JP2003115506A - Resin-sealing method and equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the upper surface of sealing resin and the upper surface of a substrate the same surface when a chip mounted on a recessed part of the substrate is resin-sealed, and restrain the number of working processes. SOLUTION: This resin sealing equipment is provided with a drag 1, a cope 2, a pot 8, a substrate accommodating part 4 and protruding pin 11 which are disposed in the drag 1, a plunger 9 disposed in the pot 8, a cull 14, a runner 15 and a gate 16 which are disposed in the cope 2, and a fixing pin 17 fixed to the gate 16. A resin film 12 is disposed under tension between the drag and the cope, in a state of the substrate 3 having the recessed part 6 being accommodated in the substrate accommodating part 4. By clamping, the resin film 12 is closely brought into contact with the upper surface of the substrate, and an aperture 18 is formed in the resin film 12 by using the fixing pin 17. Fused resin in the pot 10 is injected in the recessed part, passing the cull 14, the runner 15, the gate 16 and the aperture 18 in sequence, and is then cured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin encapsulation method and a resin encapsulation apparatus for resin-encapsulating a chip-shaped electronic component (hereinafter referred to as a chip) mounted on a substrate, and more particularly, The present invention relates to a resin sealing method and a resin sealing device for sealing a chip mounted in a recess of a substrate with a resin.

[0002]

2. Description of the Related Art Conventionally, a recessed portion having a step is provided on a substrate such as a printed circuit board, and an electrode provided on the stepped portion and an electrode of a chip are connected by wire bonding, and then a sealing resin is formed in the recessed portion. There is a package completed by. When forming this sealing resin, the fluid resin is dropped and filled in the concave portion of the substrate by a dispenser, and then the fluid resin is cured.

[0003]

However, the above conventional resin encapsulation has the following problems. First,
Since the heat sink is attached in close contact with the upper surface of the sealing resin in a later step, it is necessary to control the dropping amount of the fluid resin so that the upper surface of the liquid resin before curing is flush with the upper surface of the substrate. is there. However, this control is difficult, and the sealing resin may rise from the upper surface of the substrate, or conversely, the upper surface of the sealing resin may be located below the upper surface of the substrate. In these cases, after the heat sink is attached to the package, a gap is generated between the upper surface of the substrate or the sealing resin and the lower surface of the heat sink, so that the heat dissipation performance may be deteriorated. Further, in order to make the upper surface of the sealing resin and the upper surface of the substrate flush with each other, so-called leveling may be performed after filling the concave portion with the fluid resin and then leaving it. But in this case,
There is a problem that the number of work steps increases.

The present invention has been made to solve the above-mentioned problems, and when a chip mounted in a recess of a substrate is resin-sealed, the upper surface of the sealing resin and the upper surface of the substrate are flush with each other. In addition to the above, it is an object of the present invention to provide a resin sealing method and a resin sealing device that suppress the number of working steps.

[0005]

In order to solve the above-mentioned technical problems, a resin sealing method according to the present invention is directed to electrodes between a substrate having a recess and a chip-shaped electronic component mounted in the recess. After they are connected by wiring,
A resin sealing method of mounting a substrate on one of the molds of a set to seal an electronic component with a resin, and a step of stretching a resin film to cover the recessed portion on the upper surface of the substrate, A step of clamping a set of molds and providing an opening in a portion of the resin film on the concave portion, a step of injecting a molten resin into the concave portion through the opening, and a step of curing the molten resin to form a sealing resin. And a step of performing.

According to this, a resin film is stretched over the concave portion of the substrate, a pair of molds is clamped, an opening is formed in the resin film on the concave portion of the substrate, and the concave portion is passed through the opening. Inject the molten resin into. As a result, the resin film is stretched on the upper surface of the substrate by mold clamping, is brought into close contact with the mold surface of the mold, and the molten resin is injected into the concave portion closed by the resin film. Therefore, the upper surface of the sealing resin and the upper surface of the substrate can be flush with each other, and
The molten resin can be injected into the recess in a short time.

