JP2001145924A - Mold device for molding resin using release film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the position regulation of a lead for connecting a solder ball, etc. to be set on a substrate without positioning a release film on the gate of a resin passage and to set the viscosity of a molten resin high. SOLUTION: A resin molding surface 25 connected with the inner surface of a resin housing cavity 14 formed in the resin molding part 5 of one mold 3 is covered with a release film 26, the resin molding surface 9 of the resin molding part 4 of the other mold 2 is covered with a release film 24, a chip 18 is arranged on the depth side, and the substrate 19 is arranged on the inlet side in the cavity 14 covered with the release film 26 during molding. The resin is housed, the film is placed between the substrate 19 and the resin passage 10, and the gate 12 of the resin passage 10 is formed in the neighbourhood of the inlet of a resin injection hole 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold device for molding a resin using a release film for a semiconductor package in which a resin sealing portion is formed only on one side of a substrate.

[0002]

2. Description of the Related Art Conventionally, a semiconductor having a flip-chip type semiconductor chip mounted at the center of one surface of a substrate, a gap between the semiconductor chip and the substrate sealed with resin, and a resin-sealed portion formed only on one surface of the substrate. Package is used. At the time of manufacturing such a semiconductor package, a resin sealing portion is formed using a semiconductor chip mounting substrate as a product to be molded by using a resin molding mold apparatus. At this time, if the inner surfaces of the cavities of the upper and lower molds constituting the mold and the resin molding surface continuous with the inner surfaces are covered with a release film, the resin sealing portion can be molded without bringing the resin into contact with the inner surfaces of the cavities. . Moreover, since the molded product can be easily released from the release film, there is an advantage that an ejector pin or the like is not required, the mold structure can be simplified, and a resin material most suitable for a product can be used.

In such a resin molding method using a release film, a resin path extending from a pot to a cavity passes through a part of the chip mounting surface of the substrate and reaches the cavity. Since a circuit pattern or the like is formed on the mounting surface at a high density, there are problems such as damaging the circuit pattern and generating resin flash on the surface of the substrate when the resin path is disposed on the chip mounting surface. Accordingly, the present applicant has previously disclosed in Japanese Patent Application Laid-Open No. H11-77733, a cavity inside surface provided in a resin molding portion of one mold constituting a mold is covered with a release film, and a resin molding of the other mold is further performed. The resin molding surface provided in the part is covered with another release film, and a resin injection hole that penetrates the substrate in the thickness direction is provided in the cavity within the area where the resin sealing part formed on the substrate is attached. The resin path extending from the pot to the cavity is passed through a part of the chip non-mounting surface of the substrate to reach the resin injection hole, and the resin is injected into the cavity through the resin injection hole. How to fill was submitted.

[0004]

However, the release film can also be positioned at the entrance of the resin injection hole by passing such a resin path through a part of the chip non-mounting surface of the substrate to reach the resin injection hole. Since the film must be arranged in consideration, it is necessary to increase the film positioning accuracy, it takes time for the film positioning, it is difficult to automate, and the molding cycle becomes longer. Since the resin path must pass through a part of the chip non-mounting surface of the substrate, it is necessary to regulate the positions of connection leads such as solder balls and solder bumps provided on the chip non-mounting surface.
If a wrapping resin is used as the resin to be supplied to the pot, the wrapping film extends to the vicinity of the resin injection hole, and the resin adheres to the chip non-mounting surface of the substrate even in the resin path portion extending on the chip non-mounting surface of the substrate. Since there is no need to regulate the position of the connection lead such as a solder ball, resin burrs may still occur near the inlet of the injection hole.

Also, since the gate position of the resin path is at the end of the substrate, the viscosity of the molten resin must be set low. The reason is that if the resin viscosity is high, the resin temperature decreases at a position away from the gate position, and the resin viscosity further increases, so that the flow speed of the resin is reduced and the resin hardens in the middle of the flow, causing voids (bubbles). Because.

