KR102393495B1 - Resin molded product manufacturing method and resin molding apparatus - Google Patents

Abstract

Problems such as peeling and lifting of the release film that may occur when the release film is applied to the pin gate transfer resin molding method are prevented without significantly complicating the process or configuration. To this end, as a method of manufacturing a resin molded article in which resin is injected and molded from the gate GT opened on the bottom surface of the cavity 3 formed between the first mold 1 and the second mold 2 at the mold fastening position, , A release film 5 having an insertion hole 5a penetrating in the thickness direction is placed on the inner surface including the bottom surface of the cavity 3 so that the insertion hole 5a overlaps the gate GT, and , at the mold fastening position, a part or all of the periphery of the insertion hole 5a in the release film 5 is pressed at the time of mold fastening to have a pressing surface 61 that is pressed into close contact with the bottom surface of the cavity; A pressure flow passage member (6) is disposed to form a communication passage (7) between the passage hole (5a) and the cavity (3) at the time of frame fastening.

Description

The manufacturing method and resin molding apparatus of a resin molded article TECHNICAL FIELD

This invention relates to the manufacturing method of the resin molded article by the pin gate system which injects resin from the gate provided in the bottom surface of a cavity, and the resin molding apparatus used for it.

In transfer resin molding, for example, as in Patent Document 1, a gate is provided at a position corresponding to the surface rather than the side surface of the molded product, ie, on the bottom surface of the cavity in the molding die, and the gate is A pin gate method (or pin point gate method) in which resin is injected from

As a general advantage of the pin gate method, gate marks are small and inconspicuous, multi-pointing and multi-cavity are easy, and uniform pressure distribution is easy to be obtained. can be mentioned. In particular, in resin encapsulation molding of IC chips and the like, the advantage that the gate rest is not formed on the circuit board is also obtained.

On the other hand, in the transfer resin molding, the molded article is removed from the cavity by arranging a release film on the inner surface including the bottom surface of the cavity, and interposing the release film between the resin and the cavity ( A technique for preventing damage to a molded article during release by making it easy to fall off) is known.

However, in the said fin gate method, the example using a release film is not seen yet.

Also, in the pin gate system, when a release film is placed on the inner surface of the cavity, the release film covers the gate, so it is necessary to provide a hole in the portion corresponding to the gate in the release film, and accordingly I think this is because there could be a problem.

Described specifically. Since the release film is adsorbed to the inner surface of the cavity by negative pressure suction, as described above, when a hole is pierced in the release film, air leaks from the hole, and the adsorption force of the release film around the gate is weakened. Then, there may arise a problem that the release film around the hole is peeled off from the inner surface of the cavity due to the pressure at the time of resin injection and filling, and the resin enters from the gap, causing a molding defect.

Japanese Patent Laid-Open No. 2019-111692

The present invention has been made in view of these problems, and the release film is applied to the transfer resin molding method of the pin gate method, and while taking advantage of both advantages, peeling and lifting of the release film that may occur during resin injection. This was done to avoid problems such as

That is, the method for manufacturing a resin molded article according to the present invention is a method of molding by injecting resin into the cavity from a gate opened on the bottom surface of a cavity formed between a first mold and a second mold,

A release film having an insertion hole penetrating in the thickness direction is disposed on the inner surface including the bottom surface of the cavity so that the insertion hole overlaps the gate,

The release film has a pressing surface for pressing part or all of the periphery of the insertion hole during die-clamping to adhere to the bottom surface of the cavity, and further, the insertion hole A pressure flow passage member is disposed to form a communication passage for communicating with the cavity when the frame is fastened,

Fastening the first frame and the second frame,

It is characterized in that the resin is injected into the cavity from the gate through the insertion hole and the communication passage, and cured.

