JP4603904B2 - Resin mold and molded product removal method - Google Patents

Description

  The present invention relates to a resin molding die and a method for taking out a molded product that are used when a molded product is manufactured by curing a fluid resin filled in a cavity.

  Conventionally, an ejector pin is called for the purpose of filling a cavity of a resin mold with a fluid resin, curing the fluid resin to produce a cured resin, and releasing a molded product containing the cured resin. A mechanism is used (for example, see FIG. 9 of Patent Document 1). This is because an ejector plate that can be raised and lowered separately from the resin mold main body is provided below or above (or both) the resin mold, and one (or a plurality) of ejector pins attached to the ejector plate. Is a mechanism for projecting and releasing a molded product at one or a plurality of points that are moved up and down. In addition, the following configuration has been proposed that does not require an ejector pin. First, a hole and a valve pin are provided at one place (or a plurality of places) on the cavity surface, and high-pressure fluid such as compressed air is opened at one or more points from the hole opened by the valve pin when the mold is opened. There has been proposed a configuration in which a molded product is released from a cavity surface by spraying in a shape (see, for example, FIGS. 1 and 2 of Patent Document 1). Second, a configuration has been proposed in which a molded product is released from the cavity surface by applying predetermined vibration to the cavity surface. This vibration is applied to the cavity surface by vibration generating means provided separately from the resin mold, and the amplitude is about 1 to 2 μm (see, for example, Patent Document 2). Thirdly, a configuration has been proposed in which a piezoelectric body provided in a resin mold is displaced so as to form a cavity surface (see, for example, Patent Document 3). In this configuration, the direction in which the piezoelectric body is displaced is a direction along the cavity surface and outward from the center of the cavity, or a direction intersecting the cavity surface at one or more points (for example, a vertical direction). It is.

  However, according to the conventional technology described above, there are the following problems. First, when ejecting a molded product using an ejector pin, a large space for raising and lowering the ejector plate is required. In addition, in order to increase the rigidity of the part to which the clamping pressure is applied when clamping the opposing resin molds, a reinforcing member is attached to a part other than the part where the ejector plate moves up and down in the resin mold. Yes. As a result, the entire resin mold cannot be reduced in size and weight. Therefore, since the resin mold cannot be increased in size and weight, there are problems in terms of handling and safety, and the resin molding apparatus (hereinafter referred to as “apparatus”) itself must be reduced in size and weight. I can't. In addition, when the reinforcing member is simplified in order to reduce the size and weight of the entire resin mold, a sufficient clamping pressure cannot be applied. Therefore, in this case, there is a possibility that a resin leak occurs in which the fluid resin leaks between the resin molds that are clamped, and a resin flash may occur in the molded product.

  Also, as a configuration that does not use ejector pins, first, when using high-pressure fluid injection, a compressor, a high-pressure fluid tank, piping in a resin mold, etc. are required. It is not possible to simplify the mold. Secondly, when the molded product is released from the cavity surface by applying a predetermined vibration, not only the portion where the cavity surface and the molded product are in close contact (adhered) is vibrated. Since the entire resin mold component is vibrated from the outside, it is inefficient and complicates the apparatus. Furthermore, depending on the characteristics of the flowable resin, the adhesiveness between the cured resin and the cavity surface may be strong. In this case, the molded product may not be sufficiently released. Thirdly, among the cases where the piezoelectric body constituting the cavity surface is displaced, when the piezoelectric body is displaced in the direction along the cavity surface and in the direction from the center of the cavity to the outside, in the vicinity of the center of the cavity, Adhesion between the cavity surface and the molded product is unlikely to decrease. Further, when the piezoelectric body is displaced in the direction crossing the cavity surface, the quality may be adversely affected depending on the characteristics of the molded product.

  Further, in resin molding, a chip-like element (hereinafter referred to as “chip”) made of a semiconductor chip or the like mounted on a lead frame, a printed circuit board or the like (hereinafter referred to as “substrate”) is resin-sealed to form an electronic component. When manufacturing a package, there are the following unique problems. These problems include the thinning of the package (and hence the thickness of the molded product), the increase in the number of substrates per substrate (and the increase in the size of the molded product) due to cost requirements, and the reliability associated with the miniaturization of the package. This is caused by a recent trend such as an increase in the adhesion of a cured resin for the purpose of ensuring the safety. First, in the case of using an ejector pin, there is a problem that occurs due to protruding a molded product at one or more points that move up and down. In particular, since both the substrate and the cured resin are becoming thinner as the package becomes thinner, stress is generated around the point-projected portion of the substrate and the cured resin, which may cause cracks. There is. Further, the protrusion may cause disconnection or contact failure in a fine metal wire (wire) used for wiring between the chip and the substrate. These reduce the reliability and yield of electronic parts that are products (finished products). In addition, as the size of the molded product increases, it is necessary to increase the number of protruding points, that is, the number of ejector pins, which makes it difficult to design the resin mold and the device and complicates the resin mold and the device itself. Invite. These problems are exacerbated by the increased adhesion of the cured resin.

Of the configurations that do not use the ejector pins, first, when a high-pressure fluid is used, the molded product protrudes at one or more points as in the configuration that uses the ejector pins. In this case, since it is necessary to increase the fluid pressure in order to cope with an increase in the size of the molded product and an increase in the adhesion of the cured resin, cracks due to stress occur as the molded product becomes thinner. Reliability may be reduced. Further, when increasing the number of places where the high-pressure fluid is ejected, as in the case where the number of ejector pins is increased, the design of the resin mold / device becomes difficult and the resin mold / device itself becomes complicated. Secondly, when vibration is used, there is a possibility that the molded product cannot be sufficiently released due to an increase in size of the molded product and an increase in adhesion of the cured resin. Since the vibration is applied to the resin mold having the cavity from the outside, the cured resin in the cavity and the resin mold belong to the same vibration system. Therefore, even if the amplitude, which is about 1 to 2 μm, is increased, the magnitude of the force acting on the surface where the cavity surface and the molded product are in close contact with each other remains within the range of the inertial force generated by the vibration. The mold effect is not improved so much. Third, when the piezoelectric body constituting the cavity surface is displaced, there is a possibility that the molded product cannot be sufficiently released due to an increase in the size of the molded product and an increase in adhesion of the cured resin. In addition, when the piezoelectric body is displaced in the direction crossing the cavity surface, the molded product protrudes at a point, so that cracks due to stress occur as the electronic product package or the molded product made of the assembly is made thinner. As a result, the reliability of the electronic component may be reduced.
Japanese Utility Model Publication No. 2-336039 (FIGS. 1, 2 and 9) Japanese Patent Laid-Open No. 5-326597 (page 5-6, FIG. 1) JP 2004-223866 A (page 4-6, Fig. 1-4)

  The problems to be solved mainly include the point that the resin mold and the device cannot be reduced in size and weight, the point that resin leakage may occur and the resin flash may occur in the molded product, and Depending on the characteristics of the molded product, the quality may be adversely affected. The present invention has been made to solve these problems, and an object of the present invention is to provide a resin mold and a method for taking out a molded article that enables the molded article to be released with a simple configuration.