Further, in the resin sealing method according to the present invention, in the resin sealing method described above, in the step of providing the opening, the resin film is formed by the protruding member provided on the other die of the one die set. It is characterized by perforation.

According to this, the mold can be clamped and the resin film can be perforated on the concave portion of the substrate by the projecting member to provide the opening.

The resin sealing device according to the present invention includes a pair of metal molds facing each other in a state where electrodes of a substrate having a recess and a chip-shaped electronic component mounted in the recess are connected to each other by wiring. A resin encapsulation device for encapsulating an electronic component on a substrate placed on one of the molds with a resin, wherein a means for tensioning a resin film so as to cover the concave portion on the upper surface of the substrate, 1 A means for forming an opening in a portion of the resin film on the concave portion when the molds are clamped, a means for injecting the molten resin into the concave portion through the opening, and a method for curing the molten resin to form a sealing resin. And means for doing so.

According to this, the resin film stretched over the concave portion of the substrate is provided with an opening on the concave portion when one set of molds is clamped, and the concave portion is passed through the opening. Molten resin is injected into. As a result, the resin film is stretched on the upper surface of the substrate by the mold clamping, adheres closely to the mold surface of the mold, and the molten resin is injected into the concave portion closed by the resin film. Therefore, the upper surface of the sealing resin and the upper surface of the substrate are flush with each other, and the molten resin is injected into the recess in a short time.

Further, in the resin sealing device according to the present invention, in the above-mentioned resin sealing device, the means for providing the opening is a projecting member provided in the other die of the pair of dies. Characterize.

According to this, a set of molds is clamped, and the resin film is perforated on the concave portion of the substrate by the projecting member to provide an opening.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A resin sealing device according to the present invention will be described with reference to FIGS. FIG. 1 (A)-
(C) shows the operation of the resin sealing device according to the present invention to stretch the resin film between the molds, the operation of clamping the mold and opening the resin film, and the operation through the openings. It is sectional drawing which shows the operation | movement which injects a molten resin into a recessed part. 2 (A) to 2 (C) respectively show an operation of curing a molten resin, an operation of performing mold opening and a gate break together, and an operation of ejecting a completed package, by the resin sealing device according to the present invention. FIG.

In FIG. 1, reference numeral 1 is a lower die, and 2 is an upper die provided so as to face the lower die 1, which together constitute a set of dies. Reference numeral 3 is a substrate such as a printed circuit board provided with electrodes (not shown). As the substrate 3, a multilayer printed circuit board, a composite printed circuit board to which the printed circuit boards are attached, or the like is used. Reference numeral 4 denotes a substrate accommodating portion which is engraved from the mold surface of the lower mold 1 and accommodates the substrate 3. Here, since the depth of the substrate housing portion 4 is provided so as to be equal to the thickness of the substrate 3, the upper surface of the substrate 3 and the mold surface of the lower mold 1 are flush with each other. Reference numeral 5 is a chip made of a chip-shaped electronic component such as a semiconductor chip. Reference numeral 6 is a concave portion provided on the substrate 3 to accommodate the chip 5. Reference numeral 7 is a wire that electrically connects the electrode of the substrate 3 and the electrode (not shown) of the chip 5 provided on the step of the recess 6. 8 is lower mold 1
And a pot consisting of a cylindrical space, 9 is a pot 8
Plungers 10 that can be raised and lowered are provided on the plunger 9 and are resin tablets made of, for example, epoxy resin. Reference numeral 11 is a push-out pin that is provided in a through hole provided in the lower mold 1 so as to be able to move up and down and projects a package as a final product.

Numeral 12 is between the lower mold 1 and the upper mold 2,
Reel that faces the recess 6 (not shown)
It is a resin film stretched between. The resin film 12 is formed of a material having required heat resistance, flexibility, and releasability from the mold surface and the sealing resin.
Reference numeral 13 is a circular hole provided in a portion of the resin film 12 corresponding to the pot 8, that is, a cutout portion.