Further, according to the present invention, a gate is provided on the bottom surface of the cavity formed between the first mold and the second mold, and resin is injected into the cavity from the gate and molded,

a release film disposed on the inner surface including the bottom surface of the cavity and provided with an insertion hole for passing the resin flowing in from the gate at a position overlapping the gate in the arrangement state;

Pressing part or all of the periphery of the insertion hole in the release film has a pressing surface for bringing the pressing portion into close contact with the bottom surface of the cavity, and at the same time forming a communication channel for communicating the insertion hole and the cavity A resin molding apparatus provided with a pressure passage member may be used.

According to the present invention described above, even if a release film is used for, for example, a pin gate transfer resin molding method, the problem that the release film peels off and the molten resin penetrates into the gap with the inner surface of the cavity can be prevented.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the board|substrate in one Embodiment of this invention.
It is a schematic sectional drawing which shows the resin molding apparatus in the frame-opening position in the same embodiment.
It is a schematic sectional drawing which shows the resin molding apparatus in a frame fastening position in the same embodiment.
4 : is the top view and perspective view which looked at the pressure flow path member in the same embodiment from the back surface.
FIG. 5 is a partially enlarged view of FIG. 1 .
Fig. 6 is a cross-sectional view taken along line A-A in Fig. 5 .
7 : is a schematic sectional drawing for demonstrating the manufacturing method of the resin molded article using the resin molding apparatus in the same embodiment.
It is a schematic sectional drawing for demonstrating the manufacturing method of the resin molded article using the resin molding apparatus in the same embodiment.
It is a schematic sectional drawing for demonstrating the manufacturing method of the resin molded article using the resin molding apparatus in the same embodiment.
It is a schematic sectional drawing for demonstrating the manufacturing method of the resin molded article using the resin molding apparatus in the same embodiment.
11 : is a schematic sectional drawing for demonstrating the manufacturing method of the resin molded article using the resin molding apparatus in the same embodiment.
It is a perspective view which shows the pressure flow path member in another embodiment of this invention.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described. In addition, it goes without saying that this invention is not limited to the following embodiment.

<Summary of embodiment>

A method for manufacturing a resin molded article according to the present embodiment is a method of molding by injecting a resin into the cavity from a gate opened on the bottom surface of a cavity formed between the first and second molds at a mold fastening position,

A release film having an insertion hole penetrating in the thickness direction is disposed on the inner surface including the bottom surface of the cavity so that the insertion hole overlaps (overlaps) the gate,

In the release film, a part or all of the periphery of the insertion hole in the release film has a pressing surface that is pressed in close contact with the cavity bottom surface when the mold is fastened, and a communication channel for communicating the insertion hole and the cavity at the time of mold fastening. A pressing passage member formed at the time of frame fastening is provided,

Fastening the first frame and the second frame,

It is characterized in that the resin is injected into the cavity from the gate through the insertion hole and the communication passage, and cured.

In this way, when the mold is fastened, the pressure flow path member closes the periphery of the insertion hole in the release film to the inner surface of the cavity, so that the molten resin can be prevented from entering the gap between the release film and the inner surface of the cavity. . Moreover, since the communication flow path which communicates the gate with the cavity is formed in the pressure flow path member, injection|pouring into the cavity of molten resin is not inhibited either.

In this way, it becomes possible only to use a release film for the transfer resin molding method of a pin gate system. Moreover, since an insertion hole is drilled in the release film and a pressure passage member is provided, there is no significant complication of the process or structure.

As a specific aspect from which the above-mentioned effect is acquired more notably, making the said release film adsorb|suck to the inner surface of the said cavity is mentioned.

As a specific configuration of the pressure passage member that can be manufactured relatively easily, the pressure passage member has a through hole in the center, and extends outward from the through hole and opens on the outer circumferential surface. One or a plurality of flow passage elements are provided, and the communication passage is formed by the through hole and the passage element.

