JP6392676B2 - Wire connection structure for electronic components - Google Patents

Wire connection structure for electronic components Download PDF

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JP6392676B2
JP6392676B2 JP2015017037A JP2015017037A JP6392676B2 JP 6392676 B2 JP6392676 B2 JP 6392676B2 JP 2015017037 A JP2015017037 A JP 2015017037A JP 2015017037 A JP2015017037 A JP 2015017037A JP 6392676 B2 JP6392676 B2 JP 6392676B2
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wire
connection structure
electronic component
wire connection
circuit board
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JP2016143710A (en
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吉朗 手島
吉朗 手島
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Citizen Watch Co Ltd
Citizen Fine Device Co Ltd
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Citizen Watch Co Ltd
Citizen Fine Device Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

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  • Liquid Crystal (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

本発明は、電子部品のワイヤー接続構造に関するものである。   The present invention relates to a wire connection structure for an electronic component.

図３は、従来技術による電子部品のワイヤーの接続構造を示す（Ａ）上面図、（Ｂ）側面図、（Ｃ）Ａ−Ａ断面図である。ここに示すワイヤー接続構造は、ＬＣＯＳ（Ｌｉｑｕｉｄ Ｃｒｙｓｔａｌ Ｏｎ Ｓｉｌｉｃｏｎ）と呼ばれる液晶表示素子３と回路基板１とをワイヤー７で電気的に接続するもので、具体的に以下のように構成されている。液晶表示素子３は、表面に画素電極が形成されたシリコン基板３ｂと、それに相対する表面に透明電極が形成されたガラス基板３ａとを所定の位置関係で貼り合わせることにより形成された基板間の隙間に液晶を封入したもので、ガラス基板３ａが上側となるように回路基板１上に固定されている。ガラス基板３ａの表面に設けられた透明電極は、回路基板１の表面に設けられた電極パッド２ａと導電接着剤６で接続され、その一方で、シリコン基板３ｂの表面に設けられた電極パッド４は、回路基板１の表面に設けられた電極パッド２ｂとワイヤー７で接続されている。ワイヤー７とその周辺部にはワイヤー保護樹脂８が塗布され、また、ワイヤー保護樹脂８の周囲にはワイヤー保護樹脂８が外部へ流出するのを防止するためにワイヤー保護樹脂８よりも高粘度の流れ防止樹脂５が塗布され、共に硬化されている（例えば、特許文献１参照）。尚、このようなワイヤー接続構造は、液晶表示素子３と回路基板１とをワイヤー７で接続する場合に限らず、液晶表示素子以外の素子と回路基板とをワイヤーで接続する場合にも一般的に採用されている。   FIG. 3A is a top view, FIG. 3B is a side view, and FIG. 3C is a cross-sectional view taken along line AA. The wire connection structure shown here electrically connects the liquid crystal display element 3 called LCOS (Liquid Crystal On Silicon) and the circuit board 1 with wires 7 and is specifically configured as follows. The liquid crystal display element 3 includes a silicon substrate 3b having a pixel electrode formed on a surface thereof and a glass substrate 3a having a transparent electrode formed on a surface opposite to the silicon substrate 3b in a predetermined positional relationship. A liquid crystal is sealed in the gap, and is fixed on the circuit board 1 so that the glass substrate 3a is on the upper side. The transparent electrode provided on the surface of the glass substrate 3a is connected to the electrode pad 2a provided on the surface of the circuit substrate 1 by the conductive adhesive 6, while the electrode pad 4 provided on the surface of the silicon substrate 3b. Is connected to an electrode pad 2 b provided on the surface of the circuit board 1 by a wire 7. A wire protective resin 8 is applied to the wire 7 and the periphery thereof, and the wire protective resin 8 has a higher viscosity than the wire protective resin 8 in order to prevent the wire protective resin 8 from flowing out to the outside. The flow preventing resin 5 is applied and cured together (for example, see Patent Document 1). Such a wire connection structure is not limited to the case where the liquid crystal display element 3 and the circuit board 1 are connected by the wire 7, but is also common when the element other than the liquid crystal display element and the circuit board are connected by a wire. Has been adopted.

