JP2007320268A - Manufacturing method of resin sealed type electronic parts, and resin sealed type electronic parts - Google Patents
Manufacturing method of resin sealed type electronic parts, and resin sealed type electronic parts Download PDFInfo
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本発明は樹脂封止型電子部品の製造方法および樹脂封止型電子部品に関し、より詳細には、コネクタのような内部に空間を有する組立部品を備えた電子部品を、確実に樹脂封止することを可能とし、信頼性の高い電子部品として提供することを可能とする樹脂封止型電子部品の製造方法および樹脂封止型電子部品に関する。 The present invention relates to a method for manufacturing a resin-encapsulated electronic component and a resin-encapsulated electronic component, and more specifically, an electronic component including an assembly component having a space inside such as a connector is reliably resin-encapsulated. The present invention relates to a method for manufacturing a resin-encapsulated electronic component and a resin-encapsulated electronic component that can be provided as a highly reliable electronic component.
図６はコネクタ付きの電子部品の例を示すもので、金属基体１０に回路基板１２が実装され、回路基板１２にコネクタ２０の接続ピン２２の端部を接続してコネクタ２０が取り付けられている。図６（ｃ）は、電子部品の断面図であり、コネクタ２０の接続ピン２２が中途位置でＬ字形に折曲し、ピンガイド１４によりピン位置を位置決めして回路基板１２に接続されている。図６（ｂ）に示すように、コネクタ２０は本体２０ａを金属基体１０の前部にねじ止めして固定される。金属基体１０の前部にはコネクタ２０と回路基板１２とを接続する接続ピン２２を収容するための凹部１１が形成され、コネクタ２０金属基体１０への取り付け部分は内部空間に形成され、この内部空間に接続ピン２２が配されている。 FIG. 6 shows an example of an electronic component with a connector. A circuit board 12 is mounted on a metal base 10, and an end of a connection pin 22 of the connector 20 is connected to the circuit board 12 and the connector 20 is attached. . FIG. 6C is a cross-sectional view of the electronic component. The connection pin 22 of the connector 20 is bent in an L shape at an intermediate position, and the pin position is positioned by the pin guide 14 and connected to the circuit board 12. . As shown in FIG. 6B, the connector 20 is fixed by screwing the main body 20 a to the front portion of the metal base 10. A recess 11 for accommodating a connection pin 22 for connecting the connector 20 and the circuit board 12 is formed in the front portion of the metal base 10, and a mounting portion to the connector 20 metal base 10 is formed in an internal space. Connection pins 22 are arranged in the space.
回路基板１２には種々の電子部品が搭載されており、この製品では電子部品とともに回路基板１２の全体を樹脂１６によって樹脂封止することによって、回路基板１２を塵埃、熱、振動といった外部環境から保護している。図６（ａ）に示すように、平面形状が矩形形成された金属基体１０上に回路基板１２が実装され、樹脂１６は回路基板１２の全面を覆うように樹脂封止している。
上記のように、電子部品が搭載された回路基板１２を樹脂封止する方法として考えられる方法は、ポッティング法を利用して回路基板１２の表面を樹脂により被覆する方法、樹脂封止金型を使用して回路基板１２を樹脂封止する方法である。しかしながら、ポッティング法は、回路基板のような広い樹脂封止領域を有する製品の樹脂封止には非効率であり、また樹脂をポッティングするだけでは複雑な隙間部分に樹脂が入り込みにくく、樹脂封止品中に空気が残留し、外部温度が上昇したりした際に残留空気が膨張して樹脂が損傷するといった問題が生じ、製品の信頼性が不十分になるという問題がある。 As described above, a method that can be considered as a method of resin-sealing the circuit board 12 on which electronic components are mounted includes a method of covering the surface of the circuit board 12 with a resin using a potting method, and a resin-sealed mold. In this method, the circuit board 12 is sealed with resin. However, the potting method is inefficient for resin sealing of products having a wide resin sealing area such as a circuit board, and it is difficult for the resin to enter a complicated gap by simply potting the resin. When air remains in the product and the external temperature rises, there is a problem that the residual air expands and damages the resin, resulting in insufficient product reliability.
また、樹脂封止金型を使用した樹脂封止方法による場合は、被成形品の隙間部分に樹脂が確実に充填され、樹脂封止品中に空気が残留しないという利点があるが、このような樹脂封止を可能にするには十分な樹脂圧を加えて樹脂封止する必要がある。
図７は、上記電子部品を樹脂封止する方法として一般的な方法である。すなわち、金属基体１０に回路基板１２を搭載し、コネクタ２０を取り付けた製品を上型３０と下型３２によりクランプし、ゲート３０ａから上型３０に形成されたキャビティ３０ｂに金型により加熱されて溶融した樹脂１６を充填して樹脂封止する。
Further, in the case of the resin sealing method using the resin sealing mold, there is an advantage that the resin is surely filled in the gap portion of the molded product and no air remains in the resin sealed product. In order to enable proper resin sealing, it is necessary to apply a sufficient resin pressure to perform resin sealing.
FIG. 7 shows a general method for resin-sealing the electronic component. That is, a product in which the circuit board 12 is mounted on the metal base 10 and the connector 20 is attached is clamped by the upper mold 30 and the lower mold 32, and heated from the gate 30a to the cavity 30b formed in the upper mold 30 by the mold. Filled with molten resin 16 and sealed with resin.