When the one end face of the pressure passage member is the pressure surface and the passage element is formed to be spaced apart from the one end in the extending direction of the through hole, the pressure surface is the entire insertion hole in the release film. Since the periphery is brought into close contact with the inner surface of the cavity, it is possible to more reliably prevent the resin from penetrating into the gap between the release film and the inner surface of the cavity.

As a specific embodiment of molding the resin on a substrate such as a semiconductor substrate, the first mold holds the substrate, and the second mold has a cavity in which the surface facing the first mold is opened. It is provided, and in a frame fastening position, the said board|substrate is arrange|positioned in the opening part of the said cavity, and resin is shape|molded on the said board|substrate by injecting resin into the said cavity.

It is configured such that semiconductor chips are respectively formed at a plurality of predetermined positions set in advance on the substrate. The degree of freedom of selection of the arrangement position is increased, and for example, the pressure passage member can be arranged at a position suitable for resin injection.

In addition, it becomes possible to integrate the pressure passage member into the substrate in advance, and then, as compared with the case where the pressure passage member is a single member, steps such as positioning of the pressure passage member become unnecessary.

Moreover, the same effect can be acquired also with the following resin molding apparatus.

That is, a gate is provided on the bottom surface of the cavity formed between the first mold and the second mold, and a resin is injected into the cavity from the gate to mold the resin molding apparatus,

a release film disposed on the inner surface including the bottom surface of the cavity and provided with an insertion hole for passing the resin flowing in from the gate at a position overlapping the gate in the arrangement state;

In the mold clamping position, the release film has a pressing surface for pressing part or all of the periphery of the insertion hole in the release film to bring the pressing portion into close contact with the bottom surface of the cavity, and communicates the insertion hole and the cavity This is a resin molding apparatus provided with a pressure passage member for forming a communication passage.

<Detailed embodiment>

EMBODIMENT OF THE INVENTION Hereinafter, detailed embodiment is described with reference to drawings.

This embodiment relates to a manufacturing method of a resin molded article molded, for example, by encapsulating and covering required portions of a semiconductor chip disposed on the surface of a substrate with resin.

Before demonstrating this manufacturing method, first, the board|substrate W and the semiconductor chip C used as the object of sealing with resin, and the resin molding apparatus 100 used for the said manufacturing method are demonstrated.

<Explanation of the substrate (W)>

Examples of the substrate W include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, ceramic substrates, and the like. Moreover, the board|substrate W may be a carrier used for FOWLP (Fan 　 Out 　 Wafer 　 Level Packaging) and FOPLP (Fan ou Out 　 Panel 　 Level packaging). In other words, the wiring may be already implemented, or the wiring may be unwired.

As shown in Figs. 1 and 2, the substrate W in this embodiment has a rectangular shape, for example, in a planar view, and its surface Wa A plurality of identical semiconductor chips C forming a rectangular shape in plan view are arranged so as to protrude horizontally and vertically at equal pitches, respectively. The board|substrate W is cut|disconnected for every semiconductor chip C after shaping|molding, and is fragmented. Further, for example, as long as it is used for FOWLP or FOPLP, the substrate W may be separated from the encapsulating resin after molding without being separated into pieces.

<Explanation of the resin molding apparatus 100>

As shown in Fig. 2 or the like, the resin molding apparatus 100 includes an upper frame 1 as a first frame and a lower frame 2 as a second frame, these upper frames 1 and A frame fastening mechanism (not shown) that maintains and holds the lower frame 2 and drives forward and backward between the frame opening position shown in FIG. 2 and the frame fastening position shown in FIG. and a resin injection mechanism 4 for injecting the resin R into the cavity 3 formed between the upper frame 1 and the lower frame 2 at the frame fastening position.

Each part is explained.

The upper frame 1 is interchangeably mounted below a fixed platen (not shown). A plurality of suction holes (not shown) are provided on the lower surface of the upper frame 1 (the opposite surface facing the lower frame 2), and these suction holes are set to a negative pressure by a vacuum pump (not shown) or the like. By this, it is comprised so that the back surface of the said board|substrate W can be adsorbed and fixed.

