JPH0936155A - Manufacture of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin sealing device which is equipped with a molding die simplified in structure and capable of easily manufacturing a product of high reliability. SOLUTION: A board 12 mounted with a semiconductor element 11 on its one side is clamped between the upper die 10a and lower die 10b of a molding die, and the semiconductor element 11 mounted on the board 12 is sealed up with resin, wherein a frame 20 is fixed to the board 12 along the periphery of a resin-sealed region. A gate bearing body 20a is mounted on the board 12 extending from the frame 20 along a part which confronts a mold gate 14 to the edge of the board 12, then the gate bearing body 20a is clamped between the the upper die 10a and lower die 10b of a molding die together with the frame 20, and resin is filled up in a cavity 16 surrounded with the frame 20 and the molding die through the mold gate 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device in which one surface of a substrate on which a semiconductor element is mounted is resin-sealed.

[0002]

2. Description of the Related Art FIGS. 7 and 8 are sectional views showing a method for manufacturing a semiconductor element 11 mounted on a substrate 12 by resin-sealing a semiconductor element mounting surface of the substrate 12 on one side with a resin sealing device. . FIG. 7 shows a substrate 1 including an upper mold 10a and a lower mold 10b.
2 is clamped, and the resin 17 is filled in the cavity 16 of the upper mold 10a corresponding to the resin sealing region of the substrate 12 including the mounting portion of the semiconductor element 11 from the gate portion 14 provided on the upper mold 10a. 8 is a resin sealing method, FIG. 8 shows an upper mold 10 through a middle mold 18 for molding the outer surface of the sealing resin.
The substrate 12 is clamped by a and the lower mold 10b, and the resin 17 is filled in the cavity 16 formed by the middle mold 18 from the gate portion 14 provided on the upper surface of the middle mold 18 to seal the semiconductor element 11 with the resin. Here's how to stop it.

Comparing the resin sealing method shown in FIGS. 7 and 8, the resin 17 directly adheres to the portion of the substrate 12 which is in contact with the gate portion 14 when the resin is sealed in the method shown in FIG. In the method shown in FIG. 8, the middle mold 18 is brought into contact with the surface of the substrate 12 and the gate portion 14 is disposed through the middle mold 18 and resin-sealed to attach the resin 17 to the substrate 12. It has the feature that it can be sealed with resin without using it. As described above, according to the method shown in FIG. 8, since the resin 17 is not attached to the substrate 12 during the resin sealing, it is not necessary to peel and remove the resin burr from the substrate 12 after the resin sealing.
There is an advantage in that it is not necessary to arrange the wiring pattern while avoiding the passing position of the gate portion 14 when forming the wiring pattern.

Since a fine wiring pattern for connecting the semiconductor element 11 and the external connection terminal is provided on the surface of the substrate 12, according to the resin sealing method shown in FIG. 8, the resin burr is removed after the resin sealing. By eliminating the step of performing
Substrate 12 when damaging 2 or removing resin flash
This is preferable because there is no problem such as peeling off a protective film such as a solder resist covering the wiring pattern formed on the surface together with a resin flash, and the like. Further, since the wiring pattern can be formed on the substrate 12 regardless of the position where the gate portion 14 passes, there is an advantage that the wiring pattern can be routed freely.

FIG. 9 shows a method of using the frame body 20 as another method of sealing the mounting surface of the semiconductor element 11 on the substrate 12 with resin on one side. In this resin sealing method, the semiconductor element 11
A frame body 20 formed in a frame shape surrounding the is bonded to the substrate 12, and a resin 17 is dropped inside the frame body 20 by a potting method to seal the semiconductor element 11 with the resin. The frame body 20 acts as a flow stop for the resin 17, whereby the resin can be molded and the semiconductor element 11 can be resin-sealed.

[0006]

By the way, the method using the middle mold 18 shown in FIG. 8 is effective in that the resin 17 can be sealed without adhering the resin 17 to the substrate 12, but the upper mold 10a is used as a mold. In addition to the lower mold 10b, the middle mold 18 has to be used and the mold structure is complicated, and the middle mold has to be attached and detached for each resin sealing operation. . Further, even if the dam frame is provided, if resin molding is performed by a transfer molding method using a mold, the gate portion of the mold faces the surface of the substrate 12, and thus resin burrs remain on the substrate 12 after resin molding. There's a problem.

The present invention has been made to solve these problems, and an object of the present invention is to simplify the structure of a mold used in a resin sealing device to facilitate the manufacture of products. Another object of the present invention is to provide a semiconductor device manufacturing method that facilitates the manufacture of highly reliable products.

