JPH06224314A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH06224314A JPH06224314A JP21022993A JP21022993A JPH06224314A JP H06224314 A JPH06224314 A JP H06224314A JP 21022993 A JP21022993 A JP 21022993A JP 21022993 A JP21022993 A JP 21022993A JP H06224314 A JPH06224314 A JP H06224314A
- Authority
- JP
- Japan
- Prior art keywords
- case body
- resin case
- metal base
- thick film
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体装置に係り、特に
半導体素子などをマウントした厚膜回路板を樹脂製ケー
ス内に封装した構成の半導体装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, it relates to a semiconductor device having a structure in which a thick film circuit board on which a semiconductor element or the like is mounted is sealed in a resin case.
【０００２】[0002]
【従来の技術】たとえばマルチチップモジュールなどの
半導体装置においては、安定した機能の保持・発揮ない
し機能の信頼性向上などを目的として、ワンタッチで外
部接続が可能なターミナル、もしくはリード端子を導出
した樹脂製パッケージ内に封装した構成が採られてい
る。図９および図10は、この種の半導体装置の要部構成
を斜視的（図９）、および断面的（図10）にそれぞれ示
したものであり、１は外部接続用ターミナル２が側壁を
貫通して設けられた筒型の樹脂製ケース本体、３は前記
筒型の樹脂製ケース本体１の一端開口部を接着・封止し
て底壁面を成す金属ベース、４は前記筒型の樹脂製ケー
ス本体１内の金属ベース３面に接着・配置された厚膜回
路板、たとえば AlN系回路板である。また、５は前記厚
膜回路板４にマウントされ、かつ厚膜回路板４に電気的
に接続された半導体素子を含む電子部品、６は前記電子
部品５をマウントした厚膜回路板４の入出力端子4aを外
部接続用ターミナル２に電気的に接続する接続リード
部、および前記筒型の樹脂製ケース本体１の他端開口部
を封止する封止体（図示せず）とを具備した構成を成し
ている。この構成においては、要すれば樹脂製ケース本
体１内に、金属ベース３面に接着・配置された厚膜回路
板などの安定化・保護を目的に、シリコーン系のゴムな
どで充填・封入する。2. Description of the Related Art In a semiconductor device such as a multi-chip module, for example, a terminal that can be externally connected with a single touch or a lead terminal is provided for the purpose of maintaining and exhibiting stable functions or improving reliability of functions. The structure enclosed in the package is adopted. 9 and 10 show a perspective view (FIG. 9) and a cross section (FIG. 10) of a main part of a semiconductor device of this type, where 1 is a terminal 2 for external connection penetrating a side wall. A cylindrical resin case body 3 which is provided with a metal base 3 which forms a bottom wall surface by adhering and sealing an opening at one end of the cylindrical resin case body 1; A thick film circuit board, such as an AlN-based circuit board, is adhered and arranged on the surface of the metal base 3 in the case body 1. Further, 5 is an electronic component mounted on the thick film circuit board 4 and including a semiconductor element electrically connected to the thick film circuit board 4, and 6 is an insert of the thick film circuit board 4 on which the electronic component 5 is mounted. A connection lead portion for electrically connecting the output terminal 4a to the external connection terminal 2 and a sealing body (not shown) for sealing the other end opening of the tubular resin case body 1 are provided. Make up the composition. In this configuration, if necessary, the resin case body 1 is filled and sealed with silicone rubber or the like for the purpose of stabilizing and protecting the thick film circuit board or the like adhered and arranged on the surface of the metal base 3. .
【０００３】なお、前記構成において、外部接続用ター
ミナル２は、いわゆるワンタッチで外部との電気的な接
続が可能になっている。また、厚膜回路板４の入出力端
子4aと、外部接続用ターミナル２との電気的な接続は、
いわゆるワイヤボンディングや、リード線の溶接もしく
は半田付けによりなされている。そして、外部接続用タ
ーミナル２数が多い場合は、樹脂製ケース本体１の複数
箇所、たとえば対向する辺の側壁に貫通・配置する構成
を採っているが、いずれの場合も、一般的に一列の配設
になっている。さらに、前記筒型の樹脂製ケース本体１
側壁における外部接続用ターミナル２の貫通・配設は、
樹脂製ケース本体１のインサート成型工程で行われる
が、放熱などに寄与する前記金属ベース３による封止は
別途に行われている。すなわちインサート成型された筒
型の樹脂製ケース本体１の一端開口部の段付け部に、た
とえばシリコーン系接着剤７を予め配置した後、別途用
意しておいた金属ベース３を位置合わせ・配置し、前記
接着剤７により接着・一体化して封止している。In the above structure, the external connection terminal 2 can be electrically connected to the outside with a so-called one-touch operation. The electrical connection between the input / output terminal 4a of the thick film circuit board 4 and the external connection terminal 2 is
This is done by so-called wire bonding, welding of lead wires or soldering. When the number of external connection terminals 2 is large, the resin case body 1 has a structure of penetrating and arranging the resin case body 1 at a plurality of locations, for example, side walls on opposite sides. It is arranged. Further, the tubular resin case body 1
Penetration / arrangement of the external connection terminal 2 on the side wall,
Although it is performed in the insert molding process of the resin case main body 1, the sealing by the metal base 3 that contributes to heat radiation and the like is performed separately. That is, for example, a silicone adhesive 7 is placed in advance on the stepped portion of the one end opening of the insert-molded tubular resin case body 1, and then a separately prepared metal base 3 is aligned and placed. The adhesive 7 is adhered and integrated to seal.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記構
成の半導体装置においては、次のような不都合な問題が
認められる。先ず第１に、前記半導体装置の構成におい
ては、筒型の樹脂製ケース本体１の一端開口部の段付け
部に、金属ベース３の周辺部が接着剤７を介して、接着
・一体化されているため、接着剤７層の厚さのバラツキ
などによって、接着・封止する金属ベース３の傾斜・一
体化などに伴い不都合な問題が起こる。たとえば接着剤
７層の厚さが厚く、かつ偏った場合は、接着・封止して
底面を成す金属ベース３の傾斜により、樹脂製ケース本
体１に一体化している外部接続用ターミナル２が傾斜
し、平面度が出ずボンディング性も低下するため、電気
