WO2008041431A1 - Procédé de moulage d'un joint en résine, et appareil de moulage d'un joint en resine pour utilisation dans le procédé - Google Patents

Procédé de moulage d'un joint en résine, et appareil de moulage d'un joint en resine pour utilisation dans le procédé Download PDF

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Publication number
WO2008041431A1
WO2008041431A1 PCT/JP2007/066716 JP2007066716W WO2008041431A1 WO 2008041431 A1 WO2008041431 A1 WO 2008041431A1 JP 2007066716 W JP2007066716 W JP 2007066716W WO 2008041431 A1 WO2008041431 A1 WO 2008041431A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
mold
cavity
substrate
pot
Prior art date
Application number
PCT/JP2007/066716
Other languages
English (en)
Japanese (ja)
Inventor
Keiji Maeda
Hideki Tokuyama
Original Assignee
Towa Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corporation filed Critical Towa Corporation
Publication of WO2008041431A1 publication Critical patent/WO2008041431A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a resin sealing molding method of an electronic component for sealing and molding an electronic component such as an IC (Integrated Circuit) mounted on a substrate with a resin material and a resin sealing molding apparatus used therefor. is there.
  • a resin-sealed molding apparatus in which mold assemblies having an upper mold and a lower mold are stacked in the vertical direction has been used.
  • a resin injection mechanism is provided on the side of the mold assembly laminated structure stacked in the vertical direction. This resin injecting mechanism can contact the mold assembly layered structure or leave the mold assembly layered structure.
  • the resin injection mechanism has a pot and a plunger extending in the horizontal direction.
  • the above-described resin injection mechanism is connected to the side surface of the mold assembly laminated structure. Thereafter, the resin material is melted by heating in the pot and pressurized by the plunger. As a result, the fluid resin is injected into the cavity through the resin passage (gate) provided in the upper mold.
  • the resin injection mechanism is separated from the mold assembly laminated structure.
  • the upper mold and the lower mold are opened with the plate set in the lower mold.
  • the gate resin 81 is ejected by a release eject pin provided at the upper mold gate position.
  • a molded product 80 is obtained in which a predetermined number of electronic components are integrally sealed with a resin material.
  • the molded product 80 includes a substrate 1, a cavity resin 18 having a shape corresponding to the shape of the aforementioned cavity, and a gate having a shape corresponding to the aforementioned resin passage.
  • the resin 81 unnecessary cured resin
  • a pot resin 82 having a shape corresponding to a part of the pot described above are included.
  • the unnecessary gate resin 81 and pot resin 82 cured in the pot and resin passage of the resin injection mechanism remain together with the package resin 18 constituting the finished product.
  • the gate resin 81 and the pot resin 82 are removed from the molded product 80.
  • a removal method for example, a method of removing the gate resin 81 by rotating it in the direction indicated by the arrow in FIG. This is called a gate break. According to this method, as shown in FIG. 13, a sealed substrate 83 is obtained.
  • the sealed substrate 83 is cut by a rotary cutting blade (blade) or the like. Thereby, the sealed substrate 83 is divided into individual packages.
  • a structure using a stacked mold assembly laminated structure and a pot provided outside the mold assembly laminated structure is a multi-layer structure or a PM (Pure Malt) structure. Called s fc.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2007-095803
  • Patent Document 2 JP 2007-095802 A
  • the damaged portion 84 may be formed in the package resin 18 as shown in FIG.
  • the gate resin 81 residues may adhere to the surface of the substrate 1.
  • some measures are required to remove the gate resin 81 from the substrate 1 without forming a defective portion in the molded product 80.
  • this measure it is conceivable to perform a staking process to prevent the gate resin 81 from adhering to the position where the gate resin 81 adheres to the substrate 1 and the position in the vicinity thereof.
  • the thickness of only the portion subjected to the gold plating process increases. For this reason, the thickness of the substrate 1 becomes uneven. As a result, when the upper mold and the lower mold are closed, a gap is easily formed between the mold surface of the upper mold and the surface of the substrate. Therefore, when the resin enters the gap, the resin beam remains on the substrate.
  • the problem that occurs when removing the gate resin from the substrate is not limited to the case of using a resin sealing molding apparatus in which a pot is provided outside the mold assembly, but a pot is provided inside the mold assembly. This also occurs when the resin sealing molding apparatus is used. Next, this will be explained.
  • a pot In a resin sealing molding apparatus in which a pot is provided inside a mold assembly, a pot extending in the vertical direction having an opening on the mold surface is provided in the lower mold. In the pot, the resin material is melted by heating. This fluid resin is pushed out through the resin passage (mold gate) into the upper mold cavity by the pressurizing plunger. As a result, a molded product 85 is obtained as shown in FIG.
