WO2014208006A1 - Electronic device and method for manufacturing said electronic device - Google Patents

Electronic device and method for manufacturing said electronic device Download PDF

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Publication number
WO2014208006A1
WO2014208006A1 PCT/JP2014/002917 JP2014002917W WO2014208006A1 WO 2014208006 A1 WO2014208006 A1 WO 2014208006A1 JP 2014002917 W JP2014002917 W JP 2014002917W WO 2014208006 A1 WO2014208006 A1 WO 2014208006A1
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WIPO (PCT)
Prior art keywords
substrate
mold resin
mold
electronic device
resin
Prior art date
Application number
PCT/JP2014/002917
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French (fr)
Japanese (ja)
Inventor
祐紀 眞田
篤志 柏崎
Original Assignee
株式会社デンソー
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Publication of WO2014208006A1 publication Critical patent/WO2014208006A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Definitions

  • the present disclosure relates to an electronic device in which an electronic component is mounted on one surface side of a substrate and the one surface side is sealed with a mold resin, and a manufacturing method thereof.
  • a surface pattern that is electrically connected to a land and an external circuit is formed on one surface of a substrate, and a solder resist that covers the surface pattern is formed.
  • the solder resist has an opening for exposing a portion of the surface pattern connected to an external circuit.
  • the electronic component is mounted on a land formed on one surface of the substrate via solder or the like.
  • One surface side of the substrate including the electronic component is sealed with a mold resin so that at least a portion of the surface pattern connected to the external circuit is exposed.
  • Such an electronic device is manufactured as follows. Specifically, first, a land and a surface pattern are formed on one surface of the substrate. And after forming the solder resist which covers a surface pattern, the opening part which exposes a part of surface pattern to a solder resist is formed. Next, an electronic component is mounted on the land via solder or the like. Subsequently, a mold having a recess formed on one surface is prepared, and one surface of the mold is pressed against one surface of the substrate so that the electronic component is disposed in the recess. Thereafter, a space between the substrate and the concave portion of the mold is filled with mold resin, whereby a single-sided mounting (half mold) electronic device in which one surface side of the substrate including the electronic component is sealed is manufactured.
  • a thick mold resin is formed when the side wall surface (end surface) of the mold resin is a surface perpendicular to the substrate on the side where the substrate protrudes beyond the resin.
  • the region suddenly changes to a region where no mold resin is formed. For this reason, peeling between mold resin and a substrate arises based on the stress resulting from the thermal expansion coefficient difference of mold resin and a substrate.
  • the mold resin has a trapezoidal cross section, and the mold resin extends from the upper surface of the mold resin, that is, from the surface opposite to the substrate to the surface that is in close contact with the substrate.
  • the side wall surface of the substrate may be tapered with respect to the substrate.
  • Patent Document 1 when the side wall surface of the mold resin is tapered from the upper surface of the mold resin to the surface that is in close contact with the substrate, the area of the tapered region increases. Since this tapered region is a dead space in which electronic components cannot be placed, an increase in the area of this region leads to an increase in the size of the electronic device.
  • the internal observation is performed by emitting ultrasonic waves perpendicular to the surface of the mold resin, but the ultrasonic waves are not reflected vertically in the tapered portion, Internal observation is not possible. For this reason, if the tapered region is wide, the region where the internal observation cannot be performed increases, and the internal observation of the mold resin cannot be performed satisfactorily.
  • This disclosure is intended to provide a semiconductor device.
  • an electronic device in a first aspect of the present disclosure, includes a substrate having a first surface and a second surface opposite to the first surface, an electronic component mounted on the first surface side of the substrate, and the substrate And a mold resin that seals the electronic component. At least a part of the substrate is disposed to the outside of the mold resin.
  • the mold resin has a tapered portion.
  • the mold resin has a lower surface facing the first surface of the substrate, an upper surface opposite to the lower surface, and a side surface sandwiched between the lower surface and the upper surface.
  • the tapered portion is disposed on the side surface of the mold resin and protrudes outward from the position on the lower surface side with respect to the upper surface.
  • the taper portion is inclined with respect to the first surface in a portion of the substrate disposed outside the mold resin. The taper portion gradually decreases in height from the first surface as it goes outward of the mold resin.
  • the end portion of the mold resin is provided with a portion where the thickness of the mold resin is reduced, and the taper portion is formed by gradually decreasing the thickness toward the outside of the mold resin. .
  • the stress caused by the difference in thermal expansion coefficient between the mold resin and the substrate is applied. Can be relaxed. Thereby, it becomes possible to suppress peeling between the mold resin and the substrate.
  • the tapered portion is not formed from the upper surface of the mold resin to one surface of the substrate, there are few regions that become the tapered portion. For this reason, internal observation by an ultrasonic flaw detector can be performed in almost all regions of the mold resin. Therefore, it becomes possible to better observe the inside of the mold resin.
  • An electronic device manufacturing method comprising a mold resin that is provided on a surface side and seals the electronic component includes preparing the substrate, mounting the electronic component on a first surface of the substrate, and mounting the electronic component The first mold is brought into contact with the second surface side of the substrate, a second mold having a cavity is disposed on the first surface side of the substrate, and a resin material is filled in the cavity.
  • the mold resin is formed by molding by sliding a plunger in the cavity and the opening of the first mold and applying heat and pressure.
  • die is made into the taper shape which the said cavity spreads gradually toward the 1st surface side of the said board
  • the mold resin has a lower surface facing the first surface of the substrate, an upper surface opposite to the lower surface, and a side surface sandwiched between the lower surface and the upper surface.
  • a tapered portion is formed that is disposed on a side surface of the mold resin and protrudes outward from a position on the lower surface side of the upper surface.
  • the taper portion is inclined with respect to the first surface in a portion of the substrate disposed outside the mold resin. The taper portion gradually decreases in height from the first surface as it goes outward of the mold resin.
  • the electronic device according to the first aspect can be manufactured, the peeling between the mold resin and the substrate can be suppressed, and the internal observation by the ultrasonic flaw detector can be performed. It is possible to manufacture an electronic device that can be satisfactorily performed in almost all areas.
  • FIG. 1 is a cross-sectional view of an electronic device according to a first embodiment of the present disclosure
  • 2 is a cross-sectional view taken along the line II-II in FIG.
  • FIG. 3 is an enlarged view of a region R in FIG.
  • FIG. 4 is a schematic cross-sectional view when the mold resin 40 in the electronic device shown in FIG. 1 is manufactured by compression molding.
  • FIG. 5 is an enlarged cross-sectional view of a portion corresponding to the region R in FIG. 1 for an electronic device according to a second embodiment of the present disclosure.
  • FIG. 6 is an enlarged cross-sectional view of a portion corresponding to the region R in FIG. 1 for an electronic device according to a third embodiment of the present disclosure.