的な接続の信頼性が損なわれるという問題がある。一
方、接着剤７層の厚さが薄い（接着剤量が少ない）場合
は、不十分な接着・封止となったりして、接続リード部
６のボンディング時に、共振を起こして安定したボンデ
ィング性が得られない。また、充填・封入した未硬化の
シリコーン系ポリマーが、硬化するまでの間（通常硬化
に１時間程度は必要）漏洩を続けることになり、充填・
封入量のコントロールが難しいので、作業性の低下をも
たらすばかりでなく、充填・封入した未硬化のシリコー
ン系ポリマーの硬化工程にインライン式を採りいれ、量
産性を図ろうとすると、大掛かりな装置が必要となって
合理化が損なわれるという問題もある。However, in the semiconductor device having the above structure, the following inconvenient problems are recognized. First, in the configuration of the semiconductor device, the peripheral portion of the metal base 3 is bonded and integrated with the adhesive 7 on the stepped portion of the one end opening of the cylindrical resin case body 1. Therefore, due to variations in the thickness of the adhesive 7 layer, an inconvenient problem occurs with the inclination and integration of the metal base 3 to be adhered and sealed. For example, when the thickness of the adhesive 7 layer is thick and uneven, the external connection terminal 2 integrated with the resin case body 1 is inclined due to the inclination of the metal base 3 which is adhered and sealed to form the bottom surface. However, since the flatness is not obtained and the bondability is deteriorated, there is a problem that reliability of electrical connection is deteriorated. On the other hand, when the thickness of the adhesive 7 layer is small (the amount of the adhesive is small), insufficient bonding / sealing may occur, and resonance may occur at the time of bonding the connection lead portion 6, resulting in stable bondability. Can't get In addition, the uncured silicone polymer that has been filled / enclosed will continue to leak until it is cured (normally about 1 hour is required for curing).
Since it is difficult to control the amount of encapsulation, not only does work efficiency decrease, but an in-line type is adopted in the curing process of the uncured silicone-based polymer that has been filled and encapsulated, and a large-scale device is required for mass production. There is also the problem that rationalization is impaired.
【０００５】第２には、前記接着剤７、たとえばシリコ
ーン系ゴムは、一般的に熱膨脹係数が大きいため、半導
体装置について、たとえば温度サイクル試験を行った場
合、接着・封止した金属ベース３や接続リード部６など
を介して、外部接続用ターミナル２の変位を起こし、結
果的に接続リード部６のボンディングネック部にストレ
スが掛かり、いわゆるネック切れを起こし易いので、信
頼性に問題がある。Secondly, since the adhesive 7, for example, a silicone rubber generally has a large coefficient of thermal expansion, when a semiconductor device is subjected to, for example, a temperature cycle test, the metal base 3 or the adhered / sealed base 3 is used. The external connection terminal 2 is displaced through the connecting lead portion 6 and the like, and as a result, stress is applied to the bonding neck portion of the connecting lead portion 6, and so-called neck breakage easily occurs, which is problematic in reliability.
【０００６】加えて、半導体装置の機能アップなどに伴
う入出力端子の増加により、必然的に外部接続用ターミ
ナルも増加することになるが、この対応策として外部接
続用ターミナルを、前記筒型の樹脂製ケース本体１の各
側壁辺に形設することも試みられているが、側壁面（領
域）に限度があるので、筒型の樹脂製ケース本体１のサ
イズアップ（大形化）を招来するばかりでなく、ボンデ
ィング位置が分散するするため、半導体装置の実装・装
着が煩雑化するとともに、ワイヤボンディング作業など
の効率も低下する問題がある。[0006] In addition, the number of input / output terminals is inevitably increased due to the increase in functions of the semiconductor device, and the number of terminals for external connection is inevitably increased. Although it has been attempted to form the resin case main body 1 on each side wall side, since the side wall surface (area) is limited, the size of the cylindrical resin case main body 1 is increased (larger size). Not only this, but the bonding positions are dispersed, so that the mounting and mounting of the semiconductor device becomes complicated, and the efficiency of wire bonding work and the like also decreases.
【０００７】本発明は上記事情に対処してなされたもの
で、製造工程が簡略化されるばかりでなく、半導体素子
などをマウントした厚膜回路板を樹脂製ケース内に封装
した構成で、常に信頼性の高い機能を呈する半導体装置
の提供を目的とする。The present invention has been made in consideration of the above circumstances, and not only simplifies the manufacturing process, but also has a structure in which a thick film circuit board on which a semiconductor element or the like is mounted is sealed in a resin case. An object is to provide a semiconductor device having a highly reliable function.
【０００８】[0008]
【課題を解決するための手段】本発明に係る半導体装置
は、外部接続用ターミナルが側壁を貫通して設けられた
筒型の樹脂製ケース本体と、前記筒型の樹脂製ケース本
体の一端開口部を封止して底壁面を成す金属ベースと、
前記筒型の樹脂製ケース本体内の金属ベース面に装着・
配置された厚膜回路板と、前記厚膜回路板面にマウント
され、かつ厚膜回路板に電気的に接続された半導体素子
を含む電子部品と、前記電子部品をマウントした厚膜回
路板の入出力端子を、前記外部接続用ターミナルに電気
的に接続するリード部と、前記筒型の樹脂製ケース本体
の他端開口部を封止する封止体とを具備して成る半導体
装置において、前記筒型の樹脂製ケース本体の底壁面を
成す金属ベース周辺部が樹脂製ケース本体の側壁部に係
合した形にインサート成型により装着・一体化し、さら
に要すれば、筒型の樹脂製ケース本体の側壁を貫通して
設けらる外部接続用ターミナルを複数列化したことを特
徴とする。According to another aspect of the present invention, there is provided a semiconductor device, wherein a cylindrical resin case body is provided with an external connection terminal penetrating a side wall, and one end opening of the cylindrical resin case body. A metal base that seals the part and forms the bottom wall surface,
Attached to the metal base surface inside the tubular resin case body.