The present invention has been made in view of such conventional problems, and there is no need to align a release film with a gate position of a resin path, automation is easy, and a molding cycle can be shortened. There is no need to regulate the position of the connecting leads such as solder balls to be installed on the board of the product, it can be installed freely, the viscosity of the molten resin can be set high, the resin density of the resin sealing part of the molded product can be increased, An object of the present invention is to provide a mold apparatus for resin molding using a release film that can reduce the occurrence of voids.

[0007]

In order to achieve the above-mentioned object, the present invention provides a mold apparatus for resin molding using a release film, which is provided with upper and lower molds. A resin injection hole penetrating in the vicinity of the center in the thickness direction is provided, and a molded article receiving cavity for accommodating a substrate on which a semiconductor chip is mounted as a molded article is provided in the central part of one surface, and the substrate is formed in the resin molded part of the other mold. A resin path for feeding the resin under pressure is provided in the resin injection hole.

The first release film covers the inner surface of the cavity for accommodating the molded article provided in the resin molding portion of the one mold and a resin molding surface adjacent to the inner surface of the cavity.
The resin molding surface of the resin molding part of the other mold is covered with the second release film, and the semiconductor chip is placed in the cavity covered with the first release film at the time of molding, and the substrate is placed on the back side and the substrate is covered. The molded product is accommodated, the surface of the substrate on which the chip is not mounted is covered with a second release film, and the second release film is interposed between the substrate and the resin path, and the gate of the resin path is located near the entrance of the resin injection hole. To be provided.

[0009] It is preferable to provide a float cavity insert in the cavity for accommodating the molded article, and to bias the float cavity insert against the molded article accommodated in the cavity by a compression spring.

Further, the mold device for resin molding using a release film according to the present invention is provided with upper and lower molds, and a semiconductor chip is mounted in a concave portion provided at the center of one surface in a resin molded portion of one of the molds. A molding cavity for accommodating the formed substrate as a molding is provided, and a resin path for feeding the resin into the chip mounting recess is provided in the resin molding portion of the other mold.

The first release film covers an inner surface of the cavity for accommodating the molded article provided in the resin molded portion of the one mold and a nearby resin molded surface continuous with the inner surface.
The resin molding surface of the resin molding portion of the other mold is covered with the second release film, and the chip mounting surface of the substrate is arranged on the inlet side in the cavity covered with the first release film during molding. And the chip mounting surface of the substrate is covered with a second release film, the second release film is interposed between the substrate and the resin path, and the gate of the resin path is provided near the area of the chip mounting recess. .

Also, the mold apparatus for resin molding using a release film according to the present invention is provided with upper and lower molds, and a resin injection hole is provided in a resin molding portion of one of the molds so as to penetrate through the center of both surfaces in the thickness direction. A cavity for accommodating a substrate on which a semiconductor chip is mounted as a molded product is provided in a concave portion having a resin injection hole provided in a central portion of one surface thereof, and a chip molding cavity is provided in a resin molded portion of the other mold. A resin path for feeding the resin into the recess is provided.

[0013] A first release film covers the inner surface of the molded article accommodating cavity provided in the resin molded portion of the one mold and a nearby resin molded surface continuous with the inner surface.
The resin molding surface of the resin molding portion of the other mold is covered with the second release film, and the chip mounting surface of the substrate is disposed on the back side in the cavity covered with the first release film during molding. And a second release film is interposed between the substrate and the resin path, and a gate of the resin path is provided near the entrance of the resin injection hole.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a cross-sectional view of a main part of a left portion showing a resin-sealed portion molding state of a flip-chip type semiconductor chip mounting substrate which is a molded product by a mold of a resin mold using a release film to which the present invention is applied. FIG. This resin molding mold apparatus is configured by mounting the resin molding mold 1 on a press apparatus. The upper and lower molds 1 and 2 have a symmetrical structure so that the upper and lower molds 2 and 3 can simultaneously perform the same resin molding on both the left and right sides. Parts 4 and 5 are provided. Therefore, the main part of the left part of the upper and lower resin molded parts 4 and 5 will be mainly described below. A cylindrical pot 8 for accommodating a tablet 6 and a tablet extruding plunger 7 is provided at the center of the upper resin molding section 4.
The resin paths 10 and 11 connected to the outlet of are extended to the left and right.