しかしながら、この樹脂封止方法では、金属基体１０に取り付けられているコネクタ２０の内部が接続ピン２２が配された内部空間となっているため、大きな樹脂圧を作用させて樹脂封止すると、内部空間内に樹脂１６が浸入し、製品を損傷してしまう。このため、この樹脂封止方法では、十分な樹脂圧を加えて樹脂封止することができず、結果として、樹脂封止品の樹脂中に空気が残留してしまったり、ボイドが生じたりして製品の信頼性が低下するという問題がある。また、樹脂圧はピンガイド１４が受けることになるため、樹脂封止した際にピンガイド１４の近傍で樹脂にクラックが入るといったように的確な樹脂成形ができないという問題があった。 However, in this resin sealing method, the inside of the connector 20 attached to the metal base 10 is an internal space in which the connection pins 22 are arranged. The resin 16 enters the space and damages the product. For this reason, in this resin sealing method, sufficient resin pressure cannot be applied to perform resin sealing, and as a result, air may remain in the resin of the resin-sealed product or voids may be generated. There is a problem that the reliability of the product decreases. Further, since the resin pressure is received by the pin guide 14, there is a problem that accurate resin molding cannot be performed such that the resin cracks in the vicinity of the pin guide 14 when the resin is sealed.
そこで、本発明はこれらの課題を解決すべくなされたものであり、上述した電気製品のようにコネクタ等の内部に空間が形成されて取り付けられる組立部品を備えた電子部品を樹脂封止金型を用いて樹脂封止する際に、被成形品を損傷することなく、十分な樹脂圧を作用させて樹脂封止することを可能とし、信頼性の高い樹脂封止型の電気製品として提供することができる樹脂封止型電子部品の製造方法および樹脂封止型電子部品を提供することを目的とする。 Accordingly, the present invention has been made to solve these problems, and an electronic component including an assembly component that is attached with a space formed inside a connector or the like like the above-described electrical product is attached to a resin-sealed mold. When sealing with resin, it is possible to perform resin sealing by applying sufficient resin pressure without damaging the molded product, and provide as a highly reliable resin-sealed electrical product An object of the present invention is to provide a resin-sealed electronic component manufacturing method and a resin-sealed electronic component.
本発明は、上記目的を達成するため次の構成を備える。
すなわち、回路基板との取り付け位置に内部空間を形成して組立部品が取り付けられた電子部品を、樹脂封止金型によりクランプし、前記回路基板を樹脂封止して製造する樹脂封止型電子部品の製造方法において、前記内部空間に樹脂を充填し、樹脂を硬化させることにより、前記回路基板と組立部品の取り付け部分を前記樹脂封止金型を用いる樹脂封止工程における樹脂圧に対する耐久構造とする工程と、該耐久構造に形成した電子部品を前記樹脂封止金型によりクランプして前記回路基板を樹脂封止する工程とを有することを特徴とする。
The present invention has the following configuration in order to achieve the above object.
That is, a resin-sealed electronic device that is manufactured by clamping an electronic component in which an assembly part is attached by forming an internal space at a mounting position with a circuit board by a resin-sealing mold and resin-sealing the circuit board In a component manufacturing method, by filling a resin in the internal space and curing the resin, a structure for durability against a resin pressure in a resin sealing process using the resin sealing mold for attaching the circuit board and the assembly part And the step of clamping the electronic component formed in the durable structure with the resin-sealing mold and resin-sealing the circuit board.
また、前記電子部品は、前記回路基板が金属基体に支持され、前記組立部品としてのコネクタの接続ピンと前記回路基板との取り付け部分がコネクタの接続ピンを収容する内部空間に形成された製品であり、前記内部空間に樹脂を充填し、樹脂を硬化させて前記取付部分を耐久構造とした後、樹脂封止金型を用いて前記回路基板を樹脂封止することにより、樹脂封止金型を用いる樹脂封止工程においてコネクタと回路基板との取り付け部分を損傷させることなく、確実に回路基板を樹脂封止することができる。
また、前記内部空間を充填する樹脂として、液状樹脂を用いること、また、前記内部空間に液状樹脂を注入する際に、前記内部空間に連通させて前記回路基板に設けた連通孔から液状樹脂を注入する方法が好適に利用できる。
The electronic component is a product in which the circuit board is supported by a metal base, and a connection pin between the connector pin as the assembly part and the circuit board is formed in an internal space that accommodates the connector connection pin. Then, after filling the internal space with resin and curing the resin to make the mounting portion a durable structure, the circuit board is resin-sealed using a resin-sealed mold, thereby forming a resin-sealed mold. In the resin sealing process to be used, the circuit board can be reliably sealed with resin without damaging the attachment portion between the connector and the circuit board.
In addition, a liquid resin is used as the resin filling the internal space, and when the liquid resin is injected into the internal space, the liquid resin is communicated with the internal space from a communication hole provided in the circuit board. A method of injecting can be suitably used.