A thick film circuit board arranged, an electronic component including a semiconductor element mounted on the surface of the thick film circuit board and electrically connected to the thick film circuit board, and a thick film circuit board on which the electronic component is mounted. A semiconductor device comprising: a lead portion for electrically connecting the input / output terminal to the external connection terminal; and a sealing body for sealing the other end opening of the tubular resin case body, The peripheral portion of the metal base forming the bottom wall surface of the tubular resin case body is fitted and integrated by insert molding in a shape that engages with the side wall portion of the resin case body, and further, if necessary, the tubular resin case The invention is characterized in that a plurality of external connection terminals provided through the side wall of the main body are arranged in a row.
【０００９】[0009]
【作用】本発明に係る半導体装置によれば、外部接続用
ターミナルだけでなく、金属ベースもいわゆるインサー
ト成型により樹脂製ケース本体に装着・一体化されてい
る。つまり、金属ベースは一般的に熱膨脹係数が大きい
接着剤によらず、インサート成型で樹脂製ケース本体に
装着・一体化しているため、温度変化によるボンディン
グ接続部への応力が緩和され、接続の信頼性が大幅に向
上される。また、前記一体成型により、金属ベースの封
止（装着）・一体化部も容易に液密性を保持し得るの
で、たとえば未硬化（液状）のシリコーン系ポリマー
を、樹脂製ケース本体内に充填し、硬化させる過程にお
ける漏洩なども回避し得るので、充填量をコントロール
し易いなど作業性ないし量産性にも大きく寄与する。According to the semiconductor device of the present invention, not only the external connection terminal but also the metal base is mounted and integrated with the resin case body by so-called insert molding. In other words, the metal base is generally attached to and integrated with the resin case body by insert molding, rather than using an adhesive with a large coefficient of thermal expansion, so the stress on the bonding connection due to temperature changes is relieved, and the reliability of the connection is improved. Sex is greatly improved. In addition, since the integral molding can easily maintain the liquid-tightness of the sealing (mounting) / integrating part of the metal base, for example, an uncured (liquid) silicone polymer is filled in the resin case body. However, since leakage in the curing process can be avoided, it is easy to control the filling amount, which greatly contributes to workability and mass productivity.
【００１０】さらに、機能アップもしくは容量アップな
どに伴い入出力端子数が増加した場合は、外部接続用タ
ーミナルの複数列化によって、煩雑な作業などを要せず
に、信頼性の高い実装や接続を達成し得る。Further, when the number of input / output terminals is increased due to an increase in functions or capacity, the external connection terminals are arranged in a plurality of rows, so that highly reliable mounting and connection can be performed without complicated work. Can be achieved.
【００１１】[0011]
【実施例】以下、図１〜図８を参照して本発明の実施例
を説明する。Embodiments of the present invention will be described below with reference to FIGS.
【００１２】実施例１ 図１は本発明に係る半導体装置の第１の要部構成例を断
面的に示したもので、８は外部接続用ターミナル９が一
列に側壁を貫通して設けられた筒型の樹脂製ケース本
体、10は前記筒型の樹脂製ケース本体８の一端開口部を
封止して底壁面を成す金属ベースである。また、11は前
記筒型の樹脂製ケース本体８内の金属ベース10面に装着
・配置された厚膜回路板、たとえば AlNを支持基板とし
て成る厚膜回路板、12は前記厚膜回路板11にマウントさ
れ、かつ厚膜回路板11に電気的に接続された半導体素子
を含む電子部品、13は前記電子部品12をマウントした厚
膜回路板11の入出力端子 11aを、前記外部接続用ターミ
ナル９に電気的に接続する接続リード部であり、前記筒
型の樹脂製ケース本体８の他端開口部は、図示されない
封止体で封止されている。Embodiment 1 FIG. 1 is a cross-sectional view showing a first essential structural example of a semiconductor device according to the present invention, in which external connection terminals 9 are provided in a row through the side walls. A cylindrical resin case body 10 is a metal base that forms a bottom wall surface by sealing one end opening of the cylindrical resin case body 8. Further, 11 is a thick film circuit board mounted and arranged on the surface of the metal base 10 in the cylindrical resin case body 8, for example, a thick film circuit board using AlN as a support substrate, and 12 is the thick film circuit board 11 An electronic component including a semiconductor element mounted on the thick film circuit board 11 and electrically connected to the thick film circuit board 11, 13 denotes an input / output terminal 11a of the thick film circuit board 11 on which the electronic component 12 is mounted, the external connection terminal 9, which is a connection lead portion electrically connected to 9, and the other end opening of the cylindrical resin case body 8 is sealed with a sealing body (not shown).
【００１３】そして、この半導体装置は、前記筒型の樹
脂製ケース本体８の底壁面を成す金属ベース10が、その
金属ベース10周辺部を樹脂製ケース本体８の側壁部に係
合・一体化した形にインサート成型により封止・装着し
ていることをもって特徴付けられる。In this semiconductor device, the metal base 10 forming the bottom wall surface of the cylindrical resin case body 8 is engaged and integrated with the peripheral portion of the metal base 10 to the side wall portion of the resin case body 8. It is characterized in that it is sealed and mounted by insert molding in the specified shape.