Further, a molded article accommodating cavity 14 having a float cavity insert 13 which moves up and down within a certain range is provided at the center of the left portion of the lower resin molding section 5, and the cavity 14 is arranged on the upper side. Cavity insert 13 in lower space 15 communicating with
To accommodate. And the float cavity insert 1
3 is urged upward by a compression coil spring 16. At this time, a resin injection hole 17 penetrating the center of both surfaces in the thickness direction as shown in FIGS. 2 and 3, for example, is provided as a molded product accommodated in the cavity 14, and a flip chip type semiconductor chip 18 is mounted at the center of one surface. A substrate 19 is used.

Solder balls 20 or solder bumps are provided on one surface of the semiconductor chip 18 as connection leads, and the solder balls 20 and the like are connected to the chip mounting surface of the substrate 19 during mounting. The substrate 19 is provided with a ring-shaped concave portion 21 or a ring-shaped projection 22 (see FIG. 6) around the entrance of the resin injection hole 17 on the chip non-mounting surface thereof in order to prevent occurrence of resin burrs during injection. Metal plating such as gold. Note that an electrode having a height equal to that of the printed board 19 may be present on the chip non-mounting surface of the board 19.

Therefore, the entrance side of the cavity 14 is widened to accommodate the substrate 19 constituting the article to be molded, and the rear side is narrowed to accommodate the semiconductor chip 18. Further, the upper portion of the housing space 15 of the float cavity insert 13 is narrowed in accordance with the chip housing space, and the lower portion thereof is widened to accommodate the flange portion 23 serving as the upward movement stopper of the float cavity insert 13 in the lower space. The compression coil spring 16 is housed. At that time, the compression coil spring 1
6 is fixed to the center of the flange 23 of the float cavity insert 13 and the lower end is fixed to the bottom wall of the lower space.

During the resin molding, the upper release film 24 on which the resin molding surface 9 of the upper resin molding portion 4 is disposed along the parting line with respect to the upper and lower dies 2 and 3 of the mold 1 as described above. Then, the inner surface of the molded article accommodating cavity 14 of the lower resin molding portion 5 and the nearby resin molding surface 25 continuous with the inner surface are covered with the lower release film 26. At this time, the openings of the large number of suction holes 27 provided in the upper and lower resin molding portions 4 and 5 are respectively connected to the resin molding surfaces 9 and 25 and the cavity 1.
The upper and lower release films 24 and 26 are respectively adsorbed to predetermined locations by dispersing and disposing them at required locations such as the inner surface of the device 4 and sucking air from the respective openings in the directions indicated by arrows.
However, when the upper release film 24 is stretched, it does not cover the inside of the groove of the resin path 10 provided on the upper resin molding surface 9 and is disposed between the substrate 19 and the substrate so that the groove is simply closed. Therefore, the upper release film 24 is connected to the gate 12 of the resin path 10.
No need to align with the upper and lower release films 2
4, 26 can be easily adjusted. Therefore, it is suitable for automation of the apparatus, and the molding cycle of the molded article can be shortened.
The upper and lower release films 24 and 26 may be made of ethylene tetrafluoride ethylene copolymer (ETFE), polytetrafluoroethylene (PTFE), or the like.

Next, an article to be molded is placed at a predetermined position between the upper and lower resin molding sections 4 and 5, and the whole is covered with upper and lower release films 24 and 26 and clamped. Then, the semiconductor chip 18 mounted on the substrate 19 can be pressed upward from below by the float cavity insert 13 which receives the urging force from the compression coil spring 16 via the lower release film 26. Therefore, the thickness variation between the semiconductor chip 18 and the substrate 19 constituting the article to be molded can be absorbed and clamped satisfactorily, and the chips 18 and the substrate 19 are not damaged by excessive force. The upper release film 24 can cover the chip non-mounting surface of the substrate 19. The upper release film 24 is interposed between the substrate 19 and the resin path 10, and the gate 12 of the resin path 10 is connected to the entrance of the resin injection hole 17. Can be placed nearby. Then, the upper release film 24 is satisfactorily brought into contact with the peripheral portion of the lower release film 26 by air suction, and the substrate 19 is moved to the first position.
It can be strongly fixed to the upper resin molded part 4 via the release film 24.