The lower frame 2 is replaceably mounted above a movable platen (not shown), and the lower plate 21 and the middle portion mounted on the upper surface of the lower plate 21 so as to be detachably contacted. A plate 22 is provided. In addition, the cavity 3 having an outline smaller than that of the substrate W is formed on the upper surface of the intermediate plate 22 (the opposite surface facing the upper frame).

And in the frame fastening position, the peripheral part of the cavity 3 in the upper surface of the intermediate plate 22 is closely_contact|adhered to the peripheral edge part of the board|substrate surface Wa, and the upper opening of the cavity 3 is a board|substrate. It is configured so that the semiconductor chip C disposed (formed) on the substrate W while being closed by the W is accommodated in the cavity 3 .

In addition, in this embodiment, the depth dimension of the cavity 3 is made to be substantially the same as the thickness dimension of the semiconductor chip C, and in a frame fastening position, the top surface (頂面) is set to be close. Thereby, the resin R does not rotate on the top surface of the semiconductor chip C, and only the side peripheral surface of the semiconductor chip C is coat|covered with resin R. Therefore, after resin molding, the top surface of the semiconductor chip C is exposed. In addition, here, the "top surface" of the semiconductor chip C is a surface on the opposite side to the board|substrate W, and means the surface by the side of the release film 5 at the time of a resin molding operation|movement.

Moreover, the said intermediate plate 22 may be comprised so that it can be lifted from the upper surface of the said lower plate 21 by a lift-up mechanism (not shown).

Although not shown in the figure, the frame fastening mechanism includes a holding structure for holding the upper frame 1 and the lower frame 2, and a frame lifting mechanism for lifting and lowering the lower frame 2 held by the holding structure. will be equipped with

The holding structure (not shown) includes, for example, a base board, a plurality of guide posts standing up from the base board, the fixing platen fixed to upper ends of these guide posts, and the guide The movable platen held in the middle part of the post so as to be able to move up and down is provided. And, as described above, the upper frame 1 is mounted below the fixing platen. The upper frame 1 may be attached to the lower surface of the fixed platen via an upper frame holder (not shown). A heater for heating the upper frame 1 may be provided in the upper frame holder, or a heat insulating material may be provided on the fixed platen side of the heater.

Also, as described above, the lower frame 2 is mounted above the movable platen. The lower frame 2 may be attached to the lower surface of the movable platen via a lower frame holder (not shown). A heater for heating the lower frame 2 may be provided in the lower frame holder, or a heat insulating material may be provided on the movable platen side of the heater.

The frame raising/lowering mechanism is composed of a ball screw mechanism, a hydraulic cylinder, a toggle mechanism, etc. that lift and drive the lower frame 2 via the movable platen.

As shown in Fig. 2 or the like, the resin injection mechanism 4 includes a resin injection hole 41 penetrating the lower frame 2 in the thickness direction and a molten resin R filled in the resin injection hole 41. A plunger mechanism (42) for pressing and injecting into the cavity (3) is provided.

Each part is explained.

The resin injection hole 41 is composed of a first hole 411 penetrating the middle plate 22 in the thickness direction and a second hole 412 penetrating the lower plate 21 in the thickness direction. , the first hole 411 and the second hole 412 are arranged to be continuous.

The first hole 411 has a circular cross-section that tapers toward the bottom of the cavity 3, and one end that opens on the bottom of the cavity 3 serves as a gate GT, and other parts It functions as a sprue (SP).

The second hole 412 has a circular cross section of the same diameter in the penetrating direction, and serves as a port for accommodating the molten resin R.

The plunger mechanism 42 includes a plunger 421 inserted into the second hole 412 from the lower end, and a forward/backward actuator 422 such as a ball screw or a motor that moves the plunger 421 up and down.