[0008]

The present invention has the following constitution in order to achieve the above object. That is, the upper die and the lower die of the mold clamp the substrate on which the semiconductor element is mounted on one side,
In a method of manufacturing a semiconductor device in which a surface of a substrate on which a semiconductor element is mounted is resin-sealed, a frame is formed along a peripheral edge of the resin sealing region on a substrate at a peripheral edge of the resin sealing region including a mounting portion of the semiconductor element. After fixing the frame body formed in a shape, and attaching a gate contact body extending from the frame body to the edge portion of the substrate along a portion of the substrate facing the gate portion of the die, the upper die And the lower die clamps the gate contact body together with the frame body, and the resin is filled through the gate portion into a cavity formed by being surrounded by the frame body and the mold. To do. Moreover, after mounting the semiconductor element on the substrate, the frame body and the gate contact body are fixed to the substrate. Further, the semiconductor element is mounted on the substrate after fixing the frame body and the gate contact body to the substrate. Further, the upper surface of the gate contact body is plated with gold. Also,
A groove portion communicating with the cavity is provided on the upper surface of the gate contact body, and sealing resin is caused to flow into the groove portion to fill the cavity with the resin. Further, the upper surface of the gate contact body including the groove portion is plated with gold.

In the method of manufacturing a semiconductor device according to the present invention, the frame body is fixed along the periphery of the resin sealing region of the substrate, the gate abutting body is fixed on the substrate, and the frame body and the gate abutting body are fixed. The substrate is clamped by the upper mold and the lower mold of the mold, and the cavity is formed by the frame and the mold is filled with resin and sealed with resin. The frame body acts as a resin flow stop at the time of resin sealing, and is molded into a predetermined shape by resin molding to seal the semiconductor element with resin. Since the sealing resin is filled in the cavity from the gate portion of the mold arranged to face the gate contact body, the resin can be sealed without causing resin burrs on the substrate. After sealing with resin, unnecessary parts such as the gate contact body are removed to make the product.

[0010]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. A method of manufacturing a semiconductor device according to the present invention is characterized in that a frame body is fixed to the periphery of a resin sealing region including a mounting portion of a semiconductor element of a substrate along the periphery of the resin sealing region for resin sealing. . In FIG. 1, a substrate 12 having a frame body 20 is attached to an upper mold 10a and a lower mold 10
A state of clamping with b and resin sealing is shown. Reference numeral 14 is a gate portion provided on the upper mold 10a, and 16 is a cavity.

The substrate 12 in this embodiment is a BGA (Ball).
Grid Array) type, PPGA (Plastic Pin Gridb Array)
A substrate used for a semiconductor device such as a mold, the mounting portion of the semiconductor element 11 and the semiconductor element 1 on one surface of the substrate 12.
A wiring pattern for connecting 1 to the external connection terminal is provided, and a land for connecting the external connection terminal is provided on the other surface. The land and the wiring pattern are electrically connected to each other through a through hole provided in the substrate 12. The board 12 is a printed circuit board and may be used in either a single-layer form or a multi-layer form. The wiring pattern can be formed into a predetermined pattern by providing a conductor layer such as copper foil on the surface of the substrate and etching the conductor layer. The surface of the substrate 12 is covered with a protective film such as a solder resist except for the bonding portions of the wiring pattern and required portions such as lands.

FIG. 2 is a plan view of the substrate 12 to which the frame body 20 is attached, and FIG. 3 is a perspective view. In this embodiment, a strip-shaped substrate is used in which the semiconductor elements 11 are mounted and the substrates that are finally separated into individual pieces to be products are supported by the side rail portions. Further, in this example, the semiconductor element 11 and the wiring pattern 14 are electrically connected by wire bonding, but other connection methods can be used. The frame body 20 is a member formed in a frame shape separately from the substrate 12. The frame body 20, for each semiconductor element 11 of the substrate 12, is fixed on the substrate 12 at the periphery of the resin sealing region including the mounting portion of the semiconductor element 11 along the periphery of the resin sealing region.
When the frame body 20 is fixed to the substrate 12, the semiconductor element 11 may be fixed to the substrate 12 after mounting the semiconductor element 11, or the semiconductor element 11 may be mounted to the substrate 12 after fixing the frame body 20.