In order to solve the above-mentioned problem, the resin mold (3) according to the present invention has a resin filling portion including at least a cavity (9), and after the resin filling portion is filled with a fluid resin. A resin molding die (3) used for curing a flowable resin to form a cured resin (14) and completing a molded article (15) containing at least the cured resin (14) and a product. The fixed block (4) constituting the fixed surface (10) fixed to the molded product (15) among the mold surfaces that can come into contact with the molded product (15), and the fixed surface (10) among the mold surfaces The movable surface ( 11 ) having a predetermined area and comprising a part other than the above is configured to reciprocate the one or more movable blocks ( 7 ) and the one or more movable blocks ( 7 ) that are reciprocally provided. Reciprocating means (27) Together, by applying a force to the molded article (15) in the cured resin (14) one or more movable block (7) is operated after the formed movable surface (11), a resin mold (3) In a state where mold clamping is released, the molded product (15) is released from the mold surface, and the movable surface (11) of the one or more movable blocks (7) has at least a part of the inner bottom surface of the cavity (9). The reciprocating means (27) is a rotation mechanism (not shown) that engages with one or a plurality of movable blocks (7), and one or a plurality of movable blocks (in accordance with the rotation of the rotation mechanism). By rotating 7), one or a plurality of movable blocks (7) release the molded product (15) .

  In the resin mold (3) according to the present invention, in the above-described resin mold (3), the plurality of movable blocks (7) are opposed to each other along opposite ends of the cavity (9). Each of which is provided.

Moreover, the resin mold (3) according to the present invention is the runner part (23) provided in the resin filling part in the above-mentioned resin mold (3) for the purpose of filling the cavity (9) with the fluid resin. And a dummy runner portion (24) provided in the resin filling portion so as to face the main runner portion (23), and the runner portion (23) and the dummy runner portion (24) of the molded product (15). The cured resin (14) formed in (1) and (2) is an unnecessary part not included in the product, and the plurality of movable blocks ( 7 ) are arranged so as to face each other with the cavity (9) interposed therebetween. It is provided so that it may overlap with at least a part of runner part (23) and at least a part of dummy runner part (24), respectively.

The resin mold (3) according to the present invention includes a fluid path (16, 6 ) provided in at least one or a plurality of movable blocks ( 7 ) in the above-described resin mold (3) and through which the high-pressure fluid (18) flows. 19), an opening (17) formed by the fluid path (16, 19) on at least the side peripheral surface, and high-pressure fluid supply means connected to the fluid path (16, 19), and at least one or more movable After the block ( 7 ) has started reciprocating, the high pressure fluid (18) from the opening (17) towards the part (15) or towards the space between the part (15) and the mold surface. Is injected.

In addition, the method for taking out a molded product according to the present invention prepares a resin mold (3) having a resin filling portion including at least a cavity (9), fills the resin filling portion with a fluid resin, and cures the fluid resin. Forming a cured resin (14) and taking out a molded product (15) containing at least the cured resin (14) and including the product, wherein the mold is in contact with the molded product (15) One or a plurality of movable surfaces ( 11 ) having a predetermined area and comprising a portion other than the fixed surface (10) that is fixed to the molded product (15) among the surfaces and reciprocally movable. By operating the movable block ( 7 ) and applying force to the molded product (15) on the movable surface ( 11 ), the molded product (15) is removed from the mold surface in a state where the mold clamping of the resin mold (3) is released. Mold release Provided that the step and the step of unloading demolded molded article (15), in the step of releasing, by rotating the rotation mechanism (not shown) that engages the one or more movable block (7) by rotating the one or more movable block (7), characterized in that to release the molded article (15) from the mold surface using one or more movable block (7).

Further, in the molded product removal method according to the present invention, in the above-described molded product removal method, in the step of releasing, at least one or a plurality of movable blocks ( 7 ) through the opening (17) provided on the side peripheral surface, A high-pressure fluid (18) is injected toward the molded product (15) or toward the space between the molded product (15) and the mold surface.

According to the present invention, the movable surface ( 11 ) having a predetermined area, which is composed of a portion other than the fixed surface (10) fixed to the molded product (15) among the mold surfaces that can come into contact with the molded product (15). one or more movable block rotatably provided with configuring (7) is pivotally moved in a state where the curable resin (14) is formed. Thereby, a force is applied to the molded product (15) at the movable surface ( 11 ) having a predetermined area and rotating , that is, at the "surface". Thus, the cured resin (14) and the movable surface ( 11 ) included in the molded product (15), and the mold surface that can come into contact with the cured resin (14) and the molded product (15), are formed into the resin mold ( In the state in which the mold clamping of 3) is released, the molded product (15) is released from the mold surface after being separated, that is, in a state where it is in close contact with that in close contact. Therefore, since the stress generated when the molded product (15) is released is reduced, adverse effects on the molded product (15) are reduced. In addition, the molded product (15) can be easily released compared to a case where force is applied to the molded product in a “point” shape to release the molded product.

  Also, compared to the case where a molded article is ejected or a high-pressure fluid is injected onto the molded article, a force is applied to the molded article in a “point” shape to release the molded article. There is no need for a mechanism to project or a mechanism for injecting in a “point” shape. Therefore, the resin mold (3) / device can be easily designed and the resin mold (3) / device itself can be simplified and downsized.