The plunger 421 has a cylindrical shape set so that its outer diameter is equal to the inner diameter of the second hole 412, and is slidable in the second hole 412, In addition, it is fitted without looseness (space).

The advancing and retreating actuator 422 moves the plunger 421 between a standby position in which the tip surface is lower than the upper surface of the second hole 412 and an injection completion position set above this standby position by a predetermined distance. It will drive backwards. In the standby position, as shown in FIG. 3 or the like, a predetermined amount of tablet-like resin R in a solid state is injected into the second hole 412 from above, and the lower plate 21 ) is melted by a heating mechanism not shown. Further, from that state, when the advancing and retreating actuator 422 raises the plunger 421 to the injection completion position, as shown in FIG. 9 , the molten resin R is transferred to the spur SP and the gate ( GT) to be injected into the cavity 3 . In this embodiment, a thermosetting resin is used as resin (R).

In addition, the resin molding apparatus 100 includes a release film 5 , a film supply mechanism (not shown) for supplying the release film 5 to the upper surface of the intermediate plate 22 , and the cavity 3 . A film adhesion mechanism (not shown) for contacting the inner surface and the upper surface of the intermediate plate 22 around the cavity 3 is provided.

The release film 5 is disposed in close contact with the inner surface including the bottom surface of the cavity 3 , and is interposed between the inner surface of the cavity 3 and the injected resin R within the cavity 3 . It is for making resin R after solidified shaping|molding easy to peel from the cavity 3. Since the description of the material and the like is already known, it is omitted.

By the way, in this embodiment, since the said gate GT is opened in the bottom face of the cavity 3, it respond|corresponds to the said gate GT in the release film 5 so that the gate GT may not be blocked. An insertion hole 5a having a diameter equal to or slightly larger than that of the opening diameter of the gate GT is formed at the position.

Although not shown in the figure, the film adhesion mechanism includes a plurality of suction holes provided on the inner surface of the cavity 3 and/or the upper peripheral surface of the outer side of the cavity 3, and a vacuum (not shown) in which these suction holes are used as negative pressure. It is comprised by a pump etc., and the said release film 5 is adsorb|sucked by the negative pressure of each adsorption|suction hole.

And the resin molding apparatus 100 of this embodiment presses the circumference|surroundings of the said insertion hole 5a in the release film 5 through the board|substrate W in the frame clamping position, and the cavity 3 ) further (additionally) provided with a pressure passage member 6 to be brought into close contact with the inner surface.

Next, this pressure flow passage member 6 will be described in detail.

The pressure flow path member 6 in this embodiment forms a thin disk shape in which the through hole 6a was provided in the center, as shown in FIG. 4 which looked at this from the back side. The surface 61 thereof is flattened, and the surface 61 becomes the pressing surface referred to in the claims. On the other hand, on the back surface 62, a plurality of (here, four) bottomed grooves 6b extending radially are uniformly formed. Each of these bottomed grooves 6b is provided between the outer circumferential surface and the inner circumferential surface of the pressing passage member 6 . In other words, the outer end face of each bottomed groove 6b is opened to the outer circumferential surface of the pressure flow passage member 6, and the inner end face is the inner circumferential surface (i.e., the above It is opened in the through hole 6a), and is configured such that the radially outer side of the pressure passage member 6 and the radially inner side of the through hole 6a communicate with each of these bottomed grooves 6b. has been

Such a pressure passage member 6 is a single member separate from the substrate W, and is produced by etching, machining, or the like. And as shown in FIG.5, FIG.6, the back surface 62 of the press flow path member 6 is joined to the board|substrate surface Wa, and it is integrated with the board|substrate W. As shown in FIG. In this way, the bottomed groove 6b of the pressing channel member 6 and the substrate surface Wa are spaced apart from the pressing surface (surface) 61 of the pressing member in the penetrating direction of the through hole 6a. One flow path element 71 is adapted to be formed. These through-holes 6a and the flow path element 71 constitute the communication flow path 7 referred to in the claims. In addition, in this embodiment, as shown in FIG. 5, the flow path element 71 is extended in the 45 degree inclination direction, different from the arrangement direction of the semiconductor chips C. As shown in FIG. This is to facilitate the discharge of the resin R into the cavity.