  • the damaged portion 84 is formed in the package resin 18 of the sealed substrate 83, and the gate resin 81 not shown in the figure. Residue remains on the substrate 1.
  • the gate resin 81 is projected by the release eject pin. According to this, it is possible to remove the package resin 18 from the upper mold cavity without forming a defect in the molded product. However, it is impossible to take out the gate resin 81 from the upper mold without forming a defect in the molded product. Therefore, an eject pin is provided on the mold gate. Therefore, the resin sealing molding apparatus having the above-described multilayer structure is increased in size because it is necessary to provide an eject pin for each mold assembly.
  • the present invention has been made in view of the above-described problems, and an object of the present invention is to remove the gate resin from the substrate without forming a defective portion in the molded product, and to reduce the size of the apparatus.
  • the present invention provides a resin sealing molding method and a resin sealing molding apparatus used therefor.
  • the resin sealing molding method of the present invention first, a first mold and a second mold facing the first mold are formed. Next, a substrate on which electronic components are mounted on the first mold is set. Then, by closing the first mold and the second mold, the electronic component is inserted into the second mold cavity. Next, by connecting a resin injection mechanism having a pot to the side surface of the second mold, the resin passage that communicates with the cavity but does not face the substrate communicates with the pot. Further, by pressurizing the resin material in the pot, the fluid resin is injected into the cavity from the resin injection mechanism through the resin passage. Thereafter, the fluid resin is cured. Next, the resin injection mechanism is separated from the second mold, and the cured resin in the resin passage and the cured resin in the cavity are separated.
  • the fluid resin is injected into the cavity from the resin passage through a resin injection portion provided between the cavity and the resin passage.
  • the resin sealing molding apparatus of the present invention is the first in which a substrate on which an electronic component is mounted can be mounted.
  • a mold and a second mold that is opposed to the first mold and has a cavity into which an electronic component can be inserted and a resin passage that communicates the cavity with the outside are provided.
  • the resin injection mechanism is connected to the side surface of the second mold in a state where the first mold and the second mold are closed. Also, the resin material in the pot can be injected into the cavity without contacting the substrate in the resin passage.
  • the gate resin can be removed from the substrate without forming a defective portion in the molded product, and the apparatus can be miniaturized. I'll do it.
  • FIG. 1 is a longitudinal sectional view schematically showing a resin sealing molding apparatus of Example 1, and shows a state where each of a plurality of mold assemblies is opened.
  • FIG. 2 is a side view schematically showing the resin sealing molding apparatus shown in FIG. 1.
  • FIG. 3 is a longitudinal sectional view schematically showing a main part of the resin sealing molding apparatus shown in FIG. 1, showing a state where a pot of a resin injection mechanism is connected to a side surface of the mold assembly laminated structure. ing.
  • FIG. 4 is a longitudinal sectional view schematically showing the main part of the resin sealing molding apparatus of Example 1, in which the fluid resin passes from the pot of the resin injection mechanism to the upper mold cavity of the mold assembly through the resin passage. Show the state of being injected!
  • FIG. 5 is a longitudinal sectional view schematically showing a main part of the resin sealing molding apparatus of Example 1, in which the gate resin cured in the resin passage by separating the resin injection mechanism from the mold assembly is resin. Show the state of being pulled out of the aisle!
  • FIG. 6 is a longitudinal sectional view schematically showing a main part of the resin sealing molding apparatus of Example 1, and shows a state in which the molded product is removed from the upper mold cavity by opening the mold assembly. Show
  • FIG. 7 is a longitudinal sectional view schematically showing a main part of a resin sealing molding apparatus of Example 2, and includes a bra The state immediately before the plunger pushes out the resin material is shown.
  • FIG. 8 is a longitudinal sectional view schematically showing the main part of the resin sealing molding apparatus of Example 2, showing the state when the plunger pushes out the resin material! / .
  • FIG. 9 is a longitudinal sectional view schematically showing a main part of the resin sealing molding apparatus of Example 2, in which the gate resin cured in the resin passage when the resin injection mechanism is pulled away from the mold assembly is resin. Show the state of being pulled out of the aisle!
  • FIG. 10 is a longitudinal sectional view schematically showing a main part of the resin sealing molding apparatus of Example 2, and shows a state where the molded product is removed from the upper mold cavity by opening the mold assembly. It shows.
  • FIG. 11 is a longitudinal sectional view schematically showing a molded product sealed with resin using a conventional resin sealing molding apparatus.
