JP2001310348A - Mold apparatus for molding resin using release film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To select the exposure state of a plurality of joining terminals provided on the chip non-loading surface of a substrate without relying on the grinding of a seal resin. SOLUTION: A plurality of joining terminals provided on the chip non-loading surface of the substrate are respectively embedded in a release film at least partially and a molding cavity is filled with a molten resin, and the chip/ substrate connecting space between the semiconductor chip and substrate housed in the molding cavity and the peripheral space on the side of the terminal base parts of a plurality of the joining terminals provided on the chip non- loading surface of the substrate are respectively sealed with a resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding die apparatus using a release film for separating a molded product such as a semiconductor package from a die.

[0002]

2. Description of the Related Art Conventionally, a flip-chip type semiconductor chip is mounted at the center of one side of a substrate, and a chip-substrate connection space between the semiconductor chip and the substrate is resin-sealed, and only one side of the substrate is resin-sealed. A semiconductor package having a portion is used. At the time of manufacturing such a semiconductor package, a resin sealing portion is formed using a semiconductor chip mounting substrate as a product to be molded by using a resin molding mold apparatus. that time,
When the inner surfaces of the molding cavities of the upper and lower molds constituting the mold and the resin molding surfaces continuous with the inner surfaces are covered with the release film, the resin sealing portion can be molded without bringing the resin into contact with the inner surfaces of the cavities. Moreover, since the molded product can be easily released from the release film, there is an advantage that an ejector pin or the like is not required, the mold structure can be simplified, and a resin material most suitable for a product can be used.

In view of this, as such a mold apparatus for resin molding using a release film, the present applicant has disclosed in Japanese Patent Application No. 9-235669 a molding apparatus provided in a resin molding section of one mold constituting a mold. The inner surface of the mold cavity is covered with a release film, and the resin molding surface of the other mold is covered with another release film. A semiconductor chip mounting substrate provided with a resin injection hole that penetrates the substrate in the thickness direction is accommodated within the attachment area of the sealing portion, and a resin passage extending from the pot to the molding cavity is formed on the non-chip mounting surface of the substrate. Let a part pass and reach the resin injection hole,
A mold device for filling the resin through the resin injection hole is presented.

[0004] The present applicant has previously reported in Japanese Patent Application No. 11-327934 as an improvement of the above mold and die apparatus.
A resin molding portion of one mold is provided with a resin injection hole penetrating in the thickness direction near the center of both surfaces, and a molding cavity for accommodating a substrate on which a semiconductor chip is mounted as a molded product is provided at the center of one surface, and the other is provided with a molding cavity. The resin molding part of the mold is provided with upper and lower molds provided with a resin passage for feeding resin into the resin injection hole of the substrate, and is continuous with the inner surface of the molding cavity provided in the resin molding part of one mold and the inner surface. Cover the resin molding surface near the mold with the release film, cover the resin molding surface of the resin molding part of the other mold with another release film, and place the semiconductor chip in the molding cavity covered with the release film at the time of molding. On the back side, the board is placed on the entrance side to accommodate the molded product, and another release film covering the chip non-mounting surface of the board is interposed between the board and the resin passage, and the gate of the resin passage is made of resin. Injection hole The mold device provided bets vicinity presented.

[0005]

However, in the former mold apparatus, the non-chip mounting surface of the substrate is directly covered with a release film, and in the latter mold apparatus, a ring-shaped projection is formed around the gate of the resin injection hole. By covering the ring-shaped protrusions and the like with a part of the release film that hits the edge of the resin injection hole generated by breaking through,
Both of the mold devices are configured to prevent the molten resin from entering the chip non-mounting surface of the substrate. Therefore, when the molten resin is injected into the chip non-mounting surface of the substrate in a post-process for the molded product taken out of the cavity, all of the plurality of bonding terminals provided on the chip non-mounting surface are covered with the sealing resin. Would. Therefore, in order to expose the bonding terminals on the chip non-mounting surface, in Japanese Patent Laid-Open No. 5-55278, the sealed resin is ground to expose the tip of each protruding electrode, and in Japanese Patent Laid-Open No. 10-144825, the sealed resin is exposed. And the like, and a method is disclosed in which the tip of each bump is exposed by grinding. However, performing these grinding steps on the molded product taken out of the cavity is burdensome and problematic.

