JP2014093451A - Manufacturing method for mold package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a mold package, which can reduce formation of mold resin on a face exposed from the mold resin on a seat and which prevents leakage of mold resin during a sealing step.SOLUTION: A housing 40 is arranged so as to surround a circuit element 20 mounted on a circuit board 10. The circuit board 10 and housing 40 are sandwiched between a molding tool 200 and a placing table 300. The molding tool 200 is used as an upper mold, the housing 40 is used as lateral molds, and the circuit board 10 is used as a lower mold. Mold resin 30 is injected from a gate 202 into an area surrounded by the molding tool 200, housing 40, and circuit board 10, and thus this area is sealed with the mold resin.

Description

  The present invention relates to a method for manufacturing a mold package.

  Conventionally, as an example of a method for manufacturing a mold package including a pedestal (circuit board or the like) on which a circuit element is mounted and a connector having an external connection terminal electrically connected to the circuit element, Patent Document 1 discloses. There are disclosed techniques. In Patent Document 1, an upper mold in which an upper connector holding portion that contacts the upper outer peripheral edge of the connector is formed, and a lower mold in which a lower connector holding portion that contacts the lower outer peripheral edge of the connector is formed. The entire substrate is molded using the configured mold. In addition, the tip of the upper and lower connector clamping portions in the mold is formed at an acute angle so that when the upper die and the lower die are clamped, the tip is pressed against or bites into the outer peripheral edge of the connector.

Japanese Patent Laid-Open No. 10-76528

  By the way, the mold package is a half mold in which one side of the pedestal is exposed from the mold resin in order to improve the heat dissipation, considering the increase in size due to the expansion of functions in recent years, the increase in power consumption, and the mounting of products in more severe temperature environments. A package is preferred.

  When manufacturing this half mold package, although it is not a prior art, several manufacturing methods can be considered. For example, the surface exposed from the mold resin of the pedestal is brought into contact with the surface of the lower mold, and only the connector housing is sandwiched and sealed between the upper mold and the lower mold of the mold as in Patent Document 1, and then molded in this state. A manufacturing method is conceivable. In this case, it is necessary to seal the entire circumference of the upper and lower surfaces and side surfaces of the connector housing with a molding die. At this time, since the molding die sandwiches the connector housing between the upper die and the lower die, it is easy to ensure the sealing performance of the upper and lower surfaces of the housing.

  However, regarding the sealing property of the side surface of the connector housing, the dimensional accuracy in the left-right direction and the dimensional accuracy in the left-right direction of the connector housing are required for the portion (opening) sandwiching the connector housing in the mold. If the horizontal dimension of the connector housing is shorter than the horizontal dimension of the opening of the mold, a gap may be generated between the connector housing and the mold, and the mold resin may leak. On the other hand, if the horizontal dimension of the connector housing is longer than the horizontal dimension of the opening of the molding die, the connector housing may be damaged by the molding die during mold clamping. In addition, shavings generated when the connector housing is scratched with the mold may adhere to another sealing surface and cause resin leakage.

  Further, since the pedestal is not sandwiched between the molding dies, when the molding resin is filled with high pressure into the molding dies, there is a possibility that the molding resin enters between the surface of the pedestal exposed from the molding resin and the molding dies. In this case, in the manufactured mold package, the mold resin is formed on the surface of the pedestal that is exposed from the mold resin, and the heat dissipation may be deteriorated.

  The present invention has been made in view of the above problems, and can suppress the molding resin from being formed on the surface of the pedestal exposed from the molding resin, and can prevent the molding resin from leaking during the sealing process. It is an object of the present invention to provide a method for manufacturing a mold package that can be used.

In order to achieve the above object, the present invention provides:
A pedestal (10, 70, 70a) on which the circuit element (20) is mounted;
On one surface (11, 71) of the mounting surface on which the circuit element on the pedestal is mounted, a housing (40 to 49) disposed around the circuit element;
An external connection terminal (50) held in close contact with the housing and electrically connected to the circuit element;
A mold resin (30) for sealing a part of a base, a part of a housing, and a part of a terminal;
A step of mounting a pedestal on which a circuit element is mounted and a housing holding the terminal 50 in close contact with the circuit element is placed on the mounting table (300), the housing on the pedestal being disposed A placing step of placing the opposite surface of the surface opposite the placing table;
While the gates (202, 212, 222, 232) provided on the molding die (200, 210, 220, 230) are arranged at positions facing the area surrounded by the housing, the molding die is placed on the entire upper surface of the housing. A mold clamping step of covering the region surrounded by the housing with a molding die, pressing the pedestal and the housing against the mounting table with the molding die, and sandwiching the pedestal and the housing between the molding die and the mounting table;
After the mold clamping process, the molding die is the upper die, the housing is the horizontal die, and the pedestal is the lower die. Mold resin is injected from the gate into a region surrounded by the molding die, the housing and the pedestal, and the region is sealed with the mold resin. And a sealing step.

  In this way, by performing the mold clamping step, the molding die can be brought into close contact with the upper surface of the housing, and the lower surface (the surface opposite to the upper surface) of the housing can be brought into close contact with the pedestal. As a result, the region surrounded by the mold, the housing, and the pedestal becomes a space in which a portion other than the gate portion is sealed. Then, after the mold clamping process, the molding die is the upper die, the housing is the horizontal die, the pedestal is the lower die, and the mold resin is injected from the gate into the sealed space except for the gate portion, and this region is sealed with the mold resin. Thus, a mold package can be manufactured.

  In addition, the area where the mold resin is injected can be sealed by pressing the pedestal and the housing against the mounting table with the molding die and sandwiching the pedestal and the housing between the molding die and the mounting table. In addition, it is not necessary to match the dimensions of the mold with high accuracy. Therefore, it is possible to prevent the mold resin from leaking during the sealing process without matching the dimensions of the housing and the mold with high accuracy.

  Moreover, since the area | region enclosed by the shaping | molding die, the housing, and the base is sealed with mold resin, the surface (back surface) in which the housing in the base is not arrange | positioned can be exposed from mold resin. Then, the housing and the pedestal are sandwiched between the mold and the mounting table, and the sealing process is performed with the mold as the upper mold, the housing as the horizontal mold, and the pedestal as the lower mold. However, it can suppress that mold resin is formed in the back surface of a base.

It is drawing which shows schematic structure of the mold package manufactured with the manufacturing method of embodiment, (a) is a top view, (b) is Ib-Ib sectional view, (c) is a front view from Ic direction. . It is sectional drawing which shows the mounting process of the manufacturing method of embodiment. It is sectional drawing which shows the mold clamping process of the manufacturing method of embodiment. It is sectional drawing which shows the sealing process of the manufacturing method of embodiment. It is drawing which shows schematic structure of the mold package of the modification 1, (a) is sectional drawing, (b) is a front view from Vc direction. 10 is a cross-sectional view illustrating a schematic configuration of a mold package of Modification 2. FIG. 10 is an enlarged cross-sectional view illustrating a schematic configuration of a mold package of Modification 3. FIG. It is a perspective perspective view which shows schematic structure of the mold package of the modification 4. 10 is a cross-sectional view illustrating a sealing step of a manufacturing method according to Modification 5. FIG. 10 is an enlarged cross-sectional view showing a schematic configuration of a mold package of Modification 6. FIG. 10 is an enlarged cross-sectional view showing a schematic configuration of a mold package of Modification 7. FIG. FIG. 10 is an enlarged cross-sectional view illustrating a schematic configuration of a mold package of Modification 8; 10 is an enlarged cross-sectional view showing a schematic configuration of a mold package of Modification 9. FIG. It is drawing which shows schematic structure of the mold package of the modification 10, (a) is a top view, (b) XIVb-XIVb sectional view taken on the line, (c) is another example. FIG. 16 is an enlarged cross-sectional view illustrating a schematic configuration of a mold package of Modification 11; 14 is a plan view illustrating a schematic configuration of a mold package of Modification 12. FIG. It is drawing which shows schematic structure of the mold package of the modification 13, (a) is a top view, (b) is a front view from a XVIIb direction. It is an expanded sectional view showing a schematic structure of a mold package of modification 14. It is drawing which shows the manufacturing method (at the time of a sealing process) of the modification 15, (a) is sectional drawing, (b) is a top view, (c) is sectional drawing in the case of a small mold package, (d) is small size It is a top view in the case of a mold package. It is drawing which shows the manufacturing method (at the time of a sealing process) of the modification 16, (a) is sectional drawing, (b) is a top view. It is drawing which shows the manufacturing method (at the time of a sealing process) of the modification 17, (a) is sectional drawing in the case of a single housing, (b) is a top view in the case of a single housing, (c) is a plurality of housings It is sectional drawing in the case of.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  The present invention relates to a method for manufacturing a mold package. First, the structure of the mold package manufactured by the present invention will be described with reference to FIG. The mold package 100 includes a circuit element 20, a base 10 on which the circuit element 20 is mounted, a mold resin 30, a housing 40, terminals 50, and the like.

