JP2000036507A - Method for pouring resin by flip chip and metallic mold for pouring resin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the productivity of a flip chip by quickly pouring resin into a clearance between an electronic part and a substrate in the flip chip. SOLUTION: The inside part of the cavity of a resin injecting mold constituted of a fixed type 5 and a movable type 6 is vacuumed from a bottom face member 14 provided at the bottom face of the cavity, so that a separate type film 12 can be led to the cavity, and a hole part for resin passage is formed at the separate type film 12 by a protrusion 20 provided at a gate 18 communicated and connected with the cavity. At the same time, resin 22 (melting resin materials) is injected from the gate 18 through the hole part 21 into a clearance 4 between an electronic part 2 and a substrate 3 in the cavity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for injecting a resin into a flip chip in which a resin is injected into a gap between an electronic component such as an IC in a flip chip package and a substrate, and to an improvement in a mold for the resin.

[0002]

2. Description of the Related Art As shown in FIG. 6, a conventional method of injecting a resin into a flip chip employs, for example, dispensing a liquid resin 92 with a dispenser in order to secure the electrical connection between the electronic component 90 and the substrate 91. (Injection mechanism) The resin 92 is spontaneously injected into the gap 94 between the electronic component 90 and the substrate 91 by using a capillary phenomenon.

[0003]

However, in the method of dropping the liquid resin 92 and injecting the resin 92 into the gap between the electronic component 90 and the substrate 91, the method of dropping the liquid resin 92 and then dropping the liquid resin 92 is described. Since the time required for filling the gap 94 with the resin is considerably long, there is a problem that the productivity of the flip chip package is low.

Accordingly, it is an object of the present invention to provide a method for injecting a resin into a flip chip and a mold for injecting the resin into a gap between an electronic component and a substrate in the flip chip in a short time. And Another object of the present invention is to improve the productivity of the flip chip by injecting the resin into the gap in a short time when injecting the resin into the gap between the electronic component and the substrate in the flip chip. And

[0005]

A method for injecting a resin into a flip chip according to the present invention for solving the above-mentioned technical problem includes a method for injecting a resin into a flip chip in which an electronic component and a substrate are mounted via bumps. A method of injecting a resin into a flip chip for injecting a resin into a gap between a component and a substrate, wherein a release film is stretched on a mold surface of one of a resin injection mold including a fixed mold and a movable mold. A step of coating the release film in a cavity provided in the one mold, a step of fitting and setting an electronic component mounted on the substrate in the cavity, and a step of clamping the molds. And covering at least the non-bump mounting surface of the electronic component with the release film in the cavity, and at a position corresponding to the gate in the release film. And wherein from the through hole of the resin passage which forms a gate, further comprising the step of injecting a resin into a gap between the electronic component and the substrate in the cavity.

Further, a method for injecting a resin into a flip chip according to the present invention for solving the above-mentioned technical problem includes a step of forming a hole for resin passage with a punching blade in the release film. It is characterized by the following.

Further, a method for injecting a resin into a flip chip according to the present invention for solving the above-mentioned technical problems includes a step of forming a hole for resin passage by irradiating the release film with a laser. It is characterized by having.

In addition, the method for injecting a resin into a flip chip according to the present invention for solving the above-mentioned technical problem is characterized in that the release film is placed in the cavity during the step of coating the release film in the cavity. A step of forming a hole for resin passage in the release film by a protrusion provided on the gate by drawing in the resin.

A resin injection mold for injecting a resin in a flip chip according to the present invention for solving the above-mentioned technical problem is provided in a flip chip in which an electronic component and a substrate are mounted via bumps. A resin injection mold for injecting a resin into a gap between an electronic component and a substrate,
A fixed mold, a movable mold opposed to the fixed mold, a release film stretched on one of the two molds, and a cavity for fitting and setting the electronic component provided on the one mold, A bottom member slidably provided on the bottom surface of the cavity, a required number of air holes provided in the bottom member, a vacuuming mechanism communicating with the air holes, a gate for injecting resin into the cavity, The release film provided on the gate is provided with a projection for forming a hole for resin passage.