As shown in FIG. 1, the frame body 20 constitutes a part of the cavity 16 for molding the resin at the time of resin sealing, and the frame body 20 defines the peripheral portion of the resin sealing region. Therefore, the frame body 20 must be appropriately set in terms of its size, arrangement position and the like according to the product. In the example shown in FIG. 1, a cavity cavity is provided in the upper mold 10a to secure a required cavity space. When the cavity is not provided on the surface of the upper mold 10a facing the cavity 16 and is formed as a flat surface, the resin 17 is formed to the same height as the upper surface of the frame body 20.
Therefore, it is necessary to set the frame body 20 to a thickness such that the semiconductor element 11 is buried in the resin 17.

When the substrate 12 is clamped by the upper mold 10a and the lower mold 10b, it is clamped by the upper mold 10a and the lower mold 10b via the frame 20 as shown in FIG.
The cavity 16 is formed by 0 and the upper mold 10a.
The gate portion 14 provided in the upper mold 10a is provided in the cavity 16.
Although the resin 17 is filled in from the above, in this example, the gate abutment body 20a is extended from the frame body 20 to the edge portion of the substrate 12 at a position where the gate portion 14 of the upper mold 10a faces the gate body 14 and the gate abutment body 20a The body 20a was fixed to the substrate 12.
The thickness of the gate abutment body 20a may be the same as that of the frame body 20, or when the gate abutment body 20a is made thinner than the frame body 20, a groove portion communicating with the cavity recess is formed as described later.
May be provided. It is preferable to apply gold plating 24 or the like on the upper surface of the gate contact body 20a where the gate portion 14 passes so that the cured resin can be easily peeled off.

FIG. 1 is a sectional view at a position (line AA in FIG. 2) passing through the gate contact body 20a. 26 is a frame 2
0, an adhesive that adheres the gate contact body 20a to the substrate 12. In the embodiment, the gate portion 14 of the upper mold 10a passes through the upper surface of the gate contact body 20a and communicates with the cavity 16, and the gate opening for connecting the gate portion 14 and the cavity 16 is provided with the cavity 16 on the upper surface of the frame body 20. It was placed in the corner part of. Thus, from the gate portion 14 to the cavity 1
The resin 17 pressure-fed to 6 passes through the upper surface of the gate contact body 20 a and is filled in the cavity 16. FIG. 4 shows a perspective view of the substrate 12 after resin sealing. The sealing resin is the frame 20
And is formed by the cavity recess of the upper mold 10a.

After the resin is sealed, unnecessary parts such as the gate abutment body 20a and side rails are removed from the substrate 12 and separated into individual pieces to obtain a product. The position where the substrate 12 is separated into individual pieces is indicated by a line B in FIG. When the product is separated into individual pieces from the substrate 12, the products may be separated slightly from the peripheral edge of the frame body 20 or may be separated along the peripheral edge of the frame body 20. After separating the product from the substrate 12 into individual pieces, the external connection terminals are joined to obtain a product.

FIG. 5 shows another embodiment in which resin sealing is performed using the substrate 12 to which the frame body 20 is attached. Also in this embodiment, similar to the above example, the frame body 20 and the gate contact body 20a are provided.
The substrate 12 to which is fixed is used. Upper mold 10a and lower mold 10
The substrate 12 is clamped with b through the frame body 20 and the gate contact body 20a, and the cavity 16 is filled with resin from the gate contact body 20a to seal the resin. In this example, the cavity is not provided in the upper mold 10a, and the inner surface of the cavity is formed into a flat surface for resin sealing.

In this embodiment, as a resin path for filling the cavity 16 with resin, a groove 30 is provided on the upper surface of the gate contact body 20a from the end of the gate contact body 20a to the cavity 16, and the groove 30 is used as the resin path. 16
The inside is filled with the resin 17. The substrate 12 after resin sealing is shown in FIG.
FIG. The upper surface of the frame 20 and the sealing resin are resin-molded at the same height. The groove 30 provided in the gate contact body 20a can be formed in an appropriate shape such as a V-shape or a U-shape in cross section.

After the resin is sealed, the resin 17 remains in the groove 30 and hardens. In order that the resin cured in the groove 30 can be easily peeled off and removed, at least the groove 3
It is preferable to apply gold plating to the upper surface of the gate contact body 20a including 0. After sealing with resin, the gate contact body 2 is used as in the above example.
Unwanted parts such as 0a and side rails are removed from the substrate 12 and separated into individual pieces to obtain a product. The resin-sealed product thus obtained is one in which the frame body 20 is fixed to the substrate 12, the resin 17 is filled inside the frame body 20, and the semiconductor element 11 is sealed.

The frame body 20 and the gate contact body 20a fixed on the substrate 12 may be integrally formed in advance, or the frame body 20 and the gate contact body 20a formed separately may be used as the substrate. It may be mounted on 12 and used. Frame 2
0 and the gate abutting body 20a are separately formed, the gate abutting body 20a can be easily removed from the substrate 12 after resin sealing by temporarily fixing the gate abutting body 20a to the substrate 12. There is.