図４は、従来技術によるワイヤーの接続構造を示す断面図である。図３に示したワイヤー接続構造では、ワイヤーボンディング時にワイヤー７の撓みによる断線が発生する恐れがあり、それを防止するワイヤー接続構造として、図４に示すようなワイヤー接続構造が提案されている。このワイヤー接続構造では、液晶表示素子３１と回路基板３２が筐体３３上に固定され、液晶表示素子３１の電極パッド３４と回路基板３２の電極パッド３５とがワイヤー３６で接続され、ワイヤー３６のループ頂点直下に位置する筐体３３上にワイヤー支持台３７が固定され、ワイヤー３６とワイヤー支持台３７を覆うようにワイヤー保護樹脂（モールド樹脂）３８が塗布されている。ワイヤー支持台３７は、その上面がワイヤー３６に接触するように配置されており、ワイヤーボンディング時にワイヤー３６が撓んだ際には、ワイヤー３６がワイヤー支持台３７の上面で支持されることにより、ワイヤー３６の切断が防止される（例えば、特許文献２参照）。   FIG. 4 is a cross-sectional view showing a wire connection structure according to the prior art. In the wire connection structure shown in FIG. 3, there is a possibility that disconnection due to bending of the wire 7 may occur during wire bonding, and a wire connection structure as shown in FIG. 4 has been proposed as a wire connection structure for preventing this. In this wire connection structure, the liquid crystal display element 31 and the circuit board 32 are fixed on the housing 33, and the electrode pad 34 of the liquid crystal display element 31 and the electrode pad 35 of the circuit board 32 are connected by the wire 36. A wire support base 37 is fixed on the housing 33 located immediately below the top of the loop, and a wire protection resin (mold resin) 38 is applied so as to cover the wire 36 and the wire support base 37. The wire support 37 is arranged so that the upper surface thereof is in contact with the wire 36, and when the wire 36 is bent at the time of wire bonding, the wire 36 is supported on the upper surface of the wire support 37, Cutting of the wire 36 is prevented (see, for example, Patent Document 2).

特開２００６−３０８８２２号公報JP 2006-308822 A 特開２００５−２３４１５２号公報JP-A-2005-234152

図４に示した従来技術によるワイヤー接続構造では、ワイヤーのループ頂点直下にワイヤーと接触するようにワイヤー支持台が設けられていることから、ワイヤーの撓みに起因するワイヤーの断線を防止することができるが、温度変化に伴うワイヤー保護樹脂の膨張や収縮に起因するワイヤーの断線に対しては必ずしも有効的な構造であるとは言えない。即ち、ワイヤー保護樹脂の膨張や収縮に起因するワイヤーの断線は、一般的にワイヤーのループ頂点に発生し易いところ、図４に示したワイヤー接続構造では、ワイヤーのループ頂点直下にワイヤー支持台が介在することにより、その体積の分だけワイヤー保護樹脂の量が減ぜられ、それに伴いワイヤー保護樹脂がワイヤーへ与える応力が減ぜられてワイヤーの断線が防止されるものと考えられるが、その一方では、ワイヤーのループ頂点がワイヤー支持台と接触することにより、その部位に応力が集中してワイヤーが断線する恐れがある。   In the wire connection structure according to the prior art shown in FIG. 4, since the wire support base is provided so as to be in contact with the wire immediately below the loop apex of the wire, it is possible to prevent the wire from being disconnected due to the bending of the wire. Although it is possible, it cannot necessarily be said that the structure is effective for wire breakage caused by expansion or contraction of the wire protective resin accompanying temperature change. That is, the wire breakage caused by the expansion and contraction of the wire protective resin is generally likely to occur at the top of the wire loop. In the wire connection structure shown in FIG. By interposing, it is thought that the amount of wire protection resin is reduced by the amount of the volume, and accordingly, the stress applied to the wire by the wire protection resin is reduced, thereby preventing the wire from being disconnected. Then, when the loop top of the wire comes into contact with the wire support base, stress may concentrate on the portion, and the wire may be disconnected.

