JPH1177733A - Resin molding method and resin molding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure molding of a resin without damaging a wiring pattern to be formed on the face on which a semiconductor chip is mounted of a circuit substrate. SOLUTION: This resin molding method is to coat the resin molding part of a mold with a release film 16, then clamp a circuit substrate 10 on one of the faces of which a semiconductor chip 11 is mounted through the release film 16 and supply a resin 14 to a cavity 12 from a pot 22 under pressure and further, fill a cavity 12 with the resin 14 to mold one of the faces of the circuit substrate 10 with the resin 14. In this resin molding method, the circuit substrate 10 with a gate hole 10a which runs through the substrate in a thickness direction within a range in which a resin molding part to be applied to the surface of the substrate and formed, is applied, is set as a part to be molded. Further, the resin 14 is molded by filling the cavity 12 with the resin 14 through a sprue 26 with one of the ends connected to a pot 22 and the other end connected to the gate hole 10a after passing on one of the faces of the circuit substrate 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding method and a resin molding apparatus for one-side resin molding of a circuit board such as a BGA board as a molded article.

[0002]

2. Description of the Related Art A resin molding method in which a resin molding surface of a resin mold is covered with a release film is a method for allowing resin molding without bringing the resin into contact with the resin molding surface of the mold. The molded product can be easily released from the mold, the structure of the mold can be simplified by eliminating the need for ejector pins, etc., and it has the advantages of using the most suitable mold resin material for the product. I have.

FIG. 7 shows a conventional method of resin-molding one side of a circuit board on which a semiconductor chip is mounted by a resin molding method using a release film. In the figure, a state in which the circuit board 10 is clamped by the upper mold and the lower mold in the left half of the center line CL, and a state in which the cavity 12 is filled with the resin 14 is shown in the right half of the center line CL. Reference numeral 16 denotes a release film. In this conventional example, the cavity 12 is provided in the lower mold, the resin sealing surface of the circuit board 10 faces downward, and the inner wall surface of the cavity 12 provided in the lower mold is covered with the release film 16.

Reference numeral 18 denotes a cavity suction hole for sucking the release film 16 by air and sucking the release film 16 along the inner wall surface of the cavity 12. Reference numeral 19 denotes an air suction hole for supporting the release film 16 by suctioning air at a parting surface on a peripheral edge of the cavity concave portion. The release film 16 carried into the lower mold surface is first suctioned by air from the air suction holes 19 and supported on the parting surface of the mold, and then suctioned by air from the cavity suction holes 18 to thereby release the inner wall surface of the cavity. Adsorbed and supported. Release film 16
Is sufficiently flexible, so that it can be easily sucked and supported by the shape of the inner surface of the cavity by suction with air.

Next, the circuit board 10 is set on the lower mold, and the circuit board 10 is clamped by the upper mold and the lower mold, and the plunger 2 is clamped.
4 extrudes the resin 14 from the pot 22 to form the cavity 1
Fill 2 As shown in the right half of the center line CL in FIG. 7, the resin 14 is charged into the cavity 12 via a resin path 26 that connects the pot 22 and the cavity 12.

[0006]

When the circuit board 10 is resin-molded using the release film 16 as a molded product, in the conventional resin molding method, the circuit board 10 is extended from the pot 22 to the cavity 12 as shown in FIG. Resin path 2
6 passes over the semiconductor chip mounting surface of the circuit board 10 and communicates with the cavity 12. Since wiring patterns and the like are formed at high density on the semiconductor chip mounting surface of the circuit board 10, arranging the resin path 26 on the semiconductor chip mounting surface of the circuit board 10 as in the related art may damage the wiring pattern,
There is a problem that resin burrs are generated on the surface of the circuit board.

According to the present invention, when such a circuit board is formed into a single-sided resin-molded product by resin molding, the resin pattern can be surely molded without damaging a wiring pattern provided on the circuit board. It is an object of the present invention to provide a resin molding method and a resin molding device that can be used.