【００１４】次に、上記構成の半導体装置の製造方法に
ついて説明する。Next, a method of manufacturing the semiconductor device having the above structure will be described.
【００１５】先ず、図２ (a)に平面的に示すごとく、予
め切り離し可能な溝（ノッチ）9a′を設けた構成の外部
接続用ターミナル片９′、および図２ (b)に断面的に示
す構成の金属ベース10をそれぞれ用意する。ここで、外
部接続用ターミナル片９′は、たとえば黄銅製であり、
また金属ベース10は、たとえば銅やアルミニウム製であ
って、その周辺部が環状に段付け 10aされているととも
に、取り付け部 10bが設けられている。次いで、予め用
意しておいた筒型の樹脂製ケース本体８用のインサート
成型機の金型に、前記外部接続用ターミナル片９′およ
び金属ベース10をセットし、たとえばポリフェニレンサ
ルファイド樹脂 (PPS)を用い、常套な手段でインサート
成型することにより、図３に要部を断面的に示すような
構造の成型体を得る。すなわち、外部接続用ターミナル
片９′は成型後切り離し可能な溝（ノッチ）9a′で容易
にカットし得るように、下面側ノッチ9a′が内壁面に位
置するごとく、樹脂製ケース本体８の内壁面を段付け
し、この部分でたとえばボンディング時の加圧に対して
補強的した構成を成している。First, as shown in a plan view in FIG. 2 (a), an external connection terminal piece 9'having a groove (notch) 9a 'which can be separated in advance, and in a sectional view in FIG. 2 (b). The metal bases 10 having the configurations shown are prepared. Here, the external connection terminal piece 9'is, for example, made of brass,
The metal base 10 is made of, for example, copper or aluminum, and its peripheral portion is stepped in a ring shape 10a, and an attachment portion 10b is provided. Then, the external connection terminal piece 9'and the metal base 10 are set in a mold of an insert molding machine for the cylindrical resin case body 8 prepared in advance, and for example, polyphenylene sulfide resin (PPS) is set. By using this and insert molding by a conventional means, a molded product having a structure whose main part is shown in cross section in FIG. 3 is obtained. That is, the external connection terminal piece 9'can be easily cut by the groove (notch) 9a 'which can be separated after molding so that the lower surface side notch 9a' is located on the inner wall surface so that the inside of the resin case body 8 is The wall surface is stepped, and at this portion, for example, a structure is reinforced against pressure applied during bonding.
【００１６】一方、金属ベース10は、その周辺の環状に
段付け部が、図４に平面的（裏面側）に示すごとく、樹
脂製ケース本体８の内壁面に食い込み（係合）んだ形
で、一体化した成型体を成している。On the other hand, the metal base 10 has a stepped portion formed in an annular shape around the metal base 10 which bites (engages) with the inner wall surface of the resin case body 8 as shown in plan view (back side) in FIG. And, it forms an integrated molded body.
【００１７】上記インサート成型により製造した外部接
続用ターミナル９および金属ベース10を一体的に具備・
装着させた樹脂製ケース本体８内の金属ベース10面に、
表面側に半導体素子を含む電子部品12をマウントした厚
膜回路板11を固定・配置した後、その厚膜回路板11の入
出力端子 11aと前記外部接続用ターミナル９との間を、
たとえばワイヤボンディングによる接続リード13で電気
的に接続する。その後、要すれば未硬化シリコーンゴム
成分を、樹脂製ケース本体８内に充填し、金属ベース10
面にマウントされている電子部品12を被覆・埋設した状
態にし、たとえば加熱硬化させてから、前記樹脂製ケー
ス本体８の開口面を、接着剤層を介して封止体で封着す
ることにより、所要の半導体装置が得られる。An external connection terminal 9 and a metal base 10 which are manufactured by the insert molding are integrally provided.
On the surface of the metal base 10 inside the attached resin case body 8,
After the thick film circuit board 11 on which the electronic component 12 including the semiconductor element is mounted is fixed and arranged on the front surface side, between the input / output terminal 11a of the thick film circuit board 11 and the external connection terminal 9,
For example, it is electrically connected by the connection lead 13 by wire bonding. After that, if necessary, the uncured silicone rubber component is filled in the resin case body 8 to make the metal base 10
By covering and embedding the electronic component 12 mounted on the surface, for example, by heating and curing, the opening surface of the resin case body 8 is sealed with a sealing body via an adhesive layer. The required semiconductor device can be obtained.
【００１８】なお、上記半導体装置の製造工程におい
て、外部接続用ターミナル片９′として図５に平面的に
示すごとく、成型後の切り離し可能な溝（ノッチ）9a′
を側面側に引き出した形のものを用いてもよく、この場
合は外部接続用ターミナル９のボンディング面の損傷が
容易に回避されるので、接続の信頼性を向上し得る。ま
た、前記のように樹脂製ケース本体８を、たとえば銅の
熱膨脹係数（17×10-6／℃）やアルミニウムの熱膨脹係
数（24×10-6／℃）に近い熱膨脹係数（20×10-6／℃）
を有するポリフェニレンサルファイド樹脂 (PPS)で構成
した場合は、温度サイクル試験などですぐれた性能を呈
する。In the semiconductor device manufacturing process, as shown in plan view in FIG. 5 as the external connection terminal piece 9 ', a groove (notch) 9a' which can be separated after molding is formed.
May be drawn to the side surface side. In this case, the bonding surface of the external connection terminal 9 is easily prevented from being damaged, so that the reliability of the connection can be improved. The thermal expansion coefficient close to the resin case body 8, for example, thermal expansion coefficient of copper (17 × 10 -6 / ℃) and thermal expansion coefficient of aluminum (24 × 10 -6 / ℃) as the (20 × 10 - 6 / ℃)
When it is composed of a polyphenylene sulfide resin (PPS) having, it exhibits excellent performance in a temperature cycle test and the like.
