WO2008041431A1

WO2008041431A1 - Method for resin seal molding, and resin seal molding apparatus for use in the method

Info

Publication number: WO2008041431A1
Application number: PCT/JP2007/066716
Authority: WO
Inventors: Keiji Maeda; Hideki Tokuyama
Original assignee: Towa Corporation
Priority date: 2006-10-03
Filing date: 2007-08-29
Publication date: 2008-04-10
Also published as: JP2008087356A; TW200824013A

Abstract

A substrate (1) with an electronic component mounted thereon is first set in a lower die (3). The lower die (3) and an upper die (2) are closed, and the electronic component is inserted into a cavity (16) provided in the upper die (2). A resin pouring mechanism (9) is then connected to a die assembly (4), whereby a pot (12) is connected to a resin passage (17) in communication with the cavity (16). In this state, the resin material is melted by heating in the pot (12) and is poured from the pot (12) into the cavity (16) through the resin passage (17). The resin supply or pouring mechanism (9) is removed from the die assembly (4), whereby the pot (12) is removed from the resin passage (17). As a result, a package resin (18) within the cavity (16) is separated from a resin (19) cured within the resin passage (17).

Description

Specification

Resin sealing molding method and resin sealing molding apparatus used therefor

Technical field

TECHNICAL FIELD [0001] The present invention relates to a resin sealing molding method of an electronic component for sealing and molding an electronic component such as an IC (Integrated Circuit) mounted on a substrate with a resin material and a resin sealing molding apparatus used therefor. is there.

Background art

Conventionally, a resin-sealed molding apparatus in which mold assemblies having an upper mold and a lower mold are stacked in the vertical direction has been used. In this resin sealing molding apparatus, a resin injection mechanism is provided on the side of the mold assembly laminated structure stacked in the vertical direction. This resin injecting mechanism can contact the mold assembly layered structure or leave the mold assembly layered structure. The resin injection mechanism has a pot and a plunger extending in the horizontal direction. When this resin sealing molding apparatus is used, the fluid resin is pushed by a plunger from the pot extending in the horizontal direction to each of the mold assembly laminated structures. Thereby, in each of the plurality of mold assemblies, the electronic component mounted on the board is sealed with the resin material.

[0003] A resin seal molding method of an electronic component using the above-described resin seal molding apparatus will be specifically described below.

[0004] First, one board on which a predetermined number of electronic components are mounted is set in each lower mold of the mold assembly. Thereafter, the upper mold and the lower mold are closed. As a result, a predetermined number of electronic components are inserted into the cavity provided in the upper mold.

[0005] Next, the above-described resin injection mechanism is connected to the side surface of the mold assembly laminated structure. Thereafter, the resin material is melted by heating in the pot and pressurized by the plunger. As a result, the fluid resin is injected into the cavity through the resin passage (gate) provided in the upper mold.

[0006] Thereafter, when the time necessary for the fluid resin to harden elapses, the resin injection mechanism is separated from the mold assembly laminated structure. Next, in each of the plurality of mold assemblies, The upper mold and the lower mold are opened with the plate set in the lower mold. At the same time, the gate resin 81 is ejected by a release eject pin provided at the upper mold gate position. As a result, as shown in FIG. 11, a molded product 80 is obtained in which a predetermined number of electronic components are integrally sealed with a resin material.

As shown in FIG. 11, the molded product 80 includes a substrate 1, a cavity resin 18 having a shape corresponding to the shape of the aforementioned cavity, and a gate having a shape corresponding to the aforementioned resin passage. The resin 81 (unnecessary cured resin) and a pot resin 82 having a shape corresponding to a part of the pot described above are included. As can be seen from FIG. 11, the unnecessary gate resin 81 and pot resin 82 cured in the pot and resin passage of the resin injection mechanism remain together with the package resin 18 constituting the finished product.

Thereafter, the gate resin 81 and the pot resin 82 are removed from the molded product 80. As a removal method, for example, a method of removing the gate resin 81 by rotating it in the direction indicated by the arrow in FIG. This is called a gate break. According to this method, as shown in FIG. 13, a sealed substrate 83 is obtained.

Thereafter, the sealed substrate 83 is cut by a rotary cutting blade (blade) or the like. Thereby, the sealed substrate 83 is divided into individual packages.

[0010] It should be noted that a structure using a stacked mold assembly laminated structure and a pot provided outside the mold assembly laminated structure is a multi-layer structure or a PM (Pure Malt) structure. Called ^s fc.

Patent Document 1: Japanese Unexamined Patent Application Publication No. 2007-095803

Patent Document 2: JP 2007-095802 A

Disclosure of the invention

Problems to be solved by the invention

[0011] In the gate break of the molded product 80 described above, since the gate resin 81 is fixed to the substrate 1, it is very difficult to remove the gate resin 81 from the substrate 1 without forming a defective portion in the molded product 80. It is difficult to.

[0012] For example, according to the gate break described above, the damaged portion 84 may be formed in the package resin 18 as shown in FIG. Although not shown, the gate resin 81 residues may adhere to the surface of the substrate 1.

Therefore, some measures are required to remove the gate resin 81 from the substrate 1 without forming a defective portion in the molded product 80. As an example of this measure, it is conceivable to perform a staking process to prevent the gate resin 81 from adhering to the position where the gate resin 81 adheres to the substrate 1 and the position in the vicinity thereof.