[0008]

The present invention has the following arrangement to achieve the above object. That is, the resin molding portion of the mold is covered with a release film, a circuit board having a semiconductor chip mounted on one surface is clamped through the release film, the resin is pressure-fed from the pot to the cavity, and the cavity is filled with the resin. A resin substrate, wherein a gate hole that penetrates the substrate in the thickness direction is provided within a coverage area of a resin molded portion provided on the substrate in a resin molding method. A resin mold is formed by filling a resin into the cavity through a resin path having one end connected to the pot and passing through the other surface of the circuit board and the other end connected to the gate hole. It is characterized by doing. Further, the present invention is characterized in that a wide film that covers a parting surface of a lower mold including the pot and the resin molding portion in series is used as the release film. Further, the release film is suctioned by air from the lower side of the pot, the release film is drawn into the pot into a bag to form a concave portion, and a resin for molding is supplied to the concave portion to perform resin molding. And As a molding resin to be supplied to the pot, a wrapping resin in which a stick-shaped resin is sealed in a T-shape with a wrapping film, and a side edge of the wrapping film is removed from the pot by the circuit. On the other surface of the substrate, it extends over the range up to the gate hole and is resin-molded.

Further, the resin molded portion of the mold is covered with a release film, a circuit board having a semiconductor chip mounted on one surface is clamped via the release film, the resin is pressure-fed from the pot to the cavity, and the resin is injected into the cavity. And a resin molding apparatus for resin-molding one surface of the circuit board on which the semiconductor chip is mounted, wherein a release film supply mechanism for supplying the release film to the parting surface of the mold is provided. A circuit board provided with a gate hole penetrating the substrate in the thickness direction is supplied to a set position of a molded product of the mold within a coverage of a resin molded portion to be formed on the substrate. And an unloader that unloads the molded product from the mold. The circuit board is mounted on the mold. Upon flop, one end is connected to the pot, and the other end to the gate hole passes over the other surface of the circuit board is provided with a resin path connecting. Further, a cavity suction hole for air suction is provided on the inner bottom surface of the cavity of the mold in a dome shape or the like in which the release film sucked and supported on the parting surface of the mold is partially separated from the inner wall surface of the cavity. It is characterized by having.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a sectional view showing the configuration of the first embodiment of the resin molding apparatus according to the present invention. In the figure, the left half of the center line CL is a state in which the cavity is filled with resin, and the right half is a state before the cavity is filled with resin. Also in this embodiment, similarly to the conventional example, the parting surfaces including the resin molded portions of the upper mold 20a and the lower mold 20b are covered with the release film 16, and the circuit board 10 to be molded is clamped via the release film 16. To resin mold.

A characteristic configuration of the resin molding apparatus of the present embodiment is that a gate hole 10a penetrating the substrate in the thickness direction is provided.
The circuit board 10 provided with the holes is used as a molded article, and the cavity 1 is formed from the back side of the circuit board 10 through the gate hole 10a.
2 is to be filled with the resin 14. In this embodiment, since the cavity concave portion 12a is provided in the lower mold 20b, the circuit board 10 with the surface on which the semiconductor chip 12 is mounted faces downward.
Is set in the lower mold 20b, and the gate hole 1 is set in the upper mold 20a.
A resin path 26 for filling the cavity 12 with the resin 14 is provided from 0a.

The resin path 26 is formed between the pot 22 and the cavity 12.
Therefore, one end is connected to the pot 22, and the other end is connected to the gate hole 10a of the circuit board 10. FIG. 2 shows a planar arrangement of the circuit board 10, the gate hole 10a, the pot 22, the resin path 26, and the like in the lower mold 20b. As shown, the resin path 26 extends from the pot 22 to the circuit board 1.
0, and extends to a position where the gate hole 10a is arranged. The gate hole 10 a is arranged within the range of the opening surface of the cavity 12 to communicate with the cavity 12, that is, within the range of the surface of the resin molded portion to be mounted on the circuit board 10.

Of course, when arranging the gate hole 10a, the gate hole 10a must be communicated with the cavity 12 and set at a position where the semiconductor chip 11 is not interfered with a mounting position or a bonding portion by wire bonding. Actually, as shown in FIG. 2, it is arranged near the corner of the cavity 12 closest to the pot 22. During the resin molding, the resin path 26 passes on the back surface of the circuit board 10 until it reaches the gate hole 10a. Therefore, a portion of the circuit board 10 where the resin path 26 passes is designed so that wiring such as a land is not formed. There is no problem even if the resin 14 adheres during the resin molding.

The release film 16 covering the mold surfaces of the upper mold 20a and the lower mold 20b is a single wide film covering both the circuit boards 10 arranged on both sides of the pot 22 for the upper mold 20a. Use, lower mold 20b
Then, cover the circuit boards 10 on both sides of the pot 22, respectively.
Use a piece of film. The method of adsorbing and supporting the release film 16 on the parting surfaces of the upper mold 20a and the lower mold 20b is the same as in the conventional example, and the upper mold 20a and the lower mold 20b are each provided with an air suction hole 28 that opens on the parting surface.
By connecting the air suction hole 28 to the air suction mechanism.