【００１９】たとえば、前記例示の構成を成す本発明に
係る半導体装置につき、常温と 150℃のシリコーンオイ
ル中に、それぞれ 5分間づつ交互に浸漬させる温度サイ
クル試験を行い、外部接続用ターミナル９のボンディン
グピール強度を評価したところ、図６にて曲線Ａで示す
ごとく、すぐれた安定性ないし信頼性を備えていた。比
較のため、上記図７および図８に示した構成を成す従来
の半導体装置が、図６にて曲線Ｂで示すごとく、温度サ
イクル1200回で外部接続用ターミナル９のボンディング
部のネック切れが発生しているのに対して、本発明に係
る半導体装置の場合は少なくとも10倍の信頼性を呈しお
り、構造・組み立ての簡略化などに伴う工程の合理化、
生産性の向上と相俟って実用上多くの利点をもたらすこ
とが確認された。For example, the semiconductor device according to the present invention having the above-mentioned constitution is subjected to a temperature cycle test in which it is alternately immersed in silicone oil at room temperature and 150 ° C. for 5 minutes, respectively, and the external connection terminal 9 is bonded. When the peel strength was evaluated, as shown by the curve A in FIG. 6, excellent stability or reliability was provided. For comparison, in the conventional semiconductor device having the configuration shown in FIGS. 7 and 8, as shown by the curve B in FIG. 6, the disconnection of the bonding portion of the external connection terminal 9 occurs after 1200 temperature cycles. On the other hand, in the case of the semiconductor device according to the present invention, the reliability is at least 10 times, and the process is streamlined due to the simplification of the structure / assembly,
It was confirmed that it brings many practical advantages in combination with the improvement of productivity.
【００２０】実施例２ 図７は本発明に係る半導体装置の第２の要部構成例を断
面的に示したもので、８は外部接続用ターミナル９が二
列に側壁を貫通して設けられた筒型の樹脂製ケース本
体、10は前記筒型の樹脂製ケース本体８の一端開口部を
封止して底壁面を成す金属ベースである。また、11は前
記筒型の樹脂製ケース本体８内の金属ベース10面に装着
・配置された厚膜回路板、たとえば AlNを支持基板とし
て成る厚膜回路板、12は前記厚膜回路板11にマウントさ
れ、かつ厚膜回路板11に電気的に接続された半導体素子
を含む電子部品、13は前記電子部品12をマウントした厚
膜回路板11の入出力端子 11aを、前記外部接続用ターミ
ナル９に電気的に接続する接続リード部であり、前記筒
型の樹脂製ケース本体８の他端開口部は、図示されない
封止体で封止されている。Embodiment 2 FIG. 7 is a cross-sectional view showing an example of the configuration of a second main part of a semiconductor device according to the present invention, in which external connection terminals 9 are provided in two rows through the side walls. A cylindrical resin case body 10 is a metal base that forms a bottom wall surface by sealing one end opening of the cylindrical resin case body 8. Further, 11 is a thick film circuit board mounted and arranged on the surface of the metal base 10 in the cylindrical resin case body 8, for example, a thick film circuit board using AlN as a support substrate, and 12 is the thick film circuit board 11 An electronic component including a semiconductor element mounted on the thick film circuit board 11 and electrically connected to the thick film circuit board 11, 13 denotes an input / output terminal 11a of the thick film circuit board 11 on which the electronic component 12 is mounted, the external connection terminal 9, which is a connection lead portion electrically connected to 9, and the other end opening of the cylindrical resin case body 8 is sealed with a sealing body (not shown).
【００２１】そして、この半導体装置は、外部接続用タ
ーミナル９が複数列、筒型の樹脂製ケース本体８の側壁
を貫通配置されていること、および前記筒型の樹脂製ケ
ース本体８の底壁面を成す金属ベース10が、その金属ベ
ース10周辺部を樹脂製ケース本体８の側壁部に係合・一
体化した形にインサート成型により封止・装着している
ことをもって特徴付けられる。In this semiconductor device, the external connection terminals 9 are arranged in a plurality of rows so as to pass through the side wall of the cylindrical resin case body 8, and the bottom wall surface of the cylindrical resin case body 8 is arranged. It is characterized in that the metal base 10 constituting the above is sealed and mounted by insert molding in a form in which the peripheral portion of the metal base 10 is engaged and integrated with the side wall portion of the resin case body 8.
【００２２】上記第２の構成例である半導体装置は、前
記第１の構成例の場合に準じた製造方法で容易に製造し
得る。つまり、前記図２ (a)に平面的に示すごとく、予
め切り離し可能な溝（ノッチ）9a′を設けた構成の外部
接続用ターミナル片９′複数個、および図２ (b)に断面
的に示す構成の金属ベース10をそれぞれ用意する。ここ
で、外部接続用ターミナル片９′はいずれも、たとえば
黄銅製であり、また金属ベース10は、たとえば銅やアル
ミニウム製であって、その周辺部が環状に段付け 10aさ
れているとともに、取り付け部 10bが設けられている。The semiconductor device of the second configuration example can be easily manufactured by the manufacturing method according to the case of the first configuration example. That is, as shown in plan view in FIG. 2 (a), a plurality of external connection terminal pieces 9'having a groove (notch) 9a 'that can be separated in advance are provided, and in cross section in FIG. 2 (b). The metal bases 10 having the configurations shown are prepared. Here, each of the external connection terminal pieces 9'is made of, for example, brass, and the metal base 10 is made of, for example, copper or aluminum. Part 10b is provided.