  • the electronic device S1 is mounted on a vehicle such as an automobile, and is applied as a device for driving each device for the vehicle.
  • the electronic device S1 includes a substrate 10, electronic components 20, 30, a mold resin 40, a heat sink 50, a case 60, a lid 70, a heat radiating gel 80, and the like.
  • the substrate 10 is a plate-like member having one surface 11 on which the electronic components 20 and 30 are mounted and covered with the mold resin 40 and the other surface 12 which is the opposite surface. is there.
  • the substrate 10 is a plate-like member having a rectangular top surface as shown in FIG.
  • the substrate 10 is a wiring substrate based on a resin such as an epoxy resin, and is configured by, for example, a through substrate or a build-up substrate.
  • a wiring pattern (not shown) constituted by an inner layer wiring or a surface layer wiring is formed on the substrate 10, and the wiring pattern is extended to the outside of the mold resin 40, so that the electronic components 20, 30 and The electrical connection can be achieved.
  • through holes 13 provided with metal plating or the like connected to the wiring pattern are provided. Through this through hole 13, the wiring pattern can be electrically connected to the outside of the substrate.
  • the substrate 10 thus configured is supported by the case 60 at the four corners.
  • fixing holes 14 serving as through holes are formed at the four corners of the substrate 10, and after mechanical connection portions 64 protruding from the bottom surface 61 of the case 60 are fitted therein, the mechanical holes 64 are mechanically inserted.
  • the substrate 10 is supported on the case 60 by heat caulking the tip of the connecting portion 64.
  • the electronic components 20 and 30 are electrically connected to the wiring pattern by being mounted on the substrate 10 and may be any surface mounting component or through-hole mounting component.
  • the semiconductor element 20 and the passive element 30 are exemplified as the electronic components 20 and 30.
  • the semiconductor element 20 include a power element that generates a large amount of heat, such as a microcomputer, a control element, or an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor).
  • the semiconductor element 20 is connected to a land connected to the wiring pattern of the substrate 10 or a land formed by a part of the wiring pattern by a bonding wire 21 and a die bonding material 22 such as solder.
  • Examples of the passive element 30 include a chip resistor, a chip capacitor, and a crystal resonator.
  • the passive element 30 is connected to a land provided on the substrate 10 by a die bonding material 31 such as solder.
  • the mold resin 40 is composed of a thermosetting resin such as an epoxy resin, and is formed by a transfer molding method using a mold or a compression molding method. In the case of the present embodiment, a so-called half mold structure is formed in which the one surface 11 side of the substrate 10 is sealed with the mold resin 40 and the other surface 12 side of the substrate 10 is exposed without being sealed with the mold resin 40. .
  • the one surface 11 side of the substrate 10 is referred to as a lower surface, and the opposite side is referred to as an upper surface.
  • the upper surface of the mold resin 40 is a flat surface.
  • the center line may have a roof shape or a curved surface shape with the highest height from the first surface 11. Unevenness may be formed.
  • the mold resin 40 has a rectangular top surface, and the two opposite sides of the substrate 10, specifically, both sides perpendicular to the longitudinal direction of the substrate 10 are exposed. It is formed only on the inner side than both sides. That is, both ends in the longitudinal direction of the substrate 10 protrude from the mold resin 40 and are exposed from the mold resin 40 by being arranged to the outside.
  • a through hole 13 is disposed in a portion exposed from the mold resin 40, and an electrical connection between the wiring pattern formed on the substrate 10 and the outside is possible through the through hole 13.
  • both sides of the substrate 10 are exposed from the mold resin 40, so that the four corners of the substrate 10 are exposed. In the portion exposed from the mold resin 40, the substrate 10 is attached to the case 60 as described above. It is supported.
  • a taper portion 41 protruding in a tapered shape is provided on a part of the side surface of the mold resin 40, specifically, a portion of the side surface on the one surface 11 side of the substrate 10.
  • the side surface of the mold resin 40 is provided with a taper portion 41 by being inclined with respect to the one surface 11 at a portion on the upper surface side of the mold resin 40 and inclined with respect to the one surface 11 at a portion on the one surface 11 side.
  • the end portion of the mold resin 40 is provided with a portion where the thickness of the mold resin 40 from the lower position than the upper surface of the mold resin 40 is reduced, and gradually toward the outside of the mold resin 40.
  • the tapered portion 41 is formed by making it thinner.
  • the taper portion 41 is configured by gradually lowering the height from the one surface 11 of the mold resin 40 toward the outside of the mold 40.
  • the surface of the taper portion 41 is a flat surface, and is inclined at an arbitrary angle with respect to the one surface 11. The structure is inclined.
  • the thickness of the mold resin 40 in the taper portion 41 is lower than that of the electronic components 20 and 30 having the highest height from the one surface 11 of the substrate 10. For this reason, the area
  • the taper portion 41 by providing the taper portion 41, the thickness of the mold resin 40 is gradually reduced toward the outside of the mold resin 40. For this reason, in the terminal part of mold resin 40, since it does not change suddenly from the area where thick mold resin 40 is formed to the area where it is not formed, the difference in thermal expansion coefficient between mold resin 40 and substrate 10 occurs. The resulting stress can be relaxed. Thereby, peeling between the mold resin 40 and the substrate 10 can be suppressed. Further, since the tapered portion 41 is not formed so as to extend from the upper surface of the mold resin 40 to the one surface 11 of the substrate 10, there are few regions that become the tapered portion 41. For this reason, the internal observation by the ultrasonic flaw detector can be satisfactorily performed in most regions of the mold resin 40. Therefore, the inside observation of the mold resin 40 can be performed more favorably.
  • the position of the side surface of the mold resin 40 coincides with the position of the side surface of the substrate 10.
  • the side surface of the mold resin 40 is flat and is flush with the side surface of the substrate 10.
  • the heat sink 50 is made of a metal material having a high heat transfer coefficient, such as aluminum or copper, and is in close contact with the other surface 12 side of the substrate 10 via a bonding member 51.
  • a conductive adhesive containing a metal filler, a conductive material such as a solder material, or an insulating material such as a heat radiating gel or a heat radiating sheet is used.
  • the heat sink 50 plays a role of radiating heat when the heat generated by the electronic components 20 and 30 is transmitted from the other surface 12 side of the substrate 10 and is made of a metal material having high thermal conductivity, such as copper. Has been.
  • the semiconductor element 20 is composed of an IGBT or a MOSFET, since these are heating elements, they generate a lot of heat, but this heat is transmitted to the heat sink 50, so that the semiconductor elements 20 and the passive elements 30 High temperature is suppressed.
  • the heat sink 50 is thermally connected to the lid 70 via the heat radiating gel 80, and heat transferred from the back surface of the substrate 10 is further transmitted to the lid 70 through the heat radiating gel 80. Heat is radiated from 70 to the outside.