  The circuit element 20 includes, for example, a semiconductor element such as an IC chip and MOSFET, an electronic component such as a coil, and a chip component such as a capacitor and a resistor. In the present embodiment, the circuit elements 20 are all surface mount (SMD) type elements. The circuit element 20 is bonded (mounted) to the circuit board 10 with a conductive adhesive such as solder.

  The pedestal 10 employs the circuit board 10 in this embodiment. The circuit board 10 corresponds to the first circuit board in the claims of the present invention. The circuit board 10 is provided with a wiring made of a conductive material, a land made of a conductive material, or the like using ceramic or resin as a base material. The circuit element 10 is mounted on at least one surface of the circuit board 10. The circuit board 10 is used as a lower mold during the sealing process.

  As shown in FIG. 1A and the like, the housing 40 has an annular shape arranged so as to surround the circuit element 20 on the mounting surface 11 which is one surface of the circuit board 10 on which the circuit element 20 is mounted. It is a member. More specifically, the housing 40 includes a connector portion 40 a and an annular portion 40 b that surrounds the circuit element 20. The connector portion 40a is provided around a portion (a part of the terminal 50) disposed outside the region surrounded by the housing 40 (annular portion 40b) in the terminal 50.

  The annular portion 40b has the same thickness over the entire circumference. In other words, the annular portion 40b has the same height over the entire circumference. The thickness of the annular portion 40 b is the length in the thickness direction of the circuit board 10. Furthermore, the upper surface and the lower surface of the annular portion 40b have a flat surface over the entire circumference. Therefore, the upper surface of the annular portion 40 b is parallel to the mounting surface 11 of the circuit board 10 in a state where the housing 40 is disposed on the circuit board 10. In addition, it can be paraphrased that the annular portion 40b has a quadrangular shape (□ shape) through which the central portion passes.

  The annular portion 40 b has at least a part of its upper surface exposed to the outside of the mold resin 30, and its lower surface is in close contact with the mounting surface 11 of the circuit board 10. That is, in the annular portion 40 b, the portion displayed in FIG. 1A is the upper surface of the housing 40. The surface opposite to the upper surface is the lower surface of the housing 40. The connector portion 40a and the annular portion 40b are integrally formed of a resin material, for example. Further, the opposite surface of the circuit board 10 to the mounting surface 11 is also referred to as a back surface.

  The housing 40 is used as a horizontal type at the time of the sealing process. In the sealing step, the mold 200 is attached in close contact with the upper surface of the annular portion 40b. Therefore, the upper surface of the annular portion 40b (the portion where the mold 200 is in close contact) can be restated as the seal surface 40a1.

  The terminal 50 is a terminal for external connection for electrically connecting the circuit element 20 and an external device (such as an electronic control device) provided outside the mold package 100. As shown in FIG. 1B, the terminal 50 is held in close contact with the housing, and is surrounded by a portion disposed in a region surrounded by the housing 40 (region sealed by the mold resin 30) and the housing. The circuit element 20 is electrically connected to the circuit element 20. More specifically, the terminal 50 is electrically and mechanically connected to the land of the circuit board 10 through the conductive connection member. Here, solder 60 is employed as the conductive connection member. In this way, the terminal 50 is electrically connected to the circuit element 20. The terminals 50 and the housing 40 that holds the terminals 50 in close contact with each other can be collectively referred to as a connector. Further, the housing 40 can be referred to as a connector housing.

  The mold resin 30 seals a part of the circuit board 10, a part of the housing 40, and a part of the terminals 50. In other words, the mold resin 30 seals at least a region surrounded by the housing 40 and the circuit board 10. In the present embodiment, as shown in FIGS. 1B and 1B, an example in which the mold resin 30 is also provided on a part of the upper surface of the annular portion 40b is employed. However, the mold resin 30 is not provided on the back surface of the circuit board 10. That is, the back surface of the circuit board 10 is exposed from the mold resin 30 as a heat dissipation surface. Thus, the mold package 100 is a half mold package in which the back surface of the circuit board 10 is exposed from the mold resin 30.

  Here, the manufacturing method of the mold package 100 will be described with reference to FIGS. The method for manufacturing the mold package 100 mainly includes a placing process, a mold clamping process, and a sealing process.

  First, the mounting process will be described with reference to FIG. In the mounting step, the circuit board 10 on which the circuit element 20 is mounted and the housing 40 that holds the terminals 50 in close contact with each other so as to surround the circuit element 20 is mounted on the mounting table 300. At this time, the circuit board 10 is placed with the back surface facing the mounting table 300. In the present embodiment, the back surface of the circuit board 10 is brought into contact with the mounting table 300. The mounting table 300 fixes the circuit board 10 and the housing 40 so that the circuit board 10 and the housing 40 do not move in the direction of gravity even when pressed by the molding die 200 during a mold clamping process described later, and can be called a fixing table. .

  Next, the mold clamping process will be described with reference to FIG. In the mold clamping step, the gate 202 provided in the molding die 200 is disposed at a position facing the region surrounded by the housing 40, and the molding die 200 is closely attached to the entire upper surface of the housing 40 and surrounded by the housing 40. The formed area is covered with a mold 200. Further, the circuit board 10 and the housing 40 are pressed against the mounting table 300 with the molding die 200, and the circuit board 10 and the housing 40 are sandwiched between the molding die 200 and the mounting table 300. In other words, the circuit board 10 and the housing 40 mounted on the mounting table 300 are pressed in the gravity direction (the mounting table 300 direction) by the molding die 200. That is, the circuit board 10 and the housing 40 on which the circuit element 20 is mounted are pressed by the mold 200 and the mounting table 300 so as to be sandwiched from above and below.

  As a result, the mounting table 300 contacts the back surface of the circuit board 10. On the other hand, the mold 200 is in close contact with the seal surface 40a1 (at least a part of the upper surface) of the housing 40. Further, the lower surface of the housing 40 is in close contact with the mounting surface 11 of the circuit board 10. That is, the mold 200 and the upper surface of the housing 40 are in contact with each other without a gap. The lower surface of the housing 40 and the mounting surface 11 of the circuit board 10 are in contact with no gap. Therefore, the cavity 400 surrounded by the mold 200, the circuit board 10, and the housing 40 is formed.

  The mold 200 includes a flow path 201 through which a molten resin (hereinafter also simply referred to as a mold resin 30) that becomes the mold resin 30 flows, and a gate 202 when the resin is injected into the cavity 400 from the flow path 201. And are provided.