また、金属基体に電子部品を搭載した回路基板が支持され、金属基体とコネクタとの取り付け部分がコネクタの接続ピンを収容する内部空間に形成され、前記回路基板が回路部品とともに樹脂封止されて形成された樹脂封止型電子部品であって、前記金属基体には、前記コネクタの取り付け位置に前記接続ピンを収容する凹部が形成され、該凹部の開口部を覆うように前記接続ピンを前記回路基板に位置合わせして接続するためのピンガイドが設けられ、前記凹部と、前記ピンガイドと、前記コネクタの仕切り部とで囲まれた内部空間に樹脂が充填され、前記回路基板と組立部品の取り付け部分が樹脂封止金型を用いる樹脂封止工程における樹脂圧に対する耐久構造に形成された電子部品は、回路基板とコネクタとの取り付け部分が樹脂封止金型を用いる樹脂封止工程において樹脂によって保持され、保形性および信頼性の高い樹脂封止型電子部品として提供される。 In addition, a circuit board on which electronic components are mounted on a metal base is supported, an attachment portion between the metal base and the connector is formed in an internal space that accommodates connection pins of the connector, and the circuit board is resin-sealed together with the circuit parts. In the formed resin-sealed electronic component, the metal base is formed with a recess for accommodating the connection pin at a position where the connector is attached, and the connection pin is arranged to cover the opening of the recess. A pin guide for aligning and connecting to the circuit board is provided, and an internal space surrounded by the recess, the pin guide, and the partition of the connector is filled with resin, and the circuit board and the assembly component Electronic parts formed with a durable structure against the resin pressure in the resin sealing process using a resin-sealed mold, the mounting part of the circuit board and connector are resin-sealed Held by the resin in the resin sealing step using the mold, it is provided as a shape retention and reliable resin encapsulated electronic component.
また、前記金属基体の前記内部空間に充填された樹脂と接する内面に、樹脂を前記金属基体に対して抜け止めする抜け止め手段が設けられていることにより、樹脂封止金型を用いる樹脂封止工程において、前記内部空間に充填された樹脂を抜け止めして確実な樹脂封止を可能にする。
また、前記コネクタの前記金属基体に取り付けられるフランジ部の前記内部空間に充填された樹脂と接触する面に、該コネクタを樹脂から抜け止めする逆止テーパ面が形成されていること、また、前記コネクタの前記金属基体に取り付けられるフランジ部の前記内部空間に充填された樹脂と接触する面に、アンカー作用により前記コネクタを樹脂から抜け止めするアンカー溝が形成されていることにより、コネクタが樹脂に確実に連結され、外部から作用する振動等に対して樹脂封止型電子部品の耐久性が向上する。
In addition, the inner surface of the metal base that contacts the resin filled in the internal space is provided with a retaining means for retaining the resin from the metal base, so that a resin sealing using a resin sealing mold is possible. In the stopping step, the resin filled in the internal space is prevented from coming off, thereby enabling reliable resin sealing.
In addition, a check taper surface for preventing the connector from coming off from the resin is formed on a surface of the flange portion attached to the metal base of the connector that comes into contact with the resin filled in the internal space. An anchor groove for preventing the connector from coming off from the resin by an anchor action is formed on a surface of the flange portion attached to the metal base of the connector that comes into contact with the resin filled in the internal space, so that the connector is made of resin. The durability of the resin-encapsulated electronic component is improved with respect to vibrations and the like that are reliably connected and act from the outside.
また、前記樹脂封止型電子部品の製造方法において、回路基板と組立部品との取り付け位置に形成された内部空間に樹脂が充填され、前記回路基板と組立部品の取り付け部分が樹脂封止金型を用いる樹脂封止工程における樹脂圧に対する耐久構造に形成された被成形品を樹脂封止する樹脂封止金型であって、前記被成形品を収容する収容凹部が形成されるとともに、前記回路基板を樹脂封止するキャビティが形成されていることを特徴とする。この樹脂封止金型を使用することにより、前記被成形品を好適に樹脂封止することができる。 Further, in the method for manufacturing a resin-sealed electronic component, an internal space formed at a mounting position between the circuit board and the assembly component is filled with resin, and a mounting portion between the circuit board and the assembly component is a resin-sealed mold. A resin-sealing mold for resin-sealing a molded article formed in a durable structure against a resin pressure in a resin-sealing process using a housing, wherein an accommodating recess for accommodating the molded article is formed, and the circuit A cavity for resin-sealing the substrate is formed. By using this resin-sealed mold, the molded article can be suitably sealed with resin.
本発明によれば、回路基板に組立部品を取り付けた際に形成される内部空間をあらかじめ樹脂によって充填し、樹脂を硬化させることにより、回路基板と組立部品との取り付け部分が樹脂封止工程での樹脂圧に対する耐久構造として形成され、被成形品を樹脂封止金型によりクランプして樹脂圧を作用させて樹脂封止した際に被成形品が損傷を受けることがなく、これによって確実に回路基板を樹脂封止することができ、信頼性の高い樹脂封止型電子部品として提供することができる。 According to the present invention, the internal space formed when the assembly component is attached to the circuit board is filled with the resin in advance, and the resin is cured, so that the attachment portion between the circuit board and the assembly component is a resin sealing step. It is formed as a durable structure against resin pressure, and the molded product is not damaged when the molded product is clamped with a resin-sealing mold and the resin pressure is applied to seal the resin. The circuit board can be resin-sealed, and can be provided as a highly reliable resin-sealed electronic component.
