JP5498836B2 - Manufacturing method of electronic equipment - Google Patents

Manufacturing method of electronic equipment Download PDF

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JP5498836B2
JP5498836B2 JP2010076709A JP2010076709A JP5498836B2 JP 5498836 B2 JP5498836 B2 JP 5498836B2 JP 2010076709 A JP2010076709 A JP 2010076709A JP 2010076709 A JP2010076709 A JP 2010076709A JP 5498836 B2 JP5498836 B2 JP 5498836B2
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wire
sealing resin
substrate
manufacturing
mounting substrate
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JP2011210923A (en
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正樹 大石
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Citizen Holdings Co Ltd
Citizen Finetech Miyota Co Ltd
Citizen Watch Co Ltd
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Citizen Holdings Co Ltd
Citizen Finetech Miyota Co Ltd
Citizen Watch Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

本発明は、電子機器の製造方法に関するものである。   The present invention relates to a method for manufacturing an electronic device.

一般に、ＩＣチップやＣＣＤチップ等の電子機器は、素子を実装基板に固定し、素子と実装基板とをワイヤー等により電気的に接続した後、封止樹脂をワイヤー接続部に塗布して前記ワイヤーの保護を行うようにして製造されている。   In general, in an electronic device such as an IC chip or a CCD chip, an element is fixed to a mounting substrate, the element and the mounting substrate are electrically connected by a wire or the like, and then a sealing resin is applied to a wire connection portion to Manufactured to protect.

図５は従来技術による電子機器の一例で、液晶表示デバイスを示す図である。図５中の（Ａ）は正面断面図、（Ｂ）は上面図、（Ｃ）は斜視図である。図５を参照し、従来技術による液晶表示デバイスを説明する。   FIG. 5 is a diagram showing a liquid crystal display device as an example of an electronic apparatus according to the prior art. 5A is a front sectional view, FIG. 5B is a top view, and FIG. 5C is a perspective view. A conventional liquid crystal display device will be described with reference to FIG.

図５に示すように、素子である液晶表示素子１は実装基板２に図示しない接着材を介して固定されている。前記液晶表示素子１は、ワイヤー３によって電気的接続が取られている。前記ワイヤー３は、液晶表示素子１に設けられた素子電極６と、実装基板２に設けられた実装基板電極７とを電気的に接続するものである。また、前記ワイヤー３は封止樹脂４及び５にて保護されている。   As shown in FIG. 5, the liquid crystal display element 1 which is an element is fixed to the mounting substrate 2 via an adhesive (not shown). The liquid crystal display element 1 is electrically connected by a wire 3. The wire 3 electrically connects the element electrode 6 provided on the liquid crystal display element 1 and the mounting substrate electrode 7 provided on the mounting substrate 2. The wire 3 is protected by sealing resins 4 and 5.

図５に示す液晶表示デバイスにおいては、前記封止樹脂４の流れ出しを防止するために前記封止樹脂４の外周に塗布され、封止樹脂４の流れ防止樹脂として機能する封止樹脂５が設けられた構成となっている。（例えば、特許文献１参照）   In the liquid crystal display device shown in FIG. 5, a sealing resin 5 is provided which is applied to the outer periphery of the sealing resin 4 to prevent the sealing resin 4 from flowing out and functions as a flow preventing resin for the sealing resin 4. It is the composition which was made. (For example, see Patent Document 1)

特願２００５−１３０７２５Japanese Patent Application No. 2005-130725

図５に示す液晶デバイスの構造であると、前記封止樹脂４の流れ出しを防止することは可能であるが、前記封止樹脂４形成工程において、封止樹脂４内に気泡が混入することを防止できない。封止樹脂４の形成は、ワイヤー３の上方からワイヤー３と実装基板２に向かって適量の封止樹脂４を滴下して形成するのが一般的である。前記気泡は前記封止樹脂４形成時に、前記ワイヤー３の隙間、特に前記ワイヤー３の下部に封止樹脂４を浸透させる際に生じてしまう。   Although it is possible to prevent the sealing resin 4 from flowing out with the structure of the liquid crystal device shown in FIG. 5, in the sealing resin 4 formation step, bubbles are mixed in the sealing resin 4. It cannot be prevented. The sealing resin 4 is generally formed by dropping an appropriate amount of the sealing resin 4 from above the wire 3 toward the wire 3 and the mounting substrate 2. When the sealing resin 4 is formed, the bubbles are generated when the sealing resin 4 penetrates into the gaps of the wires 3, particularly the lower portions of the wires 3.