  • FIG. 12 is a longitudinal sectional view schematically showing a molded product sealed with resin using another conventional resin sealing molding apparatus.
  • FIG. 13 is a longitudinal sectional view schematically showing a sealed substrate after unnecessary cured resin is removed from a molded product formed using a conventional resin sealing molding apparatus.
  • the resin seal molding apparatus for electronic parts of Example 1 includes a mold assembly 4.
  • a predetermined number of electronic components 23 mounted on a single substrate 1 are sealed with resin.
  • a predetermined number of electronic components 23 are integrally molded on one main surface of the substrate 1.
  • the mold assembly 4 includes a lower mold 1 as an example of the first mold of the present invention and an upper mold 2 as an example of the second mold of the present invention that faces the lower mold 3.
  • the mold assembly laminated structure 5 is formed.
  • a predetermined number for example, four electronic components 23 mounted on one substrate 1 are integrally sealed with resin.
  • the mold assembly laminated structure 5 includes two sets of mold assemblies 4 having a mold assembly 4a and a mold assembly 4b.
  • the resin sealing molding apparatus includes a substrate supply / extraction mechanism (not shown), a mold opening / closing mechanism 7, and a mold clamping mechanism 8 (press frame mechanism).
  • the substrate supply / extraction mechanism supplies the unmolded substrate 1 to the mold assembly 4 and takes out the molded substrate 6 from the mold assembly 4.
  • Mold assembly 4 consists of mold assemblies 4a and 4b.
  • the mold opening / closing mechanism 7 opens and closes the upper mold 2a and the lower mold 3a in the mold assembly 4a, and opens and closes the upper mold 2b and the lower mold 3b in the mold assembly 4b.
  • the mold clamping mechanism 8 adds a predetermined mold clamping force to the upper mold 2a and the lower mold 3a, and adds a predetermined mold clamping force to the upper mold 2b and the lower mold 3b.
  • the mold opening / closing mechanism 7 is provided between the mold assembly 4a and the mold assembly 4b.
  • the body 7a of the mold opening / closing mechanism 7 includes a lower mold 3a in the upper mold assembly structure 4a and an upper mold 2b in the lower mold assembly 4b.
  • the resin sealing molding apparatus includes a resin injection mechanism 9 provided outside the mold assembly 4.
  • the resin injection mechanism 9 is a resin material that is melted by heating into the mold assembly 4.
  • a pot block having a pot 12 and a plunger 13 extending in the horizontal direction is included for injecting the movable resin.
  • a fluid resin in which a solid resin is melted by heating is used! /, A liquid resin melted without heating! /, A liquid resin that is melted without heating is used as the fluid resin. It can be used.
  • the resin sealing molding apparatus is provided with a reciprocating drive mechanism as shown in the figure.
  • the reciprocating drive mechanism reciprocates in the horizontal direction to bring the resin injecting mechanism 9 into contact with the side surface 5a of the mold assembly laminated structure 5 or to separate it from the side surface 5a of the mold assembly laminated structure 5.
  • the pot tip opening 12a of the resin injection mechanism 9 comes into contact with the side surface 5a or separates from the side surface 5a.
  • the resin injection mechanism 9 is arranged on the side of the mold assembly laminated structure 5 and has two pots 12. Therefore, if the resin injection mechanism 9 is brought into contact with the side surface 5a of the mold assembly laminated structure 5 by the reciprocating drive mechanism, each of the mold assemblies 4a and 4b from the opening 12a formed at the tip of each pot of the resin injection mechanism 9 Fluidity resin can be supplied to Cavity 16.
  • the mold opening / closing mechanism 7 has a rack and pinion mechanism. It has a pinion gear 7b and rack gears 7c and 7d.
  • the pinion gear 7b is rotatably provided on the main body 7a of the mold opening / closing mechanism 7.
  • the upper rack gear 7c is fixed to the upper mold 2a on the upper side, and meshes with the pinion gear 7b.
  • the lower rack gear 7d is fixed to the lower lower mold 3b and meshes with the pinion gear 7b. Therefore, by rotating the pinion gear 7b in the forward direction and the reverse direction, the force S for opening and closing each of the mold assemblies 4a and 4b is used.
  • the mold clamping mechanism 8 includes a hold frame 10 and a pressing means 11.
  • the hold frame 10 is a cylindrical body extending in the horizontal direction, and is provided so as to surround the die assembly laminated structure 5.
  • the pressing means 11 is provided below the mold assembly laminated structure 5 in the hold frame 10, that is, below the lower mold 3b, and the mold assembly laminated structure 5 is directed upward. That is, it presses in the closing direction.