In this manner, after the molded article is placed at a predetermined position and clamped, the tablet 6 is pressed by the plunger 7 to bring the resin into a molten state, and as shown in FIG. The pressure is fed toward the gate 12 of FIG. Then, as shown in FIG.
The portion facing the gate 12 of No. 4 is pierced by the resin pressure, and the film hitting the edge of the formed hole enters the ring-shaped concave portion 21, and the molten resin 28 enters the cavity 14 through the hole. Also, as shown in FIG.
Of the upper release film 24, the portion of the upper release film 24 facing the gate 12 is pierced by the resin pressure, and the film hitting the edge of the formed hole covers the ring-shaped protrusion 22. Then, the molten resin 28 enters the cavity 14 through the hole. Since the entrance of the resin injection hole 17 provided in the substrate 19 is disposed near the gate 12 in the cavity 14, the molten resin 28 passes through the injection hole 17, and further the semiconductor chip 18 and the substrate 19 It is pushed into the space 29 between them. Therefore, resin burrs are not generated near the entrance of the resin injection hole 17, and the solder balls 20 and the like in the gap 29 between the semiconductor chip 18 and the substrate 19 can be satisfactorily resin-sealed to form a resin-sealed portion. . After the upper release film 24 is stretched and covered, a small hole may be formed in a local area corresponding to the entrance of the resin injection hole 17 of the upper release film 24 with a jig.

When the gate 12 is provided in the vicinity of the center of the substrate 19 in this way, the resin reach distance in the gap 29 becomes uniform, and the reach of the gate 12 only partially does not increase. Therefore, it is possible to set the viscosity of the molten resin 28 to be high, and to increase the resin density of the resin sealing portion,
The generation of voids can be reduced. Moreover, if the upper release film 24 is interposed between the substrate 19 and the resin path 10,
Since the runner of the resin path 10 does not directly pass through the non-chip mounting surface of the substrate 19, there is no need to regulate the position of the connection lead such as a solder ball to be installed on the non-chip mounting surface, and the mounting can be performed freely. When the upper and lower molds 2 and 3 are opened, the upper and lower release films 24 and 26 can satisfactorily release the mold. Moreover, since the resin in the runner of the resin path 10 can be separated by the upper release film 24 at the time of release, a flip-chip type semiconductor package in which the resin in the runner is separated can be obtained. In the case where solder balls or the like must be provided on the chip non-mounting surface of the substrate 19, the connection is made after release.

FIG. 7 shows a molding state of a resin-sealed portion of a flip-chip type semiconductor chip mounting substrate which is a molded product by a molding die of a resin molding device using a release film according to a modification to which the present invention is applied. It is principal part sectional drawing of a right part. The resin molding die apparatus is also constructed by mounting the resin molding die 30 on a press device, and the left and right and up and down sides of the molding die 1 are reversed. Therefore, in FIG. 7, portions corresponding to the mold 1 are denoted by the same reference numerals.
Therefore, such a mold 30 and the mold 1
Are almost the same. However, in FIG. 7, the flip chip type semiconductor chip mounting substrate 1 of the molding die 30 is shown.
9 shows a case where a ring-shaped projection 22 is provided around the entrance of the resin injection hole 17 of FIG. 9 and solder balls are further provided on the chip non-mounting surface of the substrate 19. 8 shows a state immediately before the injection of the molten resin into the resin injection hole 17, and FIG. 9 shows a state of the injection of the molten resin. Since the edge of the hole formed by breaking through the lower release film 26 covers the ring-shaped protrusion 22, the ring-shaped protrusion 22
No molten resin is injected into the space between the lower release film 24 and the chip non-mounting surface of the substrate 19 on the outer side.