本発明は、以上の問題点に鑑みたもので、ワイヤー保護樹脂の膨張や収縮に起因するワイヤーの断線を防止した電子部品のワイヤー接続構造を提供することを目的とする。   The present invention has been made in view of the above problems, and an object of the present invention is to provide a wire connection structure for an electronic component that prevents the wire from being disconnected due to expansion or contraction of the wire protective resin.

電子部品に設けられた電極パッドと回路基板に設けられた電極パッドとをワイヤーで接続し、前記ワイヤーを覆うようにワイヤー保護樹脂を塗布した電子部品のワイヤー接続構造であって、前記ワイヤーのループ頂点直下に、前記ループ頂点と接触しないように、凸部が設けられ、前記電子部品は、２枚の基板を貼り合わせることにより形成された基板間の隙間に画素が設けられた画像表示素子であり、前記２枚の基板のうち一方の基板には、前記電極パッドが設けられ、前記凸部は、前記一方の基板の一部で形成されている、電子部品のワイヤー接続構造とする。
An electronic component wire connection structure in which an electrode pad provided on an electronic component and an electrode pad provided on a circuit board are connected by a wire, and a wire protection resin is applied so as to cover the wire, and the loop of the wire A convex portion is provided immediately below the apex so as not to contact the loop apex, and the electronic component is an image display element in which pixels are provided in a gap between substrates formed by bonding two substrates. In addition, one of the two substrates is provided with the electrode pad, and the convex portion is formed of a part of the one substrate, and has a wire connection structure for an electronic component.

前記画像表示素子は、前記隙間に液晶が封入された液晶表示素子である電子部品のワイヤー接続構造とすることができる。 The image display element may have a wire connection structure for an electronic component which is a liquid crystal display element in which liquid crystal is sealed in the gap .

本発明によれば、ワイヤー保護樹脂の膨張や収縮に起因するワイヤーの断線を効果的に防止することができる。   According to the present invention, it is possible to effectively prevent the wire from being disconnected due to the expansion or contraction of the wire protective resin.

本発明による電子部品のワイヤー接続構造の実施形態を示す（Ａ）上面図、（Ｂ）Ａ−Ａ断面図(A) Top view which shows embodiment of the wire connection structure of the electronic component by this invention, (B) AA sectional drawing 図１に示す本発明による電子部品のワイヤー接続構造を製造する方法を示す（Ａ）凸部を形成した後の状態を示す凸部付近の上面図とＡ−Ａ断面図、（Ｂ）ワイヤーボンディング後の状態を示すワイヤー付近の上面図とＡ−Ａ断面図1A shows a method for manufacturing a wire connection structure of an electronic component according to the present invention shown in FIG. 1, and FIG. Top view and AA cross section near the wire showing the rear state 従来技術による電子部品のワイヤー接続構造を示す（Ａ）上面図、（Ｂ）側面図、（Ｃ）Ａ−Ａ断面図(A) Top view, (B) Side view, (C) AA sectional view showing a wire connection structure of an electronic component according to the prior art 従来技術による電子部品のワイヤー接続構造を示す断面図Sectional drawing which shows the wire connection structure of the electronic component by a prior art

図１は、本発明による電子部品のワイヤー接続構造の実施形態を示す（Ａ）上面図、（Ｂ）Ａ−Ａ断面図である。本実施例は、図３に示した従来技術によるワイヤー接続構造と基本構成は同じであるため、基本構成についての説明は省略して、本実施例における特徴点についてのみ説明をする。本実施例が従来技術と大きく異なる点は、ワイヤー７のループ頂点直下に位置する回路基板１上にワイヤー７のループ頂点と接触しないように凸部１１が設けられている点である。   FIG. 1A is a top view and FIG. 1B is a cross-sectional view taken along line AA, showing an embodiment of a wire connection structure for an electronic component according to the present invention. Since the basic configuration of the present embodiment is the same as that of the conventional wire connection structure shown in FIG. 3, the description of the basic configuration is omitted, and only the feature points of the present embodiment are described. This embodiment is greatly different from the prior art in that a convex portion 11 is provided on the circuit board 1 positioned immediately below the loop apex of the wire 7 so as not to contact the loop apex of the wire 7.