[0014] However, when the gold plating process is performed on the substrate 1, the cost is inevitably increased because the gold plating process is partially performed. In addition, even if gold plating is performed on the substrate, the gate resin 81 adhering to the substrate 1 without necessarily forming a defective portion in the molded product 80 can be removed! / Not a thing!

[0015] Further, since the gold plating process is performed only on a part of the substrate, the thickness of only the portion subjected to the gold plating process increases. For this reason, the thickness of the substrate 1 becomes uneven. As a result, when the upper mold and the lower mold are closed, a gap is easily formed between the mold surface of the upper mold and the surface of the substrate. Therefore, when the resin enters the gap, the resin beam remains on the substrate.

[0016] The problem that occurs when removing the gate resin from the substrate is not limited to the case of using a resin sealing molding apparatus in which a pot is provided outside the mold assembly, but a pot is provided inside the mold assembly. This also occurs when the resin sealing molding apparatus is used. Next, this will be explained.

[0017] In a resin sealing molding apparatus in which a pot is provided inside a mold assembly, a pot extending in the vertical direction having an opening on the mold surface is provided in the lower mold. In the pot, the resin material is melted by heating. This fluid resin is pushed out through the resin passage (mold gate) into the upper mold cavity by the pressurizing plunger. As a result, a molded product 85 is obtained as shown in FIG.

[0018] In order to remove the gate resin 86 (unnecessary cured resin) and the unnecessary pot resin 87 having a shape corresponding to the pot from the molded product 85, the gate resin 86 and the cured resin 87 are indicated by arrows in FIG. It is rotated in the direction shown. This is called a gate break.

At this time, also in the gate break of the molded article 85, as shown in FIG. 13, the damaged portion 84 is formed in the package resin 18 of the sealed substrate 83, and the gate resin 81 not shown in the figure. Residue remains on the substrate 1. [0020] Further, in the resin sealing molding apparatus for an electronic component having a multilayer structure, as described above, the gate resin 81 is projected by the release eject pin. According to this, it is possible to remove the package resin 18 from the upper mold cavity without forming a defect in the molded product. However, it is impossible to take out the gate resin 81 from the upper mold without forming a defect in the molded product. Therefore, an eject pin is provided on the mold gate. Therefore, the resin sealing molding apparatus having the above-described multilayer structure is increased in size because it is necessary to provide an eject pin for each mold assembly.

However, in recent years, there is a demand for a reduction in the installation area of the resin sealing molding apparatus in a factory. That is, it is required to reduce the size of the resin sealing molding apparatus. Therefore, in order to reduce the size of the resin sealing molding device having a multilayer structure, the adoption of a structure and a structure using an ejector pin for gate resin is being considered!

The present invention has been made in view of the above-described problems, and an object of the present invention is to remove the gate resin from the substrate without forming a defective portion in the molded product, and to reduce the size of the apparatus. The present invention provides a resin sealing molding method and a resin sealing molding apparatus used therefor.

Means for solving the problem

[0023] In the resin sealing molding method of the present invention, first, a first mold and a second mold facing the first mold are formed. Next, a substrate on which electronic components are mounted on the first mold is set. Then, by closing the first mold and the second mold, the electronic component is inserted into the second mold cavity. Next, by connecting a resin injection mechanism having a pot to the side surface of the second mold, the resin passage that communicates with the cavity but does not face the substrate communicates with the pot. Further, by pressurizing the resin material in the pot, the fluid resin is injected into the cavity from the resin injection mechanism through the resin passage. Thereafter, the fluid resin is cured. Next, the resin injection mechanism is separated from the second mold, and the cured resin in the resin passage and the cured resin in the cavity are separated.

[0024] The fluid resin is injected into the cavity from the resin passage through a resin injection portion provided between the cavity and the resin passage.

[0025] The resin sealing molding apparatus of the present invention is the first in which a substrate on which an electronic component is mounted can be mounted. A mold and a second mold that is opposed to the first mold and has a cavity into which an electronic component can be inserted and a resin passage that communicates the cavity with the outside are provided. In this apparatus, the resin injection mechanism is connected to the side surface of the second mold in a state where the first mold and the second mold are closed. Also, the resin material in the pot can be injected into the cavity without contacting the substrate in the resin passage.

In the above-described apparatus, it is desirable that a resin injection portion is provided between the cavity and the resin passage.

[0027] According to the above resin sealing molding apparatus and resin sealing molding method, the gate resin can be removed from the substrate without forming a defective portion in the molded product, and the apparatus can be miniaturized. I'll do it.

[0028] The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the present invention taken in conjunction with the accompanying drawings.

Brief Description of Drawings

[0029] FIG. 1 is a longitudinal sectional view schematically showing a resin sealing molding apparatus of Example 1, and shows a state where each of a plurality of mold assemblies is opened.

FIG. 2 is a side view schematically showing the resin sealing molding apparatus shown in FIG. 1.

FIG. 3 is a longitudinal sectional view schematically showing a main part of the resin sealing molding apparatus shown in FIG. 1, showing a state where a pot of a resin injection mechanism is connected to a side surface of the mold assembly laminated structure. ing.

FIG. 4 is a longitudinal sectional view schematically showing the main part of the resin sealing molding apparatus of Example 1, in which the fluid resin passes from the pot of the resin injection mechanism to the upper mold cavity of the mold assembly through the resin passage. Show the state of being injected!

FIG. 5 is a longitudinal sectional view schematically showing a main part of the resin sealing molding apparatus of Example 1, in which the gate resin cured in the resin passage by separating the resin injection mechanism from the mold assembly is resin. Show the state of being pulled out of the aisle!