  • the case 60 is a rectangular housing that accommodates the electronic components 20 and 30 mounted on the one surface 11 side of the substrate 10 and sealed with the mold resin 40.
  • the case 60 is a member constituting the housing recess 63 in which the periphery of the bottom surface 61 is covered by the side wall surface 62, and the substrate 10 mounted with the electronic components 20 and 30 and sealed with the mold resin 40 is used.
  • the housing recess 63 the one surface 11 side faces the bottom surface 61 side.
  • the mechanical connection portion 64 that supports the substrate 10 is formed on the bottom surface 61 of the case 60.
  • the mechanical connection portion 64 is a stepped rod-like member that protrudes in the vertical direction from the bottom surface 61 and whose sectional dimensions are partially changed. Specifically, in the state before the substrate 10 is fixed, the mechanical connection portion 64 has a cross-sectional dimension on the bottom side larger than that of the fixing hole 14 formed in the substrate 10, and a cross-sectional dimension on the tip side is larger than the fixing hole 14. Is almost the same or slightly smaller. Because of such dimensions, the mechanical connection portion 64 holds the substrate 10 at the stepped portion between the front end side and the bottom surface side while the front end side is inserted into the fixing hole 14.
  • the front end side of the mechanical connection portion 64 is fitted into the fixing hole 14 and then heat caulked, so that a portion protruding from the substrate 10 has a cross-sectional dimension larger than that of the fixing hole 14 and a step difference from that portion.
  • the substrate 10 is sandwiched between and supported.
  • the protruding amount of the mechanical connection portion 64 is set lower than the height of the side wall surface 62 so that the substrate 10 enters the inside of the accommodating recess 63 rather than the tip of the side wall surface 62.
  • connection terminals 65 are erected on the bottom surface 61 of the case 60 in a direction perpendicular to the bottom surface 61.
  • each connection terminal 65 is made of a copper alloy that is tin-plated or nickel-plated.
  • Each of the plurality of connection terminals 65 is inserted through a through hole 13 formed in the substrate 10 and is electrically connected to the through hole 13 via a connection member 15 such as solder.
  • the case 60 is basically made of an insulator based on a resin such as PPS (polyphenylene sulfide) or PBT (polybutylene terephthalate), but includes a wiring pattern extending to the outside of the case 60. Yes.
  • a plurality of connection terminals 65 are connected to the wiring pattern, and the wiring pattern of the substrate 10 on which the electronic components 20 and 30 are mounted is electrically connected to the outside through the connection terminals 65 and the wiring pattern. Yes.
  • the lid 70 seals the inside of the case 60 by being connected to the opening end of the case 60, that is, the tip of the side wall surface 62.
  • the lid 70 is fixed to the case 60 via an adhesive or the like, for example.
  • the lid 70 is made of a metal material having a high heat transfer coefficient, such as aluminum or copper, and is made of a rectangular plate-like member.
  • the heat dissipating gel 80 is disposed between the heat sink 50 and the lid 70, and is disposed so as to be in contact with both, thereby transferring heat from the heat sink 50 to the lid 70.
  • the heat radiating gel 80 is made of a silicone oil compound having a high thermal conductivity.
  • the electronic device S1 As described above, the electronic device S1 according to the present embodiment is configured. Such an electronic device S1 is manufactured by the following manufacturing method.
  • the electronic components 20 and 30 are mounted on the one surface 11 of the substrate 10.
  • the substrate 10 on which the electronic components 20 and 30 are mounted is sealed with a mold resin 40 by a transfer molding method or a compression molding method.
  • FIG. 4 shows a state in which the resin sealing with the mold resin 40 is performed by, for example, compression molding.
  • a lower mold (first mold) 91, an upper mold (second mold) 92, and a plunger 93 are used as a mold 90 serving as a mold.
  • the substrate 10 is placed on the lower mold 91. It arrange
  • the resin powder used for compression molding is filled in the opening 92a of the upper die 92, and then the plunger 93 is slid in the opening 92a and heated and pressurized. Perform molding. Thereby, the mold resin 40 is formed.
  • the inner wall surface is tapered so that the cavity gradually expands toward the one surface 11.
  • a tapered portion 41 is formed in a portion of the side surface of the mold resin 40 on the one surface 11 side so that the thickness of the mold resin 40 gradually decreases as the mold resin 40 moves outward.
  • the substrate 10 is disposed in the housing recess 63 of the case 60 with the one surface 11 side facing the bottom surface 61 side.
  • the plurality of connection terminals 65 are inserted into the through holes 13 so that the tips of the mechanical connection portions 64 are fitted into the fixing holes 14.
  • the tip of the mechanical connection portion 64 is heat caulked, and the through hole 13 and the plurality of connection terminals 65 are connected by the connection member 15 by soldering or the like.
  • the lid 70 is disposed thereon, and the space between the lid 70 and the side wall surface 62 of the case 60 is fixed with an adhesive or the like. The electronic device S1 is completed.
  • the plunger 93 It is difficult to adjust the push-in amount. That is, the plunger 93 may be pushed too much, or conversely, the pushing amount of the plunger 93 may be insufficient. For this reason, the shape of the upper surface of the mold resin 40 changes according to the pushing amount of the plunger 93, and it is difficult to stably form a trapezoidal cross section, and the mold resin 40 extends from the upper surface of the mold resin 40 to the surface in contact with the substrate 10. It is difficult to taper the entire side surface.
  • the mold resin 40 can be stably formed in the same shape, and the problem that burrs are lost in a subsequent process does not occur.
  • the end portion of the mold resin 40 is provided with a portion in which the thickness of the mold resin 40 is reduced, and as it goes outward of the mold resin 40.
  • the taper portion 41 is formed by gradually reducing the thickness. For this reason, in the terminal part of mold resin 40, since it does not change suddenly from the area where thick mold resin 40 is formed to the area where it is not formed, the difference in thermal expansion coefficient between mold resin 40 and substrate 10 occurs. The resulting stress can be relaxed. Thereby, peeling between the mold resin 40 and the substrate 10 can be suppressed.
  • tapered portion 41 is not formed so as to extend from the upper surface of the mold resin 40 to the one surface 11 of the substrate 10, there are few regions that become the tapered portion 41. For this reason, the internal observation by the ultrasonic flaw detector can be satisfactorily performed in most regions of the mold resin 40. Therefore, it becomes possible to better observe the inside of the mold resin.
  • the tapered portion 41 is not formed in the entire region from the upper surface of the mold resin 40 to the one surface 11 of the substrate 10, and is formed from below the upper surface of the mold resin 40. Can be limited. For this reason, the electronic components 20 and 30 can be disposed up to the vicinity of the outer edge portion of the mold resin 40, the dead space can be reduced, and the enlargement of the electronic device S1 can be suppressed.