  Further, as compared with the case where the molded product is released from the mold by ejecting the molded product, a large space for advancing and retracting the projecting mechanism is not necessary. Therefore, a member for reinforcing the resin mold (3) is not required near this space, and the clamping pressure can be reduced, so that the resin mold (3) / device can be reduced in size and weight. Become. Further, when the devices that generate the same mold clamping pressure are compared, the mold clamping pressure acts more effectively than the conventional example, so that the occurrence of resin flash is suppressed.

Moreover, force is applied to the cured resin (14) formed in the unnecessary part which is not contained in the product, that is, the main runner part (23) and the dummy runner part (24), by the plurality of movable blocks ( 7 ). Therefore, since the stress generated in the part to be the product of the molded product (15) is reduced, the adverse effect on this part is reduced.

In addition, a force is applied to the molded product (15) by the one or more movable blocks ( 7 ) starting to rotate , and the molded product (15) or the mold surface is moved toward the molded product (15). The high-pressure fluid (18) is ejected from the opening (17) formed in the side peripheral surface of the movable block ( 7 ) toward the space therebetween. As a result, the high-pressure fluid (18) acts like a wedge and pushes the cured resin (14) on the “surface”, thereby assisting the separation between the cured resin (14) and the mold surface. Therefore, the cured resin (14) can be quickly separated from the mold surface while suppressing the stress generated in the molded product (15), particularly the stress generated in the cured resin (14).

  A resin-filled portion including at least a cavity (9); and after the resin-filled portion is filled with a fluid resin, the fluid resin is cured to form a cured resin (14), and at least the cured resin ( 14) and a resin molding die (3) used for completing a molded product (15) including the product, with respect to the molded product (15) among mold surfaces that can be in contact with the molded product (15). And a fixed block (4) constituting a fixed surface (10) fixed in a fixed manner and a movable surface (11) composed of a portion other than the fixed surface (10) of the mold surface, and relative to the cavity (9). A pair of movable blocks (7) each rotatably provided so as to face each other along the facing end portion, and a rotating means for rotating each movable block (7). Then, after the cured resin (14) is formed, each movable block (7) rotates to apply a force to the molded product (15) on the movable surface (11). Thereby, in a state where the mold clamping of the resin mold (3) is released, the molded product (15) is released from the mold surface.

  Example 1 of a resin mold and a method for taking out a molded product according to the present invention will be described with reference to FIG. Hereinafter, as an example of resin molding, a case will be described in which transfer molding is used to manufacture an electronic component package by resin-sealing a chip mounted on a substrate. In this case, the assembly of packages becomes a molded product. FIG. 1 (1) shows a state in which the resin mold according to the present embodiment is opened, and FIG. 1 (2) shows a state in which a cured resin is formed after the resin mold has been clamped with a substrate interposed therebetween. 1 (3) is a partial cross-sectional view showing a state where the resin mold is opened and the molded product is extruded. In the drawings used in the following description, unless otherwise specified, the resin flow path for filling the cavity with the fluid resin, that is, the runner portion, extends along the front-back direction of the drawing. It is not shown in the figure. In addition, any of the figures is schematically omitted and exaggerated as appropriate for easy understanding.

  As shown in FIG. 1, the lower mold 1 made of a fixed mold and the upper mold 2 made of a movable mold opposed to the fixed mold are used together when resin-sealing using transfer molding. The resin mold 3 to be formed is configured. The lower mold 1 is provided with a base portion 4, a recess portion 5 provided in the base portion 4 and filled with a fluid resin (not shown), and parallel ends provided at opposite ends of the recess portion 5 along the die surface. Two rows of groove-like and substantially cylindrical spaces 6 and a pair of substantially columnar movable blocks 7 fitted in the spaces 6 so as to reciprocate (rotate in this embodiment) are provided. . The movable block 7 is provided with a notch 8 having a predetermined cross-sectional shape. When the movable block 7 is in the initial position (the position shown in FIG. 1 (1)), the recess 5 and the notch 8 define the cavity 9 to be filled with a fluid resin (not shown). Constitute. In other words, the cross-sectional shape of the notch 8 is determined so that the recess 5 and the notch 8 together form the cavity 9 when the movable block 7 is in the initial position. Of the mold surfaces (inner side surface and inner bottom surface) in the cavity 9, the mold surface having the recess 5 is fixed to the molded product, and the mold surface having a predetermined area in the notch 8 is formed. The movable surfaces 11 that can reciprocate (rotate in this embodiment) with respect to the molded product are respectively configured. In addition, the gap between the space 6 and the movable block 7 is maintained at such a size that the movable block 7 is rotatable and the fluid resin does not enter.

  A rotating means (not shown) such as a motor is fixed to one end of each movable block 7, and this rotating means rotates each movable block 7 around a central axis 12 of each movable block 7 by a predetermined angle. Let As shown in FIG. 1 (2), a substrate 13 on which a chip (not shown) is mounted is placed on the lower mold 1 so that the chip is accommodated in the cavity 9. ing. This substrate 13 is positioned as an insert member in resin molding. Here, FIG. 1 (2) shows a state in which the fluid resin filled in the cavity 9 is cured and the cured resin 14 is formed with the resin mold 3 being clamped. In this state, including the following examples, a molded product 15 (see FIG. 1C) having the substrate 13, the chip, and the cured resin 14 is formed.

  A method for taking out a molded product according to the present embodiment will be described with reference to FIG. First, in the mold open state shown in FIG. 1A, after placing the substrate 13 on which the chip (not shown) is mounted on the lower mold 1, the upper mold 2 is lowered to lower the lower mold 1 and the upper mold. 2 and clamp. Thereafter, the cavity 9 is filled with a fluid resin (not shown).

  Next, as shown in FIG. 1 (2), in the state where the lower mold 1 and the upper mold 2 are subsequently clamped, the fluid resin filled in the cavity 9 is cured to form a cured resin 14. . Then, as shown in FIG. 1A, the movable block 7 is kept at the initial position until this state. In this state, the mold surface constituted by the surface that can come into contact with the cured resin 14 in the cavity 9, that is, the surface of the concave portion 5 of the base portion 4 and the surface of the cutout portion 8 of the movable block 7 and the cured resin 14. Due to the adhesiveness between them, the cured resin 14 is in close contact with those mold surfaces with a certain strength.