前記現象は前記封止樹脂４を塗布する工程において、一般的に生じてしまう現象であり、前記ワイヤー３下部の空気を前記封止樹脂４にて追いやる際に気泡として前記封止樹脂内に混入してしまう。特に前記ワイヤー３下部に発生した気泡は電子機器（本先行技術では液晶表示デバイス）の信頼性試験時にワイヤー３の断線の原因となり、高信頼性電子機器の妨げとなってしまう。   The phenomenon is a phenomenon that generally occurs in the step of applying the sealing resin 4, and is mixed into the sealing resin as bubbles when the air below the wire 3 is driven by the sealing resin 4. Resulting in. In particular, bubbles generated in the lower portion of the wire 3 cause disconnection of the wire 3 during a reliability test of an electronic device (a liquid crystal display device in the present prior art), which hinders a highly reliable electronic device.

前記信頼性試験時の前記ワイヤー３の断線は、特に温度サイクル試験時に顕著であり、温度サイクル試験実施時に前記気泡は膨張と収縮を繰り返す。また、前記封止樹脂４も同様に膨張と収縮を行うが、前記ワイヤー３は金属であるため前記気泡及び封止樹脂の膨張と収縮に追従することは困難であり、結果前記ワイヤー３部分にストレスを与えることとなり断線の原因となってしまう。   The disconnection of the wire 3 during the reliability test is particularly noticeable during the temperature cycle test, and the bubbles repeatedly expand and contract during the temperature cycle test. The sealing resin 4 also expands and contracts in the same manner. However, since the wire 3 is a metal, it is difficult to follow the expansion and contraction of the bubbles and the sealing resin. This will cause stress and cause disconnection.

本発明は、残留した気泡に起因するワイヤーの断線を防止することができる高信頼性の電子機器の製造方法を提供することを目的とするものである。   An object of this invention is to provide the manufacturing method of the highly reliable electronic device which can prevent the disconnection of the wire resulting from the residual bubble.

上記問題点に鑑み本発明の電子機器の製造方法は、基板上に素子を実装した後、前記基板上に設けられた基板電極と前記素子上に設けられた素子電極をワイヤーにて接続し、前記ワイヤーに封止樹脂を塗布して前記ワイヤーを保護する電子機器の製造方法において、前記基板の前記ワイヤー下方に設けられた注入口から前記ワイヤーに向かって前記封止樹脂を注入することにより、前記ワイヤーに前記封止樹脂を塗布すると共に、前記封止樹脂に混入した気泡を前記ワイヤー上方に押し出し、前記ワイヤー上方に押し出した前記気泡を外部からの物理的接触により除去することを特徴とする。 Method of manufacturing an electronic apparatus of the present invention in view of the above problem, after mounting the element on a substrate, an element electrode provided to the substrate electrode provided on the substrate on the device manually connected to the wire over the in wire over by applying a sealing resin to the manufacturing method of an electronic device to protect the wires, Kifutome resin before toward the wire over from injection port provided in the wire over lower sides of the substrate The sealing resin is applied to the wire, the bubbles mixed in the sealing resin are pushed out above the wire, and the bubbles pushed out above the wire are removed by physical contact from the outside. characterized in that it.

本発明により、素子と実装基板の電気的接続を行うワイヤー部分保護の封止樹脂形成時に前記封止樹脂内に気泡を生じさせにくく、また生じた際には、その除去を容易にすることを可能としたので、高信頼性の電子機器製造方法が得られる。   According to the present invention, it is difficult to cause bubbles in the sealing resin when forming the sealing resin for wire part protection for electrical connection between the element and the mounting substrate, and when it occurs, the removal can be facilitated. Therefore, a highly reliable electronic device manufacturing method can be obtained.