FIG. 10 shows a molded state of a resin-sealed portion of a chip-mounted substrate in a single-sided recess, which is a product to be molded by a mold of a resin mold using a release film according to an application of the present invention. It is principal part sectional drawing of a part. This resin molding mold apparatus is also configured by mounting a resin molding mold 31 on a press apparatus. Then, the resin molding mold 31 is also moved to the upper and lower molds 3.
The upper and lower molds 32 and 33 are provided with upper and lower resin molding portions 34 and 35 having a symmetrical structure so that the upper and lower molds 32 and 33 can simultaneously perform the same resin molding on both left and right sides. Therefore, the main part of the right part of the upper and lower resin molded parts 34 and 35 will be mainly described below.

An article receiving cavity 36 is provided near the center of the right portion of the upper resin molding section 34, and the lower resin molding section 3 is provided.
5 is provided with a cylindrical pot 30 for accommodating a tablet 37 and a tablet extruding plunger 38 in the center thereof, and extending resin passages 41 and 42 connected to the outlet of the pot 39 on the resin molding surface 40 to the left and right. Arrange.

At the time of resin molding, the upper and lower dies 32, 33 of the molding die 31 are first placed on the inner surface of the molded article accommodating cavity 36 of the upper resin molding portion 34 and the nearby resin molding surface 44 continuous with the inner surface. Are covered with an upper release film 45, and the resin molding surface 40 of the lower resin molding portion 35 is covered with a lower release film 46 arranged along a parting line. At this time, the openings of a large number of suction holes (not shown) provided in the upper and lower resin molding portions 34 and 35 are formed by resin molding surfaces 40 and
4. The upper and lower release films 45 and 46 are respectively adsorbed to predetermined positions by dispersing and disposing them on the inner surface of the cavity 36 and sucking air from the respective openings. However, when the lower release film 46 is stretched, it does not cover the inner surface of the groove of the resin path 42 provided on the lower resin molding surface 40, and is disposed between the lower resin film 40 and the substrate 49 so as to close the groove. Therefore, the lower release film 46 is connected to the gate 43 of the resin path 42.
It is not necessary to match the position of the upper and lower release films 4
The alignment of 5, 46 can be easily performed. Therefore, it is suitable for automation of the apparatus, and the molding cycle of the molded article can be shortened.

Next, at a predetermined position between the upper and lower resin molding portions 34 and 35, a concave portion 4 provided at the center of one surface as a molded product is provided.
A substrate 49 on which a semiconductor chip 48 is mounted is placed in the device 7 and clamped. In the figure, the semiconductor chip 48 and the substrate 49 are shown.
Are connected by lead wires 50 (50a, 50b) such as gold wires, and solder balls 51 or solder bumps are provided as connection leads on the chip mounting surface of the substrate 49. Then, by the lower release film 46,
The chip mounting surface of the substrate 49 can be covered, a lower release film 46 is interposed between the substrate 49 and the resin path 42, and the gate 43 of the resin path 42 is located at the center of the area of the chip mounting recess 47 provided on the substrate 49. Can be placed nearby.

After the molded article is placed at a predetermined position and clamped in this manner, the tablet 37 is pressed by the plunger 38 to bring the resin into a molten state.
2 is fed under pressure toward the gate 43 of the resin path 42. Then, a portion of the lower release film 46 facing the gate 43 is pierced by the resin pressure, and the molten resin 52 enters the cavity 36. In addition, since the center of the range of the chip mounting recess 47 is located near the gate 43 in the cavity 36, the molten resin 52 is placed in the chip mounting recess 4
It is pushed into 7. Therefore, the molten resin does not enter the gap between the chip mounting surface of the substrate 49 and the lower release film 46, and the semiconductor chip 48 and the like can be satisfactorily resin-sealed to form a resin-sealed portion.