  Next, as shown in FIG. 1 (3), the upper mold 2 is raised from the state of FIG. 1 (2) to open the lower mold 1 and the upper mold 2 and is shown on the left side in the figure. The movable block 7 is rotated in the counterclockwise direction, and the movable block 7 shown on the right side is rotated in the clockwise direction. Thus, each movable block 7 is used to form a mold surface of the notch 8 and mainly a mold surface (inner bottom surface) of the side peripheral surface of each movable block 7 to have a predetermined area. Is applied to the cured resin 14 that has been in close contact with the mold surface of the cavity 9. Therefore, immediately after each movable block 7 starts to rotate, the movable surface 11 of each rotating movable block 7 applies a force to the molded product 15 at opposite edges of the cured resin 14. The movable surface 11 pushes the molded product 15 mainly upward. Accordingly, when the movable surface 11 to be rotated extrudes the molded product 15, that is, by extruding the molded product 15 on the “surface” to be rotated, the cured resin 14 included in the molded product 15 and the movable surface 11 are separated from each other. . More specifically, in the cavity 9 of FIG. 1, the outer end of the movable surface 11 and the outer end of the fixed surface 10 start to be separated from the cured resin 14, respectively. Therefore, by extruding the molded product 15 on the rotating “surface”, the cured resin 14 and the movable surface 11 included in the molded product 15 are brought into a state where they are not in close contact with each other.

  Next, each movable block 7 is subsequently rotated from the state described above. Thereby, as shown in FIG. 1 (3), the molded product 15 is continuously pushed out by each movable block 7, so that the rotating movable surface 11 is a portion other than the movable surface 11 in the mold surface of the cavity 9, that is, The cured resin 14 is pulled away from the fixed surface 10 and the movable surface 11 itself. Therefore, the molded product 15 can be released from the lower mold 1. In addition, the timing which starts each movable block 7 may be simultaneous, and may provide a time difference.

  Next, from the state shown in FIG. 1 (3), the lower mold 1 and the upper mold 2 are further opened, and a conveyance mechanism is inserted between them. Thereafter, the molded product 15 is held by an appropriate method such as suction or clamping, and the molded product 15 is conveyed to a storage jig such as a tray or the next process.

  According to the present embodiment, immediately after each movable block 7 starts to rotate, it is formed on the movable surface 11 having a predetermined area of the notch 8 included in each movable block 7, that is, on the rotating “surface”. Since the product 15 is pushed out or pulled away, the following effects can be obtained. First, the molded product 15 is pushed out in a wider area than when the molded product is ejected at a “point” using an ejector pin, a high-pressure fluid, a piezoelectric body, and the like, so that the molded product 15 is pushed out. The stress that occurs is reduced. Therefore, an adverse effect on the molded product 15 (for example, a crack occurs in a protruding portion at a “point” of the substrate 15 and the cured resin 14, and the metal fine wire used for wiring between the chip and the substrate 15. The occurrence of disconnection and poor connection in the In particular, since the cured resin 14 is pushed out on the “surfaces” of the opposite edges of the cured resin 14 with respect to the molded product 15 that has been thinned and enlarged, such a molded product 15 is surely separated from the lower mold 1. Type. Further, the adverse effect on the molded product 15 is further reduced. For example, when a plurality of chips are mounted on a single large substrate 15 to form a large number of electronic components, opposite edges of the cured resin 14, in other words, an electronic product. It is possible to extrude the molded product 15 on the “surface” at an unnecessary portion that is not a part. Thereby, the bad influence given to the molded article 15 which is an aggregate | assembly of an electronic component is reduced.

  Secondly, the rigidity of the resin molding die 3 is improved because a large space for raising and lowering the ejector plate is not required as compared with the case where the ejector pins are used. Is no longer necessary. Further, when the resin mold 3 is clamped, the clamping pressure acts effectively. Accordingly, the reinforcing member is not required and the clamping pressure is reduced, so that the resin mold / device can be reduced in size and weight. Further, when the apparatuses that generate the same mold clamping pressure are compared with each other, according to this embodiment, the mold clamping pressure acts more effectively than the conventional example, so that the occurrence of resin flash is suppressed.

  Thirdly, piping in the resin mold is not necessary as compared with the conventional case in which high-pressure fluid is injected at one or more “points”. Therefore, the configuration of the resin mold is simplified.

  Hereinafter, a modification of the present embodiment will be described with reference to FIG. 2 (1) shows a state in which a cured resin is formed after the resin mold according to this modification is clamped, and FIG. 2 (2) shows a state in which the resin mold has been opened and a molded product has been extruded. FIG. The feature of this modification is that the notch 8 provided in the movable block 7 has a cross-sectional shape obtained by cutting a part of a circle, that is, an arcuate cross-sectional shape. According to this modification, the same effect as in FIG. 1 can be obtained. Further, on the movable surface 11 of the notch 8 having an arcuate cross-sectional shape, each of the movable blocks 7 rotates, so that the cured resin 14 that is in close contact with the mold surface of the cavity 9 mainly has an upward direction in the figure. Apply the power to do. As a result, the cured resin 14 is extruded on the “surface” that rotates as in the case of FIG. 1, and the area where the molded product 15 is extruded is larger than in the case of FIG. Therefore, the rotational speed of each movable block 7 can be reduced and the molded product 15 can be pushed out, so that the adverse effect on the molded product 15 is reduced as compared with the case shown in FIG. Further, since the cross-sectional shape of the notch 8 is not stepped, the manufacture of each movable block 7 is facilitated.

  Example 2 of the resin mold and the method for taking out a molded product according to the present invention will be described with reference to FIG. FIG. 3 (1) shows a state in which the cured resin is formed after the resin mold according to this embodiment is clamped, and FIG. 3 (2) shows a state in which the resin mold is opened and the molded product is extruded. FIG. The feature of the present embodiment is that, when the resin mold 3 is opened, in addition to extruding the cured resin 14 on the “surface” rotated by each movable block 7 as in the first embodiment, It is to extrude the molded product 15 at the “surface”.