図３に示した従来のワイヤー接続構造においては、ワイヤー７のループ頂点直下では、ワイヤー７に応力を及ぼすワイヤー保護樹脂８の厚みが最も大きくなるため、ワイヤー保護樹脂８の膨張や収縮によるワイヤー７への影響が最も大きくなるが、本発明では、図１に示すように、ワイヤー７のループ頂点直下に凸部１１が設けられていることから、その体積の分だけワイヤー７のループ頂点直下に介在するワイヤー保護樹脂８の量が減ぜられ、それに伴いワイヤー７に作用する応力が緩和されることによって、ワイヤー７の断線が防止される。   In the conventional wire connection structure shown in FIG. 3, the thickness of the wire protective resin 8 that exerts stress on the wire 7 is the largest immediately below the loop apex of the wire 7. However, in the present invention, as shown in FIG. 1, since the convex portion 11 is provided immediately below the loop apex of the wire 7, the volume 7 is directly below the loop apex of the wire 7. The amount of the intervening wire protection resin 8 is reduced, and the stress acting on the wire 7 is relieved accordingly, whereby the disconnection of the wire 7 is prevented.

この効果は、図４に示した従来のワイヤー接続構造によっても得られる効果であるが、本発明では、その効果に加え、更に以下のような効果を得ることができる。即ち、本発明では、ワイヤー７のループ頂点直下に設けられた凸部１１がワイヤー７のループ頂点と接触しないように配置されているため、ワイヤー保護樹脂８の膨張や収縮によりワイヤー７に応力が作用したとしても、図４に示した従来のワイヤー接続構造のように、ワイヤー７のループ頂点が凸部１１に接触してワイヤー７が断線するようなことはない。本発明によれば、以上の二つの効果により、ワイヤー７の断線を効果的に防止することができる。   This effect is also obtained by the conventional wire connection structure shown in FIG. 4. In the present invention, the following effects can be obtained in addition to the effects. That is, in this invention, since the convex part 11 provided just under the loop vertex of the wire 7 is arrange | positioned so that it may not contact with the loop vertex of the wire 7, stress is applied to the wire 7 by expansion | swelling and shrinkage | contraction of the wire protection resin 8. Even if it acts, unlike the conventional wire connection structure shown in FIG. 4, the loop apex of the wire 7 does not contact the convex part 11 and the wire 7 is not disconnected. According to the present invention, the disconnection of the wire 7 can be effectively prevented by the above two effects.

凸部１１の材質については、ワイヤー保護樹脂８との材質的な相性などを考慮して適宜選択が可能であるが、本実施例では、ワイヤー保護樹脂８の膨張／収縮率と形成する際の作業性を考慮し、チクソ性の高いエポキシ系樹脂を使用している。   About the material of the convex part 11, although material compatibility with the wire protection resin 8 etc. can be selected suitably, in the present Example, it is at the time of forming with the expansion / contraction rate of the wire protection resin 8. In consideration of workability, epoxy resin with high thixotropy is used.