【００２３】次いで、予め用意しておいた筒型の樹脂製
ケース本体８用のインサート成型機の金型に、前記複数
個の外部接続用ターミナル片９′および金属ベース10を
セットし、たとえばポリフェニレンサルファイド樹脂
(PPS)を用い、常套な手段でインサート成型することに
より、図８に要部を断面的に示すような構造の成型体を
得る。すなわち、２段（２列）を成して、樹脂製ケース
本体８の側壁を貫通・配置された外部接続用ターミナル
片９′は、成型後切り離し可能な溝（ノッチ）9a′それ
ぞれで容易にカットし得るように、下面側ノッチ9a′が
内壁面に位置するごとく、樹脂製ケース本体８の内壁面
を段付けし、この部分でたとえばボンディング時の加圧
に対して補強的した構成を成している。Next, the plurality of external connection terminal pieces 9'and the metal base 10 are set in a mold of an insert molding machine for the cylindrical resin case body 8 prepared in advance, and, for example, polyphenylene. Sulfide resin
By using (PPS) and insert molding by a conventional means, a molded product having a structure whose principal part is shown in cross section in FIG. 8 is obtained. That is, the external connection terminal piece 9'formed in two steps (two rows) and penetrating and passing through the side wall of the resin case body 8 can be easily separated by each groove (notch) 9a 'after molding. The inner wall surface of the resin case body 8 is stepped so that the lower surface side notch 9a 'is located on the inner wall surface so that it can be cut. is doing.
【００２４】一方、金属ベース10は、その周辺の環状に
段付け部が、図４に平面的（裏面側）に示すごとく、樹
脂製ケース本体８の内壁面に食い込み（係合）んだ形
で、一体化した成型体を成している。On the other hand, the metal base 10 has a stepped portion formed in an annular shape around the metal base 10 which bites (engages) with the inner wall surface of the resin case body 8 as shown in plan view (back side) in FIG. And, it forms an integrated molded body.
【００２５】上記インサート成型により製造した外部接
続用ターミナル９および金属ベース10を一体的に具備・
装着させた樹脂製ケース本体８内の金属ベース10面に、
表面側に半導体素子を含む電子部品12をマウントした厚
膜回路板11を固定・配置した後、その厚膜回路板11の入
出力端子 11aと前記外部接続用ターミナル９との間を、
たとえばワイヤボンディングによる接続リード13で電気
的に接続する。その後、要すれば未硬化シリコーンゴム
成分を、樹脂製ケース本体８内に充填し、金属ベース10
面にマウントされている電子部品12を被覆・埋設した状
態にし、たとえば加熱硬化させてから、前記樹脂製ケー
ス本体８の開口面を、接着剤層を介して封止体で封着す
ることにより、所要の半導体装置が得られる。The terminal 9 for external connection and the metal base 10 manufactured by the above insert molding are integrally provided.
On the surface of the metal base 10 inside the attached resin case body 8,
After the thick film circuit board 11 on which the electronic component 12 including the semiconductor element is mounted is fixed and arranged on the front surface side, between the input / output terminal 11a of the thick film circuit board 11 and the external connection terminal 9,
For example, it is electrically connected by the connection lead 13 by wire bonding. After that, if necessary, the uncured silicone rubber component is filled in the resin case body 8 to make the metal base 10
By covering and embedding the electronic component 12 mounted on the surface, for example, by heating and curing, the opening surface of the resin case body 8 is sealed with a sealing body via an adhesive layer. The required semiconductor device can be obtained.
【００２６】上記構成の半導体装置について、前記実施
例１の場合と同様な試験・評価を行ったところ、同様の
結果が得られた。When the semiconductor device having the above structure was tested and evaluated in the same manner as in Example 1, the same result was obtained.
【００２７】[0027]
【発明の効果】上記説明から分かるように、本発明に係
る半導体装置は、外部接続用ターミナルだけでなく、金
属ベースもいわゆるインサート成型により樹脂製ケース
本体に装着・一体化されている。すなわち、金属ベース
が一般的に熱膨脹係数が大きい接着剤によらず、インサ
ート成型で樹脂製ケース本体に装着・一体化しているた
め、前記接着剤の熱膨脹係数に起因する外部接続用ター
ミナルのボンディング接続部に対する応力が大幅に緩和
され、接続の信頼性が大幅に向上される。しかも、前記
一体成型により、金属ベースの封止（装着）・一体化部
も容易に液密性を保持し得るので、たとえば未硬化（液
状）のシリコーン系ポリマーを、樹脂製ケース本体内に
充填し、硬化させる過程における漏洩なども回避し得る
ので、充填量をコントロールし易いなど作業性ないし量
産性にも大きく寄与する。また、リード部による接続作
業性や半導体装置の実装作業性など考慮して、前記外部
接続用ターミナルを複数列化した場合は、半導体装置の
機能ないし容量のアップを容易に図ることも可能であ
る。As can be seen from the above description, in the semiconductor device according to the present invention, not only the external connection terminal but also the metal base is mounted and integrated in the resin case body by so-called insert molding. That is, since the metal base is attached / integrated to the resin case body by insert molding instead of using an adhesive having a large coefficient of thermal expansion, the bonding connection of the external connection terminal due to the coefficient of thermal expansion of the adhesive is performed. The stress on the parts is greatly relieved, and the reliability of the connection is greatly improved. Moreover, the integral molding can easily maintain the liquid tightness of the sealing (mounting) / integrating part of the metal base. For example, an uncured (liquid) silicone polymer is filled in the resin case body. However, since leakage in the curing process can be avoided, it is easy to control the filling amount, which greatly contributes to workability and mass productivity. Further, when the terminals for external connection are arranged in a plurality of rows in consideration of workability by the lead portion, workability by mounting the semiconductor device, etc., it is possible to easily increase the function or capacity of the semiconductor device. .
【図１】本発明に係る半導体装置の要部構成例を示す断
面図。FIG. 1 is a cross-sectional view showing a configuration example of a main part of a semiconductor device according to the present invention.