Reference numeral 14 is a cull which is a space provided in the upper mold 2 at a position corresponding to the pot 8. 15 is
It is a runner that communicates with the cull 14 and serves as a passage for the molten resin described later. Reference numeral 16 denotes a gate which is in communication with the runner 15 and serves as an injection port when the molten resin is injected into the recess 6 in a state where the lower mold 1 and the upper mold 2 are clamped. A fixing pin 17 is fixed to the upper mold 2 at the gate 16 and has a tip portion protruding from the mold surface of the upper mold 2 by a predetermined amount.

The operation of the resin sealing device according to the present invention will be described below. First, as shown in FIG. 1A, the substrate 3 is set in the substrate housing portion 4, and the resin tablet 10 is placed in the pot 8.
To supply. Then, in this state, the resin film 12 is stretched by appropriately winding the opposing reel (not shown).

Next, as shown in FIG. 1 (B), the upper die 2 is lowered to clamp the lower die 1 and the upper die 2 together, and the heaters provided on the lower die 1 and the upper die 2 are joined together. The plunger 9 is raised while heating and melting the resin tablet 10 by (not shown). As a result, the resin film 12 is brought into close contact with the mold surface of the lower mold 1, the upper surface of the substrate 3 and the mold surface of the upper mold 2, and the resin film 12 is perforated by the fixing pin 17 to form the opening 18.

Next, as shown in FIG. 1 (C), the resin tablet is further heated and melted, and the plunger 9 is raised. As a result, the molten resin 19 is
The cutout portion 13, the cull 14, the runner 15, shown in FIG.
It is injected into the concave portion 6 through the gate 16 and the opening 18 in order.

Next, as shown in FIG. 2 (A), the molten resin 19 is continuously heated to cure the molten resin 19. As a result, the cull 14 shown in FIG.
Cured resin is formed on each of the runner 15, the gate 16, and the recess 6. Of these, the cull 14, the runner 15, and the gate 16 have unnecessary resin 2 that is unnecessary in the final product.
0 is formed. A sealing resin 21 that seals a chip (not shown) is formed in the recess 6. The substrate 3 on which the chip is mounted and the sealing resin 21 together form a package 22.

Next, as shown in FIG. 2B, the upper mold 2 and the plunger 9 are both raised. Here, the resin film 12 is formed of a material having a required releasability from the mold surface, the unnecessary resin 20 and the sealing resin 21. As a result, the unnecessary resin 20 is separated from the resin film 12 and rises while being attached to the mold surface of the upper mold 2. Further, in most of the upper part of the substrate 3, the lower surface of the upper mold 2 is peeled off from the resin film 12, and the upper mold 2 rises. Therefore, the unnecessary resin 20 and the sealing resin 21 included in the substrate 3 held by the substrate housing portion 4 are separated. With the above operation, mold opening and gate break can be performed in the same process. If the resin film 12 is not used in this step, the sealing resin 21 is less likely to be peeled off from the mold surface of the upper mold 2, so that a mechanism for pressing the package 22 from above for the gate break is required. Therefore, by using the resin film 12, the mechanism of the resin sealing device can be simplified.

Next, as shown in FIG. 2C, the plunger 9 is lowered and the ejection pin 11 is raised. As a result, the unnecessary resin 20 is peeled off from the plunger 9 while being attached to the mold surface of the upper mold 2. Further, the package 22 is projected from the substrate housing section 4.

Next, after further raising the upper mold 2, a carry-out mechanism (not shown) is inserted between the molds. Then, the unnecessary resin 20 and the package 22 are held by suction, a clamp, or the like, and are carried out between the molds.