以下、本発明の好適な実施の形態を、添付図面に基づいて詳細に説明する。
図１は、本発明に係る樹脂封止型電子部品の製造方法の適用例として、図５に示す、金属基体１０に回路基板１２を搭載し、金属基体１０に組立部品としてのコネクタ２０を取り付けた電子部品を被成形品として樹脂封止する方法を示す。
図１（ａ）は、金属基体１０の前面にコネクタ２０を取り付け、金属基体１０の上面に、ピンガイド１４により接続ピン２２を位置決めして、接続ピン２２と回路基板１２とを接続して回路基板１２を搭載した状態を示す。コネクタ２０が取り付けられる金属基体１０の前部には接続ピン２２を収容するための凹部１１が形成され、ピンガイド１４は凹部１１の回路基板１２の取り付け側の開口部を塞ぐように取り付けられている。
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.
FIG. 1 shows an application example of the method for manufacturing a resin-encapsulated electronic component according to the present invention, in which a circuit board 12 is mounted on a metal substrate 10 and a connector 20 as an assembly component is attached to the metal substrate 10 shown in FIG. A method of resin-sealing an electronic component as a molded product will be described.
FIG. 1A shows a circuit in which a connector 20 is attached to the front surface of a metal substrate 10, a connection pin 22 is positioned by a pin guide 14 on the upper surface of the metal substrate 10, and the connection pin 22 and the circuit board 12 are connected. The state which mounted the board | substrate 12 is shown. A concave portion 11 for accommodating the connection pin 22 is formed in the front portion of the metal base 10 to which the connector 20 is attached, and the pin guide 14 is attached so as to close the opening portion of the concave portion 11 on the mounting side of the circuit board 12. Yes.
図１（ｂ）は、次に、コネクタ２０の仕切り部２０ｂと金属基体１０に設けられた凹部壁１１ａとで囲まれた内部領域Ａ１を樹脂１８ａによって充填した状態を示す。
図２に、内部領域Ａ１を樹脂１８ａによって充填する方法を示す。すなわち、図２（ａ）に示すように、回路基板１２およびピンガイド１４にコネクタ２０の取り付け部分の内部空間に連通する連通孔１２ａを設け、この連通孔１２ａから内部空間に樹脂１８ａを注入する。連通孔１２ａはピンガイド１４の配置とコネクタ２０の取り付け部分の内部空間の配置を考慮して適宜位置に形成する。
FIG. 1B shows a state in which the inner region A1 surrounded by the partition 20b of the connector 20 and the recess wall 11a provided in the metal base 10 is filled with the resin 18a.
FIG. 2 shows a method of filling the inner region A1 with the resin 18a. That is, as shown in FIG. 2A, the circuit board 12 and the pin guide 14 are provided with a communication hole 12a communicating with the internal space of the attachment portion of the connector 20, and the resin 18a is injected into the internal space from the communication hole 12a. . The communication hole 12a is formed at an appropriate position in consideration of the arrangement of the pin guide 14 and the arrangement of the internal space of the attachment portion of the connector 20.
コネクタ２０の内部領域Ａ１を樹脂１８ａによって充填するには、図２（ｂ）に示すように、回路基板１２の面が鉛直向きとなるように製品を立て、連通孔１２ａからコネクタ２０の内部に液状の樹脂１８ａを注入して、樹脂１８ａを熱硬化させればよい。
本実施形態の電子部品は、ピンガイド１４がＬ字形に屈曲しているから、この工程では、樹脂が入りにくいピンガイド１４の起立部分の裏面とコネクタ２０の仕切り部２０ｂとの間の内部領域Ａ１を樹脂１８ａによって充填している。
樹脂１８ａにはエポキシ樹脂等の熱硬化性の液状樹脂を使用し、所定量の樹脂１８ａを注入した後、加熱して樹脂１８ａを硬化させる。液状樹脂を使用することにより接続ピン２２が多数本配されている内部領域を確実に樹脂によって封止することができる。
In order to fill the inner region A1 of the connector 20 with the resin 18a, as shown in FIG. 2B, the product is erected so that the surface of the circuit board 12 is vertical, and the connector 20 is inserted into the connector 20 from the communication hole 12a. A liquid resin 18a may be injected to heat cure the resin 18a.
In the electronic component of this embodiment, since the pin guide 14 is bent in an L shape, in this step, an internal region between the back surface of the standing portion of the pin guide 14 that is difficult for resin to enter and the partition portion 20b of the connector 20 A1 is filled with resin 18a.
As the resin 18a, a thermosetting liquid resin such as an epoxy resin is used. After a predetermined amount of the resin 18a is injected, the resin 18a is cured by heating. By using the liquid resin, the internal region where a large number of the connection pins 22 are arranged can be reliably sealed with the resin.