FIG. 6 is a longitudinal sectional view schematically showing a main part of the resin sealing molding apparatus of Example 1, and shows a state in which the molded product is removed from the upper mold cavity by opening the mold assembly. Show

FIG. 7 is a longitudinal sectional view schematically showing a main part of a resin sealing molding apparatus of Example 2, and includes a bra The state immediately before the plunger pushes out the resin material is shown.

FIG. 8 is a longitudinal sectional view schematically showing the main part of the resin sealing molding apparatus of Example 2, showing the state when the plunger pushes out the resin material! / .

FIG. 9 is a longitudinal sectional view schematically showing a main part of the resin sealing molding apparatus of Example 2, in which the gate resin cured in the resin passage when the resin injection mechanism is pulled away from the mold assembly is resin. Show the state of being pulled out of the aisle!

FIG. 10 is a longitudinal sectional view schematically showing a main part of the resin sealing molding apparatus of Example 2, and shows a state where the molded product is removed from the upper mold cavity by opening the mold assembly. It shows.

FIG. 11 is a longitudinal sectional view schematically showing a molded product sealed with resin using a conventional resin sealing molding apparatus.

FIG. 12 is a longitudinal sectional view schematically showing a molded product sealed with resin using another conventional resin sealing molding apparatus.

FIG. 13 is a longitudinal sectional view schematically showing a sealed substrate after unnecessary cured resin is removed from a molded product formed using a conventional resin sealing molding apparatus.

Explanation of symbols

[0030] 1 substrate, la end face, 2 upper mold, 2a upper mold, 2b lower mold, 3 lower mold, 3a upper mold, 3b lower mold, 4 mold assembly, 4a Upper mold assembly, 4b Lower mold assembly, 5 mold assembly laminate structure, 5a side, 6 Sealed board, 7 mold opening / closing mechanism, 7a body, 7b pinion gear, 7c Upper rack gear, 7d Lower Rack gear, 8 mold clamping mechanism, 9 resin injection mechanism, 10 hold frame, 10a opening, 11 pressing mechanism, 12 pot, 12a pot end opening, 13 plunger, 14 resin tablet (resin material), 15 substrate set surface, 16 Cavity, 16a edge, 17 resin passage (through hole), 18 knock resin, 19 gate resin, 20 fluid resin, 21 molded product, 22 cured resin (pot), 23 electronic component, 31 resin locking part ( Circumferential groove), 32 flowable resin, 33 cured resin (pot), 34 concave for substrate setting, 35 resin injection part, 36 Fingate resin, 37 molded product, 38 encapsulated substrate.

BEST MODE FOR CARRYING OUT THE INVENTION

[0031] Hereinafter, with reference to the drawings, a method for resin-sealing molding an electronic component according to an embodiment of the present invention and the The resin sealing molding apparatus used for this will be described.

Example 1

Hereinafter, with reference to FIGS. 1 to 6, a method for resin-sealing and molding an electronic component according to Embodiment 1 of the present invention and a resin-sealing molding apparatus used therefor will be described.

[0033] (Overall configuration of resin sealing molding apparatus for electronic parts)

As shown in FIG. 1 and FIG. 2, the resin seal molding apparatus for electronic parts of Example 1 includes a mold assembly 4. In the mold assembly 4, a predetermined number of electronic components 23 mounted on a single substrate 1 are sealed with resin. A predetermined number of electronic components 23 are integrally molded on one main surface of the substrate 1. The mold assembly 4 includes a lower mold 1 as an example of the first mold of the present invention and an upper mold 2 as an example of the second mold of the present invention that faces the lower mold 3.

[0034] In the resin sealing molding apparatus, a predetermined number of mold assemblies 4 are stacked in the vertical direction, that is, in the mold opening / closing direction. As a result, the mold assembly laminated structure 5 is formed. In each of the plurality of mold assemblies 4 in the mold assembly laminated structure 5, a predetermined number, for example, four electronic components 23 mounted on one substrate 1 are integrally sealed with resin. In this embodiment, as shown in FIG. 1, the mold assembly laminated structure 5 includes two sets of mold assemblies 4 having a mold assembly 4a and a mold assembly 4b.

The resin sealing molding apparatus includes a substrate supply / extraction mechanism (not shown), a mold opening / closing mechanism 7, and a mold clamping mechanism 8 (press frame mechanism). The substrate supply / extraction mechanism supplies the unmolded substrate 1 to the mold assembly 4 and takes out the molded substrate 6 from the mold assembly 4. Mold assembly 4 consists of mold assemblies 4a and 4b. The mold opening / closing mechanism 7 opens and closes the upper mold 2a and the lower mold 3a in the mold assembly 4a, and opens and closes the upper mold 2b and the lower mold 3b in the mold assembly 4b. The mold clamping mechanism 8 adds a predetermined mold clamping force to the upper mold 2a and the lower mold 3a, and adds a predetermined mold clamping force to the upper mold 2b and the lower mold 3b.

In the present embodiment, the mold opening / closing mechanism 7 is provided between the mold assembly 4a and the mold assembly 4b. The body 7a of the mold opening / closing mechanism 7 includes a lower mold 3a in the upper mold assembly structure 4a and an upper mold 2b in the lower mold assembly 4b.