The present invention has been made in view of such conventional problems, and selects the exposed state of a plurality of bonding terminals provided on the chip non-mounting surface of the substrate without grinding the sealing resin. It is an object of the present invention to provide a mold device for resin molding using a release film that can be used.

[0007]

In order to achieve the above-mentioned object, a molding die apparatus for resin molding using a release film according to the present invention comprises a molding cavity for accommodating a substrate on which a semiconductor chip is mounted as a molded article. An upper and lower mold provided with a resin passage for feeding the molten resin to be filled into the molding cavity, for releasing the molded product from the mold on the chip non-mounting surface of the substrate housed in the molding cavity. Cover film. Then, at least a part of each of the plurality of bonding terminals provided on the chip non-mounting surface of the substrate is buried in a release film, and the molding cavity is filled with a molten resin.

Further, a chip / substrate connection space between the semiconductor chip and the substrate housed in the molding cavity and a terminal base side peripheral space of a plurality of bonding terminals provided on the chip non-mounting surface of the substrate are respectively sealed with resin. It will be preferable.

Further, it is preferable to provide a resin injection groove which penetrates the chip mounting surface and the chip non-mounting surface in the thickness direction on the side surface of the substrate accommodated in the molding cavity.

In addition, a resin passage is connected to the molding cavity, and a gate passage of the resin passage is passed through a part of the substrate provided in the molding cavity, on which a plating layer is provided, on a chip mounting surface. It is preferable that a resin injection hole communicating with the resin injection hole penetrating the chip mounting surface and the chip non-mounting surface of the substrate in the thickness direction is provided on the plating layer forming the inner wall.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a main part of a right portion showing a state of molding a resin sealing portion of a resin injection mold at a center of a flip-chip type semiconductor chip mounting substrate by a molding die of a resin mold using a release film to which the present invention is applied. It is sectional drawing. This resin molding mold apparatus is configured by mounting the resin molding mold 1 on a press apparatus. And the resin mold 1
The upper and lower molds 2 and 3 are provided with upper and lower resin molding portions 4 and 5 having a symmetrical structure so that the upper and lower molds 2 and 3 can simultaneously perform the same resin molding on both left and right sides. Therefore, the main part of the right part of the upper and lower resin molded parts 4, 5 will be mainly described below.

The upper resin molding portion 4 is provided with a molding cavity 7 having a float cavity insert 6 which moves up and down within a certain range near the center of the right portion, and the cavity 7 is arranged on the lower side. The float cavity insert 6 is accommodated in an upper space 8 communicating with the float cavity insert 7. Then, the float cavity insert 6 is urged downward by the compression coil spring 9. At this time, a resin injection hole 10 penetrating the center of both surfaces in the thickness direction and a flip chip type semiconductor chip 11 mounted on the center of one surface is used as a product to be housed in the molding cavity 7. The upper surface of the substrate 12 is a chip mounting surface,
The lower surface is the non-chip mounting surface.

A large number of solder balls 13 or solder bumps are arranged on one surface of the semiconductor chip 11 as bonding terminals in a matrix, and the solder balls 13 and the like are connected to the chip mounting surface of the substrate 12 during mounting. Used. Also, a large number of solder balls 14 and the like are similarly arranged on the substrate 12 on the chip non-mounting surface. In addition, bump electrodes of various shapes and the like can be used as the bonding terminals.

In view of this, the inlet side of the molding cavity 7 is wide in preparation for accommodating the substrate 12 and the back side thereof is the semiconductor chip 1.
Narrow down to accommodate 1 Further, the lower portion of the housing space 8 of the float cavity insert 6 is narrowed to fit the chip housing space, and the upper portion thereof is widened so that the flange portion 15 serving as a lowering stopper of the float cavity insert 6 is provided in the upper space.
And further accommodates a compression coil spring 9. At this time, the lower end of the compression coil spring 9 is fixed to the center of the flange 15 of the float cavity insert 6, and the upper end is fixed to the ceiling wall of the upper space.

The lower resin molded part 5 has a tablet 16 and a tablet extruder 1 at its center.
A cylindrical pot 18 for accommodating 7 is installed, and resin passages 20 and 21 connected to the outlet of the pot 18 are provided on the resin molding surface 19 so as to extend left and right.

