six conductive patterns 4 are short-circuited between adjacent three. Insulating adhesive 8 is used for adhesion for the purpose of preventing this. Therefore, there is an advantage that the mechanical strength and the joint reliability of the joint portion can be improved and the insulation property can be secured, and the size can be reduced.

By the way, as a method for forming a conductive pattern in a three-dimensional circuit component, a one-shot method in which the surface of a resin molded product is patterned by exposure or the like, or a two-shot method in which an electric path is formed by double molding using a catalyst resin. There is a conventionally known method such as a method. Particularly, in the case of the one-shot method, since light is used for patterning, it is desirable that the peripheral portion of the conductive pattern exists on a plane. Therefore, in this embodiment, the cover 3 that is formed to be substantially flat.
The joint portion on the side is used for patterning the conductive pattern 4. As a result, the conduction reliability of the conductive pattern 4 connected at the joint between the body 2 and the cover 3 can be ensured.

Next, the outline of the manufacturing process of this embodiment by the one-shot method will be briefly described. However, it goes without saying that the two-shot method and other methods can also be used for manufacturing. The main steps are a step of resin-molding a large number of bodies 2 connected in a sheet shape, a step of plating the formed bodies 2, and a die-bonding of the sensor unit 10 in the storage recess 2a of the body 2. There are a step of mounting and a step of cutting the individual body 2 on which the sensor unit 10 is mounted. However, the order of the mounting process of the sensor unit 10 and the cutting process of the body 2 may be reversed. Further, the patterning of the conductive pattern 4 is performed by the one-shot method after the plating step, with a large number of the bodies 2 arranged adjacent to each other in a sheet shape. The inner peripheral surface of the through hole formed between the bodies 2 can also be plated.

After mounting the sensor unit 10, the body 2
Are individually cut off, so that the mounting surface (top surface) and the back surface (bottom surface) of the mounting surface are electrically connected and the adjacent conductive patterns 4 are formed.
Insulated with. The cover 3 is also formed similarly to the body 2. By the way, the sensor unit 10 is die-bonded to the housing recess 2a of the body 2 with an adhesive via the pedestal 13, and the electrode 11 and the body 2 formed on the upper surface thereof.
The land 5 formed on the upper surface of the is bonded by a metal wire (mainly aluminum, gold, copper, etc.) 12. After that, in order to protect the joint between the electrode 11 of the sensor unit 10 and the metal wire (wire) 12 and the wire 12 itself, the sensor unit 10
A JCR 14 made of silicon resin or the like is applied to the surface of the above, and a cover 3 formed separately is adhered and fixed to the upper surface of the body 2. The pressure sensor A thus formed is mounted on a printed board by a method such as soldering so as to be incorporated in various electric devices, and is used as a device for converting pressure into an electric signal.

As described above, in this embodiment, the sensor unit 1
A plurality of conductive patterns Pa _{1 to} Pa ₆ and Pb _{1 to} Pb ₃ which are electrically connected to the plurality of electrodes 11 provided in 0 and at least a part of which is exposed on the surface of the body 1 on the body 2 and the cover 3. Form the pressure inlet 4 of the pressure inlet pipe 4
a side surface M _{1 of the} body 1 substantially parallel to the normal direction of a and a side surface (bottom surface) M of the body 1 substantially orthogonal to the normal direction of the pressure inlet 4a.
₂ and all the conductive patterns Pa _{1 to} Pa ₆ (and Pb _{1 to} Pb) electrically connected to the respective electrodes 11.
b ₃ ) are formed side by side on the same surface, the conductive pattern 4 formed on the bottom surface M _{2 of the} body 1 can be mounted as a terminal on the substrate as a so-called vertical pressure sensor, and The conductive pattern 4 formed on the side surface M _{1 of the} body 1 can be mounted as a terminal on a substrate as a so-called horizontal pressure sensor, and one pressure sensor can be used for both vertical and horizontal types. It is possible to realize a pressure sensor that can be mounted on a substrate in a plurality of directions in which the pressure inlet 4a is different. Although the number of the electrodes 11 of the sensor unit 10 and the conductive patterns Pa _{1 to} Pa ₆ connected to each electrode 11 is _{six in} the present embodiment, the present invention is not limited to this, and the specifications of the sensor unit 10 are not limited to this. The technical idea of the present invention can be applied to an appropriate number of electrodes and conductive patterns.