凸部１１の高さについては、凸部１１がワイヤー７のルール頂点に接触しない範囲で適宜選択が可能であるが、本実施例では、凸部１１がワイヤーボンディングの妨げにならないようにすることなどを目的として、電極パッド４が設けられている基板３ｂの表面以下の高さに設定している。尚、凸部１１は、ワイヤー７のループ頂点を除く部分とは接触していても構わないが、ワイヤー７の断線をより効果的に防止する意味では、本実施例のように、凸部１１は、ワイヤー７の何れの部位とも接触していないのが好ましい。   About the height of the convex part 11, it can select suitably in the range in which the convex part 11 does not contact the rule vertex of the wire 7, However, In a present Example, it is made for the convex part 11 not to interfere with wire bonding. For the purpose, the height is set below the surface of the substrate 3b on which the electrode pads 4 are provided. In addition, although the convex part 11 may contact the part except the loop vertex of the wire 7, in the meaning which prevents the disconnection of the wire 7 more effectively, the convex part 11 is like this Example. Is preferably not in contact with any part of the wire 7.

凸部１１の形状については、ワイヤー７のループ形状などを考慮して適宜選択が可能であるが、本実施例では、凸部１１の上面がワイヤー７のループ頂点付近のループ形状に沿う曲面を有する形状としている。   The shape of the convex portion 11 can be selected as appropriate in consideration of the loop shape of the wire 7, but in this embodiment, the upper surface of the convex portion 11 has a curved surface along the loop shape near the loop apex of the wire 7. The shape has.

図２は、図１に示す本発明による電子部品のワイヤー接続構造を製造する方法を示す（Ａ）凸部を形成した後の状態を示す凸部付近の上面図とＡ−Ａ断面図、（Ｂ）ワイヤーボンディング後の状態を示すワイヤー付近の上面図とＡ−Ａ断面図である。図１に示したワイヤー接続構造を製造する際には、まず、図２（Ａ）に示すように、ワイヤー７のループ頂点直下に位置することとなる回路基板１上にチクソ性の高いエポキシ系樹脂をディスペンサーで塗布して硬化させることにより凸部１１を形成し、その後、図２（Ｂ）に示すように、回路基板１の表面に設けられた電極パッド２と液晶表示素子３の表面に設けられた電極パッド４をワイヤーボンディングによりワイヤー７が凸部１１と接触しないようにワイヤー７で接続する。その後、図示しない工程において、ワイヤー７を取り囲むように回路基板１上に流れ防止樹脂５を塗布した上で、流れ防止樹脂５で囲まれた領域にワイヤー７と凸部１１を覆うようにワイヤー保護樹脂８を塗布し、必要に応じて加熱することにより流れ防止樹脂５とワイヤー保護樹脂８を硬化させる。   2A and 2B show a method for producing the wire connection structure for an electronic component according to the present invention shown in FIG. 1A. FIG. B) It is the upper side figure of the wire vicinity which shows the state after wire bonding, and AA sectional drawing. When the wire connection structure shown in FIG. 1 is manufactured, first, as shown in FIG. 2A, an epoxy system having a high thixotropy on the circuit board 1 that is located immediately below the loop apex of the wire 7. A convex portion 11 is formed by applying and curing a resin with a dispenser. Thereafter, as shown in FIG. 2B, the electrode pads 2 provided on the surface of the circuit board 1 and the surface of the liquid crystal display element 3 are formed. The provided electrode pad 4 is connected by wire bonding so that the wire 7 does not come into contact with the convex portion 11 by wire bonding. Thereafter, in a process not shown, the flow protection resin 5 is applied on the circuit board 1 so as to surround the wire 7, and then the wire 7 and the convex portion 11 are covered with the region surrounded by the flow prevention resin 5. The resin 8 is applied, and the flow preventing resin 5 and the wire protective resin 8 are cured by heating as necessary.

凸部１１の形成方法については、上述の方法に限らず、例えば、樹脂や金属などの成形品を回路基板１に固定する方法や、回路基板１又は基板３ｂの一部で形成する方法などを適宜選択することが可能である。尚、凸部１１を回路基板１又は基板３ｂの一部で形成する方法を用いれば、部品点数や工数を削減することができる。   The method of forming the convex portion 11 is not limited to the above-described method, and for example, a method of fixing a molded product such as resin or metal to the circuit board 1 or a method of forming the circuit board 1 or a part of the board 3b. It is possible to select appropriately. In addition, if the method which forms the convex part 11 in a part of the circuit board 1 or the board | substrate 3b is used, a number of parts and a man-hour can be reduced.