At the time of resin molding, a lower release film 22 in which the resin molding surface 19 of the lower resin molding portion 5 is first disposed along the parting line with respect to the upper and lower molds 2 and 3 of the mold 1. The upper release film 24 covers the inner surface of the molding cavity 7 of the upper resin molding portion 4 and the resin molding surface 23 adjacent to the inner surface.
At this time, a large number of suction holes 2 provided in the upper and lower resin molding portions 4 and 5 are provided.
5 are dispersed and arranged at necessary places such as the resin molding surfaces 19 and 23, the inner surface of the cavity 7, and the like, and air is sucked from the respective openings in the direction of the arrow, so that the upper and lower release films 22 and 24 are separated. Each is adsorbed at a predetermined location. However,
The lower release film 22 is arranged between the solder balls 14 of the substrate 12 so as to close the groove without covering the inside of the groove of the resin passage 21 provided on the lower resin molding surface 19 by stretching.

Therefore, there is no need to align the lower release film 22 with the gate of the resin passage 21, and the upper and lower release films 22, 24 can be easily aligned.
Therefore, it is suitable for automation of the apparatus, and the molding cycle of the molded article can be shortened. The upper and lower release films 22 and 24
Are ethylene tetrafluoride ethylene copolymers (ETF
E), polytetrafluoroethylene (PTFE) or the like may be used.

Next, an article to be molded is placed at a predetermined position between the upper and lower resin molding sections 4 and 5, and the whole is covered with upper and lower release films 22 and 24 and clamped. Then, the substrate 1
2 release the semiconductor chip 11 mounted on the upper release film 2
2 can be pressed downward from above by the float cavity insert 6 which receives a biasing force from the compression coil spring 9. Therefore, the semiconductor chip 11 and the substrate 12 constituting the molded article can absorb variations in the thickness and the like, and can be clamped satisfactorily.
No excessive force is applied to 2 to prevent damage. Then, the lower release film 22 can cover the chip non-mounting surface of the substrate 12, and the lower release film 22 is interposed between the solder ball 14 of the substrate 12 and the resin passage 22, and the gate of the resin passage 21 is connected to the resin injection hole. It can be located near ten gates.

Then, the lower release film 22 is brought into good contact with the peripheral portion of the upper release film 24 by air suction, and the substrate 12 can be firmly fixed to the lower resin molded portion 5 via the lower release film 22. Moreover, when a thicker lower release film 22 is used, by adjusting the thickness, each solder ball 14
Can be buried in the release film 22 in the same manner, and the buried amount can be selected.

In this manner, after the molded article is placed at a predetermined position and clamped, the tablet 16 is pressed by the plunger 17 to bring the resin into a molten state.
6 is fed under pressure toward the gate of the resin passage 21. Then
The portion of the lower release film 22 facing the gate is pierced by the resin pressure, and the molten resin 26 enters the cavity 14 through the through hole 27. And cavity 7
Since the gate of the resin injection hole 10 provided in the substrate 12 is disposed near the gate of the resin passage 21, the molten resin 26 passes through the injection hole 10 and
Chip / substrate connection space 28 between substrate 1 and substrate 12
It is pushed inside. The molten resin 26 is filled in the injection hole 1.
It branches from just before 0 and is simultaneously pushed into the terminal base side peripheral space 29 of each solder ball 14 between the chip non-mounting surface of the substrate 12 and the lower release film 22.

At this time, since each tip of each solder ball 14 covered with the lower release film 22 is buried in the lower release film 22, the resin does not adhere to the buried portion. Also, the semiconductor chip 1 to be molded
1 is mounted on the substrate 12 with two upper and lower release films 2
Since it is covered and wrapped by 2 and 24, the molten resin 26 does not flow laterally from the chip / substrate connection space 28 and the terminal base side surrounding space 29. Further, when the resin injection hole 10 penetrating the center of both sides of the substrate 12 in the thickness direction is provided, the resin reach distance in each of the spaces 28 and 29 becomes substantially equal, and the resin viscosity can be set high. become.