A resin injection mold for injecting a resin in a flip chip according to the present invention for solving the above-mentioned technical problem has a separation hole having a resin passage hole at a position corresponding to the gate. It is characterized by comprising a mold film.

[0011]

According to the present invention, in the cavity,
By moving the bottom member upward while the release film is suction-fixed to the bottom member, the cavity bottom surface side of the bottom member is joined to the bump non-mounting surface of the electronic component via the release film. Therefore, at least the non-bump mounting surface of the electronic component can be reliably covered with the release film, and at least the resin does not enter between the non-bump mounting surface and the release film. Can be configured.
According to the present invention, at the time of mold clamping between the fixed mold and the movable mold,
A gate can be matched with a gap between the electronic component and the substrate, and a resin is inserted into the gap between the electronic component and the substrate in the cavity through a resin passage hole formed in the release film from the gate. Can be injected.

Further, according to the present invention, the inside of the cavity is evacuated from the cavity bottom side of a bottom member slidably provided on the bottom side of the cavity, so that the suction force causes the cavity to enter the cavity. The release film is drawn in, the release film is suction-fixed to the bottom member, and the inside of the cavity can be covered with the release film. According to the present invention, at the time of coating the release film into the cavity, by drawing the release film into the cavity,
A hole for resin passage can be formed in the release film by projecting the release film with a protrusion provided on a gate communicating with the cavity.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIGS. 1, 2, 3, 4, and 5 show a resin injection mold according to the present invention.

That is, as shown in the figure, for example, the flip chip is composed of an electronic component 2 provided with bumps 1, a substrate 3 on which the electronic components 2 are mounted via the bumps 1, 2 and a resin or the like injected into the gap 4 between the substrate 3 and the like.

The resin injection mold includes a fixed upper die 5 and a movable lower die 6 disposed opposite to the fixed upper die 5. The mold surface of the fixed mold 5 is provided with a set portion 7 (set recess) for fitting and setting the substrate 3, and the mold surface of the movable mold 6 is provided with an electronic device mounted on the substrate 3. A cavity 8 for fitting and setting the component 2 is provided. The movable mold 6 has a resin injection mechanism for injecting a resin into the cavity 8, for example, a resin material supply pot 9, and a resin pressurizing plunger 11 fitted in the pot 9. Is provided, and a resin passage 10 for transferring resin is provided between the movable mold pot 9 and the movable mold cavity 8 so as to communicate with each other. The resin passage 10 is composed of a gate 18 (injection port to the cavity 8) communicating with the cavity 8 and a runner 19 communicating the gate 18 with the pot 9. Therefore, when clamping the two dies (5 and 6), the substrate 3 is supplied and set to the set portion 7 and the substrate 3 is placed in the cavity 8.
It is configured such that the electronic component 2 mounted on the device can be fitted and set. The resin material heated and melted in the pot 9 is pressurized by the plunger 11 so that the resin passage 10 (the gate 18 and the runner
19) so as to be able to be injected into the cavity 8.

Further, in the two molds (5 and 6), a flexible release film 12 is stretched between the two mold surfaces, and the release mold film 12 is mounted on the mold surface of the movable mold 6. the film
It is configured so that 12 can be installed. When the molds (5, 6) are clamped, the release film 12 is sandwiched between the surfaces of the molds.

Although not shown, both types (5.
6) includes, for example, a release film supply mechanism for supplying the release film 12 to a predetermined position on the mold surface, and the resin material 13 (in the illustrated example, a resin tablet) is supplied to the pot 9.
A supply mechanism for supplying a resin material to be supplied to the inside and a substrate supply mechanism for supplying a substrate 3 on which the electronic component 2 is mounted are provided at predetermined positions of the two dies (5 and 6). Therefore, first, the pot 9 is supplied by the resin material supply mechanism described above.
The resin material 13 is supplied into the inside, and the movable mold surface is covered with the release film 12 by the release film supply mechanism described above, and then the both molds (5 and 6) are supplied by the substrate supply mechanism described above. )
The substrate 3 on which the electronic component is mounted can be supplied to a predetermined position (see FIGS. 1 and 3).