  By the way, in this embodiment, the housing 40 (annular part 40b) is arrange | positioned on the circuit board 10, and surrounds the outer periphery with the same height so that the circuit element 20 may be surrounded. For this reason, the sealing surface of the mold 200 (the surface that is in close contact with the housing 40) can be a flat surface (constant height), and can have a simple shape.

  Next, the sealing process will be described with reference to FIG. The sealing step is a step performed after the mold clamping step. In this sealing step, the mold resin 200 is injected from the gate 202 into the cavity 400 using the mold 200 as the upper mold, the housing 40 as the horizontal mold, and the circuit board 10 as the lower mold, and the cavity 400 is sealed with the mold resin 30. In the sealing process, a well-known transfer mold method can be employed.

  As a result, the circuit element 20, the part disposed in the region surrounded by the housing 40 in the terminal 50, the connection part in which the terminal 50 and the circuit board 10 are connected by the solder 60, and the housing 40 in the circuit board 10 are surrounded. The part facing the region is sealed with the mold resin 30.

  In the present embodiment, by performing the mold clamping process as described above, the molding die 200 can be brought into close contact with the housing 40, and the circuit board 10 and the housing 40 can be brought into close contact. As a result, the region surrounded by the mold 200, the housing 40, and the circuit board 10 is a space where the portions other than the gate 202 are sealed. Then, after the mold clamping process, the molding resin 200 is injected from the gate 202 into a space where the part other than the gate 202 is sealed with the molding die 200 as the upper die, the housing 40 as the horizontal die, and the circuit board 10 as the lower die. The mold package 100 can be manufactured by sealing with the mold resin 30. In the transfer mold, molten resin is injected from the gate 202. Therefore, it is desirable that the mold 200 has a top gate structure in which the gate 202 is provided at a portion facing the circuit board 10.

  In addition, the circuit board 10 and the housing 40 are pressed against the mounting table 300 with the molding die 200, and the circuit board 10 and the housing 40 are sandwiched between the molding die 200 and the mounting table 300, and the mold resin 30 is injected. Therefore, it is not necessary to match the dimensions of the housing 40 and the mold 200 with high accuracy. Therefore, it is possible to prevent the mold resin 30 from leaking during the sealing process without matching the dimensions of the housing 40 and the mold 200 with high accuracy. That is, the dimensional accuracy of the housing 40 and the dimensional accuracy of the mold 200 can be relaxed.

  Further, as described above, in the present embodiment, the molding die 200 is brought into close contact with the entire upper surface of the housing 40, and the region surrounded by the housing 40 is covered with the molding die 200, and the circuit board 10 and the housing 40 are covered with the molding die 200. Are pressed against the mounting table 300, and the circuit board 10 and the housing 40 are sandwiched between the mold 200 and the mounting table 300. Therefore, only the upper and lower surfaces of the housing 40 need be sealed. In other words, sealing is possible only in the pressurizing direction (gravity method) of the mold 200. That is, it is not necessary to seal the side wall of the housing 40. For this reason, the sealing performance at the time of a sealing process can be ensured (improvement) easily. Also from this point, it can be said that the mold resin 30 can be prevented from leaking during the sealing process.

  In addition, since the region surrounded by the mold 200, the housing 40, and the circuit board 10 is sealed with the mold resin 30, the back surface of the circuit board 10 can be exposed from the mold resin 30. The housing 40 and the circuit board 10 are sandwiched between the molding die 200 and the mounting table 300, and the molding process is performed with the molding die 200 as the upper die, the housing 40 as the horizontal die, and the circuit substrate 10 as the lower die. Even when high pressure is filled (injected), it is possible to suppress the molding resin 30 from being formed on the back surface of the circuit board 10. Thereby, the heat dissipation of the mold package 100 can be improved.

  Moreover, since the connection part in which the terminal 50 and the circuit board 10 are connected by the solder 60 is sealed with the mold resin 30, it is possible to suppress external stress from being applied to the connection part. Therefore, the strength of the connection part and the electrical connection reliability can be improved. The external stress is, for example, stress accompanying insertion / removal of the external device side with respect to the connector portion 40a, vibration from the actuator generated when the mold package 100 is disposed near the actuator, and the like.

  Moreover, since the circuit board 10 and the housing 40 can be integrated by the mold resin 30, a connecting member (adhesive or the like) for connecting the circuit board 10 and the housing 40 in advance is not necessary, and the processing cost can be reduced. .

  Furthermore, since the entire circumference of the sealing surface 40a1 of the housing 40 can be made the same plane (flat surface), the molding die 200 can be made simple. As a result, the mold 200 can be commonly used (standardized) with another product, and the cost can be reduced even for a small amount of product.

  In addition, as shown in FIG.1 (c), as for the connector part 40a of the housing 40, the corner | angular part 40c is chamfered. In other words, as for the connector part 40a of the housing 40, the corner | angular part 40c has comprised the round shape or R shape. In such a case, a gap is formed between the housing 40 and the mounting surface 11 of the circuit board 10. It is very difficult to seal this gap using a mold. However, in this embodiment, the molding die 200 is brought into close contact with the entire upper surface of the housing 40, and the sealing process is performed with the molding die 200 as the upper die, the housing 40 as the horizontal die, and the circuit board 10 as the lower die. When performing the process, there is no need to seal a gap between the corner 40c of the housing 40 and the mounting surface 11 of the circuit board 10. Therefore, the mold resin does not leak from the gap between the corner portion 40c of the connector portion 40a and the circuit board 10.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not restrict | limited to the embodiment mentioned above at all, and various deformation | transformation are possible in the range which does not deviate from the meaning of this invention.

(Modification 1)
In the above-described embodiment, the housing 40 having the connector portion 40a is employed as an example of the housing in the claims. However, the present invention is not limited to this. As shown in FIGS. 5A and 5B, the mold package 101 includes a housing 41 having no connector portion as a housing in the scope of claims. That is, the housing 41 is equivalent to the housing 41 having only the annular portion 40b in the above-described embodiment. The terminal 50 and the housing 41 that holds the terminal 50 in close contact with each other may be collectively referred to as a pin head.

  Also in this modification 1, the same effect as the above-mentioned embodiment can be produced. In addition, the same code | symbol is provided in the drawing about the same location in the modification 1 and the above-mentioned embodiment. Further, the technique of Modification 1 can be appropriately applied to the above-described embodiment and other modifications.

(Modification 2)
In the above-described embodiment, the circuit board 10 is employed as an example of the pedestal in the claims. However, the present invention is not limited to this. As shown in FIG. 6, the mold package 102 includes a base plate 70 made of metal and a circuit board 10 mounted on the base plate 70 as a pedestal in the claims. In addition, the same code | symbol is provided in the drawing about the location similar in the modification 2 and the above-mentioned embodiment. Further, the housing 42 of the mold package 102 is slightly different from the housing 40 in the above-described embodiment, but is substantially the same, so detailed description thereof is omitted.

  In the case of Modification 2, in the mold clamping process, the mounting table 300 contacts the back surface of the base plate 70 (the surface opposite to the mounting surface 71 on which the circuit board 20 is mounted). On the other hand, the mold 200 is in close contact with the sealing surface (at least a part of the upper surface) of the housing 40. Further, the lower surface of the housing 40 is in close contact with the mounting surface 71 of the base plate 70. That is, the mold 200 and the upper surface of the housing 40 are in contact with each other without a gap. The lower surface of the housing 40 and the mounting surface 71 of the base plate 70 are in contact with no gap. Therefore, the cavity 400 surrounded by the mold 200, the base plate 70, and the housing 40 is formed.

  Therefore, also in this modification 2, the same effect as the above-mentioned embodiment can be produced. Furthermore, in Modification 2, since the circuit board 10 is mounted on the base plate 70 and one surface of the base plate 70 is exposed from the mold resin 30, heat dissipation can be improved as compared with the above-described embodiment. .