Further, the resin sealing molding apparatus includes a resin injection mechanism 9 provided outside the mold assembly 4. The resin injection mechanism 9 is a resin material that is melted by heating into the mold assembly 4. A pot block having a pot 12 and a plunger 13 extending in the horizontal direction is included for injecting the movable resin. In the present embodiment, a fluid resin in which a solid resin is melted by heating is used! /, A liquid resin melted without heating! /, A liquid resin that is melted without heating is used as the fluid resin. It can be used.

[0038] Further, the resin sealing molding apparatus is provided with a reciprocating drive mechanism as shown in the figure. The reciprocating drive mechanism reciprocates in the horizontal direction to bring the resin injecting mechanism 9 into contact with the side surface 5a of the mold assembly laminated structure 5 or to separate it from the side surface 5a of the mold assembly laminated structure 5. As a result, the pot tip opening 12a of the resin injection mechanism 9 comes into contact with the side surface 5a or separates from the side surface 5a.

As shown in FIG. 1, the resin injection mechanism 9 is arranged on the side of the mold assembly laminated structure 5 and has two pots 12. Therefore, if the resin injection mechanism 9 is brought into contact with the side surface 5a of the mold assembly laminated structure 5 by the reciprocating drive mechanism, each of the mold assemblies 4a and 4b from the opening 12a formed at the tip of each pot of the resin injection mechanism 9 Fluidity resin can be supplied to Cavity 16.

[0040] (Configuration of mold opening / closing mechanism and mold clamping mechanism)

The mold opening / closing mechanism 7 has a rack and pinion mechanism. It has a pinion gear 7b and rack gears 7c and 7d. The pinion gear 7b is rotatably provided on the main body 7a of the mold opening / closing mechanism 7. The upper rack gear 7c is fixed to the upper mold 2a on the upper side, and meshes with the pinion gear 7b. The lower rack gear 7d is fixed to the lower lower mold 3b and meshes with the pinion gear 7b. Therefore, by rotating the pinion gear 7b in the forward direction and the reverse direction, the force S for opening and closing each of the mold assemblies 4a and 4b is used.

In addition, the mold clamping mechanism 8 includes a hold frame 10 and a pressing means 11. The hold frame 10 is a cylindrical body extending in the horizontal direction, and is provided so as to surround the die assembly laminated structure 5. As shown in FIG. 2, the pressing means 11 is provided below the mold assembly laminated structure 5 in the hold frame 10, that is, below the lower mold 3b, and the mold assembly laminated structure 5 is directed upward. That is, it presses in the closing direction. As shown in FIG. 2, rectangular openings 10 a are provided at both ends of the hold frame 10. The upper mold 2a in the upper mold assembly 4a is fixed to the upper inner surface of the hold frame 10. The pressing means 11 and the mold clamping mechanism 8 are fixed to the inner surface of the lower side of the hold frame 10.

[0043] When the resin sealing molding apparatus is used, the upper mold 2a and the lower mold 3a on the upper side of the mold opening / closing mechanism 7 are closed, and the upper mold 2b and the lower mold 3b on the lower side of the mold opening / closing mechanism 7 are Closed. At this time, the two mold assemblies 4 a and 4 b are pressed upward and downward by the pressing means 11, and are sandwiched by the pressing means 11 and the hold frame 10, respectively. Thereby, the mold clamping mechanism 8 applies a clamping force to each of the two mold assemblies 4.

[0044] (Configuration of resin injection mechanism)

The resin injection mechanism 9 includes a pot 12 extending in the horizontal direction for supplying a resin material, a plunger 13 extending in the horizontal direction for pressurizing the resin provided in the pot 12, and a resin supplied into the pot 12. Heating means (not shown) for heating the resin tablet 14 as a material. Note that a tip opening 12a of the pot 12 is provided on the side surface of the pot assembly 12 extending in the horizontal direction on the side of the mold assembly layered structure 5 side (two sets of mold assembly 4 side).

[0045] Although not shown, the resin sealing molding apparatus includes a resin tablet supply mechanism or a resin material transport supply mechanism, and a reciprocating drive mechanism. The resin tablet supply mechanism supplies the resin tablet 14 from the pot tip opening 12a to the pot 12 in a state of being separated from the mold assembly laminated structure 5. Further, the reciprocating drive mechanism brings the resin injection mechanism 9 into contact with the side surface 5a of the mold assembly layered structure 5 or pulls it away from the side surface 5a. As a result, the pot tip opening 12 a of the pot 12 comes into contact with the side surface 5 a of the mold assembly laminated structure 5.

Therefore, the resin tablet 14 is supplied to the pot 12 from the resin tablet supply mechanism. Thereafter, the plunger 13 is pressed in the horizontal direction (from right to left in the figure). At this time, the resin material is melted by heating in the pot 12. Therefore, the fluidized resin material is supplied to each mold assembly 4 through the resin passage.

[0047] Fig. 1, Fig. 5 and Fig. 6 show a state where the mold assembly laminated structure 5 and the resin injection mechanism 9 are separated from each other, and Fig. 3 and Fig. 4 show the mold assembly laminated structure 5 and The state where the resin injection mechanism 9 is in contact is shown.

[0048] (Configuration of mold assembly) A substrate setting surface 15 on which the substrate 1 is set is provided on the mold surface of the lower mold 3 in the mold assembly 4. Further, when the substrate 1 is set on the substrate setting surface 15, it is positioned in the same plane as the end surface 1 a of the substrate 1 and the side surface 5 a of the die assembly laminated structure 5.