A bottom member 14 including the bottom surface is provided on the bottom surface of the cavity 8, and a reciprocating sliding mechanism (not shown) for reciprocating the bottom member 14 is provided. Is configured such that the bottom surface of the cavity is provided so as to freely enter and exit the cavity 8. In addition, the position of the bottom surface of the cavity of the bottom member 14 is configured to be able to be disposed at an appropriate position in the cavity 8. The two dies (5 and 6) are provided with a vacuuming mechanism 15 (decompression mechanism) such as a vacuum pump for vacuuming (forcibly sucking and discharging). A required number of suction ports 16 are provided and configured. The suction port 16 and the vacuuming mechanism 15 are configured to be connected to each other through an air hole 17, and the suction port provided on the bottom surface of the cavity 8 by operating the vacuuming mechanism 15. The inside of the cavity 8 can be evacuated from 16 through the air hole 17. Therefore, by evacuating the suction port 16, the release film 12 mounted on the movable mold surface is drawn into the cavity 8, and is fixed to the cavity bottom surface (the bottom member 14) by suction. 8 can be coated with the release film 12.

Since the bottom member 14 is configured to be able to enter and exit the cavity 8, the bottom member 14 is fixed to the bottom member 14 by suction. It is configured to be able to move in the direction of entering and exiting (in the example in the figure, up and down direction). Further, the electronic component 2 mounted on the substrate 3 is fitted and set in the cavity 8 to set the two molds (5).
・ 6) is clamped, and the bottom surface member 14 is moved upward in the cavity 8 so that the non-bump mounting surface side of the electronic component 2 is connected to the bottom surface member 14 via the release film 12. It is configured so that it can be joined (see FIGS. 3 and 4). That is, both types (5
At the time of the mold clamping of 6), at least the non-bump mounting surface of the electronic component 2 can be reliably covered with the release film 12 in the cavity 8. Therefore, the resin is prevented from entering at least between the non-bump mounting surface of the electronic component 2 and the release film 12.

The gate 18 has a required number of protrusions.
20 (see FIG. 2) is provided, and the release film 12 is drawn into the cavity 8 by a suction force generated by drawing a vacuum from the suction hole 16 of the bottom surface member 14, whereby the release is performed. The film 12 is configured to be protruded by the projections 20 so that a hole 21 for resin passage can be formed in the release film 12 (see FIG. 4).
That is, the hole 21 described above is formed at a position corresponding to the gate 18 in the pre-release film 12. Further, when the two dies (5, 6) are clamped, the gate 18 can be made to coincide with the gap 4 between the electronic component 2 and the substrate 3 in the cavity 8.

Therefore, at the time of clamping the two dies (5, 6), the resin material heated and melted in the pot 9 is pressed by the plunger 11, so that the release film 12 from the resin passage 10 is pressed. It is configured such that resin can be injected into the cavity 8 through the hole 21 formed at a predetermined resin pressure, and resin is injected into the gap 4 between the electronic component 2 and the substrate 3. It is configured to be able to. At this time, since at least the non-bump mounting surface of the electronic component 2 is configured to be covered with the release film 12, at least the gap between the non-bump mounting surface of the electronic component 2 and the release film 12 is provided. The resin does not penetrate into the space.