Next, the arrangement position of this pressure flow path member 6 is demonstrated. As described above, on the substrate surface Wa, the semiconductor chips C, which are objects to be encapsulated by the resin R, are provided at equal pitches horizontally and vertically. Therefore, as it is, there is no room for arranging the pressure flow path member 6 . In this embodiment, as shown in FIGS. 1 and 5 , one of the predetermined positions where the semiconductor chip C should be originally provided. Alternatively, the semiconductor chip C is not provided in a plurality of places (two places here), but the pressure passage member 6 is arranged in advance at the site.

Moreover, the thickness dimension of this pressure flow path member 6 becomes the dimension substantially equal to the distance dimension of the board|substrate surface Wa and the bottom surface of the cavity 3 . As described above, in the frame fastening position, the surface 61 (pressing surface 61 in the claims) of the pressing passage member 6 presses the release film 5 via the substrate W, , in order to adhere this to the inner surface (bottom surface) of the cavity 3 . In addition, the thickness dimension of the pressure flow path member 6 says the dimension between the front surface 61 and the back surface 62, and is the same as the thickness dimension of the semiconductor chip C in this embodiment.

<Explanation of the manufacturing method of a resin molded article>

Next, an example of the manufacturing method of a resin molded article using the resin molding apparatus 100 comprised in this way is demonstrated with reference to FIG. 2, FIG. 3, and FIGS. 7-11. In addition, in these FIG. 2, FIG. 3, and FIGS. 7-11, each part including the board|substrate W is schematically modeled for the ease of understanding.

First, as shown in Fig. 2, the upper frame (1) and the lower frame (2) are set to a frame opening position separated from each other.

Next, as shown in FIG. 7 , the release film 5 is placed on the intermediate plate 22 on the lower plate 21 and adsorbed, while the substrate W is attached to the semiconductor chip C. It is set as the attitude|position which faces the cavity 3, and it is made to adsorb|suck to the lower surface of the upper frame 1, and is hold|maintained.

Next, as shown in Fig. 8, the intermediate plate 22 is lifted away from the lower plate 21 by a lift-up mechanism (not shown). At this time, the plunger 421 is placed in a standby position whose distal end surface is lower than the upper surface opening of the second hole 412 provided in the lower plate 21 .

Then, after the tablet-shaped resin (R) in the solid state is introduced from the upper surface of the second hole 412, the tablet-shaped resin (R) is provided on the lower plate 21 by a heating mechanism (not shown). ) is melted.

Next, fasten the frame. That is, as shown in Fig. 3, the lower plate 21 is raised by the frame lifting mechanism and integrated with the intermediate plate 22, and the upper surface of the intermediate plate 22 and the substrate surface Wa A release film (5) is sandwiched between the peripheral edges. This position is the frame fastening position. At this time, as described above, the pressing surface 61 of the pressing passage member 6 presses the periphery of the insertion hole 5a in the release film 5 to closely contact the bottom surface of the cavity 3 .

Next, as shown in FIG. 9, the plunger 421 is raised to the said injection completion position. Thereby, molten resin R is inject|poured and filled in the cavity 3 .

It will be described in more detail. The molten resin R is shown in FIG. 6 etc. through the insertion hole 5a of the spur SP, the gate GT, and the release film 5 by the plunger 421 rising from a stand-by position. a flow path element 71 formed by the bottomed groove 6b of the pressure flow passage member 6 and the substrate surface Wa Then, it flows into the cavity (3).

In this way, after molten resin R is filled in the cavity 3, resin R hardens and solidifies by waiting in a heated state for a fixed period of time.