  • the boundary position between the portion other than the taper portion 41 and the taper portion 41 in the side surface of the mold resin 40 and the boundary position between the taper portion 41 and one surface of the substrate 10 are R-shaped. It is designed to be a curved surface. Thus, even if the surface of the taper portion 41 is curved, the same effect as that of the first embodiment can be obtained. In addition, by making the surface of the tapered portion 41 a curved surface, the stress caused by the difference in thermal expansion coefficient between the mold resin 40 and the substrate 10 at each boundary position can be changed smoothly. Thereby, it becomes possible to further suppress peeling between the mold resin 40 and the substrate 10.
  • the boundary position between the taper portion 41 and the portion other than the taper portion 41 on the side surface of the mold resin 40 is an R-shaped curved surface. As described above, even if the boundary position between the taper portion 41 and the portion other than the taper portion 41 on the side surface of the mold resin 40 is curved, the same effect as that of the first embodiment can be obtained. Moreover, the stress resulting from the difference in thermal expansion coefficient between the mold resin 40 and the substrate 10 at the boundary position can be changed smoothly. Thereby, it becomes possible to further suppress peeling between the mold resin 40 and the substrate 10.
  • an example of the electronic device S1 to which the electronic components 20 and 30 are mounted on the one surface 11 of the substrate 10 and then the electronic components 20 and 30 are sealed with the mold resin 40 is applied.
  • the one surface 11 side of the substrate 10, that is, the mold resin 40 side is arranged to face the bottom surface 61 side of the case 60, but the other surface 12 side, that is, the side opposite to the mold resin 40 is directed to the bottom surface 61 side. You may arrange in.
  • the formation position of the taper portion 41 is not limited to the shape described in each of the above embodiments as long as it is formed from a position below the upper surface of the mold resin 40.
  • the tapered portion 41 in order to further reduce the dead space, is provided from a position lower than the highest one of the electronic components 20 and 30.
  • the tapered portion 41 may be formed from the upper position.
  • only the boundary position between the taper portion 41 and the portion other than the taper portion 41 of the side surface of the mold resin 40 is a curved surface, but only the boundary position between the taper portion 41 and one surface of the substrate 10 is used. It may be a curved surface.
  • a plurality of mold resins 40 may be formed simultaneously.
  • the side surface of the mold resin 40 and the side surface of the substrate 10 are flush with each other. Therefore, even when a plurality of substrates 10 are formed using a multiple substrate in this way, the substrate 10 and the mold resin 40 having the structure described in the above embodiments can be manufactured.
  • the taper portions 41 can be formed on all sides of the mold resin 40 in a state before cutting, it is possible to further improve the mold release properties at the time of molding.
  • connection portion 64 is not limited to heat caulking, and may be press-fitting or screw-fixing.
  • connection between the connection terminal 65 and the through hole 13 is not limited to soldering, and may be a press fit or the like.

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Abstract

This electronic device is provided with a substrate (10), electronic components (20, 30) mounted on a first surface (11) of said substrate, and a molded resin (40) that is provided on said first surface (11) and seals the electronic components. Part of the substrate lies outside the molded resin. The molded resin is provided with tapered sections (41) that are located on the side surfaces of the molded resin and protrude outwards from positions below the top surface of the molded resin. The tapered sections (41) are angled with respect to the abovementioned first surface, and with increasing distance from the molded resin, gradually decrease in height from the first surface.

Description

電子装置およびその電子装置の製造方法Electronic device and method for manufacturing the same 関連出願の相互参照Cross-reference of related applications
　本開示は、２０１３年６月２８日に出願された日本出願番号２０１３－１３６８９５号に基づくもので、ここにその記載内容を援用する。 This disclosure is based on Japanese Application No. 2013-136895 filed on June 28, 2013, the contents of which are incorporated herein.
　本開示は、基板の一面側に電子部品を搭載すると共に、その一面側をモールド樹脂で封止するようにした電子装置およびその製造方法に関するものである。 The present disclosure relates to an electronic device in which an electronic component is mounted on one surface side of a substrate and the one surface side is sealed with a mold resin, and a manufacturing method thereof.
　従来より、基板の一面側に電子部品が搭載された電子装置がある。この電子装置では、基板の一面に、ランドおよび外部回路と電気的に接続される表面パターンが形成されていると共に表面パターンを覆うソルダレジストが形成されている。ソルダレジストには、表面パターンのうち外部回路と接続される部分を露出させる開口部が形成されている。電子部品は、基板の一面に形成されたランド上に、はんだ等を介して搭載されている。そして、電子部品を含む基板の一面側は、表面パターンのうち少なくとも外部回路と接続される部分が露出されるように、モールド樹脂によって封止されている。 Conventionally, there are electronic devices in which electronic components are mounted on one side of a substrate. In this electronic device, a surface pattern that is electrically connected to a land and an external circuit is formed on one surface of a substrate, and a solder resist that covers the surface pattern is formed. The solder resist has an opening for exposing a portion of the surface pattern connected to an external circuit. The electronic component is mounted on a land formed on one surface of the substrate via solder or the like. One surface side of the substrate including the electronic component is sealed with a mold resin so that at least a portion of the surface pattern connected to the external circuit is exposed.
　このような電子装置は、次のように製造される。具体的には、まず、基板の一面にランドおよび表面パターンを形成する。そして、表面パターンを覆うソルダレジストを形成した後、ソルダレジストに表面パターンの一部を露出させる開口部を形成する。次に、ランド上にはんだ等を介して電子部品を搭載する。続いて、一面に凹部が形成された金型を用意し、電子部品が凹部内に配置されるように、金型の一面を基板の一面側に圧接する。その後、基板と金型の凹部との間の空間にモールド樹脂を充填することにより、電子部品を含む基板の一面側が封止された片面実装型（ハーフモールド）の電子装置が製造される。 Such an electronic device is manufactured as follows. Specifically, first, a land and a surface pattern are formed on one surface of the substrate. And after forming the solder resist which covers a surface pattern, the opening part which exposes a part of surface pattern to a solder resist is formed. Next, an electronic component is mounted on the land via solder or the like. Subsequently, a mold having a recess formed on one surface is prepared, and one surface of the mold is pressed against one surface of the substrate so that the electronic component is disposed in the recess. Thereafter, a space between the substrate and the concave portion of the mold is filled with mold resin, whereby a single-sided mounting (half mold) electronic device in which one surface side of the substrate including the electronic component is sealed is manufactured.
　このような構造の電子装置では、基板が樹脂よりもはみ出している辺において、モールド樹脂の側壁面（端面）が基板に対して垂直な面になっていると、厚いモールド樹脂が形成されている領域とモールド樹脂が形成されていない領域とに急に変化することになる。このため、モールド樹脂と基板との熱膨張係数差に起因する応力に基づいて、モールド樹脂と基板との間の剥離が生じる。 In the electronic device having such a structure, a thick mold resin is formed when the side wall surface (end surface) of the mold resin is a surface perpendicular to the substrate on the side where the substrate protrudes beyond the resin. The region suddenly changes to a region where no mold resin is formed. For this reason, peeling between mold resin and a substrate arises based on the stress resulting from the thermal expansion coefficient difference of mold resin and a substrate.