本発明の一実施例に係る電子機器を示す図であり、（Ａ）は上面図、（Ｂ）はＸ−Ｘ断面図。BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the electronic device which concerns on one Example of this invention, (A) is a top view, (B) is XX sectional drawing. 本発明の一実施例で、図１の電子機器の製造工程を示す図。The figure which shows the manufacturing process of the electronic device of FIG. 1 in one Example of this invention. 本発明の一実施例に係る電子機器を示す図であり、（Ａ）は上面図、（Ｂ）はＸ−Ｘ断面図。BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the electronic device which concerns on one Example of this invention, (A) is a top view, (B) is XX sectional drawing. 本発明の一実施例に係る電子機器を示す図であり、（Ａ）は上面図、（Ｂ）はＸ−Ｘ断面図。BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the electronic device which concerns on one Example of this invention, (A) is a top view, (B) is XX sectional drawing. 従来技術による液晶表示デバイスを示す図で、（Ａ）は正面断面図、（Ｂ）は上面図、（Ｃ）は斜視図。It is a figure which shows the liquid crystal display device by a prior art, (A) is front sectional drawing, (B) is a top view, (C) is a perspective view.

図１は本発明の一実施例に係る電子機器を示す図であり、（Ａ）は上面図、（Ｂ）はＸ−Ｘ断面図を示している。１は素子であり、例えば半導体チップや固体撮像素子である。素子１は、実装基板２に、例えば熱伝導性の高い両面接着剤（不図示）で固定されており、素子１上の素子電極６と実装基板２上の実装基板電極７とは金属性のワイヤー３にて接続され電気的接続が取られている。   1A and 1B are diagrams showing an electronic apparatus according to an embodiment of the present invention, in which FIG. 1A is a top view and FIG. 1B is an XX cross-sectional view. Reference numeral 1 denotes an element, for example, a semiconductor chip or a solid-state imaging element. The element 1 is fixed to the mounting substrate 2 with, for example, a double-sided adhesive (not shown) having high thermal conductivity, and the element electrode 6 on the element 1 and the mounting substrate electrode 7 on the mounting substrate 2 are metallic. The wires 3 are connected to make electrical connection.

前記ワイヤー３の保護をするため、封止樹脂４が塗布されている。ここで、前記封止樹脂４の形成は、前記実装基板２に設けられた封止樹脂注入口９から前記ワイヤー３方向に注入を行う。また、前記封止樹脂注入口９は前記ワイヤー３の下部に設けられており、ワイヤー３のループと重なる位置関係にある。また、この封止樹脂注入口９は、素子電極６と実装基板電極７の間に位置している。   In order to protect the wire 3, a sealing resin 4 is applied. Here, the formation of the sealing resin 4 is performed in the direction of the wire 3 from the sealing resin injection port 9 provided in the mounting substrate 2. The sealing resin injection port 9 is provided in the lower part of the wire 3 and is in a positional relationship overlapping with the loop of the wire 3. Further, the sealing resin injection port 9 is located between the element electrode 6 and the mounting substrate electrode 7.

前記封止樹脂注入口９は前記ワイヤー３の下部に設けられる事が重要であり、形状等は特に問わない、例えばガラスエポキシ基板であれば電極配線のための貫通孔を利用してもよい。またフレキシブル基板形状の際は素子１を固定するための補強基板（不図示）に貫通孔を設け、これを利用して封止樹脂を注入しても良い。   It is important that the sealing resin injection port 9 is provided in the lower part of the wire 3, and the shape is not particularly limited. For example, in the case of a glass epoxy substrate, a through hole for electrode wiring may be used. In the case of a flexible substrate shape, a through-hole may be provided in a reinforcing substrate (not shown) for fixing the element 1 and sealing resin may be injected using this.

図２は本発明の一実施例で、図１の電子機器の製造工程を示す図で、工程毎断面図である。本図は、封止樹脂４の形成状態を示すと共に、封止樹脂注入時に生じる気泡８の動きを示している。   FIG. 2 is a diagram showing a manufacturing process of the electronic device of FIG. This figure shows the formation state of the sealing resin 4 and the movement of the bubbles 8 generated when the sealing resin is injected.