なお、本明細書では、ＬＣＯＳ構造の反射型液晶表示素子を電子部品として用いた場合を例にして説明を行ったが、本発明は、対向する２枚の基板が共に透明な透過型液晶表示素子や液晶を使用しない有機ＥＬ表示素子などの画像表示素子に対しても適用することが可能であり、更には、センサー素子やＩＣなどの、画像表示素子以外の電子部品に対しても適用することが可能である。また、本発明は、電子部品を回路基板上に固定した構成に限らず、図４に示したような電子部品を回路基板上に固定しない構成に対しても適用することが可能である。   In this specification, the case where a reflective liquid crystal display element having an LCOS structure is used as an electronic component has been described as an example. However, in the present invention, a transmissive liquid crystal display in which two opposing substrates are both transparent is described. It can also be applied to image display elements such as organic EL display elements that do not use elements or liquid crystals, and also applies to electronic components other than image display elements such as sensor elements and ICs. It is possible. The present invention is not limited to the configuration in which the electronic component is fixed on the circuit board, but can be applied to a configuration in which the electronic component as shown in FIG. 4 is not fixed on the circuit board.

１ 回路基板
２ａ 回路基板の電極パッド
２ｂ 回路基板の電極パッド
３ 液晶表示素子
３ａ 基板
３ｂ 基板
４ 液晶表示素子の電極パッド
５ 流れ防止樹脂
６ 導電接着剤
７ ワイヤー
８ ワイヤー保護樹脂
１１ 凸部
３１ 液晶表示素子
３２ 回路基板
３３ 筐体
３４ 液晶表示素子の電極パッド
３５ 回路基板の電極パッド
３６ ワイヤー
３７ ワイヤー支持台
３８ ワイヤー保護樹脂（モールド樹脂） DESCRIPTION OF SYMBOLS 1 Circuit board 2a Circuit board electrode pad 2b Circuit board electrode pad 3 Liquid crystal display element 3a Substrate 3b Substrate 4 Liquid crystal display element electrode pad 5 Flow prevention resin 6 Conductive adhesive 7 Wire 8 Wire protection resin 11 Convex part 31 Liquid crystal display Element 32 Circuit board 33 Case 34 Electrode pad of liquid crystal display element 35 Electrode pad of circuit board 36 Wire 37 Wire support base 38 Wire protection resin (mold resin)

Claims (2)

電子部品に設けられた電極パッドと回路基板に設けられた電極パッドとをワイヤーで接続し、
前記ワイヤーを覆うようにワイヤー保護樹脂を塗布した電子部品のワイヤー接続構造であって、
前記ワイヤーのループ頂点直下に、前記ループ頂点と接触しないように、凸部が設けられ、
前記電子部品は、２枚の基板を貼り合わせることにより形成された基板間の隙間に画素が設けられた画像表示素子であり、
前記２枚の基板のうち一方の基板には、前記電極パッドが設けられ、
前記凸部は、前記一方の基板の一部で形成されている、
ことを特徴とする電子部品のワイヤー接続構造。 Connect the electrode pad provided on the electronic component and the electrode pad provided on the circuit board with a wire,
A wire connection structure of an electronic component coated with a wire protective resin so as to cover the wire,
A convex part is provided immediately below the loop apex of the wire so as not to contact the loop apex ,
The electronic component is an image display element in which pixels are provided in a gap between substrates formed by bonding two substrates.
One of the two substrates is provided with the electrode pad,
The convex portion is formed by a part of the one substrate.
A wire connection structure for electronic components. 前記画像表示素子は、前記隙間に液晶が封入された液晶表示素子であることを特徴とする請求項１に記載の電子部品のワイヤー接続構造。
The wire connection structure for an electronic component according to claim 1 , wherein the image display element is a liquid crystal display element in which liquid crystal is sealed in the gap .
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