  In the second modification, the base plate 70 is built in the mold package 102. For this reason, the mold package 102 can be improved in strength than the mold package 100 in the above-described embodiment. Therefore, the mold package 102 does not need to be built in a metal case or the like. In other words, the mold package 102 has the advantage that the base plate 70 is also integrally molded, so that it is completed as a product in this state, and a lid and a protective case are unnecessary. Note that the technique of Modification 2 can be applied as appropriate to the above-described embodiment and other modifications.

(Modification 3)
As shown in FIG. 7, the mold package 103 includes a base plate 70a made of metal and a circuit board 10 mounted on the base plate 70a. In addition, the same code | symbol is provided in the drawing about the location similar in the modification 3 and the above-mentioned embodiment.

  The base plate 70 a is provided with a through hole 70 a 1 penetrating in the thickness direction at a portion facing the region surrounded by the housing 41. If it does in this way, when sealing with mold resin 30, an anchor effect will be acquired and the joint strength of mold resin 30 and base board 70a can be raised. Thereby, the mechanical strength of the entire mold package 103 can be improved.

Furthermore, as shown in FIG.
The base plate 70a may be provided with a through hole 70a1 and an enlarged diameter portion 70a2 having an opening area larger than that of the through hole 70a1. The enlarged diameter portion 70a2 is provided on the back surface side of the base plate 70a with respect to the through hole 70a1. In other words, the base plate 70a may be provided with through-holes (70a1, 70a2) whose opening area increases toward the back surface side.

  In this case, the mold resin 30 is provided on the mounting surface 71 side and the enlarged diameter portion 70a2 of the base plate 70a through the through hole 71a1. By doing so, it is possible to further improve the bonding strength between the mold resin 30 and the base plate 70a. Therefore, the mechanical strength of the entire mold package 103 can be further improved. Needless to say, this modification 3 can achieve the same effects as those of the above-described embodiment and modification 2.

  Note that the technique of Modification 3 can be applied as appropriate to the above-described embodiment and other modifications. That is, in the above-described embodiment and other modifications, the circuit board 10 that is a pedestal may be provided with a through hole that penetrates in the thickness direction. Even if it does in this way, similarly to the modification 3, the joint strength of the mold resin 30 and the circuit board 10 can be improved.

(Modification 4)
In the above-mentioned embodiment, the example which performs a mounting process, a mold clamping process, and a sealing process in one mold package unit is adopted. In other words, a manufacturing method for manufacturing one mold package 100 with a set of the mold 200 and the mounting table 300 was adopted. However, the present invention is not limited to this. As shown in FIG. 8, you may make it perform a mounting process, a mold-clamping process, and a sealing process in a some mold package unit. In other words, a plurality of mold packages may be manufactured by a set of mold 200 and mounting table 300. In addition, the same code | symbol is provided in the drawing about the location similar in the modification 4 and the above-mentioned embodiment and modification.

  In the modification 4, the housing 41 is employed. The portion of the upper surface of the housing 41 where the mold 200 is in close contact is flat over the entire upper surface of the housing 41. Moreover, in the modification 4, the base board 70 and the circuit board 10 are employ | adopted as a base.

  The circuit board 10 is mounted with circuit elements 20 (not shown in FIG. 8) as in the above-described embodiment, and is divided in advance for each mold package unit. The plurality of circuit boards 10 are mounted on one (common) base plate 70 at a predetermined interval from each other. The housing 41 (annular portion) is disposed on the base plate 70 so as to surround the plurality of circuit boards 10. That is, the plurality of circuit boards 10 are surrounded by one housing 41.

  In the mounting process, the circuit board 20 is mounted on each circuit board 10, and the base plate 70 arranged so that the housing 41 holding the terminals 50 in close contact with each other surrounds the circuit element 20 is mounted on the mounting table 300. Put. At this time, the back surface of the base plate 70 is placed facing the mounting table 300. In FIG. 8, the mold 200 and the mounting table 300 are not shown.

  Next, in the mold clamping step, the molding die 200 is brought into close contact with the entire upper surface of the housing 41 while the gate 202 provided in the molding die 200 is disposed at a position facing the region surrounded by the housing 41. A region surrounded by 41 is covered with a mold 200. Further, the base plate 70 and the housing 41 are pressed against the mounting table 300 with the molding die 200, and the base plate 70 and the housing 41 are sandwiched between the molding die 200 and the mounting table 300. In other words, the base plate 70 and the housing 41 mounted on the mounting table 300 are pressed by the molding die 200 in the direction of gravity (the mounting table 300 direction). That is, the housing 40 and the base plate 70 on which the circuit element 20 is mounted via the circuit board 10 are pressed by the mold 200 and the mounting table 300 so as to be sandwiched from above and below. As a result, a cavity 400 surrounded by the base plate 70, the housing 41, and the mold 200 is formed.

  A sealing process is performed after this mold clamping process. In the sealing step, the mold resin 200 is injected from the gate 202 into the cavity 400 using the mold 200 as the upper mold, the housing 41 as the horizontal mold, and the base plate 70 as the lower mold, and the cavity 400 is sealed with the mold resin 30.

  As a result, the plurality of circuit boards 10, the circuit elements 20 mounted on each circuit board 10, the portions arranged in the region surrounded by the housing 40 in the terminals 50, the terminals 50 and the circuit board 10 are connected by the solder 60. The portion of the base plate 70 facing the region surrounded by the housing 40 is sealed with the mold resin 30. That is, a structure in which a plurality of mold packages 104 are integrally formed is formed.

  Furthermore, in the modification 4, the cutting process (cutting process) which cuts the mold resin 30, the housing 41, and the base board 70 with the cutting line 500 is performed after a sealing process. At this time, the circuit board 10 is cut so as to be divided. As a result, a plurality of mold packages 104 can be formed by performing the placing process, the mold clamping process, and the sealing process once.

  Also in this modification 4, the same effect as the above-mentioned embodiment and modification 2 can be produced. Furthermore, in the modified example 4, since the circuit board 10 is divided in advance and mounted on the base plate 70, the circuit board 10 is not exposed to the outside of the mold resin 30 even after being cut. For this reason, waterproofing and moisture resistance can be improved.

  The housing 41 has an annular shape before the cutting process. However, it is not annular after the cutting process. Therefore, in the mold package 104 manufactured according to the modified example 4, a part of the annular housing 41 is arranged around the circuit element 20.

  The technique of the modification 4 can be applied as appropriate to the above-described embodiment and other modifications. For example, the present invention can be applied even when only the circuit board 10 is employed as the pedestal. In this case, a common circuit board is prepared for a plurality of mold packages. Then, in the cutting process, the circuit board is divided into a plurality of parts.

(Modification 5)
In the above-described embodiment, a mold package manufacturing method having a pedestal (a circuit board or a circuit board and a base plate) on one surface is employed. However, the present invention is not limited to this. As shown in FIG. 9, the present invention can also manufacture a mold package having pedestals on both sides. In addition, the same code | symbol is provided in drawing with the same location in the modification 5 and the above-mentioned embodiment and modification.

  The mold package 105 includes a circuit board 210 on which a circuit element 20 different from the circuit element 20 mounted on the circuit board 10 is mounted in addition to the circuit board 10 on which the circuit element 20 is mounted, the housing 41, and the terminals 50. It is a waste. The circuit board 210 corresponds to the second circuit board in the claims of the present invention. In Modification 5, the circuit board 10 is used as a pedestal.

  The circuit board 210 has a function as a part of the mold. The circuit board 210 is provided with a through hole 212 penetrating in the thickness direction. In the mold clamping process, the through hole 212 and the gate 202 of the mold 200 are arranged to face each other. Therefore, the flow path 201 and the cavity 400 (the region filled with the mold resin 30 in FIG. 9) communicate with each other through the gate 202 and the through hole 212. That is, in Modification 5, the through hole 212 and the gate 202 function as a gate.