【図２】本発明に係る半導体装置の製造例において用い
た外部接続用ターミナル片の構成例を示す平面図。FIG. 2 is a plan view showing a configuration example of an external connection terminal piece used in a semiconductor device manufacturing example according to the present invention.
【図３】本発明に係る半導体装置の樹脂製ケースのイン
サート成型で外部接続用ターミナル片および金属ベース
を一体化成型したときの要部態様を示す断面図。FIG. 3 is a cross-sectional view showing a mode of a main part when an external connection terminal piece and a metal base are integrally molded by insert molding of a resin case of a semiconductor device according to the present invention.
【図４】本発明に係る半導体装置の樹脂製ケースのイン
サート成型で外部接続用ターミナル片および金属ベース
を一体化成型したときの要部態様を示す裏面図。FIG. 4 is a rear view showing a mode of a main part when an external connection terminal piece and a metal base are integrally molded by insert molding of a resin case of a semiconductor device according to the present invention.
【図５】本発明に係る半導体装置の製造例において用い
る外部接続用ターミナル片の他の構成例を示す平面図。FIG. 5 is a plan view showing another configuration example of the external connection terminal piece used in the manufacturing example of the semiconductor device according to the invention.
【図６】本発明に係る半導体装置および従来の半導体装
置について温度サイクル試験を行ったときのボンディン
グビール強度を比較して示す曲線図。FIG. 6 is a curve diagram showing a comparison of bonding beer strength when a temperature cycle test is performed on a semiconductor device according to the present invention and a conventional semiconductor device.
【図７】本発明に係る半導体装置の他の要部構成例を示
す断面図。FIG. 7 is a cross-sectional view showing another configuration example of the main part of the semiconductor device according to the invention.
【図８】本発明に係る半導体装置の樹脂製ケースのイン
サート成型で外部接続用ターミナル片および金属ベース
を一体化成型したときの他の要部態様を示す断面図。FIG. 8 is a cross-sectional view showing another principal part mode when the external connection terminal piece and the metal base are integrally molded by insert molding of the resin case of the semiconductor device according to the present invention.
【図９】従来の半導体装置の要部構成を示す斜視図。FIG. 9 is a perspective view showing a main configuration of a conventional semiconductor device.
【図１０】従来の半導体装置の要部構成を示す断面図。FIG. 10 is a cross-sectional view showing the configuration of a main part of a conventional semiconductor device.
１，８…筒型の樹脂製ケース本体 ２，９…外部接続
用ターミナル ３，10…金属ベース ４，11…厚膜
回路板 4a， 11a…入出力端子 ５，12…半導体素
子を含む電子部品 ６，13…接続リード ７…接着
剤層1, 8 ... Cylindrical resin case body 2, 9 ... External connection terminal 3, 10 ... Metal base 4, 11 ... Thick film circuit board 4a, 11a ... Input / output terminal 5, 12 ... Electronic component including semiconductor element 6, 13 ... Connection lead 7 ... Adhesive layer
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 5/00 Ｂ 7362−4Ｅ Continuation of the front page (51) Int.Cl. 5 Identification number Office reference number FI technical display location H05K 5/00 B 7362-4E
Claims (2)
設けられた筒型の樹脂製ケース本体と、 前記筒型の樹脂製ケース本体の一端開口部を封止して底
壁面を成す金属ベースと、 前記筒型の樹脂製ケース本体内の金属ベース面に装着・
配置された厚膜回路板と、 前記厚膜回路板にマウントされ、かつ厚膜回路板に電気
的に接続された半導体素子を含む電子部品と、 前記電子部品をマウントした厚膜回路板の入出力端子
を、前記外部接続用ターミナルに電気的に接続するリー
ド部と、 前記筒型の樹脂製ケース本体の他端開口部を封止する封
止体とを具備して成る半導体装置において、 前記筒型の樹脂製ケース本体の底壁面を成す金属ベース
周辺部が樹脂製ケース本体の側壁部に係合した形にイン
サート成型により装着・一体化していることを特徴とす
る半導体装置。1. A cylindrical resin case main body having an external connection terminal penetrating through a side wall thereof, and a metal base forming a bottom wall surface by sealing one end opening of the cylindrical resin case main body. And attached to the metal base surface inside the tubular resin case body.
A thick film circuit board arranged, an electronic component including a semiconductor element mounted on the thick film circuit board and electrically connected to the thick film circuit board; and a thick film circuit board on which the electronic component is mounted. A semiconductor device comprising: a lead portion that electrically connects an output terminal to the external connection terminal; and a sealing body that seals the other end opening of the tubular resin case body. A semiconductor device characterized in that a peripheral portion of a metal base forming a bottom wall surface of a cylindrical resin case body is mounted and integrated by insert molding in a shape engaged with a side wall portion of the resin case body.
設けられた筒型の樹脂製ケース本体と、 前記筒型の樹脂製ケース本体の一端開口部を封止して底
壁面を成す金属ベースと、 前記筒型の樹脂製ケース本体内の金属ベース面に装着・
配置された厚膜回路板と、 前記厚膜回路板にマウントされ、かつ厚膜回路板に電気
的に接続された半導体素子を含む電子部品と、 前記電子部品をマウントした厚膜回路板の入出力端子
を、前記外部接続用ターミナルに電気的に接続するリー
ド部と、 前記筒型の樹脂製ケース本体の他端開口部を封止する封
止体とを具備して成る半導体装置において、 前記筒型の樹脂製ケース本体の底壁面を成す金属ベース
周辺部が樹脂製ケース本体の側壁部に係合した形にイン
サート成型により装着・一体化し、かつ側壁を貫通して
設けられた外部接続用ターミナルが複数列であることを
特徴とする半導体装置。2. A cylindrical resin case body having an external connection terminal penetrating a side wall thereof, and a metal base forming a bottom wall surface by sealing one end opening of the cylindrical resin case body. And attached to the metal base surface inside the tubular resin case body.