As described above, according to the present invention, as shown in FIG. 1B, the resin film 12 stretched on the upper surface of the substrate 3 and in close contact with the mold surface of the mold closes the recess 6. Then, as shown in FIG. 1C, the molten resin 19 is injected into the closed concave portion 6. After that, as shown in FIG. 2A, the molten resin 19 is cured. Therefore, the upper surface of the sealing resin 21 and the upper surface of the substrate 3 can be flush with each other, so that a package having excellent heat dissipation performance can be obtained with the heat dissipation plate attached. In addition, as compared with the case where the resin filled in the recess is leveled, the recess 6 can be formed in a shorter time.
The molten resin 19 can be injected into the. Therefore,
The work man-hour in the resin sealing process can be suppressed.

A modification of the present invention will be described below. Figure 3
(A) to (C) respectively show an operation in which the resin sealing device according to the modification of the present invention stretches a resin film between molds,
FIG. 6 is a cross-sectional view showing an operation of clamping the mold and providing an opening in the resin film, and an operation of injecting the molten resin into the recess via the opening.

In this modification, the fixing pin 17 shown in FIG.
Instead of the movable pin 23, the movable pin 23 is provided on the upper mold 2 so as to be vertically movable.
To use. As shown in FIG. 3A, the movable pin 23
When the resin film 12 is stretched between the molds, the resin film 12 is evacuated to a predetermined position and its tip end surface forms the wall surface of the gate 16. Further, as shown in FIG. 3 (B), the movable pin 23 descends to perforate the resin film 12 in a state where the lower mold 1 and the upper mold 2 are clamped. Then, as shown in FIG. 3C, when the molten resin 19 is injected into the concave portion 6, the movable pin 23 is retracted to a predetermined position again.

Also in this modification, the upper surface of the sealing resin and the upper surface of the substrate 3 can be flush with each other, and the molten resin 19 can be injected into the recess 6 in a short time.
In addition, it is possible to eliminate the trace of the fixing pin 17 that is generated on the upper surface of the sealing resin 21 when the fixing pin 17 shown in FIG. 1 is used. Therefore, the appearance quality of the package is improved.

In the above description, the resin film 12 is brought into close contact with the mold surface of the lower mold 1 and the upper surface of the substrate 3 by clamping the mold. The invention is not limited to this, and the resin film 12 may be brought into close contact with the die surface of the lower die 1 and the upper surface of the substrate 3 by suction, for example, before die clamping, and then die clamping may be performed.

The upper die 2 is provided with the substrate housing portion 4, and the lower die 1 is provided with the fixed pin 17 or the movable pin 23, the runner 15, and the gate 1.
6 may be provided. In this configuration, it is preferable to fix the substrate 3 to the substrate housing portion 4 by suction. Therefore, when the package is taken out, it is sufficient to release the suction. As a result, the protrusion pin 11 is not needed, and the mechanism of the resin sealing device can be simplified. Further, in this case, the pot 8, the plunger 9, and the cull 14 may be provided in either the lower mold 1 or the upper mold 2.

Further, without providing the substrate accommodating portion 4 in the lower die 1, the lower die 1 is made flat and the substrate 3 is fixed to the die surface by suction or the like, and a concave portion for accommodating the substrate 3 in the upper die 2 is formed. It can also be provided.

Clamping was performed by lowering the upper mold 2. The present invention is not limited to this, and the lower mold 1 may be raised and the lower mold 1 and the upper mold 2 may be relatively moved.

Further, instead of the fixed pin 17 or the movable pin 23 provided on the upper mold 2, a laser is irradiated from an irradiation mechanism provided on the upper mold 2 and the resin film 12 is heated by the heat.
It is also possible to provide an opening 18 in the.

Further, a step is provided in the concave portion 6 of the substrate 3, and the electrode formed on the step is wire-bonded.
Not limited to this, an electrode may be provided on the bottom surface of the recess 6 without providing a step.

The electrodes of the substrate 3 and the electrodes of the chip 5 were electrically connected by wires 7. Not limited to this, the electrodes of the substrate 3 and the electrodes of the chip 5 may be connected to each other by using a wiring such as a copper foil formed on the insulating film.