  As shown in FIG. 3, a groove 16 extending along the axial direction is provided on the side peripheral surface of each movable block 7. The groove portion 16 extends substantially from end to end in the axial direction of each movable block 7, is closed near the end, and is connected to a pipe (not shown) at a predetermined position. These pipes are connected to high-pressure fluid supply means such as a high-pressure tank (both not shown) via valves. Further, when each movable block 7 is in the initial position (position shown in FIG. 3 (1)), each groove 16 is not exposed to the mold surface of the cavity 9 and is contained in the space 6. . Further, as shown in FIG. 3 (2), each groove portion 16 is formed in the cavity 9 in a state in which each movable block 7 reciprocates (rotates in this embodiment) by a predetermined angle in a predetermined direction. An opening 17 is formed on the mold surface.

  A method for taking out a molded product according to the present embodiment will be described with reference to FIG. First, in the same manner as shown in FIG. 1A, the substrate 13 is placed on the lower mold 1, the lower mold 1 and the upper mold 2 are clamped, and a fluid resin (not shown) is placed in the cavity 9. ) To cure it. Thereby, as shown in FIG. 3 (1), the cured resin 14 is formed. The movable block 7 is kept at the initial position until this state.

  Next, as shown in FIG. 3 (2), the lower die 1 and the upper die 2 are opened as in the case shown in FIG. 1 (3), and the movable block 7 shown on the left side of the drawing is moved. The movable block 7 shown on the right side is rotated in the counterclockwise direction in the clockwise direction. In this embodiment, the lower mold 1 and the upper mold 2 are opened, and a high-pressure fluid such as compressed air 18 is supplied to each groove 16. Then, the compressed air 18 is ejected from the opening 17 into the cavity 9, that is, toward the cured resin 14, or toward the space between the cured resin 14 and the mold surface of the cavity 9. Thus, similarly to the first embodiment, the movable block 7 pushes the molded product 15 on the movable surface 11 having a predetermined area, that is, on the rotating “surface”, so that the cured resin 14 included in the molded product 15 and The mold surface of the cavity 9 is separated. Further, while the movable surface 11 continues to separate the cured resin 14 and the mold surface of the cavity 9 toward the cured resin 14 or toward the space formed between the cured resin 14 and the mold surface of the cavity 9, Compressed air 18 is ejected. Thus, the compressed air 18 acts like a wedge and pushes the cured resin 14 at the “surface”, thereby assisting the separation between the cured resin 14 and the mold surface of the cavity 9. Therefore, particularly in the vicinity of the center of the mold surface of the cavity 9, the cured resin 14 can be quickly separated from the mold surface while suppressing the stress generated in the molded product 15 (particularly the cured resin 14). Thereafter, the molded product 15 is unloaded by an appropriate method.

  According to the present embodiment, the same effect as in the first embodiment can be obtained. Further, the compressed air 18 assists the separation of the cured resin 14 and the mold surface of the cavity 9 by extruding the cured resin 14 on the “surface”, and therefore adverse effects such as stress applied to the molded product 15 in a shorter time. Is reduced so that the molded product 15 is released from the lower mold 1. Further, by changing the area of the opening 17 or the pressure of the compressed air 18, the molded product 15 can be pushed out with an optimum force according to the characteristics of the molded product 15, so that adverse effects on the molded product 15 are reduced. . Furthermore, since it is not necessary to provide piping in the base part 4, the complexity of the lower mold 1 can be avoided.

  Hereinafter, a modification of the present embodiment will be described with reference to FIG. 4 (1) shows a state in which a cured resin is formed after the resin mold according to this modification is clamped, and FIG. 4 (2) shows a state in which the resin mold has been opened and the molded product has been extruded. FIG. In this modification, the high-pressure fluid path 19 is formed in the movable block 7 so as to be connected to the groove 16 and to penetrate to the opposite side of the groove 16. The high-pressure fluid path 19 is exposed to the mold surface of the cavity 9 to form an opening 17. Here, one high-pressure fluid path 19 may be provided so as to extend substantially from end to end in the axial direction of the movable block 7, or a plurality of high-pressure fluid paths 19 may be provided in a jumping manner. According to this modification, the size, number, and the like of the opening 17 can be determined according to the adhesion between the mold surface of the cavity 9 and the cured resin 14, the area where they are in close contact, and the like. Thereby, for example, when the adhesion strength of the cavity 9 to the mold surface is small due to the characteristics of the cured resin 14, the area of the opening 17 can be reduced or the number of the high-pressure fluid paths 19 can be reduced. Therefore, since the molded product 15 can be pushed out with an optimum force in accordance with the characteristics of the molded product 15, adverse effects on the molded product 15 are reduced.

  In the present embodiment (including modifications, the same applies hereinafter), before each movable block 7 rotates and an opening 17 is formed in the mold surface of the cavity 9, compressed air 18 is supplied to each groove 16. It is preferable to supply. Thereby, as soon as the opening 17 starts to be formed, the compressed air 18 is jetted into the space between the cured resin 14 and the fixed surface 10. Moreover, it is preferable that the opening 17 is formed in as short a time as possible after each movable block 7 starts to rotate. As a result, the compressed air 18 is immediately ejected as soon as a space between the cured resin 14 and the fixed surface 10 is formed. Therefore, the forces generated by the movable blocks 7 and the compressed air 18 cooperate with each other in the cured resin 14. Works. Therefore, the effect that the molded product 15 is released from the lower mold 1 in a short time and in such a manner that adverse effects such as stress applied to the molded product 15 are reduced is increased.

  In this embodiment, compressed air is used as the high pressure fluid. As the high-pressure fluid, high-pressure gas (nitrogen gas or the like) other than compressed air may be used. Further, depending on the properties of the molded product 15, a liquid such as high-pressure water can be used.

  A third embodiment of the resin mold and the method for taking out a molded product according to the present invention will be described with reference to FIG. FIG. 5 (1) shows a state in which the cured resin is formed after the resin mold according to this embodiment is clamped, and FIG. 5 (2) shows a state in which the resin mold is opened and the molded product is extruded. FIG. The feature of the present embodiment is that, firstly, each movable block 7 has a prismatic shape (in the figure, a regular quadrangular prism shape) instead of a substantially cylindrical shape. Secondly, the lower mold 1 is composed of a plurality of blocks 20, 21 and 22.

  According to the present embodiment, the same effect as in the first embodiment can be obtained. In addition, since the degree of processing the side peripheral surface with respect to the movable block 7 is small, the configuration of the movable block 7 is simplified. In addition, since it is not necessary to provide a substantially cylindrical space (corresponding to the space 6 in FIGS. 1 to 4) in the lower mold 1, the configuration of the lower mold 1 is simplified.