A method for sucking and supporting the release film 16 on the inner wall surface of the cavity 12 is to provide a cavity suction hole 30 opened on the inner bottom surface of the cavity concave portion 12a, and to connect an air suction mechanism to the cavity suction hole 30 to allow the cavity suction hole 30 to communicate. By sucking air from In the present embodiment, as shown in FIG.
The cavity suction holes 30 are respectively arranged on the diagonal line provided with “a”, at a portion close to the corner portion facing the gate hole 10a and substantially at the center of the diagonal line.

The reason why the cavity suction holes 30 are displaced diagonally away from the gate hole 10a is that air is sucked from the cavity suction holes 30 to release the release film 16 along the inner wall surface of the cavity 12. This is so that the release film 16 is slightly separated from the inner wall of the cavity 12 on the side where the gate hole 10a is arranged when adsorbing. FIG. 3 shows a state in which the release film 16 is sucked by air from the cavity suction holes 30. The reason why the rod 32 is inserted into the cavity suction hole 30 so that the cavity suction hole 30 is opened in a slit shape on the inner bottom surface of the cavity concave portion 12a is to enhance the suction effect of the cavity suction hole 30.

As shown in FIG. 3, when the release film 16 is made to float from the inner wall of the cavity 12 on the side where the gate hole 10a is disposed, when the resin 14 flows into the cavity 12 from the gate hole 10a, To prevent air from being caught in the resin 14,
There is an effect that it is possible to prevent voids from being generated in the resin 14 when the filling of the resin is completed.

When performing resin molding using the resin molding apparatus of the present embodiment, first, the upper mold 2 is opened in a state where the mold is opened.
The release film 16 is supplied to the lower mold 20a and the lower mold 20b, and the release film 18 is suctioned to the parting surfaces of the upper mold 20a and the lower mold 20b by sucking air from the air suction holes 28. Next, the cavity suction holes 30 are formed with the lower mold 20b.
Then, the release film 16 is sucked by air following the inner wall surface of the cavity concave portion 12a. in this case,
On the side where the gate hole 10a is arranged, the release film 16 is slightly separated from the inner wall surface of the cavity recess 12a.

Next, the circuit board 10 on which the semiconductor chip 11 is mounted is set at a predetermined position of the lower mold 20b, and the pot 2
After the mold resin 14 is supplied to the mold 2, the circuit board 10 is clamped by the upper mold 20 a and the lower mold 20 b via the release film 16, and the resin 14 melted in the pot 22 is extruded by the plunger 24, and The cavity 12 is filled with resin through the gate 26 and the gate hole 10a.

The molten resin 14 is applied to the gate hole 1 from the side of the circuit board 10 opposite to the surface on which the semiconductor chip 11 is mounted.
Oa enters the cavity 12. The resin 14 that has entered the cavity 12 gradually fills the space of the cavity 12 and fills the entire cavity 12 in such a manner that the release film 16 is also spread out in the vicinity of the gate hole 10a.

After the cavity 12 is completely filled with the resin 14 and pressurized with a predetermined resin pressure to be cured in a state where there is no void or the like, the mold is opened and the molded product is carried out from the mold. The release film 16 has a predetermined heat resistance,
Since it is easily peeled off from the mold, it is easy to release from the mold. After the molded product is taken out together with the release film 16, the release film 16 is peeled off from the molded product, whereby only a resin molded product can be obtained. Since the release film 16 is easily peeled off from the resin molded portion, the operation of removing the release film 16 from the molded product is also easy.

The resin 14 cured in the resin path 26
Since the (runner resin) remains on the back surface of the circuit board 10, the runner resin may be removed from the circuit board 10 by a method similar to the conventional degate method. Since the resin path 26 is arranged in a portion of the circuit board 10 where no wiring portion such as a land is provided, the degate does not particularly adversely affect the product.

In the resin molded product thus obtained, the surface of the circuit board 10 on which the semiconductor chip 11 is mounted
And a resin 14 is filled in a gate hole 10a provided in the circuit board 10. Since this resin molded product is obtained in a form in which the gate hole 10a is filled with the resin 14, the sealing property (sealing property) is improved as compared with the conventional resin molded product, and the resin filled in the gate hole 10a is improved. There is an advantage that the resin molded portion is not easily peeled off from the circuit board 10 by the anchor 14 serving as an anchor.