If the thickness of the substrate 3 varies greatly, it is difficult to make the die surface of the lower die 1 and the upper surface of the substrate 3 flush with each other. In this case, resin leakage of the molten resin 19 and damage to the substrate 3 may occur. To prevent these, a floating mechanism using an elastic body may be provided below the substrate housing portion 4 in the lower mold 1.

Further, the fixed pin 17 or the movable pin 23 is used to punch the resin film 12. Not limited to such pins, blade-shaped members may be used.

The present invention is not limited to the above-mentioned embodiments, and may be arbitrarily and appropriately modified and selected as necessary within the scope of the gist of the present invention.
Alternatively, they can be used in combination.

[0038]

According to the present invention, the resin film is stretched on the upper surface of the substrate by mold clamping, is brought into close contact with the mold surface of the mold, and the molten resin is injected into the concave portion closed by the resin film. . Therefore, the upper surface of the sealing resin and the upper surface of the substrate can be flush with each other. Further, since the molten resin is injected into the concave portion in a short time, it is possible to reduce the number of working steps. Therefore, the present invention can provide a resin sealing method and a resin sealing device in which the upper surface of the sealing resin and the upper surface of the substrate are flush with each other and the number of working steps can be reduced. Is played.

[Brief description of drawings]

1 (A) to 1 (C) respectively show an operation in which a resin sealing device according to the present invention stretches a resin film between molds, and the mold is clamped and an opening is provided in the resin film. FIG. 6 is a cross-sectional view showing an operation and an operation of injecting a molten resin into a recess via an opening.

2 (A) to (C) are views showing the completed package, in which the resin sealing device according to the present invention performs an operation of curing the molten resin, an operation of performing mold opening and a gate break together, respectively. It is sectional drawing which shows operation | movement.

3 (A) to 3 (C) are views showing an operation in which a resin sealing device according to a modified example of the present invention stretches a resin film between molds, and the mold is clamped to the resin film. FIG. 6 is a cross-sectional view showing an operation of providing an opening and an operation of injecting a molten resin into the recess via the opening.

[Explanation of symbols]

1 Lower mold (one mold) 2 Upper mold (other mold) 3 substrates 4 Substrate housing 5 chips (electronic parts) 6 recess 7 wires 8 pots 9 Plunger (means for injecting) 10 resin tablets 11 protruding pin 12 Resin film 13 Extraction part 14 Cal 15 Lanna 16 gates 17 Fixing pin (projecting member) 18 openings 19 Molten resin 20 unnecessary resin 21 sealing resin 22 packages 23 Movable pin (projecting member)

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Claims (4)

[Claims] 1. A substrate having a concave portion and electrodes of a chip-shaped electronic component mounted in the concave portion are connected to each other by wiring, and then the pair of metallic molds facing each other is formed on one of the metallic molds. A resin sealing method for mounting a substrate and resin-sealing the electronic component, the method comprising: tensioning a resin film to cover the recess on the upper surface of the substrate; and clamping the pair of molds. And a step of providing an opening in a portion of the resin film on the recess, a step of injecting a molten resin into the recess via the opening, and a step of curing the molten resin to form a sealing resin. A resin sealing method comprising: 2. The resin sealing method according to claim 1, wherein in the step of providing the opening, the resin film is perforated by a protruding member provided in the other die of the one set of dies. A characteristic resin sealing method. 3. One of a pair of molds facing each other in a state where electrodes of a substrate having a recess and a chip-shaped electronic component mounted in the recess are connected to each other by wiring. A resin encapsulation device for encapsulating the mounted electronic component on the substrate with a resin, wherein the resin film is stretched so as to cover the recess on the upper surface of the substrate, and the one set of A means for providing an opening in a portion of the resin film on the concave portion when the mold is clamped, a means for injecting a molten resin into the concave portion through the opening, and a method for curing the molten resin and sealing. A resin encapsulation device, comprising: a means for forming a resin. 4. The resin sealing device according to claim 3, wherein the means for providing the opening is a protruding member provided in the other mold of the one set of molds. Stop device.