Although not shown, the substrate setting surface 15 is provided with a substrate fixing mechanism.

The substrate fixing mechanism is for fixing the substrate 1 set on the substrate setting surface 15 to the substrate setting surface 15. The substrate fixing mechanism includes, for example, a predetermined number of suction holes extending from the substrate setting surface 15, a vacuum mechanism such as a vacuum pump, and a vacuum nozzle that communicates the suction holes and the vacuum mechanism.

[0050] Therefore, the vacuum suction mechanism forcibly sucks air through the suction hole and the vacuum pipe. Thereby, the substrate 1 is attracted to the substrate setting surface 15. In this state, the end face la of the substrate 1 is positioned in the same plane as the side face 5a. Note that the substrate fixing mechanism provided on the substrate setting surface 15 is not limited to one using an adsorption action, and may use a fixture such as a metal fitting.

[0051] When the mold assembly 4 is opened, the substrate 1 is fixed to the substrate setting surface 15 of the lower mold 3. Therefore, since the package resin 18 is integrated with the substrate 1, it is separated from the internal mold force 16 internal force.

[0052] When the mold assembly 4 is opened, the package resin 18 in the cavity 16 and the gate resin 19 that is a cured resin in the resin passage 17 are cut. As a result, the sealed substrate 6 (including the package resin 18, the substrate 1, and the gate resin 19) from the molded product existing in the mold assembly 4 is removed from the sealed substrate 6 (the package resin 18 and the substrate 1). Obtainable.

Further, the upper mold 2 is provided with a single resin molding cavity 16. The cavity 16 is a space having a size capable of receiving a predetermined number of electronic components 23 mounted on the board 1. Therefore, after the substrate supply / extraction mechanism sets the substrate 1 on the substrate setting surface 15 of the lower mold 3, the mold opening / closing mechanism 7 closes the upper mold 2 and the lower mold 3, so that a predetermined number of electronic components are placed in the cavity 16. 23 is purchased.

Note that the upper mold cavity 16 includes a cavity top surface and a cavity side surface, and a cavity opening is formed in the mold surface of the upper mold 2.

[0055] Further, the upper cavity 16 has a cavity top surface between the cavity top surface and the cavity side surface. Edge portion 16a. The edge portion 16a constitutes one side of the cavity top surface. The upper cavity 16 has an edge portion on the side surface of the cavity between the side surface of the cavity and the side surface of the cavity. The edge portion of the cavity side surface constitutes one side of the cavity side surface. The contact point between the two edges of the edge 16a of the cavity top surface and one side of the edge of the cavity side surface constitutes a corner of the cavity top surface.

(Configuration of resin passage 'through hole)

A resin passage for resin transfer is provided between the side surface 5a on the resin injection mechanism 9 side of the upper mold 2 and the upper mold cavity 16 so as to penetrate the upper mold 2.

[0056] The resin passage 17 is configured as, for example, a conical through hole, and has an opening on each of the side surface 5a of the upper mold 2 and the inner surface of the upper mold cavity 16.

Note that, for example, a conical apex-side portion constituting the resin passage 17 (sprue) is positioned on the upper mold cavity 16 side. Therefore, the opening on the inner surface of the upper mold 16 is as small as the mold gate opening. Further, the conical bottom surface portion constituting the resin passage 17 is positioned on the side surface 5 a side of the upper mold 2.

Accordingly, the fluid resin 20 can be injected into the cavity 16 from the conical bottom side opening in the resin passage 17 through the apex side opening (Gutro).

[0059] In addition, the electronic component 23 mounted on the substrate 1 can be encapsulated in the package resin 18 corresponding to the shape of the cavity. As a result, a molded product 21 is obtained in the upper mold 2 and the lower mold 3.

In addition, when the upper mold 2 and the lower mold 3 are closed while the substrate 1 is set on the substrate setting surface 15, the resin passage 17 is separated from the substrate 1. Therefore, the fluid resin can be injected into the upper mold cavity 16 without bringing the fluid resin 20 passing through the resin passage 17 into contact with the substrate 1.

[0061] Further, the package resin 18 that is the cured resin in the cavity 16 and the gate resin 19 that is the cured resin in the resin passage 17 can be easily cut at the connecting portion. Therefore, by removing the gate resin 19 including the resin 22 cured in the pot 12 from the resin passage 17, that is, by separating the gate resin 19 cured in the resin passage 17 from the package resin 18, the gate resin 19 And the package resin 18 are separated from each other. That Thus, the molded product 21 is obtained.

[0062] Further, the position where the resin passage 17 and the cavity 16 communicate with each other is such that the fluid resin 20 passing through the resin passage 17 does not come into contact with the substrate 1 set on the substrate setting surface 15; It may be a position. In this embodiment, the mold gate 17 as a resin passage communicates with the edge portion 16a of the cavity top surface so that an edge gate as a small opening is formed.

[0063] Further, the resin passage 17 and the cavity 16 are provided at any position of the edge portion of the cavity top surface, the edge portion of the cavity side surface, the cavity top surface, the cavity side surface, and the cavity corner portion. Anyway.

In the present embodiment, the resin passage 17 is a mold gate as a through hole. The force resin passage 17 can include a part of the configuration of the mold for molding the molded product 21. For example, a part of a mold such as a mold runner and a mold pot may be included.