  • rectangular openings 10 a are provided at both ends of the hold frame 10.
  • the upper mold 2a in the upper mold assembly 4a is fixed to the upper inner surface of the hold frame 10.
  • the pressing means 11 and the mold clamping mechanism 8 are fixed to the inner surface of the lower side of the hold frame 10.
  • the upper mold 2a and the lower mold 3a on the upper side of the mold opening / closing mechanism 7 are closed, and the upper mold 2b and the lower mold 3b on the lower side of the mold opening / closing mechanism 7 are Closed.
  • the two mold assemblies 4 a and 4 b are pressed upward and downward by the pressing means 11, and are sandwiched by the pressing means 11 and the hold frame 10, respectively.
  • the mold clamping mechanism 8 applies a clamping force to each of the two mold assemblies 4.
  • the resin injection mechanism 9 includes a pot 12 extending in the horizontal direction for supplying a resin material, a plunger 13 extending in the horizontal direction for pressurizing the resin provided in the pot 12, and a resin supplied into the pot 12. Heating means (not shown) for heating the resin tablet 14 as a material. Note that a tip opening 12a of the pot 12 is provided on the side surface of the pot assembly 12 extending in the horizontal direction on the side of the mold assembly layered structure 5 side (two sets of mold assembly 4 side).
  • the resin sealing molding apparatus includes a resin tablet supply mechanism or a resin material transport supply mechanism, and a reciprocating drive mechanism.
  • the resin tablet supply mechanism supplies the resin tablet 14 from the pot tip opening 12a to the pot 12 in a state of being separated from the mold assembly laminated structure 5.
  • the reciprocating drive mechanism brings the resin injection mechanism 9 into contact with the side surface 5a of the mold assembly layered structure 5 or pulls it away from the side surface 5a. As a result, the pot tip opening 12 a of the pot 12 comes into contact with the side surface 5 a of the mold assembly laminated structure 5.
  • the resin tablet 14 is supplied to the pot 12 from the resin tablet supply mechanism. Thereafter, the plunger 13 is pressed in the horizontal direction (from right to left in the figure). At this time, the resin material is melted by heating in the pot 12. Therefore, the fluidized resin material is supplied to each mold assembly 4 through the resin passage.
  • Fig. 1, Fig. 5 and Fig. 6 show a state where the mold assembly laminated structure 5 and the resin injection mechanism 9 are separated from each other, and Fig. 3 and Fig. 4 show the mold assembly laminated structure 5 and The state where the resin injection mechanism 9 is in contact is shown.
  • a substrate setting surface 15 on which the substrate 1 is set is provided on the mold surface of the lower mold 3 in the mold assembly 4. Further, when the substrate 1 is set on the substrate setting surface 15, it is positioned in the same plane as the end surface 1 a of the substrate 1 and the side surface 5 a of the die assembly laminated structure 5.
  • the substrate setting surface 15 is provided with a substrate fixing mechanism.
  • the substrate fixing mechanism is for fixing the substrate 1 set on the substrate setting surface 15 to the substrate setting surface 15.
  • the substrate fixing mechanism includes, for example, a predetermined number of suction holes extending from the substrate setting surface 15, a vacuum mechanism such as a vacuum pump, and a vacuum nozzle that communicates the suction holes and the vacuum mechanism.
  • the vacuum suction mechanism forcibly sucks air through the suction hole and the vacuum pipe.
  • the substrate 1 is attracted to the substrate setting surface 15.
  • the end face la of the substrate 1 is positioned in the same plane as the side face 5a.
  • the substrate fixing mechanism provided on the substrate setting surface 15 is not limited to one using an adsorption action, and may use a fixture such as a metal fitting.
  • the package resin 18 in the cavity 16 and the gate resin 19 that is a cured resin in the resin passage 17 are cut.
  • the sealed substrate 6 including the package resin 18, the substrate 1, and the gate resin 19
  • the sealed substrate 6 is removed from the sealed substrate 6 (the package resin 18 and the substrate 1).
  • the upper mold 2 is provided with a single resin molding cavity 16.
  • the cavity 16 is a space having a size capable of receiving a predetermined number of electronic components 23 mounted on the board 1. Therefore, after the substrate supply / extraction mechanism sets the substrate 1 on the substrate setting surface 15 of the lower mold 3, the mold opening / closing mechanism 7 closes the upper mold 2 and the lower mold 3, so that a predetermined number of electronic components are placed in the cavity 16. 23 is purchased.