　これを防止するためには、特許文献１に示されるように、モールド樹脂を断面台形状とし、モールド樹脂の上面、つまり基板と反対側の面から基板と密着させられる側の面にかけて、モールド樹脂の側壁面を基板に対して傾斜したテーパ状にすれば良い。このような構造とすれば、モールド樹脂の端部において、モールド樹脂の厚みがモールド樹脂の外方に向かうに連れて徐々に薄くなるため、上記応力も徐々に小さくなる。したがって、この領域に発生する応力を緩和することができ、モールド樹脂と基板との間の剥離を抑制することが可能になる。また、このような構造とすることで、モールド樹脂の側壁面を基板に対して垂直にする場合と比較して、金型からモールド樹脂を抜くときの型抜き性を良好にすることも可能になる。 In order to prevent this, as shown in Patent Document 1, the mold resin has a trapezoidal cross section, and the mold resin extends from the upper surface of the mold resin, that is, from the surface opposite to the substrate to the surface that is in close contact with the substrate. The side wall surface of the substrate may be tapered with respect to the substrate. With such a structure, since the thickness of the mold resin gradually decreases toward the outside of the mold resin at the end portion of the mold resin, the stress gradually decreases. Therefore, the stress generated in this region can be relaxed, and peeling between the mold resin and the substrate can be suppressed. In addition, by adopting such a structure, it is possible to improve the mold release property when removing the mold resin from the mold as compared with the case where the side wall surface of the mold resin is perpendicular to the substrate. Become.
　しかしながら、特許文献１に示されるように、モールド樹脂の上面から基板と密着させられる側の面にかけて、モールド樹脂の側壁面をテーパ状にした場合、テーパ状とされた領域の面積が大きくなる。このテーパ状とされる領域は電子部品を配置することができないデッドスペースであるため、この領域の面積が大きくなると、電子装置の大型化を招いてしまう。また、超音波探傷装置による内部観察を行う場合に、モールド樹脂の表面に対して垂直に超音波を発することで内部観察を行うが、テーパ状の部分では超音波が垂直方向に反射されず、内部観察が行えなくなる。このため、テーパ状とされた領域が広いと、内部観察が行えない領域が増え、モールド樹脂の内部観察が良好に行えなくなる。 However, as shown in Patent Document 1, when the side wall surface of the mold resin is tapered from the upper surface of the mold resin to the surface that is in close contact with the substrate, the area of the tapered region increases. Since this tapered region is a dead space in which electronic components cannot be placed, an increase in the area of this region leads to an increase in the size of the electronic device. In addition, when performing internal observation with an ultrasonic flaw detector, the internal observation is performed by emitting ultrasonic waves perpendicular to the surface of the mold resin, but the ultrasonic waves are not reflected vertically in the tapered portion, Internal observation is not possible. For this reason, if the tapered region is wide, the region where the internal observation cannot be performed increases, and the internal observation of the mold resin cannot be performed satisfactorily.
特開２０１１－１８８５６号公報JP 2011-18856 A
　本開示は、半導体装置を提供することを目的とする。 This disclosure is intended to provide a semiconductor device.
　本開示の第一の態様において、電子装置は、第一面および前記第一面の反対の第二面とを有する基板と、前記基板の第一面側に実装された電子部品と、前記基板の第一面側に設けられ、前記電子部品を封止するモールド樹脂と、を備える。前記基板のうちの少なくとも一部が前記モールド樹脂の外側まで配置されている。前記モールド樹脂は、テーパ部を備えている。前記モールド樹脂は、前記基板の第一面に対向する下面と、該下面と反対の上面、および、下面と上面に挟まれた側面を有している。テーパ部は、該モールド樹脂の側面に配置され、前記上面よりも前記下面側の位置から外方に向かって突き出している。テーパ部は、前記モールド樹脂の外側に配置された前記基板の一部において、前記第一面に対して傾斜している。テーパ部は、該モールド樹脂の外方に向かうに連れて徐々に前記第一面からの高さが低くなる。 In a first aspect of the present disclosure, an electronic device includes a substrate having a first surface and a second surface opposite to the first surface, an electronic component mounted on the first surface side of the substrate, and the substrate And a mold resin that seals the electronic component. At least a part of the substrate is disposed to the outside of the mold resin. The mold resin has a tapered portion. The mold resin has a lower surface facing the first surface of the substrate, an upper surface opposite to the lower surface, and a side surface sandwiched between the lower surface and the upper surface. The tapered portion is disposed on the side surface of the mold resin and protrudes outward from the position on the lower surface side with respect to the upper surface. The taper portion is inclined with respect to the first surface in a portion of the substrate disposed outside the mold resin. The taper portion gradually decreases in height from the first surface as it goes outward of the mold resin.
　上記の電子装置において、モールド樹脂の端部において、モールド樹脂の厚みを薄くした部分を備えるようにしつつ、モールド樹脂の外方に向かうに連れて徐々に薄くなるようにすることでテーパ部としている。このため、モールド樹脂の終端部において、厚いモールド樹脂が形成されている領域から形成されていない領域に急に変化するのではないため、モールド樹脂と基板との熱膨張係数差に起因する応力を緩和できる。これにより、モールド樹脂と基板との間の剥離を抑制することが可能となる。また、テーパ部をモールド樹脂の上面から基板の一面に掛けて形成していないため、テーパ部となる領域が少ない。このため、超音波探傷装置による内部観察をモールド樹脂の殆どの領域で行える。よって、モールド樹脂の内部観察をより良好に行うことが可能となる。 In the above electronic device, the end portion of the mold resin is provided with a portion where the thickness of the mold resin is reduced, and the taper portion is formed by gradually decreasing the thickness toward the outside of the mold resin. . For this reason, in the terminal part of mold resin, since it does not change suddenly from the area where the thick mold resin is formed to the area where it is not formed, the stress caused by the difference in thermal expansion coefficient between the mold resin and the substrate is applied. Can be relaxed. Thereby, it becomes possible to suppress peeling between the mold resin and the substrate. Further, since the tapered portion is not formed from the upper surface of the mold resin to one surface of the substrate, there are few regions that become the tapered portion. For this reason, internal observation by an ultrasonic flaw detector can be performed in almost all regions of the mold resin. Therefore, it becomes possible to better observe the inside of the mold resin.