Note that the molded product 21 includes a sealed substrate 6 having a substrate 1 and a package resin 18, a gate resin 19 cured in the resin passage 17, and a resin 22 cured in the pot 12 or the like. Have

In addition, the gate resin 19 is formed so as not to be pulled by the pulling force on the inner wall surface of the resin passage 17 when being pulled out from the resin passage 17. Therefore, by pulling the pot 12 of the resin injection mechanism 9 away from the upper mold 3 and the lower mold 2, the force S for easily extracting the gate resin 19 cured in the resin path 17 from the resin path 17 can be obtained.

[0067] (Resin sealing molding method for electronic parts)

Next, a method of integrally covering a predetermined number of electronic components 23 mounted on the substrate 1 using a resin sealing molding apparatus for the electronic components 23 will be described.

First, in each of the mold assemblies 4, the substrate supply / extraction mechanism sets one substrate 1 on the substrate setting surface 15 of the lower mold 3. Next, the mold opening / closing mechanism 7 closes the upper mold 3 and the lower mold 2. As a result, a predetermined number of electronic components 23 on the substrate 1 are inserted into the upper mold cavity 16. At this time, the substrate 1 is set on the lower die 2 with the side surface 5a of the mold assembly 4 and the end face la of the substrate 1 positioned in the same plane.

[0069] Next, the resin tablet 14, which is a solid resin material, is inserted into the two pot tip openings 12a. Each is fed into two horizontally extending pots 12. Next, the resin injection mechanism 9 is moved by the reciprocating drive mechanism, and the pot tip opening 12 a of the pot 12 extending in the horizontal direction comes into contact with the side surface 5 a of the mold assembly 5. At this time, the tip opening 12 a of the pot 12 coincides with the opening of the resin passage 17.

[0070] Next, in each of the mold assemblies 4a and 4b, the resin tablet 14 is pressurized by the resin pressurizing plunger 13 while being melted by heating in the pot 12 of the resin tablet. As a result, the fluid resin 20 is injected into the cavity 16 through the resin passage 17.

[0071] At this time, the force of injecting the fluid resin 20 from the edge 16a of the cavity top surface into the cavity 16 without bringing the fluid resin 20 passing through the resin passage 17 into contact with the surface of the substrate 1 S it can.

[0072] After the time required for the fluid resin 20 to cure in the cavity 16 elapses, the resin injection mechanism 9 is pulled away from the mold assembly 4. As a result, the gate resin 19 cured in the resin passage 17 and the package resin 18 cured in the cavity 16 are separated from each other at the connecting portion. Further, when the substrate assembly 1 is adsorbed to the lower mold 3 and the mold assembly 4 is opened, the package resin 18 is separated from the cavity 16 by the bow I.

Further, as shown in FIG. 5, the resin 22 cured in the pot 12 of the resin injection mechanism 9 is pressed by the plunger. Thereby, the gate resin 19 and the resin 22 that are cured resins can be extruded from the inside of the pot 12 to the outside.

According to the conventional resin sealing molding apparatus, the gate resin 19 is attached to the surface of the substrate 1. However, according to the resin sealing molding apparatus of Example 1, the fluid resin 20 can be injected into the cavity 16 without contacting the surface of the substrate 1. Therefore, it is possible to prevent the gate resin 19 from adhering to the substrate 1.

In addition, according to the resin sealing molding apparatus of Example 1, the gate resin 19 can be extracted from the resin passage 17 when the resin injection mechanism 9 is separated from the mold assembly 4. Thereby, the goat resin 19 and the package resin 18 can be separated from each other at the connection portion. For this reason, it is not necessary to provide an ejection pin for the mold gate. Therefore, the resin sealing molding device can be reduced in size by the space for installing the ejector pin. [0076] Further, in the resin sealing molding method of this embodiment, if the resin is cured in the mold assembly 4! /, The resin injection mechanism 9 is changed from the mold assembly 4. Mold assembly 4 may be opened before pulling apart. Further, according to the resin sealing molding apparatus of the present embodiment, the step of separating the resin injection mechanism 9 from the mold assembly 4 and the step of opening the mold assembly 4 may be performed simultaneously. By either method, the gate resin 19 cured in the resin passage and the package resin 18 cured in the cavity 16 can be separated from each other at the connection portion.

Example 2

[0077] The resin sealing molding method of Example 2 and the resin sealing molding apparatus used therefor will be described with reference to Figs.

In FIGS. 7 to 10, the same components as those of the resin sealing molding apparatus described with reference to FIGS. 1 to 6 in Example 1 described above are denoted by the same reference numerals. The description will not be repeated unless otherwise required.

[0079] (Overall configuration of resin sealing molding apparatus for electronic parts)

Further, the overall configuration of the resin sealing molding apparatus shown in FIGS. 7 to 10 is basically the same as the overall configuration of the resin sealing molding apparatus of Example 1 shown in FIGS. The explanation will not be repeated.

[0080] (resin locking part in the pot)

As shown in FIGS. 7 to 10, a resin locking portion 31 for locking the resin hardened in the pot 12 is provided on the inner surface of the pot 12. The resin locking portion 31 is formed of a concave portion as a circumferential groove. Therefore, when the fluid resin is cured in the resin locking portion 31, the resin cured in the pot 12 is locked by the pot 12.