  • the upper mold cavity 16 includes a cavity top surface and a cavity side surface, and a cavity opening is formed in the mold surface of the upper mold 2.
  • the upper cavity 16 has a cavity top surface between the cavity top surface and the cavity side surface. Edge portion 16a. The edge portion 16a constitutes one side of the cavity top surface. The upper cavity 16 has an edge portion on the side surface of the cavity between the side surface of the cavity and the side surface of the cavity. The edge portion of the cavity side surface constitutes one side of the cavity side surface. The contact point between the two edges of the edge 16a of the cavity top surface and one side of the edge of the cavity side surface constitutes a corner of the cavity top surface.
  • a resin passage for resin transfer is provided between the side surface 5a on the resin injection mechanism 9 side of the upper mold 2 and the upper mold cavity 16 so as to penetrate the upper mold 2.
  • the resin passage 17 is configured as, for example, a conical through hole, and has an opening on each of the side surface 5a of the upper mold 2 and the inner surface of the upper mold cavity 16.
  • a conical apex-side portion constituting the resin passage 17 is positioned on the upper mold cavity 16 side. Therefore, the opening on the inner surface of the upper mold 16 is as small as the mold gate opening. Further, the conical bottom surface portion constituting the resin passage 17 is positioned on the side surface 5 a side of the upper mold 2.
  • the fluid resin 20 can be injected into the cavity 16 from the conical bottom side opening in the resin passage 17 through the apex side opening (Gutro).
  • the electronic component 23 mounted on the substrate 1 can be encapsulated in the package resin 18 corresponding to the shape of the cavity. As a result, a molded product 21 is obtained in the upper mold 2 and the lower mold 3.
  • the resin passage 17 is separated from the substrate 1. Therefore, the fluid resin can be injected into the upper mold cavity 16 without bringing the fluid resin 20 passing through the resin passage 17 into contact with the substrate 1.
  • the package resin 18 that is the cured resin in the cavity 16 and the gate resin 19 that is the cured resin in the resin passage 17 can be easily cut at the connecting portion. Therefore, by removing the gate resin 19 including the resin 22 cured in the pot 12 from the resin passage 17, that is, by separating the gate resin 19 cured in the resin passage 17 from the package resin 18, the gate resin 19 And the package resin 18 are separated from each other. That Thus, the molded product 21 is obtained.
  • the position where the resin passage 17 and the cavity 16 communicate with each other is such that the fluid resin 20 passing through the resin passage 17 does not come into contact with the substrate 1 set on the substrate setting surface 15; It may be a position.
  • the mold gate 17 as a resin passage communicates with the edge portion 16a of the cavity top surface so that an edge gate as a small opening is formed.
  • the resin passage 17 and the cavity 16 are provided at any position of the edge portion of the cavity top surface, the edge portion of the cavity side surface, the cavity top surface, the cavity side surface, and the cavity corner portion.
  • the resin passage 17 is a mold gate as a through hole.
  • the force resin passage 17 can include a part of the configuration of the mold for molding the molded product 21.
  • a part of a mold such as a mold runner and a mold pot may be included.
  • the molded product 21 includes a sealed substrate 6 having a substrate 1 and a package resin 18, a gate resin 19 cured in the resin passage 17, and a resin 22 cured in the pot 12 or the like.
  • the gate resin 19 is formed so as not to be pulled by the pulling force on the inner wall surface of the resin passage 17 when being pulled out from the resin passage 17. Therefore, by pulling the pot 12 of the resin injection mechanism 9 away from the upper mold 3 and the lower mold 2, the force S for easily extracting the gate resin 19 cured in the resin path 17 from the resin path 17 can be obtained.
  • the substrate supply / extraction mechanism sets one substrate 1 on the substrate setting surface 15 of the lower mold 3.
  • the mold opening / closing mechanism 7 closes the upper mold 3 and the lower mold 2.
  • a predetermined number of electronic components 23 on the substrate 1 are inserted into the upper mold cavity 16.
  • the substrate 1 is set on the lower die 2 with the side surface 5a of the mold assembly 4 and the end face la of the substrate 1 positioned in the same plane.
  • the resin injection mechanism 9 is moved by the reciprocating drive mechanism, and the pot tip opening 12 a of the pot 12 extending in the horizontal direction comes into contact with the side surface 5 a of the mold assembly 5. At this time, the tip opening 12 a of the pot 12 coincides with the opening of the resin passage 17.
  • the resin tablet 14 is pressurized by the resin pressurizing plunger 13 while being melted by heating in the pot 12 of the resin tablet.
  • the fluid resin 20 is injected into the cavity 16 through the resin passage 17.