図１（ｃ）は内部領域Ａ１に注入した樹脂１８ａを熱硬化させた後、内部空間の残りの内部領域Ａ２を樹脂１８ｂによって充填した状態を示す。内部領域Ａ２についても、熱硬化性の液状の樹脂１８ａを連通孔１２ａから注入し、樹脂１８ｂを熱硬化させて内部領域Ａ２を樹脂１８ｂによって充填する。内部領域Ａ２に樹脂１８ｂを注入する際には、製品を横置きにして行う。内部領域Ａ１がすでに樹脂１８ａによって充填されているから、製品を横置きにした状態で連通孔１２ａから樹脂１８ｂを注入することで内部領域Ａ２に樹脂が充填される。こうして、金属基体１０と回路基板１２とコネクタ２０とによって囲まれた内部空間が樹脂１８によって充填される。 FIG. 1C shows a state in which the resin 18a injected into the internal region A1 is thermally cured and then the remaining internal region A2 of the internal space is filled with the resin 18b. Also for the inner region A2, the thermosetting liquid resin 18a is injected from the communication hole 12a, the resin 18b is thermally cured, and the inner region A2 is filled with the resin 18b. When injecting the resin 18b into the internal region A2, the product is placed horizontally. Since the inner region A1 is already filled with the resin 18a, the resin is filled into the inner region A2 by injecting the resin 18b from the communication hole 12a in a state where the product is placed horizontally. In this way, the internal space surrounded by the metal base 10, the circuit board 12, and the connector 20 is filled with the resin 18.
図１（ｄ）は、コネクタ２０と金属基体１０の凹部壁１１ａによって囲まれた内部空間を樹脂１８によって充填した後、樹脂封止金型を用いて電子部品を樹脂封止した後の状態を示す。樹脂封止金型を用いて樹脂封止することにより、回路基板１２の全面が樹脂１６によって被覆され、回路基板１２が外部から封止される。
図３は、樹脂封止金型を用いて電子部品を樹脂封止している状態を示す。本実施形態においても、図７に示した従来方法と同様に電子部品を上型３０と下型３２とによりクランプし、上型３０に設けられたキャビティ３０ｂにゲート３０ａから樹脂１６を充填して樹脂封止する。本実施形態では上型３０に回路基板１２を樹脂封止するキャビティ３０ｂを設けている。また、下型３２には被成形品の形状に合わせて被成形品を収容する収容凹部が設けられる。なお、下型３２にキャビティを設け、上型３０に被成形品を収容する収容凹部を設けてもよい。
FIG. 1D shows a state after filling the internal space surrounded by the connector 20 and the concave wall 11a of the metal substrate 10 with the resin 18 and then resin-sealing the electronic component using a resin-sealing mold. Show. By resin-sealing using a resin-sealing mold, the entire surface of the circuit board 12 is covered with the resin 16, and the circuit board 12 is sealed from the outside.
FIG. 3 shows a state in which an electronic component is resin-sealed using a resin-sealing mold. Also in this embodiment, the electronic component is clamped by the upper mold 30 and the lower mold 32 as in the conventional method shown in FIG. 7, and the cavity 16b provided in the upper mold 30 is filled with the resin 16 from the gate 30a. Seal with resin. In this embodiment, the upper mold 30 is provided with a cavity 30b for sealing the circuit board 12 with resin. In addition, the lower mold 32 is provided with an accommodating recess for accommodating the molded product in accordance with the shape of the molded product. The lower mold 32 may be provided with a cavity, and the upper mold 30 may be provided with an accommodation recess for accommodating a product to be molded.
上型３０と下型３２により被成形品をクランプしてゲート３０ａからキャビティ３０ｂに樹脂を充填して樹脂封止する方法は、通常の樹脂封止金型を用いたトランスファーモールド方法によるものであり、説明は省略する。たとえば、本実施形態においても、被成形品を上型３０と下型３２によりクランプした際にキャビティ３０ｂに閉じ込められた空気を逃がすために金属基体１０をクランプするクランプ位置にエアベントを設けるといった方法がとられる。 The method of clamping the product by the upper mold 30 and the lower mold 32 and filling the resin from the gate 30a to the cavity 30b and sealing the resin is by a transfer molding method using a normal resin-sealed mold. The description is omitted. For example, also in the present embodiment, there is a method in which an air vent is provided at a clamping position for clamping the metal base 10 in order to release air trapped in the cavity 30b when the workpiece is clamped by the upper mold 30 and the lower mold 32. Be taken.
本実施形態の電子部品の製造方法によれば、電子部品のコネクタ２０の仕切り部２０ｂと金属基体１０の凹部壁１１ａによって囲まれた内部空間を、あらかじめ樹脂１８ａ、１８ｂによって充填し、硬化樹脂によって内部空間を充実させた領域として形成した後、上型３０と下型３２とにより電子部品をクランプし、キャビティ３０ｂに所要の樹脂圧を作用させて樹脂１６を充填することによって回路基板１２を樹脂封止するから、回路基板１２と接続ピン２２との接続部、ピンガイド１４等を損傷させることなく確実に樹脂封止することができる。
すなわち、本発明方法は、１次モールド工程として、金属基体１０と回路基板１２とコネクタ２０との取り付け部分に形成される内部空間を樹脂によって充填して樹脂硬化させ、次いで、樹脂封止金型を用いて樹脂封止する２次モールド工程においては、１次モールドされた被成形品を樹脂封止することで、被成形品を損傷させずに樹脂封止することを可能にしたものである。
According to the method for manufacturing an electronic component of the present embodiment, the internal space surrounded by the partition portion 20b of the connector 20 of the electronic component and the recessed wall 11a of the metal base 10 is filled in advance with the resins 18a and 18b, and the cured resin is used. After the internal space is formed as a region enriched, the electronic component is clamped by the upper mold 30 and the lower mold 32, and the resin 16 is filled by applying the required resin pressure to the cavity 30b to thereby resin the circuit board 12. Since the sealing is performed, the resin sealing can be reliably performed without damaging the connection portion between the circuit board 12 and the connection pin 22, the pin guide 14, and the like.