First, the resin tablet 14 is supplied into the pot 12. Next, the pot tip opening 12 a of the resin injection mechanism 9 is connected to the side surface 5 a of the mold assembly 4. Thereafter, the resin material melted by heating in the pot 12 is pressurized by the plunger 13. As a result, the fluid resin 32 is injected into the cavity 16 of the mold assembly 4. Next, the resin injection mechanism 9 is pulled away from the mold assembly 4. At this time, the resin 33 cured in the pot 12 is locked by the resin locking portion 31. As a result, the pot 12 and the cured resin 33 in the pot 22 are separated from the mold assembly 4 in an integrated state. [0082] (Recesses for substrate set and resin injection part)

Further, in the resin sealing molding apparatus shown in FIGS. 7 to 10, a substrate setting recess 34 is provided in the lower mold 3 of the mold assembly 4. The board 1 having the predetermined number of electronic components 23 mounted thereon is set in the board setting recess 34. When the substrate 1 is set in the substrate setting recess 34, the end face la is positioned in the same plane as the side surface 5 a of the mold structure 4.

[0083] Also, the upper mold 2 in the mold assembly 4 is provided with a resin molding cavity 16 and a resin transfer resin passage 17 in the same manner as the resin sealing molding apparatus of the first embodiment described above. It has been. Further, a resin injection portion 35 for guiding the fluid resin 32 injected into the resin passage 17 to the cavity 16 is provided between the cavity 16 on the side of the cavity 16 and the resin passage 17. The resin injection part 35 is a recess provided in the upper mold 2. The resin injection portion 35 performs the same function as the mold gate, and the size of the injection port on the cavity 16 side of the resin injection portion 35 is substantially the same as the size of the mold gate port. As the resin injection part 35, for example, a fin gate structure may be adopted.

Accordingly, the fluid resin 32 injected from the resin passage 17 into the resin injection part 35 can be injected into the cavity 16 through the resin injection part 35. Further, the fin gate resin 36 cured in the resin injection portion 35 is formed adjacent to the package resin 18 on the surface of the substrate 1.

It should be noted that the mold surface opening of the resin injection portion 35 is provided in the mold surface of the upper mold 2. In addition, the mold surface opening of the resin injecting portion 35 is positioned so as to coincide with the surface of the substrate 1 set in the substrate setting concave portion 34 in a state where the upper die 3 and the lower die 2 are closed. . In the present embodiment, the resin injecting portion 35 is positioned so as to come into contact with a side frame portion as an edge portion of the substrate 1.

In addition, the opening of the resin passage 17 and the opening of the mold surface of the upper mold 2 are provided in a state of being separated from each other with the space in the resin injection portion 35 as a medium. The opening of the resin passage 17 has a small size about the gate opening. Further, like the resin sealing molding apparatus of the first embodiment, the fluid resin 32 passing through the resin passage 17 is injected into the resin injection portion 35 without contacting the surface of the substrate 1. As a result, the packaged resin 18 having a shape corresponding to the shape of the cavity 16 is sealed as a molded product 37 in which the electronic component 23 on the substrate 1 is included. A substrate 38 is obtained.

[0087] According to the resin sealing molding apparatus of the present embodiment, as in the resin sealing molding apparatus of Example 1, the pot 12 together with the resin injection mechanism 9 can be obtained by pulling the resin injection mechanism 9 away from the mold assembly 4. The resin 33 cured inside and the gate resin 19 cured in the resin passage 17 can be pulled away from the mold assembly 4. As a result, the gate resin 19 and the fin gate resin 36 cured in the resin injection portion 35 can be separated from each other at the connection portion.

In addition, in the resin sealing molding apparatus of Example 2, in order to guide the flowable resin to the cavity 16, the mold gate is separated from the resin passage (mold gate) 17 and the resin injection portion (fin gate) 35. Have two gates!

[0089] (Method of resin sealing molding of electronic parts)

Similar to the resin sealing molding method of the first embodiment, first, the substrate 1 on which a predetermined number of electronic components 23 are mounted is set in the substrate setting recess 34 of the lower mold 3. Next, each of the two mold assemblies 4 lined up and down is closed. As a result, a predetermined number of electronic components 23 are included in the cavity 16. Thereafter, the resin tablet 14 is supplied into the pot 12 of the resin injection mechanism 9. Next, the pot tip opening 12 a is connected to the side surface 5 a of the mold assembly 4 by moving the resin injection mechanism 9.

Next, similarly to the resin sealing molding method of Example 1, the resin material melted by heating in the pot 12 is pressurized by the plunger 13. As a result, the fluid resin 32 is injected into the cavity 16 through the resin passage 17 and the resin injection portion 35. As a result, a molded product 37 is obtained in which the electronic component 23 on the substrate 1 is enclosed in the package resin 18 having a shape corresponding to the shape of the cavity 16 in the cavity 16.

Furthermore, after the time necessary for curing the resin has elapsed, the resin injection mechanism 9 is pulled away from the mold assembly 4 in the same manner as the resin sealing molding method of Example 1. As a result, the gate resin 19 is extracted from the resin passage 17. As a result, the gate resin 19 in the resin passage 17 and the fin gate resin 36 cured in the resin injection portion 35 are separated from each other at the connection portion. After that, the sealed substrate 38 is taken out from the mold assembly 4 with the upper mold 3 and the lower mold 2 opened.

[0092] Finally, as shown in FIG. 10, the cured resin 22 in the pot 12 is transferred to the plunger 13. Therefore, it is pressed. As a result, the gate resin 19 and the resin 33, which are cured resins, are removed.

[0093] The gate resin 19 adheres to the surface of the substrate 1 according to a conventional resin sealing molding apparatus. However, according to the resin sealing molding apparatus of Example 2, since the fluid resin 32 is injected into the cavity 16 so as not to contact the surface of the substrate 1, the gate resin 19 adheres to the surface of the substrate 1. do not do.