  • the resin injection mechanism 9 is pulled away from the mold assembly 4. As a result, the gate resin 19 cured in the resin passage 17 and the package resin 18 cured in the cavity 16 are separated from each other at the connecting portion. Further, when the substrate assembly 1 is adsorbed to the lower mold 3 and the mold assembly 4 is opened, the package resin 18 is separated from the cavity 16 by the bow I.
  • the resin 22 cured in the pot 12 of the resin injection mechanism 9 is pressed by the plunger. Thereby, the gate resin 19 and the resin 22 that are cured resins can be extruded from the inside of the pot 12 to the outside.
  • the gate resin 19 is attached to the surface of the substrate 1.
  • the fluid resin 20 can be injected into the cavity 16 without contacting the surface of the substrate 1. Therefore, it is possible to prevent the gate resin 19 from adhering to the substrate 1.
  • the gate resin 19 can be extracted from the resin passage 17 when the resin injection mechanism 9 is separated from the mold assembly 4. Thereby, the goat resin 19 and the package resin 18 can be separated from each other at the connection portion. For this reason, it is not necessary to provide an ejection pin for the mold gate. Therefore, the resin sealing molding device can be reduced in size by the space for installing the ejector pin. [0076] Further, in the resin sealing molding method of this embodiment, if the resin is cured in the mold assembly 4! /, The resin injection mechanism 9 is changed from the mold assembly 4. Mold assembly 4 may be opened before pulling apart.
  • the step of separating the resin injection mechanism 9 from the mold assembly 4 and the step of opening the mold assembly 4 may be performed simultaneously.
  • the gate resin 19 cured in the resin passage and the package resin 18 cured in the cavity 16 can be separated from each other at the connection portion.
  • FIGS. 7 to 10 the same components as those of the resin sealing molding apparatus described with reference to FIGS. 1 to 6 in Example 1 described above are denoted by the same reference numerals. The description will not be repeated unless otherwise required.
  • the overall configuration of the resin sealing molding apparatus shown in FIGS. 7 to 10 is basically the same as the overall configuration of the resin sealing molding apparatus of Example 1 shown in FIGS. The explanation will not be repeated.
  • a resin locking portion 31 for locking the resin hardened in the pot 12 is provided on the inner surface of the pot 12.
  • the resin locking portion 31 is formed of a concave portion as a circumferential groove. Therefore, when the fluid resin is cured in the resin locking portion 31, the resin cured in the pot 12 is locked by the pot 12.
  • the resin tablet 14 is supplied into the pot 12.
  • the pot tip opening 12 a of the resin injection mechanism 9 is connected to the side surface 5 a of the mold assembly 4.
  • the resin material melted by heating in the pot 12 is pressurized by the plunger 13.
  • the fluid resin 32 is injected into the cavity 16 of the mold assembly 4.
  • the resin injection mechanism 9 is pulled away from the mold assembly 4.
  • the resin 33 cured in the pot 12 is locked by the resin locking portion 31.
  • the pot 12 and the cured resin 33 in the pot 22 are separated from the mold assembly 4 in an integrated state.
  • a substrate setting recess 34 is provided in the lower mold 3 of the mold assembly 4.
  • the board 1 having the predetermined number of electronic components 23 mounted thereon is set in the board setting recess 34.
  • the end face la is positioned in the same plane as the side surface 5 a of the mold structure 4.
  • the upper mold 2 in the mold assembly 4 is provided with a resin molding cavity 16 and a resin transfer resin passage 17 in the same manner as the resin sealing molding apparatus of the first embodiment described above. It has been. Further, a resin injection portion 35 for guiding the fluid resin 32 injected into the resin passage 17 to the cavity 16 is provided between the cavity 16 on the side of the cavity 16 and the resin passage 17.
  • the resin injection part 35 is a recess provided in the upper mold 2.
  • the resin injection portion 35 performs the same function as the mold gate, and the size of the injection port on the cavity 16 side of the resin injection portion 35 is substantially the same as the size of the mold gate port.
  • a fin gate structure may be adopted.
  • the fluid resin 32 injected from the resin passage 17 into the resin injection part 35 can be injected into the cavity 16 through the resin injection part 35.
  • the fin gate resin 36 cured in the resin injection portion 35 is formed adjacent to the package resin 18 on the surface of the substrate 1.
  • the mold surface opening of the resin injection portion 35 is provided in the mold surface of the upper mold 2.
  • the mold surface opening of the resin injecting portion 35 is positioned so as to coincide with the surface of the substrate 1 set in the substrate setting concave portion 34 in a state where the upper die 3 and the lower die 2 are closed.