When the upper and lower dies 2 and 3 are opened, the upper and lower release films 22 and 24 can satisfactorily release the resin, and the lower release film 22 separates the resin in the runner of the resin passage 21 from the flip-chip type semiconductor package. Is obtained. In addition, when the semiconductor package 30 is manufactured in this manner, the resin in which the solder balls 13 and the like in the chip / substrate connection space 28 are well resin-sealed as shown in FIG. Not only can the sealing portion 31 be formed, but also the resin sealing portion 32 in which the base side periphery of each solder ball 14 in the terminal base side space 29 is well sealed with resin can be formed.

Therefore, each solder ball 14 can be reinforced by the interposition of the sealing resin filled around its base side. Also, since each tip of each solder ball 14 is in an exposed state, there is no need for a pre-process such as excavating a joint portion of the solder ball 14 from resin at the time of mounting,
Can be implemented as is. The appearance of the molded product can be improved by preventing the molten resin from flowing out from the chip / substrate connection space 28 and the terminal base side peripheral space 29 to the side. In addition, by setting the viscosity of the molten resin to be high, the density of the resin sealing portions 31 and 32 can be increased and the generation of voids (bubbles) can be reduced. FIG. 4 shows a state in which the distal end portion is exposed from the resin molded portion 32 when the solder bump 33 is provided on the chip non-mounting surface of the substrate 12.

FIG. 5 shows a state in which a resin-sealed portion of a flip-chip type semiconductor chip mounting substrate is molded by a resin mold using a mold of a resin mold using a release film according to an application of the present invention. And FIG. 6 is a plan view of the flip chip type semiconductor chip mounting substrate. The resin molding die apparatus is also connected to the press apparatus by the resin molding mold 34.
To be configured. The upper and lower dies 35 and 36 are also used as the resin mold dies 34 and 36, and the upper and lower dies 35 and 36 have the same upper and lower dies. Molding part 3
7, 38. Therefore, the upper and lower resin molding parts 37,
The main part of the left part of 38 will be mainly described.

The upper resin molding portion 37 is provided with an upper molding cavity 39 near the center of the left portion thereof, and a resin passage 40 extending left and right is provided at a lower portion at the center on the right side of the cavity 39.
Are connected to each other. The lower resin molding section 38 is provided with a lower molding cavity 41 near the center of the left portion. At this time, the upper molding cavity 39 is mounted in the upper and lower molding cavities 39 and 41 in order to accommodate the substrate 43 on which the flip-chip type semiconductor chip 42 is mounted as a product to be molded.
Is smaller corresponding to the volume of the semiconductor chip 42 accommodating the size, and the lower molding cavity 41 is increased corresponding to the volume of the substrate 43 accommodating the size.

On such a semiconductor chip 42, a large number of solder balls 44 are arranged on one surface of the semiconductor chip 42 as joining terminals in a matrix form.
4 is connected to the chip mounting surface of the substrate 43 and used. A large number of conical solder bumps 45 are similarly provided on the substrate 43 on the surface where the chip is not mounted. As shown in FIG. 6, a rectangular gold plating layer 46 is formed on a part of the chip mounting surface of the substrate 43 through which the gate path 40a of the resin passage 40 passes, and the right side of the substrate 43 near the plating layer 46 is provided. At the center of the surface, a groove is formed which penetrates the chip mounting surface and the chip non-mounting surface perpendicularly to the thickness direction. At this time, the resin injection groove 4 of the substrate 43
7 can also be plated. The groove 48 at the center on the left side of the substrate 43 is an air vent.

At the time of resin molding, the upper and lower dies 35 and 36 of the molding die 34 are connected to the inner surfaces of the upper molding cavity 39 and the resin passage 40 and the inner surfaces thereof first. The nearby resin molding surface 49 is covered with an upper release film 50. Further, the inner surface of the lower molding cavity 41 of the lower resin molding portion 38 and the nearby resin molding surface 51 continuous with the inner surface are covered with the lower release film 52. At this time, the openings of the large number of suction holes 53 provided in the upper and lower resin molding portions 37 and 38 are distributed and arranged at necessary places, and when air is sucked from these openings in the direction of the arrow, the upper and lower release films 50 and 52 can be adsorbed to predetermined locations.