まず、図２（Ａ）に示すように、前記封止樹脂注入口９からワイヤー３方向（図中矢印方向）へ向けて封止樹脂４を注入する。徐々に封止樹脂４の注入作業を続けると、図２（Ｂ）に示すように封止樹脂４内に気泡８が発生する。   First, as shown in FIG. 2A, the sealing resin 4 is injected from the sealing resin injection port 9 toward the wire 3 (arrow direction in the figure). When the operation of injecting the sealing resin 4 is continued gradually, bubbles 8 are generated in the sealing resin 4 as shown in FIG.

しかしながら、封止樹脂４の注入作業を継続すると、図２（Ｃ）に示すように、前記気泡８は封止樹脂４の上方への注入流動により、前記ワイヤー３上部に押し出され、封止樹脂４がワイヤー３を覆う状態になった時にはワイヤーの上方に完全に移動する。このような状態になれば、熱膨張による部材の伸縮があっても気泡８がワイヤー３にダメージを与えることがなくなる。また、上記の状態であれば、ワイヤー３上部に押し出された気泡８をワイヤー３に触れることなく除去することもできる。例えば先端の細い金属等を用いれば容易に除去することができる。   However, if the operation of injecting the sealing resin 4 is continued, as shown in FIG. 2C, the bubbles 8 are pushed out above the wire 3 by the injection flow upward of the sealing resin 4, and the sealing resin When 4 is in a state of covering the wire 3, it moves completely above the wire. In such a state, the bubbles 8 do not damage the wire 3 even if the member expands or contracts due to thermal expansion. Moreover, if it is said state, the bubble 8 extruded on the wire 3 upper part can also be removed, without touching the wire 3. FIG. For example, it can be easily removed by using a metal with a thin tip.

上述の如く、前記封止樹脂注入口９から前記封止樹脂４の注入を行うことにより、封止樹脂４内に気泡８が生じた際も、前記封止樹脂注入口９から封止樹脂４を注入することにより気泡８はワイヤー３上部に追いやられる。気泡８は前記ワイヤー３上部に追いやられることにより前記封止樹脂４の上部から容易に除去が可能である。除去方法としては、例えば先端の細い金属等で潰す方法や、前記封止樹脂４の外部に追いやる方法が挙げられる。   As described above, by injecting the sealing resin 4 from the sealing resin injection port 9, even when bubbles 8 are generated in the sealing resin 4, the sealing resin 4 is injected from the sealing resin injection port 9. Is injected into the upper part of the wire 3. The bubbles 8 can be easily removed from the upper part of the sealing resin 4 by being driven to the upper part of the wire 3. Examples of the removing method include a method of crushing with a metal having a thin tip, and a method of driving the sealing resin 4 to the outside.

本実施例によると、前記ワイヤー３下部に前記気泡８が混入することを防止できるため、熱膨張によるワイヤーへのダメージをなくすことができるので信頼性の高い電子機器の製造が可能となる。   According to the present embodiment, since the bubbles 8 can be prevented from being mixed into the lower portion of the wire 3, damage to the wire due to thermal expansion can be eliminated, so that a highly reliable electronic device can be manufactured.

図３は本発明の他の実施例を示す図で、電子機器を示す図である。図３中の（Ａ）は上面図、（Ｂ）はＸ−Ｘ断面図を示している。本実施例おいては素子１に設けられた素子電極６と、実装基板２に設けられた実装基板電極７が素子１の互いに対向する両辺部方向に存在しているが、構造及び効果は先の実施例と同じである。本実施例に示されるように、本発明によれば電極位置及び電極数、電極配置にとらわれることなく効果を得ることが可能である。   FIG. 3 is a view showing another embodiment of the present invention and is a view showing an electronic apparatus. 3A is a top view, and FIG. 3B is an XX cross-sectional view. In the present embodiment, the element electrode 6 provided on the element 1 and the mounting substrate electrode 7 provided on the mounting substrate 2 exist in the direction of both sides of the element 1 facing each other. This is the same as the embodiment. As shown in the present embodiment, according to the present invention, it is possible to obtain an effect without being limited by the electrode position, the number of electrodes, and the electrode arrangement.