  • the resin injecting portion 35 is positioned so as to come into contact with a side frame portion as an edge portion of the substrate 1.
  • the opening of the resin passage 17 and the opening of the mold surface of the upper mold 2 are provided in a state of being separated from each other with the space in the resin injection portion 35 as a medium.
  • the opening of the resin passage 17 has a small size about the gate opening.
  • the fluid resin 32 passing through the resin passage 17 is injected into the resin injection portion 35 without contacting the surface of the substrate 1.
  • the packaged resin 18 having a shape corresponding to the shape of the cavity 16 is sealed as a molded product 37 in which the electronic component 23 on the substrate 1 is included.
  • a substrate 38 is obtained.
  • the pot 12 together with the resin injection mechanism 9 can be obtained by pulling the resin injection mechanism 9 away from the mold assembly 4.
  • the resin 33 cured inside and the gate resin 19 cured in the resin passage 17 can be pulled away from the mold assembly 4.
  • the gate resin 19 and the fin gate resin 36 cured in the resin injection portion 35 can be separated from each other at the connection portion.
  • the substrate 1 on which a predetermined number of electronic components 23 are mounted is set in the substrate setting recess 34 of the lower mold 3.
  • each of the two mold assemblies 4 lined up and down is closed.
  • a predetermined number of electronic components 23 are included in the cavity 16.
  • the resin tablet 14 is supplied into the pot 12 of the resin injection mechanism 9.
  • the pot tip opening 12 a is connected to the side surface 5 a of the mold assembly 4 by moving the resin injection mechanism 9.
  • the resin material melted by heating in the pot 12 is pressurized by the plunger 13.
  • the fluid resin 32 is injected into the cavity 16 through the resin passage 17 and the resin injection portion 35.
  • a molded product 37 is obtained in which the electronic component 23 on the substrate 1 is enclosed in the package resin 18 having a shape corresponding to the shape of the cavity 16 in the cavity 16.
  • the resin injection mechanism 9 is pulled away from the mold assembly 4 in the same manner as the resin sealing molding method of Example 1. As a result, the gate resin 19 is extracted from the resin passage 17. As a result, the gate resin 19 in the resin passage 17 and the fin gate resin 36 cured in the resin injection portion 35 are separated from each other at the connection portion. After that, the sealed substrate 38 is taken out from the mold assembly 4 with the upper mold 3 and the lower mold 2 opened.
  • the gate resin 19 adheres to the surface of the substrate 1 according to a conventional resin sealing molding apparatus. However, according to the resin sealing molding apparatus of Example 2, since the fluid resin 32 is injected into the cavity 16 so as not to contact the surface of the substrate 1, the gate resin 19 adheres to the surface of the substrate 1. do not do.
  • the resin-sealing molding of the electronic component is performed by the space where the ejection pin is provided.
  • the size of the device can be reduced.
  • the mold assembly 4 after resin injection may be opened before the step of separating the resin injection mechanism 9 from the mold assembly 4. Further, the step of separating the resin injection mechanism 9 from the mold assembly 4 and the step of opening the mold assembly 4 after resin injection may be performed simultaneously.
  • the gate resin 19 cured in the resin passage 17 and the fin gate resin 36 cured in the resin injection portion 35 can be separated from each other at the connection portion.
  • the package resin 18 in the cavity 16 and the gate resin 19 in the resin passage 17 are mutually connected.
  • the fin gate resin 36 hardened in the resin injection portion 35 and the gate resin 19 in the resin passage 17 are separated from each other instead of being separated at the connection portion V. Therefore, when the gate resin 19 is pulled away from the package resin 18, the force S can easily prevent the package resin 18 from being damaged.
  • a mold assembly 4 in which a plurality of resin passages 17 are provided in one cavity 16 may be employed.
  • a mold assembly 4 in which two resin passages 17 are provided for one cavity 16 may be employed.
  • one pot 12 communicates with each of the two resin passages 17, and fluid resin is injected from one pot 12 into one of the cavities 16 through each of the two resin passages 17.
  • the upper mold 2 is provided with a plurality of cavities, and the resin passage 17 has a plurality of cavities.
  • a mold assembly 4 connected to each of the cavities may be employed.
  • two resin passages 17 respectively corresponding to two cavities 16 are provided, and the fluid resin is injected through a mold runner branched from one pot 12 to two resin passages 17.
  • Each of the resin passages 17 may be poured into two cavities 17.
  • the force with which one substrate 1 is set in the mold assembly 4 A plurality of substrates 1 may be set in the mold assembly 4.