Then, as shown in FIG. 10, the lower frame 2 (lower plate 21 and the intermediate plate 22) is lowered by the said frame raising/lowering mechanism, and it is set as the frame open position. At this time, the spur SP, the gate GT, and the remaining resin R (cull) remaining on the upper part of the second hole 412 are pulled off from the substrate W and at the same time, The resin-molded substrate W (resin molded product) is removed (separated) from the upper mold 1 . On the other hand, as shown in FIG. 11, the curl R is taken out by separating the middle plate 22 from the lower plate 21 by a lift-up mechanism, and is discarded.

<Effect>

According to the present embodiment as described above, at the clamping position or at the time of clamping the mold, the pressing surface 61 of the pressing passage member 6 forms a closed annular shape (here, circular circular shape), and the Since the pressing surface 61 adheres the entire periphery of the insertion hole 5a in the release film 5 to the bottom surface of the cavity 3, there is no gap between them, and the molten resin R is released. Intrusion into the film 5 and the inner surface of the cavity can be reliably prevented. Moreover, since the communication flow path 7 is formed in the pressure flow path member 6, injection|pouring into the cavity 3 of the molten resin R is not inhibited either.

In this way, it becomes possible only to use the release film 5 for the transfer resin molding method of a pin gate system. In addition, since only the insertion hole 5a is drilled in the release film 5 and the pressure passage member 6 is provided, there is no significant complication of the process or structure.

In particular, in this embodiment, instead of the semiconductor chip C, the pressure flow path member 6 can be disposed at any of a plurality of predetermined positions where the semiconductor chip C is to be disposed. , the degree of freedom in selecting an arrangement position of the pressure passage member 6 is increased, and the pressure passage member 6 can be disposed at a position suitable for resin injection. In this embodiment, for example, as shown in Fig. 1, on the center line extending in the longitudinal direction (left and right direction) in the rectangular substrate W, the resin injection port is formed at two symmetrical places. Since the pressure flow path member 6 used as the used pressure flow path member 6 is arrange|positioned, resin can be inject|poured into the cavity 3 as equally and rapidly as possible.

Moreover, since the pressure flow path member 6 is previously joined and integrated with the board|substrate W, the effect that processes, such as positioning of the pressure flow path member 6 at the position of a shaping|molding die, becomes unnecessary is also acquired.

<Other embodiment>

In addition, this invention is not limited to the said embodiment.

For example, in the above embodiment, the pressure passage member 6 is bonded to the substrate W as a separate member separate from the substrate W, but the pressure passage member 6 is integrated with the substrate W. may be formed as

Moreover, you may supply the mold release film 5 to which the pressure flow path member 6 was previously affixed (pasted) to a shaping|molding die. In this case, the positional relationship between the pressure flow path member 6, the release film 5, the board|substrate W, and the mutual positional relationship at the time of the frame fastening of the semiconductor chip C can be carried out similarly to the above-mentioned embodiment.

Moreover, as shown in FIG. 12, not the bottomed groove|channel 6b, but the hole 6b' which communicates the outer peripheral surface of the pressure flow path member 6 and the through-hole 6a, etc. may be provided. .

Moreover, you may arrange|position the said press flow path member 6 upside down. In this case, the bottomed groove 6b faces the release film 5 side, and in a portion corresponding to the bottomed groove 6b, the insertion hole 5a of the release film 5 is Although it cannot be pressed all around, it can contribute to peeling prevention of the release film 5.

It is good also considering the pressure flow path member 6 not in disk shape, but a rectangular disc shape or polygonal disc shape.

It is good also as what consists of a several pressing element arrange|positioned so that the pressing flow path member 6 is not mutually spaced apart, for example, around the insertion hole 5a, instead of a single body. In this case, the gap between the pressing elements forms a communication passage.

As for the release film 5, the insertion hole 5a may be drilled in advance as in the above embodiment, and the release film 5 is placed on the intermediate plate 22 to be adsorbed, and then the gate GT You may drill a hole according to the position.