  Here, the manufacturing method of the modification 5 is demonstrated. Since the mounting process is the same as that in the above-described embodiment, the description thereof is omitted. In the mold clamping process, the circuit board 210 which is a part of the mold is disposed on the upper surface of the housing 41. At this time, the circuit board 210 is arranged so that the through hole 212 is positioned opposite to the region surrounded by the housing 40. Further, one surface of the circuit board 210 on which the circuit element 20 is mounted is disposed so as to face the circuit board 10. Therefore, one surface of the mounting surface on which the circuit element 20 is mounted on the circuit board 210 and the upper surface of the housing 41 are arranged to face each other. Thereafter, the mold 200 is placed on the circuit board 210. At this time, the gate 202 provided in the molding die 200 and the through hole 212 are opposed to each other, and the molding die 200 is brought into close contact with the circuit board 210. In this manner, the region surrounded by the housing 40 is covered with the molding die (the molding die 200 and the circuit board 210).

  Further, the circuit board 10, the housing 41, and the circuit board 210 are pressed against the mounting table 300 by the molding die 200, and the circuit board 10, the housing 41, and the circuit board 210 are sandwiched between the molding die 200 and the mounting table 300.

  As a result, the mounting table 300 contacts the back surface of the circuit board 10. On the other hand, the circuit board 210 is in close contact with the seal surface 41 a 1 (at least a part of the upper surface) of the housing 41. Further, the lower surface of the housing 40 is in close contact with the mounting surface 11 of the circuit board 10. That is, the circuit board 210 and the upper surface of the housing 40 are in contact with each other without a gap. The lower surface of the housing 40 and the mounting surface 11 of the circuit board 10 are in contact with no gap. Therefore, the cavity 400 surrounded by the circuit board 10, the housing 41, and the circuit board 210 is formed.

  A sealing process is performed after this mold clamping process. In the sealing process, the mold resin 30 is injected into the cavity 400 from the gate 202 and the through-hole 212 using the circuit board 210 as the upper mold, the housing 41 as the horizontal mold, and the circuit board 10 as the lower mold, and the cavity 400 is sealed with the mold resin 30. Stop.

  Also by doing in this way, the same effect as the above-mentioned embodiment can be produced. Furthermore, in the modified example 5, it is possible to manufacture the mold package 105 having a mounting efficiency twice as high as that of the mold package 100 in the above-described embodiment.

  Note that the technique of Modification 5 can be applied as appropriate to the above-described embodiment and other modifications. For example, in combination with the second modification and the fifth modification, the circuit board 10 and the base plate 70 are employed as the pedestal, and the second circuit board 210 is disposed so as to face the circuit board 10 and the base plate 70. Also good.

(Modification 6)
Further, as shown in FIG. 10, the housing 43 has a first protrusion that can be deformed at least in the mold clamping process and the sealing process in at least one of the part where the molding die 200 is in close contact and the facing part of the base. It may have a portion 43a. In addition, the same code | symbol is provided in the drawing about the location similar in the modification 6 and the above-mentioned embodiment and modification. Moreover, in the modification 6, the circuit board 10 is employ | adopted as a base.

  The first protrusion 43a is formed over the entire circumference of the portion of the housing 43 where the mold 200 is in close contact. Similarly, the first protrusion 43 a is formed over the entire circumference of the portion of the housing 43 that faces the circuit board 10. That is, the first protrusion 43a is formed in an annular shape.

  Although the circuit board 10 is a flat surface (one plane), there is actually a minute height variation (100 μm or less) such as the presence or absence of a wiring line or an insulating film. However, in the modified example 6, the first protrusion 43a can be deformed at least during the mold clamping process and the sealing process. In this way, by deforming the first protrusion 43a, it is possible to absorb the height variation of the circuit board 10 (for example, a height deviation of 100 μm or less). In addition, the adhesion between the mold 200 and the housing 43 and the adhesion between the housing 43 and the circuit board 10 can be improved. Therefore, leakage of the mold resin 30 during the sealing process can be suppressed. Thus, the first protrusion 43a is a height deviation absorbing mechanism for preventing leakage of the mold resin.

  Furthermore, the housing 43 is preferably made of a thermoplastic resin that softens during the sealing process. Thereby, the first protrusion 43a can be easily deformed during the sealing process. Therefore, the adhesiveness between the housing 43 and the mold 200 and the adhesiveness between the housing 43 and the circuit board 10 can be further improved, and the leakage of the mold resin 30 during the sealing process is further suppressed. Can do. Further, the force applied to deform the first protrusion 43a during the mold clamping process can be weakened. Therefore, not only the force applied to the housing 43 but also the force applied to the circuit board 10 is preferable. Of course, also in the modification 6, the same effect as the above-mentioned embodiment can be produced.

  Note that the technique of Modification 6 can be applied as appropriate to the above-described embodiment and other modifications. For example, in combination with Modification 2 and Modification 6, the circuit board 10 and the base plate 70 may be adopted as the pedestal, and the first protrusion 43 a may be provided on the housing 42.

(Modification 7)
Further, as shown in FIG. 11, the housing 44 may have a first recess 44 a that is in the vicinity of a portion of the upper surface where the mold 200 is in close contact and is recessed from the periphery outside the mold 200. . That is, the first recess 44 a is provided in a portion that is around the portion where the mold 200 is in close contact with the outer surface of the mold 200 in a state where the mold 200 is disposed on the upper surface of the housing 44. The first recess 44 a is preferably formed over the entire upper surface of the housing 44. That is, the first recess 44a is preferably formed in an annular shape. In addition, the same code | symbol is provided in the drawing about the location similar in the modification 7 and the above-mentioned embodiment and modification. Moreover, in the modification 7, the circuit board 10 is employ | adopted as a base.

  As described above, in the mold clamping process, the upper surface of the housing 44 and the mold 200 are brought into close contact with each other. However, a gap may be formed at the interface between the upper surface of the housing 44 and the mold 200. Thus, when a gap is generated at the interface between the housing 44 and the mold 200, the mold resin 30 may leak from the gap.

  However, by providing the first recess 44a on the upper surface of the housing 44, a gap is generated at the interface between the upper surface of the housing 44 and the mold 200, and even if the mold resin 30 leaks from this gap, the leakage occurred. The mold resin 30 can be stored in the first recess 44a. Therefore, it is possible to suppress the molding resin 30 from being formed to a location where it is not necessary to provide the molding resin 30 such as the side surface of the housing 44. Therefore, by providing the first recess 44a, a deburring process is not required and the defect rate can be reduced. Thus, the 1st recessed part 44a is a resin pool when the mold resin 30 leaks. Of course, also in the modification 7, the same effect as the above-mentioned embodiment can be produced.

  Note that the technique of Modification 7 can be applied as appropriate to the above-described embodiment and other modifications. For example, in combination with Modification 2 and Modification 7, the circuit board 10 and the base plate 70 may be employed as the pedestal, and the first protrusion 43 a may be provided on the housing 42.

(Modification 8)
Further, as shown in FIG. 12, the upper surface of the housing 45 and the portion facing the pedestal may be a concave / convex surface 45a formed with a plurality of concave / convex portions. The uneven surface 45a can also be referred to as a satin shape. The uneven surface 45a is preferably formed over the entire periphery of the upper surface of the housing 45 and the entire periphery of the portion facing the pedestal. That is, the uneven surface 45a is preferably formed in an annular shape. In addition, the same code | symbol is provided in drawing with the same location in the modification 8 and the above-mentioned embodiment and modification. Moreover, in the modification 8, the circuit board 10 is employ | adopted as a base.