As described above, the gate 43 of the resin path 42 is arranged near the center of the area of the chip mounting recess 47 and
When the lower release film 46 is interposed between the resin path 42 and the resin path 42, the runner of the resin path 42 does not directly pass through the chip mounting surface of the substrate 49, so that the connection leads such as the solder balls 51 installed on the chip mounting surface are not provided. It can be installed freely without the need for position regulation. In addition, the reach of the resin in the chip mounting recess 47 becomes uniform, and the reach of only a part of the resin from the gate 43 does not increase. Therefore, it is possible to set the viscosity of the molten resin 52 high, so that the resin density of the resin sealing portion can be increased and the generation of voids can be reduced.
Further, when the upper and lower molds 32 and 33 are opened, the mold can be released well, and at the same time, the resin in the runner of the resin path 42 can be separated.
A chip-mounted semiconductor package in a single-sided recess in which the resin in the runner is separated can be obtained.

FIG. 11 is a view showing a molded state of a resin-sealed portion of a flip-chip type semiconductor chip mounting substrate which is a molded product by a molding die of a resin molding device using a release film according to another application example of the present invention. It is principal part sectional drawing of the right part which shows. This resin molding mold apparatus is also configured by mounting the resin molding mold 53 on a press apparatus. Then, the resin sealing of the chip mounting substrate 49 in the one-sided recess is performed by the molding die 31 using the molding die 53.
Perform in the same manner as described above. Therefore, in FIG. 11, the portions corresponding to the mold 31 are denoted by the same reference numerals.

However, in the mold 53, a resin injection hole 54 penetrating the center of both surfaces in the thickness direction is formed as a molded product, and the semiconductor chip is placed in a recess 47 having the resin injection hole 54 provided in the center of one surface. A substrate 49 on which is mounted is used. Then, at the time of molding, the chip mounting surface of the substrate 49 is placed and accommodated in the cavity 36 covered with the upper release film 45, and the chip non-mounting surface of the substrate 49 is covered with the lower release film 46. The lower release film 46 is interposed between the substrate 49 and the resin path 42, and the gate 43 of the resin path 42 is provided near the entrance of the resin injection hole 54.

Then, the local portion of the lower release film 46 facing the gate 43 is pierced by the resin pressure, and the molten resin 52 enters the cavity 36 and the cavity 36
As shown in FIG. 12, the entrance of the resin injection hole 54 provided at one corner of the chip mounting recess 47 is located near the gate 43 of the resin path 42, so that the molten resin 52 It is pushed into the recess 47. Therefore, the same effect as the mold 31 can be obtained by the mold 53. However, in the molding die 53, since the chip mounting surface of the substrate 49 is disposed on the back side of the cavity 36, the resin path does not directly pass through the chip mounting surface,
There is no need to regulate the position of the solder balls and the like to be installed on the chip mounting surface, and the chips can be freely installed. The mold 5
When a solder ball or the like must be placed on the chip mounting surface of the substrate 19 housed in the circuit board 3, the connection is made after release.

[0032]

According to the present invention described above, claim 1
In the described invention, since the first release film is interposed between the substrate and the resin path, it is not necessary to align the first release film with the gate of the resin path, and the first and second release films can be easily aligned. I can do it. Therefore, it is suitable for automation of the apparatus, and the molding cycle of the molded article can be shortened. Further, even if the chip non-mounting surface of the substrate is arranged on the entrance side of the cavity due to the interposition of the first release film, the resin path does not pass directly through the chip non-mounting surface, so that the solder ball to be installed on the chip non-mounting surface is used. There is no need to regulate the position of the connection leads such as those described above, and it can be installed freely.

Further, at the time of release, the resin in the resin path can be separated by the release film, and good release can be performed. And
By providing a resin injection hole near the center of the substrate and providing the gate of the resin path near the entrance of the resin injection hole, the resin reach distance in the gap between the substrate and the semiconductor chip becomes almost uniform, and a portion from the gate Only the reach distance will not be long. Therefore, it is possible to set the viscosity of the molten resin to be high, and it is possible to increase the resin density of the resin sealing portion and reduce the generation of voids.