Next, an article to be molded is placed at predetermined positions of the upper and lower resin molding sections 37 and 38 and clamped. Then, by using a thicker lower release film 52 and adjusting its thickness, the tip of each solder bump 45 can be buried in the lower release film 52 in the same manner, and the amount of burial can be selected. . Then, the tablet is pressed by the plunger to bring the resin into a molten state, and the molten resin 54 is moved in the direction of the arrow through the resin passage 40 and is fed toward both cavities 39 and 41 by pressure. Then, the semiconductor chip 42 and the substrate 4 are moved from the gate path 40 a of the resin path 40.
It is pushed into the chip / substrate connection space 55 between the three. Further, the solder bumps 45 are pushed from the resin injection groove 47 of the substrate 43 into the terminal base side peripheral space 56 of the large number of solder bumps 45 provided on the chip non-mounting surface of the substrate 43.

Therefore, the chip / substrate connection space 55 and the terminal base side peripheral space 56 are simultaneously filled with the molten resin, and the solder balls 44, Resin-sealed portions can be formed by satisfactorily resin-sealing the solder bumps 45 and the like. At this time, each solder bump 45 is reinforced by the interposition of a resin filled around its base side. However, since the tip of each solder bump 45 is buried in the lower release film 52, the resin does not adhere to the buried portion.
Also, a substrate 43 on which a semiconductor chip 42 as a molded product is mounted.
Is covered with the upper and lower release films 50 and 52, so that the molten resin 54 does not flow laterally from the chip / substrate connection space 55 and the terminal base side surrounding space 56.

When the upper and lower molds 35 and 36 are opened, the upper and lower release films 50 and 52 can release the mold satisfactorily. However, since a flip-chip type semiconductor package to which the resin in the runner of the resin passage 40 adheres is obtained,
The resin in the runner is separated. Then, since the tips of the solder bumps 45 are all exposed,
In mounting the flip-chip type semiconductor package, it is possible to mount the flip-chip type semiconductor package as it is, without requiring a pre-process such as excavating a joint portion of the solder bump 45 from the resin.

FIG. 7 is a side view of a resin-injection-type resin sealing portion of a flip-chip type semiconductor chip mounting substrate using a mold of a resin mold using a release film according to another application of the present invention. FIG. 8 is a cross-sectional view of a main part of a left portion showing a molding start state, and FIG. 8 is a plan view of the flip-chip type semiconductor chip mounting substrate. This resin molding mold device is also configured by mounting a resin molding mold 57 on a press device. And the mold 5
7, resin sealing of the flip-chip type semiconductor chip mounting substrate is performed in the same manner as in the molding die 34. Therefore,
In FIG. 7, portions corresponding to the mold 34 are denoted by the same reference numerals.

However, in the mold 57, the substrate 43 is provided with a resin injection hole 58 penetrating the chip mounting surface and the chip non-mounting surface of the substrate 43 perpendicularly to the thickness direction. Then, the gate path 40a of the resin path 40 is passed through the chip mounting surface at the center of the right side of the substrate 43, which is provided in the upper and lower molding cavities 39 and 41, on which the plating layer 46 is applied, thereby forming the inner wall of the gate path 40a. Plating layer 46
Is provided with a through hole 59 for resin injection, and the resin injection hole 59 is provided.
And the resin injection hole 58 of the substrate 43.

Therefore, the mold 57 has substantially the same operation and effect as the mold 34. However, in the molding die 57, the plating layer 46 is formed on the inner wall of the gate path 40a.
Is applied to the plating layer 46 so that a resin injection hole 58 of the substrate 43 is formed.
By providing the resin injection hole 59 that communicates with the substrate, the plating layer 46 exists around the gate of the resin injection hole 58,
The step of removing the burrs is further simplified as compared with the case where the resin injection groove 47 is provided on the side surface of the substrate 43 near the plating layer 46.

[0034]

According to the present invention described above, claim 1
In the described invention, when a release film having a large thickness is used and its thickness is adjusted, the burial amount of each joint terminal covered with the release film can be selected. Then, the resin does not adhere to the portion of each joint terminal buried in the release film at the time of resin injection, and the exposed state of each terminal joint portion can be selected. Therefore, in mounting, the step of grinding and cleaning the joint of each terminal can be omitted, and mounting can be performed reliably.

According to the second aspect of the present invention, the space for connecting the chip and the substrate is resin-sealed, and the space around the terminal base side of the plurality of bonding terminals provided on the chip non-mounting surface of the substrate is resin-sealed. Thus, each joint terminal can be reinforced by the interposition of the sealing resin filled around the base side.