  By doing in this way, the same effect as the above-mentioned embodiment can be produced. Further, it is possible to lengthen the extended distance between the housing 45 and the circuit board 10 and between the housing 45 and the molding die and to prevent the mold resin 30 from leaking.

  Note that the technique of Modification 8 can be applied as appropriate to the above-described embodiment and other modifications. For example, in combination with Modification 2 and Modification 8, the circuit board 10 and the base plate 70 are employed as the pedestal, and the upper surface of the housing 42 and the portion facing the pedestal are formed as a concavo-convex surface formed with a plurality of concavo-convexities. Good.

(Modification 9)
As shown in FIG. 13, the housing 46 may be provided with a cushion material 46 a on the surface (upper surface) facing the mold 200 and the surface (lower surface) facing the pedestal. The cushion material 46a can be formed of, for example, silicone. The cushion material 46a is preferably formed over the entire circumference of the upper surface and the entire circumference of the lower surface of the housing 46. That is, the cushion material 46a is preferably formed in an annular shape. In addition, the same code | symbol is provided in the drawing about the location similar in the modification 9 and the above-mentioned embodiment and modification. Moreover, in the modification 9, the circuit board 10 is employ | adopted as a base.

  By doing in this way, the same effect as the above-mentioned embodiment and modification 6 can be produced. Moreover, since the adhesiveness between the housing 46 and the mold 200 and the adhesiveness between the housing 46 and the circuit board 10 can be improved, leakage of the mold resin 30 can be suppressed. Note that the technique of Modification 9 can be applied as appropriate to the above-described embodiment and other modifications.

(Modification 10)
Further, when the housing 41 is disposed on the circuit board 10, it is preferable that the circuit board 10 and the housing 41 have the same linear expansion coefficient. In addition, the same code | symbol is provided in the drawing about the location similar in the modification 10 and the above-mentioned embodiment and modification. Moreover, in the modification 10, the circuit board 10 is employ | adopted as a base. Further, since a pin header is employed here, the same reference numeral 41 as that of the pin header of FIG. 5 is given to the housing for convenience.

  FIG. 14A is a drawing before sealing with the mold resin 30, and illustration of the circuit element 20 is omitted. Here, an example in which four mold packages are manufactured together is adopted. Therefore, after the structure shown in FIG. 14A is sealed with the mold resin 30, a cutting process of cutting along the cutting line 500 is performed as in the fourth modification.

  Also by doing in this way, the same effect as the above-mentioned embodiment can be produced. Further, by making the linear expansion coefficients of the circuit board 10 and the housing 41 equal, even if the housing 41 and the circuit board 10 are deformed at a high temperature, the positional deviation between the terminal 50 and the circuit board 10 is suppressed. can do. Accordingly, it is possible to suppress stress from being applied to the solder 60 that connects the terminal 50 and the circuit board 10.

  For example, as shown in FIGS. 14B and 14C, the housing 41 may be provided with an adjustment member 41 a for matching the linear expansion coefficient with the circuit board 10. Specifically, since the wiring material is Cu, the circuit board 10 tends to use a linear expansion coefficient member that is close to Cu as the surrounding resin material. Therefore, the linear expansion coefficient is generally such that the housing 41> the circuit board 10. Therefore, as shown in FIG. 14B, the linear expansion coefficient is reduced by inserting an adjustment member 41a having a smaller linear expansion coefficient than the resin material of the housing 41 such as Fe or Cu into the housing 41. It is possible to make it equivalent. Further, as shown in FIG. 14C, an adjustment member 41 a having a smaller linear expansion coefficient than the resin material of the housing 41 such as Fe or Cu may be provided on the upper surface of the housing 41. By doing in this way, the linear expansion coefficient of the whole housing 41 can be adjusted, and the linear expansion coefficient of the circuit board 10 and the housing 41 can be made equivalent.

  The constituent material of the housing 41 is preferably the same as the constituent material of the circuit board 10. That is, as described above, the constituent material of the housing 41 and the constituent material of the circuit board 10 are preferably the same without providing the adjustment member 41a. Also by doing so, the linear expansion coefficients of the circuit board 10 and the housing 41 can be made equal.

(Modification 11)
In addition, as shown in FIG. 15, the housing 47 has a second protrusion 47 a that protrudes from the periphery at a portion (lower surface) that faces the pedestal, and the pedestal has a portion that faces the housing 47 and is closer to the periphery than the periphery. You may make it have the recessed 2nd recessed part 13. As shown in FIG. Here, a through hole is adopted as the second recess 13. In the placing process or the mold clamping process, the second protrusion 47a of the housing 47 is press-fitted into the second recess 13 of the base. That is, the housing 47 and the pedestal are mechanically coupled by press-fitting the second protrusion 47a of the housing 47 into the second recess 13 of the pedestal.

  In addition, the same code | symbol is provided in drawing with the same location in the modification 11 and the above-mentioned embodiment and modification. Moreover, in the modification 11, the circuit board 10 is employ | adopted as a base.

  Also by doing in this way, the same effect as the above-mentioned embodiment can be produced. Further, the linear expansion coefficients of the housing 47 and the circuit board 10 are different, and even when the housing 47 and the circuit board 10 are deformed at a high temperature, the positional deviation between the housing 47 and the circuit board 10 can be suppressed. . As a result, positional deviation between the terminal 50 and the circuit board 10 can also be suppressed. Accordingly, it is possible to suppress stress from being applied to the solder 60 that connects the terminal 50 and the circuit board 10.

  Note that the technique of the modification 11 can be appropriately applied to the above-described embodiment and other modifications. For example, in combination with Modification 2 and Modification 11, the circuit board 10 and the base plate 70 may be adopted as the pedestal, and the second recess 13 may be provided in the base plate 70.

(Modification 12)
Further, as shown in FIG. 16, the housing 48 may be configured by combining a plurality of members (here, three members 48 a to 48 c). That is, in the modified example 12, the entire circumference (annular portion) of the housing 48 can be configured by three members 48a, 48b, and 48c. In addition, the same code | symbol is provided in the drawing about the location similar in the modification 12 and the above-mentioned embodiment and modification. Moreover, in the modification 12, the circuit board 10 is employ | adopted as a base.

  FIG. 16 is a drawing before sealing with the mold resin 30, and illustration of the circuit element 20 is omitted. Here, an example in which four mold packages are manufactured together is adopted. Therefore, after the structure shown in FIG. 16 is sealed with the mold resin 30, a cutting process of cutting along the cutting line 500 is performed as in the fourth modification.

  As shown in FIG. 16, the housing 48 is configured by using three members 48a, two members 48b, and one member 48c. The three members 48a have the same shape as each other, and are different from the members 48b and 48c. The two members 42e have the same shape as each other, and have a shape different from that of the member 48c.

  The housing 48 is formed in an annular shape by connecting adjacent members of the plurality of members 48a to 48c with an adhesive. The housing 48 composed of the plurality of members 48a to 48c is provided on the circuit board 10 so as to surround an area on the circuit board 10 where the circuit element 20 is mounted.

  Also by doing in this way, the same effect as the above-mentioned embodiment can be produced. Furthermore, when manufacturing other mold packages, the plurality of members 48a to 48c can be diverted, and standardization will proceed. That is, the housing 48 can be configured by appropriately combining a plurality of members 48 a to 48 c according to the size and number of circuit boards 10. In other words, the housing 48 can be configured by appropriately combining a plurality of members 48a to 48c in accordance with the size of the region where the circuit element 20 is mounted and the number of the regions.

  Furthermore, the pin header (housing 48 and terminal 50) is usually manufactured by insert resin molding. If this pin header is manufactured with one housing, it is expected that a large molding die will be required, which may lead to an increase in cost. However, the individual members 48a to 48c can be manufactured with a relatively small mold. Of the three members 48a to 48c, only the member 48a has the terminal 50 molded by insert resin. Thus, in the example of the modified example 12, standardization of each member and the molding die for manufacturing the housing 48 can be reduced in size.