  In Example 1-3 described above (including each modification example, the same applies hereinafter), the space 6 and the movable block 7 are enlarged, and the side peripheral surface of each movable block 7 is hardened in the molded product 15. You may make it contact | connect not only the resin 14 but the insert member, ie, the board | substrate 13. FIG. Thereby, each movable block 7 has a predetermined area and applies a force not only to the cured resin 14 but also to the substrate 13 on the rotating surface, that is, the movable surface 11. Therefore, since the movable surface 11 pushes out or separates the cured resin 14 and the substrate 13, the stress generated in the molded product 15 is dispersed, so that adverse effects on the molded product 15 are reduced.

  Example 4 of the resin mold and the method for taking out a molded product according to the present invention will be described with reference to FIG. FIG. 6 (1) shows a state in which the resin mold according to the present embodiment is opened, and FIG. 6 (2) shows a state in which the cured resin is formed after the resin mold is clamped with the substrate interposed therebetween. 6 (3) is a partial cross-sectional view showing a state where the resin mold is opened and the molded product is extruded. As shown in FIG. 6, the feature of the present embodiment is that, firstly, transfer molding is used, and in the resin filling portion composed of a space to be filled with the fluid resin in the resin molding die 3, The main runner portion 23 connected to the cavity 9 is provided for the purpose of filling the cavity 9 with the fluid resin. Secondly, in the resin filling portion, a dummy runner portion 24 is provided so as to face the main runner portion 23 and accommodate the fluid resin overflowing from the cavity 9. Third, the pair of movable blocks 7 are reciprocably movable so as to face each other across the cavity 9 and overlap the main runner portion 23 and the dummy runner portion 24 (this embodiment) In this case, it is provided to be freely rotatable. Fourth, a part of the cavity 9 in the molded product 15 becomes an electronic component (or an assembly thereof) that is a product, and the cured resin 14 formed in the main runner portion 23 and the dummy runner portion 24 is finally It becomes unnecessary.

  According to this embodiment, the movable surface 11 having a predetermined area and rotating applies a force to the cured resin 14 formed in the main runner portion 23 and the dummy runner portion 24 facing each other. That is, the movable surface 11 pushes out the molded product 15 on the “surface” that rotates. Thereby, the same effect as Example 1 is acquired. In addition, the pair of movable blocks 7 includes, in the runner portion 23 and the dummy runner portion 24, an unnecessary portion that is not a product electronic component (or an assembly thereof) of the molded product 15, that is, of the cured resin 14. Extrude unnecessary parts. Thereby, the adverse effect on the product is reduced. Therefore, in the present embodiment, when the cavity 9 has a large area as in the case where a plurality of chips are mounted in a lattice shape on one substrate 13 and a large number of electronic components are obtained, the product This is particularly effective in that the adverse effect on the surface is reduced.

  In Embodiment 1-4 described above, only one movable block 7 may be provided and rotated. In this case, only one movable block 7 of the two movable blocks 7 shown in FIGS. 1 to 6 is provided and rotated. According to this configuration, the stress generated in the molded product 15 increases as compared to the case where two movable blocks 7 are provided. Therefore, this configuration can be employed when the molded product 15 is not easily affected by the stress.

  Example 5 of the resin mold and the method for taking out a molded product according to the present invention will be described with reference to FIG. FIG. 7 (1) shows a state in which the resin mold according to the present embodiment is opened, and FIG. 7 (2) shows a state in which the cured resin is formed after the resin mold is clamped with the substrate sandwiched therebetween. 7 (3) is a partial cross-sectional view showing a state where the resin mold is opened and the molded product is extruded. A feature of the present embodiment is that a substantially semicircular and groove-shaped space 6 is provided in a substantially central portion of the cavity 9, and a single column-shaped movable member having a substantially semicircular cross section is provided in the space 6. That is, the block 7 is fitted so as to be reciprocally movable (in this embodiment, freely rotatable). In other words, in this embodiment, the movable surface 11 is included only in the inner bottom surface of the cavity 9.

  In this embodiment, first, from the state shown in FIG. 7 (2), the upper mold 2 is raised to open the lower mold 1 and the upper mold 2, and a rotating means (not shown) such as a motor is used. Then, the movable block 7 is rotated in the counterclockwise direction. As a result, as shown in FIG. 7 (3), the movable surface 11 which the movable block 7 has and has a predetermined area exerts a force on the molded product 15 at substantially the center of the cavity 9. In detail, immediately after each movable block 7 starts to rotate, the right half of the figure pushes the molded product 15 out of the movable surface 11 that rotates, and the left half of the figure shows the molded product from that surface. Pull 15 apart.

  Next, by further rotating the movable block 7, the movable block 7 further pushes out the molded product 15, and the molded product 15 is pulled away from the fixed surface 10 at the left end portion of the cavity 9 in the drawing. Thereby, the molded product 15 is completely released from the lower mold 1. Then, the movable block 7 is returned to the initial position, the molded product 15 is held by an appropriate method such as suction or clamping, and the molded product 15 is conveyed to a storage jig such as a tray or the next process.

  According to the present embodiment, the same effect as in the first embodiment can be obtained. In addition, one movable block 7 is provided in the substantially central portion of the cavity 9, and when the movable block 7 rotates, the molded product 15 is molded on the “surface” that rotates with a predetermined area. Push or pull away from the surface. Thereby, especially when the cavity 9 has a large area, the area of the movable block 7 is compared with the configuration in which the movable blocks 7 are respectively provided at both ends of the cavity 9 (see FIGS. 1, 2 and 5). -By properly determining the shape, the adverse effects on the product are further reduced. In addition, since one movable block 7 is provided in one space 6, the configuration of the lower mold 1 is simplified.

  The direction in which the movable block 7 is rotated may be a clockwise direction. Further, after the movable block 7 is rotated by a predetermined minute angle in one direction, it can be rotated by a predetermined minute angle in the opposite direction. Accordingly, the movable block 7 is rotated, and the molded product 15 can be pushed out or separated from the mold surface on the “surface” having a predetermined area and rotating.