That is, in the method of the present invention, as a primary molding step, the internal space formed in the attachment portion of the metal base 10, the circuit board 12, and the connector 20 is filled with resin and cured, and then the resin-sealed mold In the secondary molding step of resin-sealing using resin, it is possible to resin-seal the molded product without damaging the molded product by resin-sealing the molded product subjected to primary molding. .
樹脂封止金型を使用して樹脂圧を作用させるようにして樹脂封止することにより、回路基板１２に半導体装置や抵抗等の種々の回路部品が搭載されている場合でも、部品間の隙間部分に確実に樹脂１６を充填することができ、封止樹脂中にボイドを発生させたり、空気を残留させたりすることなく確実に樹脂封止することができる。また、所定の樹脂圧を加えて樹脂成形することによって、樹脂成形部も外形寸法を精度良く仕上げることができる。
また、樹脂封止金型を使用する樹脂封止の際に使用する樹脂と内部空間を充填した樹脂１８ａ、１８ｂとを同種の樹脂材とすることにより、樹脂間での熱膨張度をマッチングさせ樹脂封止品の全体としての信頼性を向上させることができる。
Even when various circuit components such as a semiconductor device and a resistor are mounted on the circuit board 12 by resin sealing by applying a resin pressure using a resin sealing mold, the gap between the components The resin 16 can be reliably filled in the portion, and the resin can be reliably sealed without generating voids in the sealing resin or leaving air. Further, by applying a predetermined resin pressure and performing resin molding, the resin molded portion can also finish the outer dimensions with high accuracy.
Further, by using the same kind of resin material for the resin 18a and 18b filled in the internal space with the resin used in the resin sealing using the resin sealing mold, the degree of thermal expansion between the resins is matched. The reliability of the entire resin-encapsulated product can be improved.
図４は、樹脂封止金型を用いて１次モールドした被成形品を樹脂封止する際に、コネクタ２０の仕切り部２０ｂと凹部壁１１ａによって囲まれた内部空間に充填された樹脂に樹脂圧が作用した際に、内部空間に充填された樹脂１８が抜けないようにする抜け止め手段を設けた例を示す。図４（ａ）は、電子部品の内部空間に充填された樹脂１８（図は説明上、中間状態まで樹脂が充填された状態を示す）に接する金属基体１０の内面、具体的には金属基体１０とコネクタ２０との連接部の近傍の金属基体１０の内面に係止溝１０ａを設けた例、図４（ｂ）は、金属基体１０の内面に硬化樹脂の抜き方向に逆止状となるテーパ面１０ｂを設けた例を示す。この他に、金属基体１０の樹脂１８に接する内面に複数の凹溝を設け、凹溝のアンカー作用によって樹脂１８に樹脂圧が作用した際に樹脂１８を金属基体１０に対して抜け止めするようにすることもできる。 FIG. 4 shows the resin filled in the internal space surrounded by the partition portion 20b and the concave wall 11a of the connector 20 when the molded product that has been primarily molded using the resin-sealed mold is resin-sealed. An example in which a retaining means for preventing the resin 18 filled in the internal space from being removed when pressure is applied will be described. FIG. 4A shows an inner surface of the metal base 10 that is in contact with the resin 18 filled in the internal space of the electronic component (the figure shows a state in which the resin is filled up to an intermediate state), specifically, the metal base. FIG. 4B shows an example in which a locking groove 10a is provided on the inner surface of the metal base 10 in the vicinity of the connecting portion between the connector 10 and the connector 20, and FIG. The example which provided the taper surface 10b is shown. In addition, a plurality of concave grooves are provided on the inner surface of the metal base 10 that is in contact with the resin 18 so that the resin 18 is prevented from coming off from the metal base 10 when the resin pressure is applied to the resin 18 by the anchor action of the concave grooves. It can also be.
なお、上記実施形態においては、コネクタ２０の仕切り部２０ｂと金属基体１０の凹部壁１１ａによって囲まれた内部空間に液状の樹脂を注入して内部空間を樹脂によって充填する方法を示したが、被成形品の内部空間に充填できる樹脂であれば液状の樹脂のかわりに、粉末状樹脂、顆粒状樹脂を使用することができる。また、連通孔１２ａに挿入可能であればミニタブレットを使用することもできる。これらの樹脂を使用する場合は、樹脂材を入れた後、樹脂材を加熱溶融して内部空間に樹脂が充填されるようにすればよい。また、樹脂材は熱硬化形樹脂の他に紫外線硬化形樹脂を使用することもできる。 In the above embodiment, a method has been described in which liquid resin is injected into the internal space surrounded by the partition portion 20b of the connector 20 and the concave wall 11a of the metal base 10 and the internal space is filled with the resin. A powdery resin or a granular resin can be used instead of a liquid resin as long as it is a resin that can be filled in the internal space of the molded product. In addition, a mini tablet can be used as long as it can be inserted into the communication hole 12a. When these resins are used, after the resin material is added, the resin material is heated and melted to fill the internal space with the resin. In addition to the thermosetting resin, an ultraviolet curable resin can be used as the resin material.