According to the third aspect of the present invention, the molten resin can be filled into the chip / substrate connection space from the gate passage through the resin passage, and at the same time, can be filled from the resin injection groove into the terminal base side surrounding space. One resin injection is sufficient, and the resin sealing step can be reduced.

According to the present invention, a resin injection hole communicating with the resin injection hole provided in the substrate is provided on the inner wall of the gate path where the plating layer is formed, and the resin injection hole provided in the substrate is provided around the gate. Since the plating layer is present, the flash removal step can be easily performed.

[Brief description of the drawings]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an essential part of a right part showing a molding state of a resin sealing portion of a resin injection mold at a center of a flip-chip type semiconductor chip mounting substrate by a molding die of a resin mold using a release film according to the present invention. It is a fragmentary sectional view.

FIG. 2 is an essential part cross-sectional view of a right portion showing a state immediately before the molding of a resin sealing portion of a flip-chip type semiconductor chip mounting substrate using a molding die of a substrate central resin injection mold.

FIG. 3 is a cross-sectional view of a main part of a semiconductor package manufactured by using the same mold.

FIG. 4 is a cross-sectional view of a main part of a semiconductor package manufactured using the same mold and using solder bumps for bonding terminals.

FIG. 5 is a diagram showing a starting state of forming a resin-sealed portion of a flip-chip type semiconductor chip mounting substrate on a side surface of a flip-chip type semiconductor chip mounting substrate using a mold of a resin mold using a release film according to an application example of the present invention. It is principal part sectional drawing of a left part.

FIG. 6 is a plan view of the flip-chip type semiconductor chip mounting substrate.

FIG. 7 is a view showing another example of application of the present invention, in which a resin mold for a flip-chip type semiconductor chip mounting substrate is formed by a resin mold using a mold for a resin mold using a release film; It is principal part sectional drawing of the left part which shows a state.

FIG. 8 is a plan view of the flip chip type semiconductor chip mounting substrate.

[Explanation of symbols]

1, 34, 57: Mold mold 2, 35: Upper mold
3, 36: Lower mold 4, 37: Upper resin molded part 5, 38
… Lower resin molded part 6… Float cavity insert
7, 39, 41 ... molding cavity 9 ... compression coil spring 10, 27, 58, 59 ... resin injection hole 1
1, 42: semiconductor chip 12, 43: substrate 13, 1
4, 44 solder balls 16 tablets 17 plungers 18 pots 19, 23, 49, 51
Resin molding surface 20, 21, 40 ... Resin passage 22, 2
4, 50, 52: Release film 26, 54: Molten resin 28, 55: Chip / substrate connection space 29, 5
6: terminal base side space 30: semiconductor package 31,
32: resin molded part 33, 45: solder bump 46:
Plating layer 47: Resin injection groove

Claims (4)

[Claims] An upper and lower mold provided with a molding cavity for accommodating a substrate on which a semiconductor chip is mounted as a molded article, and a resin passage for feeding a molten resin filled in the molding cavity. In a resin mold mold device for resin molding, a release film is used to release the molded product from the mold on the non-chip mounting surface of the substrate housed in the cavity. A mold device for resin molding using a release film, wherein at least a part of each of the plurality of joint terminals provided is buried in a release film and a molten resin is filled in a molding cavity. 2. A chip-to-substrate connection space between a semiconductor chip and a substrate housed in a molding cavity, and a terminal base side peripheral space of a plurality of bonding terminals provided on a chip non-mounting surface of the substrate, respectively. The mold apparatus for resin molding using a release film according to claim 1. 3. A resin molding using a release film according to claim 2, wherein a resin injection groove penetrating a chip mounting surface and a chip non-mounting surface in a thickness direction is provided on a side surface of the substrate accommodated in the molding cavity. Mold equipment. 4. A resin passage is connected to the molding cavity,
The gate path of the resin passage is passed through a part of the chip mounting surface provided with the plating layer of the substrate housed in the molding cavity, and the plating layer constituting the inner wall of the gate path and the chip mounting surface of the substrate are separated from the chip mounting surface. 3. The mold apparatus according to claim 2, further comprising a resin injection hole communicating with a resin injection hole penetrating the mounting surface in a thickness direction.