[0029]

According to the invention of claim 1, a sensor unit for converting pressure into an electric signal is housed in the body, and a pressure inlet for introducing a fluid to be pressure-detected is provided in the body.
A body formed by a body and a cover formed as a three-dimensional circuit component, and a plurality of conductive members that are electrically connected to a plurality of electrodes of the sensor unit and at least a part of which is exposed on the body surface. A pattern is formed on the body and the cover, and is electrically connected to each electrode at least on the side surface of the body substantially parallel to the normal direction of the pressure inlet and the side surface of the body substantially orthogonal to the normal direction of the pressure inlet. Since all the conductive patterns are arranged on the same surface, if the side of the body that is substantially parallel to the normal direction of the pressure inlet is mounted on the substrate, the normal direction of the pressure inlet becomes substantially parallel to the substrate. It becomes a so-called horizontal pressure sensor, and if the side surface of the body that is substantially orthogonal to the normal direction of the pressure inlet is mounted on the substrate, it becomes a so-called vertical pressure sensor in which the normal direction of the pressure inlet is substantially orthogonal to the substrate. From a vertical type with one pressure sensor In either horizontal an adaptable,
There is an effect that it is possible to realize a pressure sensor that can be mounted in a plurality of directions in which the direction of the pressure inlet is different with respect to the substrate.

According to the second aspect of the present invention, since the joint between the body and the cover is made substantially flat, the area of the joint can be increased to improve the joint strength, and the joint between the body and the cover can be connected. There is an effect that the conduction reliability of the conductive pattern can be secured. According to the third aspect of the present invention, since the conductive pattern is formed on at least one of the body side and the cover side of the joint portion, the patterning dimensional accuracy of the conductive pattern is improved, and the conduction reliability can be improved. There is an effect.

Since the land for electrically connecting the electrode of the sensor section to the conductive pattern is formed on the same plane as the joint on the body side, the conductive pattern up to the land is formed. There is an effect that the routing area can be deleted, the size can be reduced, and the accuracy of the patterning dimension can be improved. According to the fifth aspect of the present invention, among the joint portions of the body and the cover, the joint portions where the conductive patterns of the body and the cover are electrically connected to each other are bonded by the anisotropic conductive resin.
There is an effect that miniaturization is possible without requiring a special structure for preventing a short circuit between adjacent conductive patterns.

According to the sixth aspect of the present invention, among the joint portions of the body and the cover, the joint portions where the conductive patterns are not conductive are bonded by an insulating adhesive, so that the mechanical strength and the joint reliability of the joint portions. It is possible to improve the electrical characteristics and ensure the insulation, and to achieve miniaturization. According to the invention of claim 7, since all the conductive patterns are formed in substantially the same area on the side surface of the body in which all the conductive patterns are arranged on the same surface, the terminals and the board pattern when mounted on the board are There is an effect that the joint reliability of can be improved.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is a side sectional view of the above.

FIG. 3 is a perspective view of the above cover.

FIG. 4A and FIG. 4B are perspective views of the same as seen from different directions.

FIG. 5 is a side sectional view showing a conventional example.

FIG. 6 is a side sectional view showing a state in which the printed circuit board is mounted on the same printed circuit board.

FIG. 7 is an exploded perspective view showing another conventional example.

FIG. 8 is a perspective view of the above.

FIG. 9 is a perspective view seen from another direction of the above.

FIG. 10 is a side sectional view of the above.

FIG. 11 is a plan view showing a state in which the above cover is removed.

[Explanation of symbols]

A pressure sensor 1 body 2 body 3 cover 4 pressure introduction pipe 4a pressure introduction port 10 sensor section Pa _{1 to} Pa ₆ , Pb _{1 to} Pb ₃ conductive pattern

Claims (7)

(57) [Claims] 1. A pressure sensor in which a sensor section for converting pressure into an electric signal is housed in a body and a pressure inlet for introducing a fluid to be pressure-detected is provided in the body, which is formed as a three-dimensional circuit component. The body and the cover form a body, and a plurality of conductive patterns are formed on the body and the cover, each of which is electrically connected to the plurality of electrodes of the sensor unit and at least a part of which is exposed on the body surface. At least all conductive patterns electrically connected to each electrode are on the same plane on at least the side surface of the body parallel to the normal direction of the pressure inlet and the side surface of the body substantially orthogonal to the normal direction of the pressure inlet. A pressure sensor characterized by being arranged on top of each other. 2. The pressure sensor according to claim 1, wherein the joint between the body and the cover is made substantially flat. 3. The pressure sensor according to claim 2, wherein a conductive pattern is formed on at least one of the body side and the cover side of the joint portion. 4. The pressure according to claim 2, wherein a land for electrically connecting the electrode of the sensor section to the conductive pattern is formed on the same plane as the joint section on the body side. Sensor. 5. The joint between the body and the cover, wherein the joint where the conductive patterns are electrically connected to each other is bonded by an anisotropic conductive resin. Pressure sensor. 6. The pressure according to claim 1, wherein among the joints of the body and the cover, the joints in which the conductive patterns are not electrically connected to each other are bonded by an insulating adhesive. Sensor. 7. The conductive pattern according to claim 1, wherein all conductive patterns are formed in substantially the same area on the side surface of the body in which all conductive patterns are arranged on the same surface. Pressure sensor.