また、上記実施形態では、コネクタ２０の金属基体１０への取り付け部分の内部空間を樹脂によって充填する際に、２工程にわけて樹脂を注入した。これは、電子部品の内部空間に空気溜りが生じたりしないようにして確実に樹脂が充填できるようにするためである。コネクタ２０の取り付け部分の内部空間が樹脂によって確実に充填される方法であれば、１回の工程で樹脂を注入してももちろんかまわない。また、組立部品によって内部空間の形態が複雑になる場合には樹脂の注入、熱硬化工程をさらに多数回としてもよい。
また、上記実施形態では、回路基板１２とピンガイド１４を貫通するように連通孔１２ａを設けたが、図５に示すように、コネクタ２０の仕切り部２０ｂに連通孔２０ｃを設けて、この連通孔２０ｃからコネクタ２０の取り付け部分の内部空間に液状樹脂を注入する方法も可能である。
Moreover, in the said embodiment, when filling the internal space of the attachment part to the metal base | substrate 10 of the connector 20 with resin, resin was inject | poured into 2 processes. This is for ensuring that the resin can be filled without causing air accumulation in the internal space of the electronic component. Of course, the resin may be injected in one step as long as the internal space of the mounting portion of the connector 20 is reliably filled with the resin. Further, when the shape of the internal space becomes complicated depending on the assembly parts, the resin injection and the thermosetting process may be performed many times.
In the above embodiment, the communication hole 12a is provided so as to penetrate the circuit board 12 and the pin guide 14. However, as shown in FIG. 5, the communication hole 20c is provided in the partition portion 20b of the connector 20, and this communication is performed. A method of injecting a liquid resin from the hole 20c into the internal space of the attachment portion of the connector 20 is also possible.
図５（ａ）に示すコネクタ２０は、コネクタ２０の金属基体１０への取り付け側のフランジ部２１の内面２１ａを、コネクタ２０が樹脂１８から抜け止めされる逆止テーパ面に形成した例である。このようにコネクタ２０と樹脂１８との連結部の形態を、樹脂１８に対してコネクタ２０を抜け止め形状にすると、コネクタ２０が確実に電子部品に取り付けられ電子部品の信頼性を向上させることができる。図５（ｂ）は、コネクタ２０と樹脂１８との接合性を向上させるため、樹脂１８に接触するコネクタ２０のフランジ部２１の内面にアンカー溝２１ｂを設け、樹脂１８とコネクタ２０との密着性を向上させた例である。このように、コネクタ２０の樹脂１８への取り付け強度を増大させることにより、電子部品に外部から振動が作用したような場合の耐久性が向上し、常時、振動が作用するような部位に取り付けられる電子部品の信頼性を向上させることができる。 The connector 20 shown in FIG. 5A is an example in which the inner surface 21 a of the flange portion 21 on the attachment side of the connector 20 to the metal base 10 is formed as a non-return taper surface that prevents the connector 20 from coming off from the resin 18. . If the connector 20 and the resin 18 are connected to the resin 18 in such a manner that the connector 20 is prevented from coming off, the connector 20 can be securely attached to the electronic component and the reliability of the electronic component can be improved. it can. In FIG. 5B, in order to improve the bondability between the connector 20 and the resin 18, an anchor groove 21 b is provided on the inner surface of the flange portion 21 of the connector 20 in contact with the resin 18, and the adhesion between the resin 18 and the connector 20. This is an example in which Thus, by increasing the attachment strength of the connector 20 to the resin 18, durability in the case where vibration is applied to the electronic component from the outside is improved, and the connector 20 is always attached to a site where the vibration acts. The reliability of electronic components can be improved.
１０ 金属基体
１１ 凹部
１１ａ 凹部壁
１２ 回路基板
１２ａ 連通孔
１４ ピンガイド
１６ 樹脂
１８ａ、１８ｂ 樹脂
２０ コネクタ
２０ａ 本体
２０ｂ 仕切り部
２０ｃ 連通孔
２１ フランジ部
２１ａ 逆止テーパ面
２１ｂ 係止溝
２２ 接続ピン
３０ 上型
３０ａ ゲート
３０ｂ キャビティ
３２ 下型
DESCRIPTION OF SYMBOLS 10 Metal base | substrate 11 Concave part 11a Concave wall 12 Circuit board 12a Communication hole 14 Pin guide 16 Resin 18a, 18b Resin 20 Connector 20a Main body 20b Partition part 20c Communication hole 21 Flange part 21a Check taper surface 21b Locking groove 22 Connection pin 30 Top Mold 30a Gate 30b Cavity 32 Lower mold
Claims (9)
前記内部空間に樹脂を充填し、樹脂を硬化させることにより、前記回路基板と組立部品の取り付け部分を前記樹脂封止金型を用いる樹脂封止工程における樹脂圧に対する耐久構造とする工程と、
該耐久構造に形成した電子部品を前記樹脂封止金型によりクランプして前記回路基板を樹脂封止する工程とを有することを特徴とする樹脂封止型電子部品の製造方法。 A resin-sealed electronic component manufactured by clamping an electronic component having an internal space formed at an attachment position with a circuit board and mounting an assembly part with a resin-sealing mold and resin-sealing the circuit board. In the manufacturing method,
Filling the internal space with resin and curing the resin, thereby making the mounting portion of the circuit board and assembly part a durable structure against resin pressure in a resin sealing process using the resin sealing mold;
And a step of clamping the electronic component formed in the durable structure with the resin-sealed mold and resin-sealing the circuit board.