That is, first, the release film 12 is stretched between the two dies (5, 6) (see FIG. 1), and the movable film surface is mounted and covered with the release film 12, and the vacuum Pull mechanism
At 15, the release film 12 is suction-fixed to the cavity bottom side of the bottom member 14 by forcibly sucking and discharging through the air hole 17 from the suction port 16 provided in the bottom member 14. At this time, since the release film 12 is drawn into the cavity, the protrusions 20 in the gate 18 are formed.
Thus, the hole 21 can be formed in the release film 12 by projecting the release film 12 (see FIG. 4). Next, the electronic component 2 mounted on the substrate 3 is fitted and set in the cavity 8 and the molds (5 and 6) are clamped. Next, by moving the bottom member 14 upward, the electronic component 2 is joined to the non-bump mounting surface of the electronic component 2 via the release film (see FIG. 3). At this time, at least the non-bump mounting surface of the electronic component 2 is covered with the release film 12, and the gate 18 can be aligned with the gap 4 between the electronic component 2 and the substrate 3. Therefore, by pressing the resin material heated and melted in the pot 9 by the plunger 11, the hole formed in the resin passage 10 (the runner 19 and the gate 18) and the release film 12 is formed. The resin 22 (molten resin material) can be injected into the gap 4 between the electronic component 2 and the substrate 3 in the cavity 8 through the cavity 21 (see FIG. 5). At this time, the resin does not enter between at least the non-bump mounting surface of the electronic component 2 and the release film 12. That is, since the above-described configuration is employed, the resin is injected into the electronic component 2 in a short time in comparison with the conventional configuration in which the liquid resin is naturally injected into the gap between the electronic component and the substrate by utilizing the capillary phenomenon. Can be injected into the gap 4 between the substrate and the substrate 3 to improve the productivity of the flip chip. Therefore, it is possible to provide a method for injecting a resin into a flip chip and a mold for injecting the resin into the gap between the electronic component and the substrate in the flip chip in a short time.

Further, in the above embodiment, the bottom member
In a state where the release film 12 is fixed by suction to 14 (the bottom surface of the cavity), the bottom member 14 is moved down (for example, from the position of the movable mold surface to the position of the bottom surface of the cavity). By doing so, the cavity 8
The release film 12 is pulled into the release film 12 and the release film 12
The structure in which the hole 21 is formed can be adopted.
At this time, the inside of the cavity 8 is filled with the release film.
12 can be coated.

Further, in the above-described embodiment, the configuration in which the resin passage holes are formed in the release film by the projections provided on the gate is exemplified. The hole can be formed at a position corresponding to the gate. For example, a configuration in which the hole is formed in the release film with a piercing member such as a piercing blade, or
A configuration in which the hole is formed in the release film by irradiating the release film with a laser can be employed. Therefore, for example, in the step of stretching the release film on the movable mold surface or in the step of coating the release film in the cavity, the release film or the laser is used to release the release film. The hole can be formed in the hole.

Further, in the above embodiment, a configuration in which a release film having a hole for resin passage is provided in advance in the resin injection mold may be adopted.

Further, in the above-described embodiment, a configuration in which a single pot or a plurality of pots are provided can be adopted.

Further, in the above-described embodiment, it is possible to adopt a configuration in which the pot and the cavity are connected and connected only by the gate (short resin passage) and the gate is provided with a required number of protrusions. In this case, FIGS.
As compared with the embodiment shown in (1), the effective utilization rate of the resin (the amount of resin injected into the gap between the electronic component and the substrate with respect to the amount of resin of the resin material before injection) is improved.

Further, in the above-described embodiment, it is possible to adopt a configuration in which the fixed type set portion is provided on the movable type side.

In the above-described embodiment, a resin tablet, a granular resin material, or a powder resin material can be used as the resin material.

Further, as the resin in the above-described embodiment, a thermosetting resin or a thermoplastic resin can be adopted.

The present invention is not limited to the above-described embodiment, but can be arbitrarily and appropriately changed and selected as necessary without departing from the spirit of the present invention. It is.

[0032]

According to the present invention, it is possible to provide a method for injecting a resin into a flip chip and a mold for injecting the resin into the gap between an electronic component and a substrate in the flip chip in a short time. An excellent effect is achieved.

Further, according to the present invention, when a resin is injected into a gap between an electronic component and a substrate in a flip chip, the resin can be injected into the gap in a short time, thereby reducing the productivity of the flip chip. It has an excellent effect that it can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic longitudinal sectional view schematically showing a resin injection mold for explaining a method of injecting a resin into a flip chip according to the present invention, showing a mold open state.