　本開示の第二の態様において、第一面および前記第一面の反対となる第二面とを有する基板と、前記基板の第一面側に実装された電子部品と、前記基板の第一面側に設けられ、前記電子部品を封止するモールド樹脂とを備える電子装置の製造方法は、前記基板を用意し、該基板の第一面に前記電子部品を実装し、前記電子部品が実装された前記基板の第二面側において第１金型を接触させ、前記基板の第一面側にキャビティが設けられた第２金型を配置し、前記キャビティ内に樹脂材料を充填すると共に、該キャビティと前記第１金型の開口部内にプランジャを摺動させて加熱加圧を行うことで、モールド成形により前記モールド樹脂を形成することを備える。前記第２金型として、該第２金型のうち前記キャビティを構成する内壁面が、前記基板の第一面側に向かって前記キャビティが徐々に広がるテーパ状とされている。前記モールド樹脂は、前記基板の第一面に対向する下面と、該下面と反対の上面、および、下面と上面に挟まれた側面を有している。前記モールド樹脂の形成では、該モールド樹脂の側面に配置され、前記上面よりも前記下面側の位置から外方に向かって突き出す、テーパ部を形成している。テーパ部は、前記モールド樹脂の外側に配置された前記基板の一部において、前記第一面に対して傾斜している。テーパ部は、該モールド樹脂の外方に向かうに連れて徐々に前記第一面からの高さが低くなる。 In the second aspect of the present disclosure, a substrate having a first surface and a second surface opposite to the first surface, an electronic component mounted on the first surface side of the substrate, and a first of the substrate An electronic device manufacturing method comprising a mold resin that is provided on a surface side and seals the electronic component includes preparing the substrate, mounting the electronic component on a first surface of the substrate, and mounting the electronic component The first mold is brought into contact with the second surface side of the substrate, a second mold having a cavity is disposed on the first surface side of the substrate, and a resin material is filled in the cavity. The mold resin is formed by molding by sliding a plunger in the cavity and the opening of the first mold and applying heat and pressure. As said 2nd metal mold | die, the inner wall surface which comprises the said cavity among this 2nd metal mold | die is made into the taper shape which the said cavity spreads gradually toward the 1st surface side of the said board | substrate. The mold resin has a lower surface facing the first surface of the substrate, an upper surface opposite to the lower surface, and a side surface sandwiched between the lower surface and the upper surface. In forming the mold resin, a tapered portion is formed that is disposed on a side surface of the mold resin and protrudes outward from a position on the lower surface side of the upper surface. The taper portion is inclined with respect to the first surface in a portion of the substrate disposed outside the mold resin. The taper portion gradually decreases in height from the first surface as it goes outward of the mold resin.
　上記の製造方法において、第一の態様における電子装置を製造することが可能となり、モールド樹脂と基板との間の剥離を抑制することが可能となると共に、超音波探傷装置による内部観察をモールド樹脂の殆どの領域で良好に行うことが可能な電子装置を製造できる。 In the manufacturing method described above, the electronic device according to the first aspect can be manufactured, the peeling between the mold resin and the substrate can be suppressed, and the internal observation by the ultrasonic flaw detector can be performed. It is possible to manufacture an electronic device that can be satisfactorily performed in almost all areas.
　本開示についての上記目的およびその他の目的、特徴や利点は、添付の図面を参照しながら下記の詳細な記述により、より明確になる。その図面は、
図1は、本開示の第１実施形態にかかる電子装置の断面図であり、 図２は、図１中のII－II矢視断面図であり、 図３は、図１中の領域Ｒの拡大図であり、 図４は、図１に示す電子装置におけるモールド樹脂４０をコンプレッション成形によって製造する場合の断面模式図であり、 図５は、本開示の第２実施形態にかかる電子装置について、図１中の領域Ｒと対応する部分を拡大した断面図であり、 図６は、本開示の第３実施形態にかかる電子装置について、図１中の領域Ｒと対応する部分を拡大した断面図である。 The above and other objects, features and advantages of the present disclosure will become more apparent from the following detailed description with reference to the accompanying drawings. The drawing
FIG. 1 is a cross-sectional view of an electronic device according to a first embodiment of the present disclosure; 2 is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is an enlarged view of a region R in FIG. FIG. 4 is a schematic cross-sectional view when the mold resin 40 in the electronic device shown in FIG. 1 is manufactured by compression molding. FIG. 5 is an enlarged cross-sectional view of a portion corresponding to the region R in FIG. 1 for an electronic device according to a second embodiment of the present disclosure. FIG. 6 is an enlarged cross-sectional view of a portion corresponding to the region R in FIG. 1 for an electronic device according to a third embodiment of the present disclosure.
　（第１実施形態）
　図１～図３を参照して、本開示の第１実施形態にかかる電子装置Ｓ１の全体構成について説明する。この電子装置Ｓ１は、例えば自動車などの車両に搭載され、車両用の各装置を駆動するための装置として適用される。 (First embodiment)
With reference to FIG. 1 to FIG. 3, the overall configuration of the electronic device S1 according to the first embodiment of the present disclosure will be described. The electronic device S1 is mounted on a vehicle such as an automobile, and is applied as a device for driving each device for the vehicle.
　図１および図２に示すように、電子装置Ｓ１は、基板１０、電子部品２０、３０、モールド樹脂４０、ヒートシンク５０、ケース６０、蓋７０および放熱ゲル８０などを有した構成とされている。 As shown in FIGS. 1 and 2, the electronic device S1 includes a substrate 10, electronic components 20, 30, a mold resin 40, a heat sink 50, a case 60, a lid 70, a heat radiating gel 80, and the like.
　図１に示すように、基板１０は、電子部品２０、３０が実装されると共にモールド樹脂４０にて覆われる一面１１と、その反対面となる他面１２とを有する板状部材をなすものである。本実施形態では、基板１０は、図２に示すように上面形状が矩形状の板状部材とされている。具体的には、基板１０は、エポキシ樹脂等の樹脂をベースとした配線基板とされ、例えば、貫通基板やビルドアップ基板などによって構成されている。 As shown in FIG. 1, the substrate 10 is a plate-like member having one surface 11 on which the electronic components 20 and 30 are mounted and covered with the mold resin 40 and the other surface 12 which is the opposite surface. is there. In the present embodiment, the substrate 10 is a plate-like member having a rectangular top surface as shown in FIG. Specifically, the substrate 10 is a wiring substrate based on a resin such as an epoxy resin, and is configured by, for example, a through substrate or a build-up substrate.
　基板１０には、内層配線もしくは表層配線などによって構成される図示しない配線パターンが形成されており、配線パターンがモールド樹脂４０の外部まで延設されることで、配線パターンを通じて電子部品２０、３０との電気的な接続が図れるようになっている。また、基板１０のうちの長手方向（図１の左右方向）の両側には、配線パターンに繋がる金属メッキなどが施されたスルーホール１３が備えられている。このスルーホール１３を通じて、配線パターンと基板外部との電気的な接続が行えるようになっている。 A wiring pattern (not shown) constituted by an inner layer wiring or a surface layer wiring is formed on the substrate 10, and the wiring pattern is extended to the outside of the mold resin 40, so that the electronic components 20, 30 and The electrical connection can be achieved. In addition, on both sides of the substrate 10 in the longitudinal direction (left-right direction in FIG. 1), through holes 13 provided with metal plating or the like connected to the wiring pattern are provided. Through this through hole 13, the wiring pattern can be electrically connected to the outside of the substrate.