前記内部空間に樹脂を充填し、樹脂を硬化させて前記取付部分を耐久構造とした後、樹脂封止金型を用いて前記回路基板を樹脂封止することを特徴とする請求項１記載の樹脂封止型電子部品の製造方法。 The electronic component is a product in which the circuit board is supported by a metal base, and a connecting portion of the connector pin as the assembly component and the circuit board are formed in an internal space for accommodating the connector connecting pin,
2. The circuit board according to claim 1, wherein after filling the internal space with resin and curing the resin to make the mounting portion a durable structure, the circuit board is resin-sealed using a resin-sealing mold. A method for manufacturing a resin-encapsulated electronic component.
前記金属基体には、前記コネクタの取り付け位置に前記接続ピンを収容する凹部が形成され、該凹部の開口部を覆うように前記接続ピンを前記回路基板に位置合わせして接続するためのピンガイドが設けられ、
前記凹部と、前記ピンガイドと、前記コネクタの仕切り部とで囲まれた内部空間に樹脂が充填され、前記回路基板と組立部品の取り付け部分が樹脂封止金型を用いる樹脂封止工程における樹脂圧に対する耐久構造に形成されていることを特徴とする樹脂封止型電子部品。 A circuit board on which electronic components are mounted on a metal base is supported, a mounting portion between the metal base and the connector is formed in an internal space that accommodates connection pins of the connector, and the circuit board is formed by resin sealing together with the circuit parts. A resin-encapsulated electronic component,
The metal base is formed with a recess for accommodating the connection pin at the connector mounting position, and a pin guide for aligning and connecting the connection pin to the circuit board so as to cover the opening of the recess Is provided,
Resin in a resin sealing process in which an internal space surrounded by the concave portion, the pin guide, and the partition portion of the connector is filled with resin, and a mounting portion of the circuit board and the assembly component uses a resin sealing mold A resin-sealed electronic component, characterized in that the resin-sealed electronic component is formed in a pressure-resistant structure.
前記被成形品を収容する収容凹部が形成されるとともに、前記回路基板を樹脂封止するキャビティが形成されていることを特徴とする樹脂封止金型。 5. The method for manufacturing a resin-encapsulated electronic component according to claim 1, wherein an internal space formed at a mounting position between the circuit board and the assembly component is filled with resin, and a mounting portion between the circuit board and the assembly component is a resin. A resin-sealed mold for resin-sealing a molded article formed in a durable structure against a resin pressure in a resin-sealing process using a sealing mold,
A resin-sealed mold, wherein a housing recess for housing the molded product is formed and a cavity for resin-sealing the circuit board is formed.
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| WO2012124682A1 (en) * | 2011-03-17 | 2012-09-20 | イリソ電子工業株式会社 | Resin molded product and method for producing same |
| JP7085991B2 (en) | 2015-10-14 | 2022-06-17 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング | Vehicles equipped with an interference suppression module for an electric rectifying motor, a method for manufacturing an interference suppression module, and an interference suppression module of this type. |
| JP7453846B2 (en) | 2020-05-15 | 2024-03-21 | 三井化学株式会社 | Manufacturing method and mold for metal-resin joint |
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| JPH06224314A (en) * | 1992-12-04 | 1994-08-12 | Toshiba Corp | Semiconductor device |
| JPH08148642A (en) * | 1994-11-16 | 1996-06-07 | Toshiba Corp | Semiconductor device and manufacture thereof |
| JP2004111435A (en) * | 2002-09-13 | 2004-04-08 | Hitachi Ltd | Electric/electronic module having integral molding structure of connector and electronic part and method for molding the same |
| JP2004127571A (en) * | 2002-09-30 | 2004-04-22 | Sumitomo Wiring Syst Ltd | Molding structure of case with connector |
| JP2004134257A (en) * | 2002-10-10 | 2004-04-30 | Sumitomo Wiring Syst Ltd | Connector for board and case with connector |
| JP2005142215A (en) * | 2003-11-04 | 2005-06-02 | Japan Aviation Electronics Industry Ltd | Deformation preventing structure of cabinet lid |
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| JP7085991B2 (en) | 2015-10-14 | 2022-06-17 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング | Vehicles equipped with an interference suppression module for an electric rectifying motor, a method for manufacturing an interference suppression module, and an interference suppression module of this type. |
| JP7453846B2 (en) | 2020-05-15 | 2024-03-21 | 三井化学株式会社 | Manufacturing method and mold for metal-resin joint |
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