FIG. 4 is a sectional view showing a second embodiment of the resin molding apparatus according to the present invention. Also in this embodiment, resin molding using the circuit board 10 provided with the gate hole 10a is the same as in the above embodiment. The configuration of the present embodiment is characterized in that a cavity recess 12a is provided in an upper mold 20a, a resin path 26 is formed in a lower mold 20b, and a release film 16 is formed in the cavity recess 12a.
Cavity suction holes 30 for sucking
By using one wide release film 16 that covers the parting surface of the lower mold 20b and the circuit board 10 on both sides including the pot 22, the release film 16 covering the parting surface of the lower mold 20b is used. is there.

In FIG. 4, the left half of the center line CL is in a state where the granular resin 14 is supplied to the pot 22 to clamp the circuit board 10, and the right half of the center line CL is in the cavity 12.
4 shows a state in which filling is started. The release film 16 set in the lower mold 20b is suctioned by air from the air suction holes 28 to be suction-supported on the parting surface of the lower mold 20b, and then suctioned by air from the pot 22 to store the molding resin in the pot 22. To form a concave portion. Since the inner surface of the pot 22 and the outer peripheral surface of the plunger 24 are in sliding contact with each other, in the present embodiment, the inner periphery of the pot 22 is slightly enlarged at the position where the plunger 24 is lowered, and the outer peripheral surface of the plunger 24 and the inner A little gap is formed between the pot and the surrounding surface.
The base of No. 2 was connected to an air suction mechanism.

After the release film 16 is adsorbed on the parting surface by air, the release film 16 is drawn into the pot 22 by sucking air from the lower part of the pot 22, thereby forming a recess for accommodating the resin for molding.
After forming the concave portion in this way, the molding resin 14 is supplied into the concave portion, the resin is melted, and the process proceeds to a resin filling operation.
By pulling the release film 16 into a bag shape in the pot 22, a resin tablet formed into a cylindrical shape can be supplied to the concave portion, and a granular resin or a liquid resin can be supplied.

In the present embodiment, one cavity suction hole 30 is provided at the center of the cavity recess 12a because the release film 16 is sucked from the cavity suction hole 30 when the release film 16 is sucked from the inner wall surface of the cavity 12. This is to allow the release film 16 to be sucked in a dome shape as shown in FIG. In this manner, the suction of the release film 16 in a dome shape means that the air space of the cavity at the time of starting the injection of the resin is narrowed, and the resin 14 is injected into the cavity 12 through the gate hole 10a. This is to prevent air from being caught.

By gradually injecting the resin from the gate hole 10a, the release film 16 is pressed by the resin pressure.
Is spread out, and is finally molded into a resin according to the inner surface shape of the cavity 12. Also in the present embodiment, the circuit board 1
The resin is filled in the cavity 12 from the back side of the circuit board 10 so that the wiring pattern formed on the surface of the circuit board 10 is not damaged, and the inner wall portion of the pot 22 is covered with the release film 16 and resin-molded. There is an advantage that resin molding can be performed without attaching any resin to the mold including the pot 22.

FIG. 5 is a sectional view showing a third embodiment of the resin molding apparatus according to the present invention. Also in the present embodiment, a gate hole 10a is provided in the circuit board 10, and a resin 14 is filled into the cavity 12 from the back side of the circuit board 10 and resin-molded. The features of the configuration in the present embodiment are as follows.
The wrapping resin 40 is used as a resin for molding to be supplied to the pot 22. Wrapping resin 40
6 means that the resin is sealed in a T-shaped end face using a wrapping film 42 as shown in FIG.

As shown in FIG. 5, the wrapping resin 40 is supplied to the pot 22, and the side edge of the wrapping film 42 extending laterally is positioned on the back surface of the circuit board 10 at the position where the gate hole 10a is arranged. The resin path 26 extending above the circuit board 10 is
4 can be resin-molded without adhering to the surface of the circuit board 10. Since it is necessary to arrange the side edge of the wrapping film 42 on the back surface of the circuit board 10, when performing resin molding, the upper mold 20a and the lower mold 20b are covered with the release film 16, and then the circuit is attached to the lower mold 20b. Substrate 1
0, then wrapping resin 40 into pot 2
Feed to 2.

Next, the circuit board 10 is clamped by the upper mold 20a and the lower mold 20b, and
May be filled with resin. FIG. 5 shows a state in which the circuit board 10 is clamped in the right half of the center line CL, and a state in which the cavity 12 is filled with resin from the pot 22 in the left half. When the cavity 12 is filled with the resin, the heat-sealed side edge of the wrapping film 42 is pushed open by the resin pressure, and the resin path 26 is formed.
2 is filled with resin 14. In this embodiment, since the wrapping resin 40 is formed in a stick shape, the pot 2
Numeral 2 is formed as a slender rectangular communicating pot having a planar shape, and plunger 24 is formed as a flat plate slidable in pot 22.