　このように構成された基板１０が四隅においてケース６０に支持されている。本実施形態の場合、基板１０の四隅に貫通孔となる固定用孔１４を形成しており、この中にケース６０の底面６１から突出させた機械的接続部６４を嵌め込んだ後、機械的接続部６４の先端を熱かしめすることで、基板１０をケース６０に支持している。 The substrate 10 thus configured is supported by the case 60 at the four corners. In the case of the present embodiment, fixing holes 14 serving as through holes are formed at the four corners of the substrate 10, and after mechanical connection portions 64 protruding from the bottom surface 61 of the case 60 are fitted therein, the mechanical holes 64 are mechanically inserted. The substrate 10 is supported on the case 60 by heat caulking the tip of the connecting portion 64.
　電子部品２０、３０は、基板１０に実装されることで配線パターンに電気的に接続されるものであり、表面実装部品やスルーホール実装部品などどのようなものであってもよい。本実施形態の場合、電子部品２０、３０として、半導体素子２０および受動素子３０を例に挙げてある。半導体素子２０としては、マイコンや制御素子もしくはＩＧＢＴ（Insulated Gate Bipolar Transistor）やＭＯＳＦＥＴ（Metal-Oxide-Semiconductor Field-Effect Transistor）等の発熱が大きいパワー素子等が挙げられる。この半導体素子２０は、ボンディングワイヤ２１およびはんだ等のダイボンド材２２により、基板１０の配線パターンに繋がるランドもしくは配線パターンの一部によって構成されたランドに接続されている。また、受動素子３０としては、チップ抵抗、チップコンデンサ、水晶振動子等が挙げられる。この受動素子３０は、はんだ等のダイボンド材３１により基板１０に備えられたランドに接続されている。これらの構成により、電子部品２０、３０は、基板１０に形成された配線パターンに電気的に接続され、配線パターンに接続されたスルーホール１３を通じて外部と電気的に接続可能とされている。 The electronic components 20 and 30 are electrically connected to the wiring pattern by being mounted on the substrate 10 and may be any surface mounting component or through-hole mounting component. In the case of the present embodiment, the semiconductor element 20 and the passive element 30 are exemplified as the electronic components 20 and 30. Examples of the semiconductor element 20 include a power element that generates a large amount of heat, such as a microcomputer, a control element, or an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). The semiconductor element 20 is connected to a land connected to the wiring pattern of the substrate 10 or a land formed by a part of the wiring pattern by a bonding wire 21 and a die bonding material 22 such as solder. Examples of the passive element 30 include a chip resistor, a chip capacitor, and a crystal resonator. The passive element 30 is connected to a land provided on the substrate 10 by a die bonding material 31 such as solder. With these configurations, the electronic components 20 and 30 are electrically connected to the wiring pattern formed on the substrate 10 and can be electrically connected to the outside through the through holes 13 connected to the wiring pattern.
　モールド樹脂４０は、エポキシ樹脂等の熱硬化性樹脂等より構成されるもので、金型を用いたトランスファーモールド法やコンプレッションモールド法により形成されている。本実施形態の場合、基板１０の一面１１側をモールド樹脂４０で封止しつつ、基板１０の他面１２側をモールド樹脂４０で封止せずに露出させた、いわゆるハーフモールド構造とされている。なお、本明細書では、モールド樹脂４０のうち、基板１０の一面１１側を下面、その反対側を上面と呼ぶことにする。ここでは、モールド樹脂４０の上面を平面とているが、必ずしも平面である必要はなく、例えば中央線が最も一面１１からの高さが高くされた屋根形状や曲面形状とされていても良いし、凹凸が形成されていても良い。 The mold resin 40 is composed of a thermosetting resin such as an epoxy resin, and is formed by a transfer molding method using a mold or a compression molding method. In the case of the present embodiment, a so-called half mold structure is formed in which the one surface 11 side of the substrate 10 is sealed with the mold resin 40 and the other surface 12 side of the substrate 10 is exposed without being sealed with the mold resin 40. . In the present specification, in the mold resin 40, the one surface 11 side of the substrate 10 is referred to as a lower surface, and the opposite side is referred to as an upper surface. Here, the upper surface of the mold resin 40 is a flat surface. However, the upper surface is not necessarily a flat surface. For example, the center line may have a roof shape or a curved surface shape with the highest height from the first surface 11. Unevenness may be formed.
　また、モールド樹脂４０は、図２に示すように上面形状が矩形状とされ、基板１０の相対する二辺、具体的には基板１０のうち長手方向と垂直な両辺を露出させるように、この両辺よりも内側にのみ形成されている。つまり、基板１０の長手方向両端がモールド樹脂４０からはみ出し、外側まで配置されることでモールド樹脂４０から露出させられている。このモールド樹脂４０から露出させられている部分にスルーホール１３が配置されており、このスルーホール１３を通じて、基板１０に形成された配線パターンと外部との電気的接続が可能とされている。また、基板１０の両辺がモールド樹脂４０から露出させられることで、基板１０の四隅が露出させられており、このモールド樹脂４０から露出させられた部分において、上記したように基板１０がケース６０に支持されている。 Further, as shown in FIG. 2, the mold resin 40 has a rectangular top surface, and the two opposite sides of the substrate 10, specifically, both sides perpendicular to the longitudinal direction of the substrate 10 are exposed. It is formed only on the inner side than both sides. That is, both ends in the longitudinal direction of the substrate 10 protrude from the mold resin 40 and are exposed from the mold resin 40 by being arranged to the outside. A through hole 13 is disposed in a portion exposed from the mold resin 40, and an electrical connection between the wiring pattern formed on the substrate 10 and the outside is possible through the through hole 13. Further, both sides of the substrate 10 are exposed from the mold resin 40, so that the four corners of the substrate 10 are exposed. In the portion exposed from the mold resin 40, the substrate 10 is attached to the case 60 as described above. It is supported.