  In Example 1-5 described above, the angle at which each movable block 7 rotates to push the molded product 15 upward may be an angle that reliably separates the molded product 15 from the mold surface of the cavity 9. . Moreover, what is necessary is just the angle which extrudes this so that the molded article 15 may be hold | maintained easily as needed. Further, the angular velocity at which each movable block 7 rotates may be an angular velocity that does not adversely affect the molded product 15. Each movable block 7 can also be rotated in two stages (or three or more stages), that is, an operation for separating the molded product 15 from the mold surface of the cavity 9 and an operation for pushing the molded product 15 upward. .

Reference example

A reference example of a resin mold and a method for taking out a molded product according to the present invention will be described with reference to FIG. FIG. 8 (1) shows a state in which the cured resin is formed after the resin mold according to this reference example is clamped with the substrate interposed therebetween, and FIG. 8 (2) shows that the resin mold is opened and the cam mechanism is opened. FIG. 8 (3) is a partial cross-sectional view showing a state where the movable block is raised by the rotation, and FIG. 8 (3) is a state where the movable block is lowered by the rotation of the cam mechanism from the state of FIG. 8 (2). The feature of this reference example is that a cylindrical space 25 extending perpendicularly to the mold surface is provided in the substantially central portion of the cavity 9 in the lower mold 1 and is a columnar shape that occupies a certain portion of the mold surface at the initial position. That is, the movable block 26 is provided in the space 25 so as to be reciprocally movable (in this reference example , freely movable up and down), and the movable block 26 is engaged with the cam mechanism 27. Since the movable block 26 is always pulled downward by a tension spring (not shown), for example, the movable block 26 is raised or lowered from the initial position shown in FIG. The gap between the space 25 and the movable block 26 is maintained at such a size that the movable block 26 can be moved up and down and the fluid resin does not enter. Also in this reference example , the movable surface 28 having a predetermined area is included only in the inner bottom surface of the cavity 9.

In this reference example , first, after the mold is clamped to form the cured resin 14 in the state shown in FIG. 8A, that is, the movable block 26 is in the initial position, the upper mold 2 is raised and the lower mold 1 is moved. Open the upper mold 2. At the same time, the movable block 26 is raised from the initial position as shown in FIG. 8B by rotating the cam mechanism 27 by a predetermined angle in the clockwise direction. As a result, the movable surface 28 which is the surface of the movable block 26 and rises applies an upward force to the molded product 15. Accordingly, the molded product 15 rises, and the cured resin 14 of the molded product 15 is pulled away from the fixed surface 10 in the cavity 9 in the vicinity of both ends of the cavity 9.

  Next, as shown in FIG. 8 (3), the movable block 26 is lowered from the initial position by rotating the cam mechanism 27 in a counterclockwise direction by a predetermined angle. As a result, the movable surface 28 which is the surface of the movable block 26 and descends applies a downward force to the molded product 15. Accordingly, the molded product 15 is held at both ends of the cavity 9, and the cured resin 14 of the molded product 15 has a predetermined area in the cavity 9, and a downward force is applied from the movable surface 28 that descends, It is pulled away from the movable surface 28.

According to this reference example , the same effects as those of the first embodiment can be obtained. In addition, as the movable block 26 provided at the substantially central portion of the cavity 9 rises, the movable surface 28 having a predetermined area rises in the vicinity of both ends of the cavity 9 and the cured resin 14 of the molded product 15. Are separated from the fixed surface 10 at the “surface”. Further, as the movable block 26 descends, the movable surface 28 having a predetermined area in the cavity 9 and descending pulls the cured resin 14 of the molded product 15 away from the movable surface 28 at the “surface”. Thus, particularly when the cavity 9 has a large area, the movable block 7 is provided at both ends of the cavity 9 by appropriately determining the area and shape of the movable block 7 (FIGS. 1, 2, and 3). 5), the adverse effect on the product is further reduced.

In the present reference example , the movable block 26 was raised from the initial position and lowered at the substantially central portion of the cavity 9. By reversing this order, the movable block 26 can be raised after being lowered from the initial position. Further, the movable block 26 may perform an operation of moving back and forth without being lifted or lowered.

Also, this reference example can be applied to the first and fourth embodiments. In this case, instead of the combination of the space 6 and the movable block 7 shown in FIGS. 1, 2 and 6, the combination of the space 25, the movable block 26 and the cam mechanism 27 shown in FIG. Only a pair need be provided.

Further, in Example 5, one movable block 7 having the movable surface 11 included only in the inner bottom surface of the cavity 9 was provided at the substantially central portion of the cavity 9 and the movable block 7 was rotated. In the present reference example , one movable block 26 having a movable surface 28 included only in the inner bottom surface of the cavity 9 is provided in the substantially central portion of the cavity 9, and the movable block 26 is moved up and down. In the fifth embodiment , a plurality of movable blocks 7 including the movable surface 11 included in the inner surface of the cavity 9 and having a predetermined area may be provided over the entire cavity 9. One movable block 7 may be provided so that the movable surface 11 corresponds to the entire inner surface of the cavity 9.

Incidentally, Oite to the above embodiments (Example 1 5), the movable block 7 as a mechanism for reciprocating (turning), was used rotation means of the motor and the like. Not only this but other rotation means can also be used. In the reference example , the cam mechanism 27 is used as a mechanism for reciprocating (moving up and down) the movable block 26. Not limited to this, other rotating means, for example, an electromagnetic actuator or an actuator using fluid pressure may be used.

In addition, among the above-described embodiments (embodiments 1-5 ), the base portion 4 of the lower mold 1 can be configured by combining a plurality of blocks other than the embodiment 3 (see FIG. 5). This facilitates processing and assembly of the lower mold 1.

Of the above-described embodiments, the fourth embodiment is applied to transfer molding. Other examples and reference examples can be applied not only to transfer molding but also to compression molding and injection molding.

  Moreover, in each Example mentioned above, the case where the board | substrate 13 was used as an insert member was demonstrated. The present invention is not limited to this, and the present invention can be applied to resin molding that does not use an insert member.

The high-pressure fluid injection described in the second embodiment can be applied to other embodiments and reference examples . Furthermore, the opening 17 for injecting the high-pressure fluid in FIGS. 3 and 4 is not limited to the side peripheral surface of the movable block 7 and may be provided on the base portion 4 side. For example, the opening 17 may be provided on an inner side surface that surrounds the spaces 6 and 25 and may constitute a portion connected to the cavity 9. Thus, the compressed air 18 acts like a wedge and pushes the cured resin 14 at the “surface”, thereby assisting the separation between the cured resin 14 and the mold surface of the cavity 9.