In this embodiment, the cavity recess 12 is also used.
A single cavity suction hole 30 is provided at the center of a.
Also in the case of the resin molding method of the present embodiment, by using the wrapping resin 40, it is possible to perform resin molding without attaching the resin 14 to the mold including the pot 22 at all, and the resin path 26 on the circuit board 10 is formed. Can be molded without adhering the resin 14 to the back surface portion through which the resin passes.

[0033]

According to the resin molding method and the resin molding apparatus of the present invention, as described above, the resin is injected into the cavity from the surface of the circuit board opposite to the surface on which the semiconductor chip is mounted, and the resin is molded. Therefore, the resin molding can be performed more reliably without damaging the surface of the circuit board on which the wiring pattern and the like are formed during the resin molding. Also,
Since the molded product obtained by the resin mold is obtained by filling the gate hole with the resin, it has a remarkable effect that it can be obtained as a resin molded product having good adhesion between the circuit board and the resin molded portion and good sealing performance. Play.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a configuration of a mold in a first embodiment of a resin molding device according to the present invention.

FIG. 2 is an explanatory view showing a planar arrangement of pots, cavities and the like of a mold.

FIG. 3 is an explanatory view showing a state in which a release film is sucked from a cavity suction hole.

FIG. 4 is a cross-sectional view illustrating a configuration of a mold according to a second embodiment of the resin molding apparatus.

FIG. 5 is a cross-sectional view illustrating a configuration of a mold according to a third embodiment of the resin molding apparatus.

FIG. 6 is a perspective view of a wrapping resin used in a third embodiment.

FIG. 7 is a cross-sectional view illustrating a configuration of a conventional resin molding device using a release film.

[Explanation of symbols]

 Reference Signs List 10 circuit board 10a gate hole 12 cavity 12a cavity recess 14 resin 16 release film 20a upper die 20b lower die 22 pot 24 plunger 26 resin path 28 air suction hole 30 cavity suction hole 32 rod 40 lapping resin 42 wrapping film

Claims (6)

[Claims] 1. A resin molded portion of a mold is covered with a release film, a circuit board on which a semiconductor chip is mounted on one surface is clamped via the release film, the resin is pressure-fed from a pot to a cavity, and the resin is injected into the cavity. A resin molding method for filling one side of the circuit board with a resin, wherein a gate hole penetrating the board in a thickness direction is provided within a coverage area of a resin molding portion formed on the board. Filling the cavity with a resin via a resin path having one end connected to the pot and passing over the other surface of the circuit board and the other end connected to the gate hole. A resin molding method, characterized in that the resin molding is performed by: 2. The resin molding method according to claim 1, wherein a wide film that covers a parting surface of a lower mold including the pot and the resin molding portion is used as the release film. 3. A vacuum is drawn from the lower side of the pot to release the release film, the release film is drawn into the pot into a bag to form a concave portion, and a resin for molding is supplied to the concave portion to perform resin molding. 3. The resin molding method according to claim 2, wherein: 4. A wrapping resin in which a stick-shaped resin is sealed in a T-shape with a wrapping film, and a side edge of the wrapping film is used as a molding resin to be supplied to the pot. 2. The resin molding method according to claim 1, wherein the resin molding is performed so as to extend over a range from the substrate to the gate hole on the other surface of the circuit board. 5. A resin molded portion of a mold is covered with a release film, a circuit board having a semiconductor chip mounted on one surface is clamped via the release film, the resin is pressure-fed from a pot to the cavity, and the resin is injected into the cavity. A resin molding apparatus for resin-molding one surface of the circuit board on which the semiconductor chip is mounted, and a release film supply mechanism for supplying the release film to a parting surface of the mold; A circuit board provided with a gate hole penetrating the substrate in the thickness direction is supplied to a set position of a molded product of the mold within a coverage of a resin molded portion to be formed on the substrate. And an unloader that unloads a molded product from the mold, and clamps the circuit board on the mold. In this case, a resin path having one end connected to the pot and passing through the other surface of the circuit board and connecting the other end to the gate hole is provided. 6. A cavity suction hole for sucking air into a dome shape or the like in which a release film sucked and supported on a parting surface of the mold is partially separated from an inner wall surface of the cavity is formed in an inner bottom surface of the cavity of the mold. The resin molding device according to claim 5, wherein the resin molding device is provided.