図４は本発明の他の実施例を示す図であり、（Ａ）は上面図、（Ｂ）はＸ−Ｘ断面図である。素子１として液晶表示素子を例としたものである。素子１は、実装基板２に例えば熱伝導性の高い両面接着剤で固定されており、前記素子１を構成する第一基板１０上の素子電極６と実装基板２上の実装基板電極７とはワイヤー３にて電気的に接続を取っている。また、素子１を構成する第二基板１１は例えば導電性樹脂１２にて実装基板２との電気的接続を行っている。   4A and 4B are views showing another embodiment of the present invention, in which FIG. 4A is a top view and FIG. 4B is a cross-sectional view taken along line XX. The element 1 is a liquid crystal display element as an example. The element 1 is fixed to the mounting substrate 2 with, for example, a double-sided adhesive having high thermal conductivity. The element electrode 6 on the first substrate 10 and the mounting substrate electrode 7 on the mounting substrate 2 constituting the element 1 are The wire 3 is electrically connected. The second substrate 11 constituting the element 1 is electrically connected to the mounting substrate 2 by, for example, a conductive resin 12.

前記ワイヤー３の保護を封止樹脂４で行っているが、前記封止樹脂４形成時には、前記実装基板２に設けられた封止樹脂注入口９から前記ワイヤー３方向に向けて封止樹脂４を注入する。また、前記封止樹脂注入口９は前記ワイヤー３の下部に設けられており、ワイヤーループに重なる位置で、且つ、前記素子電極６と前記実装基板電極７の間に位置している。   The wire 3 is protected by the sealing resin 4. When the sealing resin 4 is formed, the sealing resin 4 is directed from the sealing resin inlet 9 provided in the mounting substrate 2 toward the wire 3. Inject. The sealing resin injection port 9 is provided in the lower part of the wire 3 and is located between the element electrode 6 and the mounting substrate electrode 7 at a position overlapping the wire loop.

前記封止樹脂注入口９は前記ワイヤー３の下部に設けられる事が重要であり、形状等は特に問わない。例えばガラスエポキシ基板であれば電極配線のための貫通孔を利用してもよい。またフレキシブル基板形状の際は素子１を固定するための補強基板（不図示）に貫通孔を設け、これを利用して封止樹脂を注入しても良い。   It is important that the sealing resin injection port 9 is provided in the lower part of the wire 3, and the shape and the like are not particularly limited. For example, if it is a glass epoxy board | substrate, you may utilize the through-hole for electrode wiring. In the case of a flexible substrate shape, a through-hole may be provided in a reinforcing substrate (not shown) for fixing the element 1 and sealing resin may be injected using this.

１ 素子
２ 実装基板
３ ワイヤー
４ 封止樹脂
５ 流れ出し防止用封止樹脂
６ 素子電極
７ 実装基板電極
８ 気泡
９ 封止樹脂注入口
１０ 第一基板
１１ 第二基板 DESCRIPTION OF SYMBOLS 1 Element 2 Mounting board 3 Wire 4 Sealing resin 5 Sealing resin for flow-out prevention 6 Element electrode 7 Mounting board electrode 8 Bubble 9 Sealing resin inlet 10 First board 11 Second board

Claims (1)

基板上に素子を実装した後、前記基板上に設けられた基板電極と前記素子上に設けられた素子電極をワイヤーにて接続し、前記ワイヤーに封止樹脂を塗布して前記ワイヤーを保護する電子機器の製造方法において、
前記基板の前記ワイヤー下方に設けられた注入口から前記ワイヤーに向かって前記封止樹脂を注入することにより、前記ワイヤーに前記封止樹脂を塗布すると共に、前記封止樹脂に混入した気泡を前記ワイヤー上方に押し出し、前記ワイヤー上方に押し出した前記気泡を外部からの物理的接触により除去することを特徴とした電子機器の製造方法。
After mounting the element on a substrate, an element electrode provided to the substrate electrode provided on the substrate on the device manually connected to the wire over, the wire is coated with a sealing resin to said wire over In the manufacturing method of electronic equipment to be protected,
By injecting Kifutome resin before toward the wire over from injection port provided in the wire over lower sides of the substrate, together with applying the sealing resin to the wire, mixed in the sealing resin A method of manufacturing an electronic device, wherein the air bubbles are pushed out above the wire and the air bubbles pushed out above the wire are removed by physical contact from the outside .
JP2010076709A 2010-03-30 2010-03-30 Manufacturing method of electronic equipment Expired - Fee Related JP5498836B2 (en)

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