It is not limited to the said embodiment also about the manufacturing method of a resin molded article, You may carry out a procedure before and after. Further, for example, the release film 5 may not be adsorbed, and the periphery of the insertion hole 5a may be pressed only with the pressure passage member 6 . Even in this way, the release film 5 can closely_contact|adhere to the inner surface of the cavity 3 by the filling pressure of resin R.

Although the cavity 3 was provided only in the lower frame 2 in the said embodiment, you may provide also in the upper frame, and you may inject|pour and shape|mold resin in both the front and back surfaces of a board|substrate.

The object to be molded is not limited to the substrate W on which the semiconductor chip C is provided, and the present manufacturing method is applicable even when only the resin R is molded by the cavity 3 .

The present invention can be applied to the molding die not only moving up and down, but also moving forward and backward in a horizontal direction or in other directions.

In addition, this invention is not limited to the said embodiment, It cannot be overemphasized that various deformation|transformation is possible in the range which does not deviate from the meaning.

100… resin molding equipment
One… Upper frame (first frame)
2… Lower frame (2nd frame)
3… cavity
GT… gate
R… profit
5… release film
5a… insertion hole
6… No pressure flow path
61... pressure surface
6a… through hole
7… flue euro
71… euro element
W… Board
C… semiconductor chip

Claims (7)

A method for producing a resin molded article, comprising: providing a gate on the bottom surface of a cavity formed in at least one of a first mold or a second mold, and injecting a resin into the cavity from this gate and molding,
A release film having an insertion hole penetrating in the thickness direction is disposed on the inner surface including the bottom surface of the cavity so that the insertion hole overlaps the gate,
A part or all of the periphery of the insertion hole in the release film is pressed toward the bottom surface of the cavity at the time of frame fastening to adhere to the bottom surface of the cavity, and at the same time, the insertion hole and Placing a pressing flow path member formed at the time of frame fastening of the communication flow path for communicating the cavity,
Fastening the first frame and the second frame,
A method for manufacturing a resin molded article, characterized in that the resin is injected into the cavity from the gate through the insertion hole and the communication passage, and cured. The method of claim 1,
Method of manufacturing a resin molded article, characterized in that the release film is adsorbed to the inner surface of the cavity. 3. The method of claim 1 or 2,
The pressing passage member has a through hole in the center, and one or more passage elements that extend outward from the through hole and open on the outer circumferential surface, the through hole and A method for manufacturing a resin molded article, characterized in that the communication passage is formed by a passage element. 4. The method of claim 3,
A method for producing a resin molded article, wherein a pressing surface is provided on one end surface of the pressing passage member, and the passage element is formed to be spaced apart from the one end surface in an extending direction of the through hole. The method of claim 1,
At the same time that the substrate is maintained in the first frame, the second frame is provided with a cavity in which a surface facing the first frame is opened,
A method for manufacturing a resin molded article, characterized in that, in the mold clamping position, the opening of the cavity is closed by the substrate, the resin is poured into the cavity, and the resin is molded on the substrate. 6. The method of claim 5,
A method for manufacturing a resin molded article, wherein a semiconductor chip is disposed at each predetermined position on the substrate, and the pressure passage member is disposed at any of those predetermined positions instead of the semiconductor chip. A resin molding apparatus for molding by injecting a resin into the cavity from the gate, wherein a gate is provided on the bottom surface of the cavity formed in at least one of the first mold or the second mold,
a release film disposed on the inner surface including the bottom surface of the cavity and provided with an insertion hole for passing the resin flowing in from the gate at a position overlapping the gate in the arrangement state;
The release film has a pressing surface that presses part or all of the periphery of the insertion hole toward the bottom surface of the cavity to bring the pressing portion into close contact with the bottom surface of the cavity, and the insertion hole and the cavity A resin molding apparatus comprising a pressure flow passage member for forming a communication passage for communicating with the resin.

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