A thick film circuit board arranged, an electronic component including a semiconductor element mounted on the thick film circuit board and electrically connected to the thick film circuit board; and a thick film circuit board on which the electronic component is mounted. A semiconductor device comprising: a lead portion that electrically connects an output terminal to the external connection terminal; and a sealing body that seals the other end opening of the tubular resin case body. For external connection, which is mounted and integrated by insert molding so that the peripheral part of the metal base forming the bottom wall surface of the cylindrical resin case body engages with the side wall part of the resin case body and penetrates the side wall. A semiconductor device having a plurality of terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21022993A JP2939404B2 (en) | 1992-12-04 | 1993-08-25 | Semiconductor device and manufacturing method thereof |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4-325407 | 1992-12-04 | ||
| JP32540792 | 1992-12-04 | ||
| JP21022993A JP2939404B2 (en) | 1992-12-04 | 1993-08-25 | Semiconductor device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06224314A true JPH06224314A (en) | 1994-08-12 |
| JP2939404B2 JP2939404B2 (en) | 1999-08-25 |
Family
ID=26517924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21022993A Expired - Fee Related JP2939404B2 (en) | 1992-12-04 | 1993-08-25 | Semiconductor device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2939404B2 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0752720A3 (en) * | 1995-07-07 | 1998-06-03 | Mitsubishi Denki Kabushiki Kaisha | Lead for semiconductor device |
| US5920119A (en) * | 1996-02-22 | 1999-07-06 | Hitachi, Ltd. | Power semiconductor module employing metal based molded case and screw fastening type terminals for high reliability |
| JP2003297497A (en) * | 2002-04-08 | 2003-10-17 | Hitachi Ltd | Electronic control device |
| JP2007035718A (en) * | 2005-07-22 | 2007-02-08 | Hitachi Ltd | Molded electronic circuit device and manufacturing method thereof |
| JP2007320268A (en) * | 2006-06-03 | 2007-12-13 | Apic Yamada Corp | Manufacturing method of resin sealed type electronic parts, and resin sealed type electronic parts |
| JP2009219322A (en) * | 2008-03-12 | 2009-09-24 | Autonetworks Technologies Ltd | Electric connection box |
| JP2010251812A (en) * | 2010-08-13 | 2010-11-04 | Panasonic Corp | Method for installing board, and board accommodation body |
| WO2014069073A1 (en) * | 2012-10-30 | 2014-05-08 | 浜松ホトニクス株式会社 | Photodetection unit and method for manufacturing same |
| JP2014093451A (en) * | 2012-11-05 | 2014-05-19 | Denso Corp | Manufacturing method for mold package |
| JPWO2018128005A1 (en) * | 2017-01-06 | 2019-11-07 | パナソニックＩｐマネジメント株式会社 | Capacitor, capacitor unit, capacitor manufacturing method, and capacitor unit manufacturing method |
| JP2023123939A (en) * | 2022-02-25 | 2023-09-06 | 株式会社リケン | Electronic device case |
-
1993
- 1993-08-25 JP JP21022993A patent/JP2939404B2/en not_active Expired - Fee Related
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0752720A3 (en) * | 1995-07-07 | 1998-06-03 | Mitsubishi Denki Kabushiki Kaisha | Lead for semiconductor device |
| US5920119A (en) * | 1996-02-22 | 1999-07-06 | Hitachi, Ltd. | Power semiconductor module employing metal based molded case and screw fastening type terminals for high reliability |
| JP2003297497A (en) * | 2002-04-08 | 2003-10-17 | Hitachi Ltd | Electronic control device |
| JP2007035718A (en) * | 2005-07-22 | 2007-02-08 | Hitachi Ltd | Molded electronic circuit device and manufacturing method thereof |
| JP4601509B2 (en) * | 2005-07-22 | 2010-12-22 | 日立オートモティブシステムズ株式会社 | Molded electronic circuit device and manufacturing method thereof |
| JP2007320268A (en) * | 2006-06-03 | 2007-12-13 | Apic Yamada Corp | Manufacturing method of resin sealed type electronic parts, and resin sealed type electronic parts |
| JP2009219322A (en) * | 2008-03-12 | 2009-09-24 | Autonetworks Technologies Ltd | Electric connection box |
| JP2010251812A (en) * | 2010-08-13 | 2010-11-04 | Panasonic Corp | Method for installing board, and board accommodation body |
| WO2014069073A1 (en) * | 2012-10-30 | 2014-05-08 | 浜松ホトニクス株式会社 | Photodetection unit and method for manufacturing same |
| JP2014089878A (en) * | 2012-10-30 | 2014-05-15 | Hamamatsu Photonics Kk | Photo-detection unit and method of manufacturing the same |
| CN104769699A (en) * | 2012-10-30 | 2015-07-08 | 浜松光子学株式会社 | Photodetection unit and method for manufacturing same |
| US9607814B2 (en) | 2012-10-30 | 2017-03-28 | Hamamatsu Photonics K.K. | Photodetection unit and method for manufacturing same |
| CN104769699B (en) * | 2012-10-30 | 2017-05-31 | 浜松光子学株式会社 | Optical detecting unit and its manufacture method |
| JP2014093451A (en) * | 2012-11-05 | 2014-05-19 | Denso Corp | Manufacturing method for mold package |
| JPWO2018128005A1 (en) * | 2017-01-06 | 2019-11-07 | パナソニックＩｐマネジメント株式会社 | Capacitor, capacitor unit, capacitor manufacturing method, and capacitor unit manufacturing method |
| JP2023123939A (en) * | 2022-02-25 | 2023-09-06 | 株式会社リケン | Electronic device case |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2939404B2 (en) | 1999-08-25 |
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