According to the second aspect of the present invention, the molded article can be pressed by the float cavity insert receiving the urging force from the compression spring via the second release film. Therefore, it is possible to absorb the variation in the thickness of the semiconductor chip and the substrate constituting the molded product and to clamp the semiconductor chip well, and the semiconductor chip and the substrate are not damaged by excessive force.

According to the third aspect of the present invention, the second release film is interposed between the substrate and the resin path, whereby the second release film is provided.
There is no need to align the release film with the gate of the resin path, and the first and second release films can be easily aligned. Therefore, it is suitable for automation of the apparatus, and the molding cycle of the molded article can be shortened. In addition, even if the chip mounting surface of the substrate is arranged on the entrance side of the cavity due to the interposition of the second release film, the resin path does not pass directly through the chip mounting surface, so that a solder ball or the like installed on the chip mounting surface is not provided. There is no need to regulate the position of the connection leads, so they can be installed freely. Further, at the time of release, the resin in the resin path can be separated by the second release film, and good release can be performed.

According to the fourth aspect of the present invention, the second release film is interposed between the substrate and the resin path, so that the second release film is provided.
There is no need to align the release film with the gate of the resin path, and the first and second release films can be easily aligned. Therefore, it is suitable for automation of the apparatus, and the molding cycle of the molded article can be shortened. In addition, when the chip mounting surface of the substrate is arranged on the back side of the cavity, the resin path does not pass directly through the chip mounting surface, so there is no need to regulate the position of the connection lead such as a solder ball installed on the chip mounting surface. Can be installed in Further, at the time of release, the resin in the resin path can be separated by the second release film, and good release can be performed.

[Brief description of the drawings]

FIG. 1 is a main part of a left part showing a resin-sealed portion molding state of a flip-chip type semiconductor chip mounting substrate, which is a product to be molded by a mold of a resin mold using a release film, to which the present invention is applied. It is sectional drawing.

FIG. 2 is a front view of the flip chip type semiconductor chip mounting substrate.

FIG. 3 is a bottom view of the flip chip type semiconductor chip mounting substrate.

FIG. 4 is a fragmentary cross-sectional view showing a state immediately before the injection of molten resin into a resin injection hole provided with a ring-shaped recess of a flip-chip type semiconductor chip mounting substrate of the same mold;

FIG. 5 is a fragmentary cross-sectional view showing a state in which molten resin is injected into a resin injection hole provided with a ring-shaped concave portion of the flip chip type semiconductor chip mounting substrate of the same mold.

FIG. 6 is a fragmentary cross-sectional view showing a state in which molten resin is injected into a resin injection hole provided with a ring-shaped protrusion of a flip-chip type semiconductor chip mounting substrate of the same mold.

FIG. 7 is a right part showing a molded state of a resin-sealed portion of a flip-chip type semiconductor chip mounting substrate which is a product to be molded by a mold of a resin mold using a release film according to a modification to which the present invention is applied. It is principal part sectional drawing of.

FIG. 8 is a cross-sectional view of a main part showing a state immediately before the injection of molten resin into a resin injection hole provided with a ring-shaped protrusion of the flip chip type semiconductor chip mounting substrate of the same mold.

FIG. 9 is a cross-sectional view of a main part showing a state in which molten resin is injected into a resin injection hole provided with a ring-shaped protrusion of a flip chip type semiconductor chip mounting substrate of the same mold.

FIG. 10 is a right part showing a molded state of a resin-sealed portion of a chip-mounted substrate in a single-sided recess, which is a product to be molded by a molding die of a resin molding mold device using a release film according to an application example of the present invention. It is principal part sectional drawing.

FIG. 11 is a right side showing a molded state of a resin-sealed portion of a chip-mounted substrate in a single-sided recess as a product to be molded by a mold of a resin mold using a release film according to another application example of the present invention. It is principal part sectional drawing of a part.

FIG. 12 is a main part plan view showing a gate position of a resin path with respect to a resin injection hole provided in the chip mounting recess of the chip mounting substrate in the single-sided recess.