  • a plurality of electronic components 23 mounted on a single substrate 1 are covered with resin as a single body.
  • 1S A plurality of electronic components 23 mounted on a single substrate 1 are provided.
  • the resin may be coated individually or by gnolep.
  • the force cavity 16 provided in the upper mold 2 may be provided in the lower mold 3.
  • a cavity may be provided in each of the upper mold 3 and the lower mold 2.
  • the mold assembly 4 is closed after the two substrates 1 are set in the mold assembly 4 in a state where the electronic component non-mounting surfaces of the two substrates 1 are in contact with each other.
  • the electronic component 23 can be inserted into each of the upper mold 3 and lower mold 2 cavities. Accordingly, the force S can be poured from the pot 12 into the upper mold 3 cavity and the lower mold 2 cavity through the resin passage 17 and the resin injection portion 35, respectively.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Un substrat (1) sur lequel est monté un composant électronique est tout d'abord disposé dans une matrice inférieure (3). La matrice inférieure (3) et une matrice supérieure (2) sont fermées, et le composant électronique est introduit dans une cavité (16) prévue dans la matrice supérieure (2). Un mécanisme de versement de résine (9) est ensuite relié à un ensemble de matrice (4), ce par quoi un pot d'injection (12) est relié à un passage de résine (17) en communication avec la cavité (16). Dans cet état, la matière de résine est fondue par chauffage dans le pot d'injection (12) et versée du pot d'injection (12) dans la cavité (16) à travers le passage de résine (17). Le mécanisme (9) d'alimentation ou de versement de résine est retiré de l'ensemble de matrice (4), ce par quoi le pot d'injection (12) est retiré du passage de résine (17). Il en résulte qu'une résine de conditionnement (18) à l'intérieur de la cavité (16) est séparée d'une résine (19) durcie à l'intérieur du passage de résine (17).
PCT/JP2007/066716 2006-10-03 2007-08-29 Procédé de moulage d'un joint en résine, et appareil de moulage d'un joint en resine pour utilisation dans le procédé WO2008041431A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006271708A JP2008087356A (ja) 2006-10-03 2006-10-03 電子部品の樹脂封止成形方法及び装置
JP2006-271708 2006-10-03

Publications (1)

Publication Number Publication Date
WO2008041431A1 true WO2008041431A1 (fr) 2008-04-10

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PCT/JP2007/066716 WO2008041431A1 (fr) 2006-10-03 2007-08-29 Procédé de moulage d'un joint en résine, et appareil de moulage d'un joint en resine pour utilisation dans le procédé

Country Status (3)

Country Link
JP (1) JP2008087356A (fr)
TW (1) TW200824013A (fr)
WO (1) WO2008041431A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2881232A1 (fr) * 2013-12-05 2015-06-10 Nakanishi Metal Works Co. Ltd. Article moulé par insertion annulaire
WO2022023009A1 (fr) * 2020-07-30 2022-02-03 Vitesco Technologies Germany Gmbh Dispositif de presse de moulage par injection pour surmoulage d'éléments semi-conducteurs et procédé de surmoulage d'éléments semi-conducteurs

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140346686A1 (en) * 2011-09-02 2014-11-27 Fu Peng Methods for forming color images on memory devices and memory devices formed thereby
KR101600170B1 (ko) * 2014-03-03 2016-03-07 하이디스 테크놀로지 주식회사 실런트 주입 장치
CN105216237A (zh) * 2015-10-31 2016-01-06 重庆市博平液压机械有限公司 液压机上密封圈的压注模

Citations (2)

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Publication number Priority date Publication date Assignee Title
JPH11284002A (ja) * 1998-03-31 1999-10-15 Sumitomo Heavy Ind Ltd 半導体素子の樹脂封止装置
JPH11354557A (ja) * 1998-06-08 1999-12-24 Sanyo Electric Co Ltd 混成集積回路装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11284002A (ja) * 1998-03-31 1999-10-15 Sumitomo Heavy Ind Ltd 半導体素子の樹脂封止装置
JPH11354557A (ja) * 1998-06-08 1999-12-24 Sanyo Electric Co Ltd 混成集積回路装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2881232A1 (fr) * 2013-12-05 2015-06-10 Nakanishi Metal Works Co. Ltd. Article moulé par insertion annulaire
WO2022023009A1 (fr) * 2020-07-30 2022-02-03 Vitesco Technologies Germany Gmbh Dispositif de presse de moulage par injection pour surmoulage d'éléments semi-conducteurs et procédé de surmoulage d'éléments semi-conducteurs

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JP2008087356A (ja) 2008-04-17

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