FIG. 2 is a schematic enlarged cross-sectional view schematically showing a main part of the mold shown in FIG. 1 in an enlarged manner, showing a projection provided on a mold gate.

FIG. 3 is a schematic longitudinal sectional view schematically showing a mold corresponding to FIG. 1, showing a mold clamping state of the mold.

FIG. 4 is a schematic enlarged longitudinal sectional view schematically showing an enlarged main part of the mold shown in FIG. 3;

FIG. 5 is a schematic enlarged longitudinal sectional view showing a main part of the mold corresponding to FIG. 4, and injects a resin from a mold gate into a mold cavity through a resin passage hole formed in a release film; It shows a state in which

FIG. 6 is a schematic longitudinal sectional view schematically showing an injection mechanism used in a conventional method for injecting a resin in a flip chip, and shows a state at the time of resin injection.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 bump 2 electronic component 3 substrate 4 gap 5 fixed upper die 6 movable lower die 7 set part 8 cavity 9 pot 10 resin passage 11 plunger 12 release film 13 resin material 14 bottom member 15 evacuation mechanism 16 suction port 17 air hole 18 Gate 19 Runner 20 Projection 21 Hole 22 Resin (Molten resin material)

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B29C 45/02 B29C 45/02 5F061 45/14 45/14 45/34 45/34 H01L 21/60 311 H01L 21/60 311Z // B29L 31:34 F term (reference) 3C060 AA04 AB01 BA06 4E068 AF01 DB10 4F202 AD19 AD23 AH33 CA12 CB01 CB12 CK06 CK35 CM72 CQ01 CQ06 4F206 AD19 AD23 AH37 JA02 JB17 JF01 J41 JM04 J14 JN04 J14 FF01 GG19 5F061 AA01 BA03 CA21 DA01 DA05 DA06 DA08

Claims (6)

[Claims] 1. A method of injecting resin into a gap between an electronic component and a substrate in a flip chip in which an electronic component and a substrate are mounted via bumps, comprising: a fixed type and a movable type. A step of stretching a release film on the mold surface of one of the molds for resin injection comprising: a step of coating the release film in a cavity provided in the one mold; A step of fitting and setting an electronic component mounted on the substrate; a step of clamping the two dies; a step of covering at least a non-bump mounting surface of the electronic component in the cavity with the release film; Through the resin passage hole formed at a position corresponding to the gate in the release film, the resin is filled from the gate into the gap between the electronic component and the substrate in the cavity. And a step of injecting a resin into the flip chip. 2. The method for injecting a resin into a flip chip according to claim 1, further comprising a step of forming a hole for resin passage in the release film with a punching blade. 3. The method for injecting a resin into a flip chip according to claim 1, further comprising a step of irradiating a laser to the release film to form a resin passage hole. 4. A resin passage hole is formed in the release film by a projection provided on a gate by drawing the release film into the cavity during a step of coating the release film into the cavity. The method for injecting a resin into a flip chip according to claim 1, comprising a step. 5. A resin injection mold for injecting a resin into a gap between the electronic component and the substrate in a flip chip in which the electronic component and the substrate are mounted via bumps, the resin injection mold comprising: a fixed die; A movable mold opposite to the mold, a release film stretched on one of the molds, a cavity for fitting and setting the electronic component provided on the one mold, and reciprocating sliding on the bottom surface of the cavity. A bottom member arbitrarily provided; a required number of air holes provided in the bottom member; a vacuum evacuation mechanism connected to and connected to the air holes; a gate for injecting resin into the cavity; A resin injection mold for injecting a resin in a flip chip, wherein the mold film is provided with a projection for forming a resin passage hole. 6. A resin injection mold for injecting a resin in a flip chip according to claim 5, wherein a release film having a hole for resin passage is provided at a position corresponding to the gate. .