[Explanation of symbols]

1, 30, 31, 53 ... mold for resin molding 2,
32: Upper mold 3, 33 ... Lower mold 4, 34 ... Upper resin molded part 5, 35 ... Lower resin molded part 6, 37 ... Tablet 7, 38 ... Plunger 8, 39 ... Pot 9, 2
5, 40, 44 ... resin molding surface 10, 11, 41, 42
... resin path 12, 43 ... gate 13 ... float cavity insert 14, 36 ... molded product receiving cavity 15 ... float cavity insert receiving space 16
... compression coil springs 17, 54 ... resin injection hole 1
8, 48: semiconductor chip 19, 49: substrate 20, 5
1, 55: solder ball 21: ring-shaped recess 22:
Ring-shaped protrusion 23 ... Flange 24,45 ... Upper release film 26,46 ... Lower release film 27 ... Suction hole 28,52 ... Molten resin
29: Air gap between chip substrates of molded product

Claims (4)

[Claims] 1. A molded product in which a resin injection hole is provided in a resin molded portion of one of the molds in the vicinity of the center of both surfaces in a thickness direction, and a substrate on which a semiconductor chip is mounted is accommodated as a molded product in the central portion of one surface. In a resin molding mold apparatus provided with an upper cavity and a lower cavity provided with a housing cavity and a resin path for feeding resin into a resin injection hole of a substrate in a resin molding portion of the other mold, A first release film covers an inner surface of a molded article receiving cavity provided in the resin molding portion and a nearby resin molding surface continuous with the inner surface, and a second release film covers a resin molding surface of a resin molding portion of the other mold. The semiconductor chip is placed in the cavity covered with the first release film at the time of molding and the substrate is placed at the entrance side to accommodate the molded product, and the chip non-mounting surface of the substrate is placed at the second position.
A resin mold using a release film, wherein a second release film is interposed between the substrate and the resin path, and a gate of the resin path is provided near the entrance of the resin injection hole. apparatus. 2. The release according to claim 1, further comprising a float cavity insert provided in the cavity for accommodating the molded article, wherein the float cavity insert is pressed against the molded article accommodated in the cavity by a compression spring. Mold mold equipment for resin molding using film. 3. A molded article receiving cavity for accommodating, as a molded article, a substrate on which a semiconductor chip is mounted in a recess provided at the center of one surface, in a resin molded portion of one of the molds. In a resin molding mold apparatus comprising upper and lower dies provided with a resin path for feeding the resin into the chip mounting recess in the resin molding section, a molded article provided in the resin molding section of the one mold is accommodated. The inner surface of the cavity and the resin molding surface adjacent to the inner surface are covered with a first release film, and the resin molding surface of the resin molding portion of the other mold is covered with a second release film. The chip mounting surface of the substrate is placed on the entrance side in the cavity covered with the release film, the molded object is accommodated, the chip mounting surface of the substrate is covered with the second release film, and the second release film is used as the substrate. Tree A mold device for resin molding using a release film, characterized in that a resin film gate is provided between the oil passages and the gate of the resin passage is provided in the vicinity of the chip mounting recess. 4. A substrate in which a resin injection hole penetrating the center of both surfaces in the thickness direction is provided in a resin molding portion of one mold, and a semiconductor chip is mounted in a recess having a resin injection hole provided in the center of one surface. Molding mold for upper and lower molds provided with a molded article accommodating cavity for accommodating the resin as a molded article, and a resin path for feeding resin into the chip mounting recess is provided in the resin molded section of the other mold. In the mold apparatus, the first release film covers an inner surface of a molding receiving cavity provided in the resin molding portion of the one mold and a nearby resin molding surface continuous with the inner surface, and a resin molding of the other mold. The resin molding surface of the part is covered with a second release film, and the chip mounting surface of the substrate is disposed on the back side in the cavity covered with the first release film at the time of molding, and the molded article is accommodated. Film based A mold apparatus for resin molding using a release film, wherein the mold is provided between a plate and a resin path, and a gate of the resin path is provided near an entrance of the resin injection hole.