[0094] Further, since it is not necessary to use the ejection pin provided at the mold gate position as in the prior art, the resin-sealing molding of the electronic component is performed by the space where the ejection pin is provided. The size of the device can be reduced.

Also in this embodiment, the mold assembly 4 after resin injection may be opened before the step of separating the resin injection mechanism 9 from the mold assembly 4. Further, the step of separating the resin injection mechanism 9 from the mold assembly 4 and the step of opening the mold assembly 4 after resin injection may be performed simultaneously.

In any case, the gate resin 19 cured in the resin passage 17 and the fin gate resin 36 cured in the resin injection portion 35 can be separated from each other at the connection portion.

Further, according to the resin sealing molding apparatus of the second embodiment, unlike the resin sealing molding apparatus of the first embodiment, the package resin 18 in the cavity 16 and the gate resin 19 in the resin passage 17 are mutually connected. The fin gate resin 36 hardened in the resin injection portion 35 and the gate resin 19 in the resin passage 17 are separated from each other instead of being separated at the connection portion V. Therefore, when the gate resin 19 is pulled away from the package resin 18, the force S can easily prevent the package resin 18 from being damaged.

In each of the above-described first and second embodiments, a mold assembly 4 in which a plurality of resin passages 17 are provided in one cavity 16 may be employed. For example, a mold assembly 4 in which two resin passages 17 are provided for one cavity 16 may be employed. In this case, one pot 12 communicates with each of the two resin passages 17, and fluid resin is injected from one pot 12 into one of the cavities 16 through each of the two resin passages 17.

[0099] Further, the upper mold 2 is provided with a plurality of cavities, and the resin passage 17 has a plurality of cavities. A mold assembly 4 connected to each of the cavities may be employed. For example, two resin passages 17 respectively corresponding to two cavities 16 are provided, and the fluid resin is injected through a mold runner branched from one pot 12 to two resin passages 17. Each of the resin passages 17 may be poured into two cavities 17.

Further, in Examples 1 and 2, the force with which one substrate 1 is set in the mold assembly 4 A plurality of substrates 1 may be set in the mold assembly 4. In Examples 1 and 2, a plurality of electronic components 23 mounted on a single substrate 1 are covered with resin as a single body. 1S A plurality of electronic components 23 mounted on a single substrate 1 are provided. The resin may be coated individually or by gnolep. Further, in Examples 1 and 1, the force cavity 16 provided in the upper mold 2 may be provided in the lower mold 3.

[0101] In Examples 1 and 2, a cavity may be provided in each of the upper mold 3 and the lower mold 2. In this case, the mold assembly 4 is closed after the two substrates 1 are set in the mold assembly 4 in a state where the electronic component non-mounting surfaces of the two substrates 1 are in contact with each other. According to this, the electronic component 23 can be inserted into each of the upper mold 3 and lower mold 2 cavities. Accordingly, the force S can be poured from the pot 12 into the upper mold 3 cavity and the lower mold 2 cavity through the resin passage 17 and the resin injection portion 35, respectively.

[0102] In this case, it is possible to obtain the same effect S as the effects obtained by the resin sealing molding apparatuses of Examples 1 and 2. Furthermore, the productivity of the sealed substrate 6 or 38 (product) can be substantially doubled in comparison with a conventional resin sealing molding apparatus. Therefore, product productivity can be improved.

[0103] Although the invention has been described and illustrated in detail, this is for purposes of illustration only and not as a limitation, the scope of the invention is limited only by the appended claims. It will be clearly understood.

Claims

The scope of the claims

[1] providing a first mold (3) and a second mold (2) facing each other;

Setting the board (1) on which the electronic component (23) is mounted on the first mold (3), and closing the first mold (3) and the second mold (2) Inserting the electronic component (23) into the cavity (16) of the second mold (2);

A resin passage that communicates with the cavity (16) but does not face the substrate (1) by connecting a resin injection mechanism (9) having a pot (12) to the side surface of the second mold (2) (17) and a step of communicating the pot (12);

By pressurizing the resin material (14) in the pot (12), a fluid resin (20) is injected from the resin injection mechanism (9 through the resin passage (17) into the cavity (16). Curing the flowable resin (20);

By separating the resin injection mechanism (9) from the second mold (2), the cured resin (19) in the resin passage (17) and the cured resin (18) in the cavity (16) are separated. And a resin sealing molding method for an electronic component.

[2] The fluid resin (20) passes from the resin passage (17) to the cavity (16) through a resin injection part (35) provided between the cavity (16) and the resin passage (17). The resin sealing molding method for an electronic component according to claim 1, wherein the molding is performed.

[3] a first mold (3) on which a substrate (1) on which an electronic component (23) is mounted can be mounted;

A cavity (16) facing the first mold (3) and into which the electronic component (23) can be inserted, and a resin passage (17) communicating the cavity (16) with the outside A second mold having

A resin injection mechanism (9) connected to a side surface of the second mold (2) in a state where the first mold (3) and the second mold (2) are closed,

A resin sealing molding apparatus in which the resin material (14) in the pot (12) can be poured into the cavity (16) without contacting the substrate (1) in the resin passage (17).

[4] The resin sealing molding apparatus according to claim 3, wherein a resin injection part (35) is provided between the cavity (16) and the resin passage (17).