In the method of manufacturing a semiconductor device according to the present invention, the frame body 20 is clamped together with the substrate 12 and resin-sealed. Therefore, the frame body 20 only needs to have a certain strength that can be clamped by a mold. In addition to glass-fabric-epoxy, glass-fabric-polyimide, glass-fabric-Teflon, BT resin, and the like used for printed circuit boards and the like, metal materials can also be used. In addition, when the frame body 20 is made of the same material as the substrate 12, the thermal expansion coefficients of the substrate 12 and the frame body 20 can be matched, and the reliability when mounting the semiconductor device can be improved. There are advantages.

In the above embodiment, the upper mold 10a is provided with the gate portion 14 and the cavity 16 is filled with the resin 17 from the upper mold 10a side, but the structure of the mold is not limited to that of the embodiment. , For example, the gate portion 14 on the lower mold 10b.
It is also possible to adopt a method in which the lower mold 10b is provided and the cavity 16 is filled with the resin 17. Further, the shape, dimensions, etc. of the frame body 20 and the gate contact body 20a can be appropriately set and resin-sealed according to the product.

[0023]

According to the method of manufacturing a semiconductor device of the present invention, as described above, by using the substrate on which the frame body and the gate contact body are attached, the resin sealing is performed without directly adhering the resin to the substrate. Therefore, it is not necessary to remove the resin adhering to the substrate after the resin sealing, and it is possible to prevent the protective film covering the substrate from being damaged. Also,
Since the wiring pattern can be formed on the substrate regardless of the gate passage position, there is an advantage that the degree of freedom in wiring the wiring pattern is increased. In addition, it is not necessary to use a middle mold for resin sealing, the structure of the mold can be simplified, and the resin sealing operation using the mold can be easily performed. .

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a state in which a substrate to which a frame body is attached is clamped with a mold and resin-sealed.

FIG. 2 is a plan view of a substrate to which a frame body is attached.

FIG. 3 is a perspective view of a substrate to which a frame body is attached.

FIG. 4 is a perspective view of a substrate after resin sealing.

FIG. 5 is a cross-sectional view showing another method of resin-sealing by clamping a substrate having a frame attached thereto with a mold.

FIG. 6 is a perspective view of a substrate after resin sealing.

FIG. 7 is a cross-sectional view showing a conventional example of a method for resin-sealing a substrate on one side.

FIG. 8 is a cross-sectional view showing a conventional example of a method for resin sealing a substrate on one side.

FIG. 9 is a cross-sectional view showing an example of a semiconductor device in which a frame is attached to a substrate and resin-sealed.

[Explanation of symbols]

 10a Upper mold 10b Lower mold 11 Semiconductor element 12 Substrate 14 Gate part 16 Cavity 17 Resin 18 Medium mold 20 Frame 20a Gate contacting body 24 Gold plating 26 Adhesive 30 Groove

Claims (6)

[Claims] 1. A method of manufacturing a semiconductor device, wherein a substrate having a semiconductor element mounted on one surface thereof is clamped by an upper die and a lower die of a mold, and the surface of the substrate on which the semiconductor element is mounted is resin-sealed. A frame body formed in a frame shape along the peripheral edge of the resin sealing region is fixed on the substrate at the peripheral edge of the resin sealing region including the mounting portion, and the gate portion of the mold faces the substrate. After attaching a gate contact body extending from the frame body to the edge portion of the substrate along the part, the gate contact body is clamped together with the frame body by the upper mold and the lower mold, and A method for manufacturing a semiconductor device, characterized in that a cavity is surrounded by a mold and resin is filled through the gate portion. 2. The method of manufacturing a semiconductor device according to claim 1, wherein after mounting the semiconductor element on the substrate, the frame body and the gate contact body are fixed to the substrate. 3. The method of manufacturing a semiconductor device according to claim 1, further comprising mounting the semiconductor element on the substrate after fixing the frame body and the gate contact body to the substrate. 4. The method for manufacturing a semiconductor device according to claim 1, 2 or 3, wherein an upper surface of the gate contact body is plated with gold. 5. A groove portion communicating with a cavity is provided on an upper surface of the gate contact body, and a sealing resin is caused to flow into the groove portion to fill the cavity with the resin.
4. The method for manufacturing a semiconductor device according to 2 or 3. 6. The method for manufacturing a semiconductor device according to claim 5, wherein an upper surface of the gate contact body including a groove portion is plated with gold.