  Here, an example in which the housing 48 is configured by the three members 48a to 48c is adopted. However, the present invention is not limited to this. The housing 48 may be configured by combining two members, or the housing 48 may be configured by combining four or more members.

  Further, the technique of the modification 12 can be appropriately applied to the above-described embodiment and other modifications. When a plurality of members 48 a to 48 c are connected in this way to form a single housing 48, a step may occur on the upper surface of the housing 48. Therefore, for example, combining the modification 6 and the modification 12 is preferable because it absorbs a step generated on the upper surface of the housing 48 and suppresses the leakage of the mold resin 30. Further, for example, when the modification 7 and the modification 12 are combined, a step is generated on the upper surface of the housing 48, so that even if a gap is formed between the housing 48 and the mold 200, the mold is formed at an unnecessary place. It is preferable because the formation of the resin 30 can be suppressed.

(Modification 13)
As shown in FIGS. 17A and 17B, the housing 48 may be provided with a rubber member 48d between a plurality of members 48a to 48c. The housing 48 in the modification 13 is the same as the housing 48 in the modification 12 except that a rubber member 48d is provided between the plurality of members 48a to 48c. Therefore, in the modified example 13, the description of the same parts as the modified example 12 is omitted. For convenience, the same reference numerals are given to the housing of the modification 13 and the housing of the modification 12. Furthermore, the same code | symbol is provided in drawing with the same location in the modification 13 and the above-mentioned embodiment and modification. In Modification 13, the circuit board 10 is used as a pedestal.

  The housing 48 of the modified example 12 is formed in an annular shape by connecting adjacent members of the plurality of members 48a to 48c with an adhesive. On the other hand, in the housing 48 of the modified example 13, a rubber member 48d is disposed between adjacent members of the plurality of members 48a to 48c. The rubber member 48d is simply disposed between adjacent members of the plurality of members 48a to 48c. Therefore, the rubber member 48d can be removed and reused after the sealing step.

  By doing in this way, the same effect as the above-mentioned embodiment can be produced. Further, the linear expansion coefficient differs between the housing 48 and the circuit board 10, and the rubber member 48 d can absorb the deformation of the housing 48 even when the housing 48 and the circuit board 10 are deformed at a high temperature. As a result, positional deviation between the terminal 50 and the circuit board 10 can also be suppressed. Accordingly, it is possible to suppress stress from being applied to the solder 60 that connects the terminal 50 and the circuit board 10.

  Here, the example which comprises the housing 48 with the three members 48a-48c was employ | adopted. However, the present invention is not limited to this. The housing 48 may be configured by combining two members, or the housing 48 may be configured by combining four or more members.

  Note that the technique of the modification 13 can be appropriately applied to the above-described embodiment and other modifications. For example, the connector housing (housing 40) may be composed of a plurality of members in combination with the above-described embodiment and the modified example 13, and the rubber member 48d may be inserted between the members.

(Modification 14)
As shown in FIG. 18, the housing 49 has a third recess 49 a that is recessed in the vicinity of the part to which the mold 200 is in close contact and surrounded by the mold 200 (in other words, in the cavity 400). 49b may be provided. That is, the third recesses 49 a and 49 b are provided in a portion surrounded by the molding die 200 around the portion where the molding die 200 is in close contact with the upper surface of the housing 49. In addition, the same code | symbol is provided in drawing with the same location in the modification 14 and the above-mentioned embodiment and modification. Moreover, in the modification 14, the circuit board 10 is employ | adopted as a base.

  The third recess 49 a is a bottomed hole that is recessed in the thickness direction of the housing 49. On the other hand, the third recess 49b is a through-hole penetrating the housing 49 in the thickness direction (from the upper surface to the lower surface). Thus, although the 3rd recessed part 49a and the 3rd recessed part 49b differ in a shape, both are called the 3rd recessed part for convenience. Note that the third recesses 49 a and 49 b may be provided on the side wall of the housing 49 in the cavity 400.

  Also by doing in this way, the same effect as the above-mentioned embodiment can be produced. Furthermore, after the sealing step, the mold resin 30 can be formed in the third recesses 49a and 49b. As a result, the bonding strength between the mold resin 30 and the housing 49 can be improved. In addition, since the bonding strength between the mold resin 30 and the housing 49 can be improved in this way, external stress (for example, stress due to insertion / removal of the connector on the external device side, vibration from the actuator, etc.) Even when applied to the housing 49, it is possible to prevent the mold resin 30 and the housing 49 from coming off.

  In this modification, an example in which a third recess 49a and a third recess 49b are provided is adopted. However, the present invention is not limited to this. The present invention can achieve the above-described effects as long as at least one of the third recess 49a and the third recess 49b is provided.

  Further, regarding the third concave portion 49a, it is preferable that the third concave portion 49a is formed over the entire periphery around the portion where the molding die 200 is in close contact with the housing 49, since the bonding strength can be further improved. The third recess 49a is preferably formed in an annular shape. On the other hand, regarding the third concave portion 49b, it is preferable that the third concave portion 49b is formed at a plurality of locations around the portion where the molding die 200 in the housing 49 is in close contact, since the bonding strength can be further improved.

  Note that the technique of the modification 14 can be appropriately applied to the above-described embodiment and other modifications.

(Modification 15)
Further, as shown in FIGS. 19A and 19C, the housing 41 is provided at a position higher than the circuit element 20 with its upper surface mounted on the circuit board (pedestal) 10. Can be adopted. In this case, the molding die 220 may adopt a surface whose surface facing the circuit board 10 and the housing 41 is a flat surface (one flat surface, flat surface). In FIG. 19, for the sake of convenience, reference numeral 41 is given to the housing for the molding package 106 and the housing for the molding package 107.

  In addition, the same code | symbol is provided in drawing with the same location in the modification 15 and the above-mentioned embodiment and modification. Moreover, in the modification 15, the circuit board 10 is employ | adopted as a base. In FIG. 19, an example in which five mold packages 106 and 107 are manufactured in a lump is adopted. Therefore, as shown in FIG. 19, after sealing with the mold resin 30, a cutting process of cutting along the cutting line 500 is performed as in the fourth modification. FIGS. 19B and 19D are plan perspective views of a state in which the mold 220 is disposed on the housing 41. FIG.

  Also by doing in this way, the same effect as the above-mentioned embodiment can be produced. Further, a planar shape is also possible for the mold 220. Further, not only the mounting table 300 but also the mold 220 can be standardized more easily. That is, the versatility of the mold 220 is enhanced. In other words, the size of the mold package to be manufactured can be changed within the range of the mold 220. In other words, the number of mold packages to be manufactured can be changed within the range of the mold 220.

  For example, as shown in FIGS. 19B and 19D, the mold 220 has a length y1 and a width x1. On the other hand, as shown in FIG. 19B, the housing 41 used in manufacturing the mold package 106 has a length y2 (<y1) and a lateral width x2 (<x1). Further, as shown in FIG. 19D, the housing 41 used when the mold package 107 is manufactured has a length y2 (<y1) and a width x3 (<x2). Thus, the same mold 220 can be used when manufacturing either the mold package 106 or the mold package 107.

  In addition, as shown in FIGS. 19B and 19D, when a molding die 220 provided with a plurality of gates 222 is used for one housing 41, the plurality of gates 222 are arranged equally (gates). It is preferable to make the intervals between the holes 222 equal. The molding resin 30 can be formed more easily in the entire area of the cavity 400 than when the plurality of gates 222 are provided in a biased manner.

  Note that the mold packages 106 and 107 are formed by arranging a part of the annular housing 41 around the circuit element 20 in the same manner as the mold package 101 manufactured according to the above-described modification 4.