  In addition, the present invention is not limited to the above-described embodiments, and may be arbitrarily combined, changed, or selected as necessary without departing from the spirit of the present invention. It can be done.

FIG. 1 (1) shows a state in which the resin mold according to Example 1 is opened, and FIG. 1 (2) shows a state in which a cured resin is formed after the resin mold has been clamped with a substrate interposed therebetween. 1 (3) is a partial cross-sectional view showing a state where the resin mold is opened and the molded product is extruded. 2 (1) shows a state in which the cured resin is formed after the resin mold according to the modification of Example 1 is clamped, and FIG. 2 (2) shows that the resin mold is opened and the molded product is extruded. It is a fragmentary sectional view showing each state. 3 (1) shows a state in which the cured resin is formed after the resin mold according to Example 2 is clamped, and FIG. 3 (2) shows a state in which the resin mold is opened and the molded product is extruded. FIG. 4 (1) shows a state in which the cured resin is formed after the resin mold according to the modification of Example 2 is clamped, and FIG. 4 (2) shows that the resin mold is opened and the molded product is extruded. It is a fragmentary sectional view showing each state. 5 (1) shows a state in which a cured resin is formed after the resin mold according to Example 3 is clamped, and FIG. 5 (2) shows a state in which the resin mold has been opened and a molded product has been extruded. FIG. 6 (1) shows a state in which the resin mold according to Example 4 is opened, and FIG. 6 (2) shows a state in which the cured resin is formed after the resin mold is clamped with the substrate sandwiched therebetween. 6 (3) is a partial cross-sectional view showing a state where the resin mold is opened and the molded product is extruded. FIG. 7 (1) shows a state in which the resin mold according to Example 5 is opened, and FIG. 7 (2) shows a state in which the cured resin is formed after the resin mold has been clamped with the substrate interposed therebetween. 7 (3) is a partial cross-sectional view showing a state where the resin mold is opened and the molded product is extruded. FIG. 8 (1) shows a state in which the cured resin is formed after the resin mold according to the reference example is clamped with the substrate interposed therebetween, and FIG. 8 (2) shows that the resin mold is opened and the cam mechanism is rotated. FIG. 8 (3) is a partial cross-sectional view showing a state where the movable block is lifted by movement, and FIG. 8 (3) is a state where the movable block is lowered by the rotation of the cam mechanism from the state of FIG. 8 (2).

1 Lower mold 2 Upper mold 3 Resin mold 4 Base (fixed block)
DESCRIPTION OF SYMBOLS 5 Recess 6, 25 Space 7, 26 Movable block 8 Notch 9 Cavity 10 Fixed surface 11, 28 Movable surface 12 Central axis 13 Substrate 14 Cured resin 15 Molded product 16 Groove (fluid path)
17 Opening 18 Compressed air (high pressure fluid)
19 High-pressure fluid path (fluid path)
20, 21, 22 Block 23 Runner part 24 Dummy runner part 27 Cam mechanism (reciprocating means)

Claims (6)

A resin-filled portion including at least a cavity; and after the resin-filled portion is filled with a flowable resin, the flowable resin is cured to form a cured resin, including at least the cured resin and a product. A resin mold used to complete a molded product,
A fixed block constituting a fixed surface fixed to the molded product among mold surfaces that can come into contact with the molded product;
One or a plurality of movable blocks which are configured to be movable in a reciprocating manner while constituting a movable surface having a predetermined area and including a portion other than the fixed surface of the mold surface;
Reciprocating means for reciprocating the one or more movable blocks, and
After the cured resin is formed, the one or more movable blocks operate to apply force to the molded product on the movable surface, so that the molded product is released in a state where the mold clamping of the resin mold is released. Release from the mold surface ,
The movable surface of the one or more movable blocks constitutes at least a part of an inner bottom surface of the cavity;
The reciprocating means is a rotation mechanism that engages with the one or more movable blocks,
A resin molding die in which the one or more movable blocks are released from the molded product when the one or more movable blocks are rotated according to the rotation of the rotation mechanism . The resin mold according to claim 1, wherein
The plurality of movable blocks are respectively provided so as to face each other along opposite ends of the cavity. The resin mold according to claim 1, wherein
A main runner portion provided in the resin filling portion for the purpose of filling the cavity with the fluid resin;
A dummy runner portion provided in the resin filling portion so as to face the main runner portion, and
The cured resin formed in the main runner part and the dummy runner part of the molded product is an unnecessary part not included in the product,
The plurality of movable blocks are provided so as to face each other across the cavity and to overlap at least a part of the main runner part and at least a part of the dummy runner part. A resin mold characterized by. In the resin mold in any one of Claims 1-3 ,
A fluid path provided in at least the one or more movable blocks and through which a high-pressure fluid flows;
An opening formed by the fluid path at least on the side peripheral surface;
High pressure fluid supply means connected to the fluid path,
After at least the one or more movable blocks start reciprocating, the high-pressure fluid is ejected from the opening toward the molded product or toward the space between the molded product and the mold surface. A resin mold characterized by that. A resin mold having a resin filling portion including at least a cavity is prepared, the resin filling portion is filled with a flowable resin, and the flowable resin is cured to form a cured resin. A method for taking out a molded product when taking out a molded product containing
One or a plurality of movable members that are configured to form a movable surface that has a predetermined area and includes a portion other than the fixed surface that is fixed to the molded product among the mold surfaces that can contact the molded product. Releasing the molded product from the mold surface in a state where the mold clamping of the resin mold is released by operating a block and applying force to the molded product on the movable surface;
A step of carrying out the released molded product ,
In the step of releasing the mold, the one or more movable blocks are used by rotating a rotation mechanism that engages with the one or more movable blocks and rotating the one or more movable blocks. And removing the molded product from the mold surface . In the method for taking out a molded product according to claim 5 ,
In the step of releasing, at least from the opening provided on the side peripheral surface of the one or more movable blocks, toward the molded product or toward the space between the molded product and the mold surface, A method for taking out a molded product, comprising ejecting a fluid.

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