(Modification 16)
Further, as shown in FIG. 20A, as in the modification 15, the housing 41 is provided at a position higher than the circuit element 20 in which the upper surface of the housing 41 is mounted on the circuit board (pedestal) 10. As the mold 220, a mold having a plane (one plane, flat plane) facing the circuit board 10 and the housing 41 is employed. As a result, the size and number of mold packages to be manufactured can be changed within the range of the mold 220.

  Therefore, as shown in FIG. 20B, a plurality of housings 41 separated from each other may be covered with a single mold 220. However, when a plurality of housings 41 are used, the molding die 220 needs to be provided with a gate 222 at a position facing the region surrounded by each housing 41 as shown in FIG. In FIG. 20, for convenience, the same reference numerals as those of the modification 15 are given to the housing and the mold.

  In addition, the same code | symbol is provided in drawing with the same location in the modification 16 and the above-mentioned embodiment and the modification 15. Moreover, in the modification 16, the circuit board 10 is employ | adopted as a base. In FIG. 20, an example in which three mold packages 108 are manufactured in a lump is adopted. Therefore, as shown in FIG. 20, after sealing with the mold resin 30, a cutting process of cutting along the cutting line 500 is performed as in the fourth modification. Moreover, the code | symbol 14 in FIG.20 (b) is a connection part which each housing 41 in the circuit board 10 is arrange | positioned, and connects between areas, and is connected at the time of a cutting process. FIG. 20B is a plan perspective view showing a state where the molding die 220 is disposed on the housing 41.

  Also by doing in this way, the same effect as the above-mentioned embodiment and modification 15 can be produced. Furthermore, the mold package 108 in which the terminals 50 protrude from three or more side walls can be manufactured.

  Note that the technique of the modification 16 can be appropriately applied to the above-described embodiment and other modifications.

(Modification 17)
In the above-described embodiments and modifications, the transfer mold method is employed. However, the present invention is not limited to this. The present invention can also employ a compression molding method. In addition, the same code | symbol is provided in drawing with the same location in the modification 17 and the above-mentioned embodiment and modification. Moreover, in the modification 17, the circuit board 10 is employ | adopted as a base.

  As shown in FIG. 21A, the molding die 230 in the modified example 16 is provided with a slidable slide portion 231 and a gate 232 that is an injection port for the mold resin 30. As shown in FIG. 21B, when one housing 41 is provided on one circuit board 10 and a plurality of mold packages 107 are taken, a plurality of areas are surrounded by the housing 41. It is preferable to provide a gate 232 at a location.

  Further, as shown in FIG. 21C, when a plurality of housings 41 are provided on one circuit board 10 and a plurality of mold packages 108 are taken, each of the regions surrounded by the housings 41 is provided. In contrast, it is preferable to provide one gate 232. In this compression molding method, the molten resin that is upside down is injected into the cavity 400 from the gate 232 by the movement of the slide portion 231.

  Thus, even when the compression molding method is employed in the sealing process, the same effects as those of the above-described embodiment can be achieved.

  10 circuit boards (pedestal), 20 circuit elements, 70, 70a base plate (pedestal), 30 mold resin, 40-49 housing, 50 terminals, 200, 220, 230 molding die, 210 circuit board (molding die), 202, 222,232 gate, 300 mounting table

Claims (18)

A pedestal (10, 70, 70a) on which the circuit element (20) is mounted;
A housing (40 to 49) disposed around the circuit element on one surface (11, 71) of the mounting surface on which the circuit element is mounted on the pedestal;
An external connection terminal (50) held in close contact with the housing and electrically connected to the circuit element;
A mold resin (30) for sealing a part of the pedestal, a part of the housing, and a part of the terminal;
Mounting the pedestal on which the circuit element is mounted and the housing holding the terminal 50 in close contact with the circuit element is placed on a mounting table (300), A placing step of placing the opposite surface of the surface of the pedestal on which the housing is disposed facing the placing table;
The gates (202, 212, 222, 232) provided on the mold (200, 210, 220, 230) are arranged at positions facing the area surrounded by the housing, and the entire upper surface of the housing An area surrounded by the housing is covered with the molding die in close contact with the molding die, the pedestal and the housing are pressed against the mounting table with the molding die, and the pedestal is formed with the molding die and the mounting table. And a mold clamping process for sandwiching the housing and the housing,
After the mold clamping step, the molding die is injected from the gate into the region surrounded by the molding die, the housing and the pedestal, with the molding die as the upper die, the housing as the horizontal die, and the pedestal as the lower die, A sealing step of sealing the region with the mold resin;
A manufacturing method comprising:   The method according to claim 1, wherein the pedestal includes a first circuit board (10) on which the circuit elements are mounted.   The manufacturing method according to claim 2, wherein the pedestal includes a base plate (70, 70a) made of metal and the first circuit board (10) mounted on the base plate.   The manufacturing method according to claim 2, wherein the housing and the first circuit board have the same linear expansion coefficient.   The manufacturing method according to claim 4, wherein a constituent material of the housing is the same as a constituent material of the first circuit board.   The manufacturing method according to claim 4, wherein the housing is provided with an adjustment member (41 b) for matching a linear expansion coefficient with the first circuit board.   The manufacturing method according to claim 1, wherein the housing is made of a thermoplastic resin that is softened during the sealing process.   The housing (43) has a first protrusion (43a) that can be deformed in at least one of a portion where the molding die is in close contact and a portion facing the pedestal at least during the mold clamping step and the sealing step. The manufacturing method according to claim 1, further comprising:   The manufacturing method according to any one of claims 1 to 8, wherein a portion of the housing (45) facing the upper surface and the pedestal is an uneven surface (45a) in which a plurality of unevennesses are formed.   The manufacturing method according to any one of claims 1 to 7, wherein a portion of the upper surface of the housing (41) where the mold is in close contact is flat over the entire upper surface of the housing.   The housing (44) is characterized in that a first recess (44a) that is recessed from the periphery is provided in a periphery of a portion of the upper surface where the molding die is in close contact with and outside the molding die. The manufacturing method according to any one of claims 1 to 10. The housing (47) has a second protrusion (47a) protruding from the periphery at a portion facing the pedestal, and the pedestal is recessed at a portion facing the housing from the periphery (second recess ( 13)
The said 2nd protrusion part of the said housing (47) is press-fitted in the said 2nd recessed part of the said base in the said mounting process or the said mold clamping process, The Claim 1 thru | or 11 characterized by the above-mentioned. Production method.   The housing (49) is provided with third recesses (49a, 49b) which are in the vicinity of a portion where the molding die is in close contact and which are surrounded by the molding die. Item 13. The manufacturing method according to any one of Items 1 to 12.   The manufacturing method according to any one of claims 1 to 13, wherein the housing (48) is configured by combining a plurality of members (48a to 41c).   The manufacturing method according to claim 14, wherein the housing (48) is provided with a rubber member (48d) between a plurality of members.   The said base (70a) is provided with the through-hole (70a1) penetrated in the thickness direction in the site | part which opposes the area | region enclosed with the said housing, The any one of Claim 1 thru | or 15 characterized by the above-mentioned. The manufacturing method as described in. The upper surface of the housing is provided at a position higher than the circuit element mounted on the pedestal,
The method according to any one of claims 1 to 16, wherein the mold (220) has a flat surface facing the pedestal and the housing. The mold package includes a second circuit board (210) on which a circuit element different from the circuit element mounted on the pedestal is mounted as a part of the mold.
The second circuit board is provided with a through hole (212) penetrating in the thickness direction at a position facing the gate (202) during the mold clamping step.
18. The mold clamping step according to claim 1, wherein one surface of the mounting surface on which the circuit element of the second circuit board is mounted is brought into close contact with the entire upper surface of the housing. Manufacturing method.

Images