　さらに、図３に示すように、モールド樹脂４０の側面の一部、具体的には側面のうちの基板１０の一面１１側の部分に、テーパ状に突き出したテーパ部４１を備えている。モールド樹脂４０の側面について、モールド樹脂４０の上面側の部分では一面１１に対して垂直とし、一面１１側の部分では一面１１に対して傾斜させることでテーパ部４１を備えている。換言すれば、モールド樹脂４０の端部において、モールド樹脂４０の上面よりも下方位置からのモールド樹脂４０の厚みを薄くした部分を備えるようにしつつ、モールド樹脂４０の外方に向かうに連れて徐々に薄くなるようにすることでテーパ部４１としている。つまり、モールド４０の外方に向かうに連れて、モールド樹脂４０の一面１１からの高さを徐々に低くすることでテーパ部４１を構成している。本実施形態の場合、テーパ部４１の表面を平面としており、一面１１に対して任意の角度で傾斜させられ、モールド樹脂４０の側面のうちテーパ部４１以外の部分に対しても任意の角度で傾斜させた構成としている。 Further, as shown in FIG. 3, a taper portion 41 protruding in a tapered shape is provided on a part of the side surface of the mold resin 40, specifically, a portion of the side surface on the one surface 11 side of the substrate 10. The side surface of the mold resin 40 is provided with a taper portion 41 by being inclined with respect to the one surface 11 at a portion on the upper surface side of the mold resin 40 and inclined with respect to the one surface 11 at a portion on the one surface 11 side. In other words, the end portion of the mold resin 40 is provided with a portion where the thickness of the mold resin 40 from the lower position than the upper surface of the mold resin 40 is reduced, and gradually toward the outside of the mold resin 40. The tapered portion 41 is formed by making it thinner. That is, the taper portion 41 is configured by gradually lowering the height from the one surface 11 of the mold resin 40 toward the outside of the mold 40. In the case of the present embodiment, the surface of the taper portion 41 is a flat surface, and is inclined at an arbitrary angle with respect to the one surface 11. The structure is inclined.
　このテーパ部４１におけるモールド樹脂４０の厚みは、基板１０における一面１１からの最も高さの高い電子部品２０、３０よりも低くされている。このため、モールド樹脂４０のうち厚みが薄くされている領域は限定的であり、モールド樹脂４０の外縁部近傍においても、一面１１からのモールド樹脂４０の高さが電子部品２０、３０を覆える高さになっている。 The thickness of the mold resin 40 in the taper portion 41 is lower than that of the electronic components 20 and 30 having the highest height from the one surface 11 of the substrate 10. For this reason, the area | region where thickness is thin among the mold resin 40 is limited, and the height of the mold resin 40 from the one surface 11 covers the electronic components 20 and 30 also in the vicinity of the outer edge part of the mold resin 40. It is height.
　そして、テーパ部４１を備えることによって、モールド樹脂４０の厚みがモールド樹脂４０の外方に向かうに連れて徐々に薄くなるようにしている。このため、モールド樹脂４０の終端部において、厚いモールド樹脂４０が形成されている領域から形成されていない領域に急に変化するのではないため、モールド樹脂４０と基板１０との熱膨張係数差に起因する応力を緩和できる。これにより、モールド樹脂４０と基板１０との間の剥離を抑制することが可能となる。また、テーパ部４１をモールド樹脂４０の上面から基板１０の一面１１に掛けて形成していないため、テーパ部４１となる領域が少ない。このため、超音波探傷装置による内部観察をモールド樹脂４０の殆どの領域で良好に行える。よって、モールド樹脂４０の内部観察をより良好に行うことが可能となる。 And, by providing the taper portion 41, the thickness of the mold resin 40 is gradually reduced toward the outside of the mold resin 40. For this reason, in the terminal part of mold resin 40, since it does not change suddenly from the area where thick mold resin 40 is formed to the area where it is not formed, the difference in thermal expansion coefficient between mold resin 40 and substrate 10 occurs. The resulting stress can be relaxed. Thereby, peeling between the mold resin 40 and the substrate 10 can be suppressed. Further, since the tapered portion 41 is not formed so as to extend from the upper surface of the mold resin 40 to the one surface 11 of the substrate 10, there are few regions that become the tapered portion 41. For this reason, the internal observation by the ultrasonic flaw detector can be satisfactorily performed in most regions of the mold resin 40. Therefore, the inside observation of the mold resin 40 can be performed more favorably.
　なお、矩形状とされたモールド樹脂４０のうち図２中の紙面上下に位置している２辺については、モールド樹脂４０のうち側面の位置が基板１０の側面の位置と一致している、この部分については、モールド樹脂４０の側面を平面状にしており、基板１０の側面と同一平面となるようにしている。このように、モールド樹脂４０の側面と基板１０の側面とが同一平面になる場合には、基板１０の外縁部までモールド樹脂４０から受ける応力が均一である。このため、この部分にはテーパ部４１を備えていなくてもモールド樹脂４０と基板１０との間の剥離の問題が生じ難い。 For the two sides of the mold resin 40 having a rectangular shape located above and below the paper surface in FIG. 2, the position of the side surface of the mold resin 40 coincides with the position of the side surface of the substrate 10. As for the portion, the side surface of the mold resin 40 is flat and is flush with the side surface of the substrate 10. As described above, when the side surface of the mold resin 40 and the side surface of the substrate 10 are on the same plane, the stress received from the mold resin 40 to the outer edge portion of the substrate 10 is uniform. For this reason, even if the taper part 41 is not provided in this part, the problem of peeling between the mold resin 40 and the substrate 10 hardly occurs.
　ヒートシンク５０は、熱伝達率の高い金属材料、例えばアルミニウムや銅によって構成されており、基板１０の他面１２側に、接合部材５１を介して密着させられている。接合部材５１としては、例えば金属フィラーを含有した導電性接着剤、はんだ材料などの導電材料、放熱ゲルや放熱シートなどの絶縁材料を用いている。ヒートシンク５０は、電子部品２０、３０が発した熱が基板１０の他面１２側から伝えられると、それを放熱させる役割を果たすものであり、熱伝導率の高い金属材料、例えば銅などにより構成されている。特に、半導体素子２０がＩＧＢＴやＭＯＳＦＥＴによって構成される場合、これらが発熱素子であることから、多くの熱を発するが、この熱がヒートシンク５０に伝えられることで、半導体素子２０や受動素子３０の高温化が抑制されるようになっている。本実施形態の場合、ヒートシンク５０は、放熱ゲル８０を介して蓋７０に対して熱的に接続されており、基板１０の裏面から伝えられた熱を更に放熱ゲル８０を通じて蓋７０に伝え、蓋７０から外部に放熱させるようにしている。 The heat sink 50 is made of a metal material having a high heat transfer coefficient, such as aluminum or copper, and is in close contact with the other surface 12 side of the substrate 10 via a bonding member 51. As the joining member 51, for example, a conductive adhesive containing a metal filler, a conductive material such as a solder material, or an insulating material such as a heat radiating gel or a heat radiating sheet is used. The heat sink 50 plays a role of radiating heat when the heat generated by the electronic components 20 and 30 is transmitted from the other surface 12 side of the substrate 10 and is made of a metal material having high thermal conductivity, such as copper. Has been. In particular, when the semiconductor element 20 is composed of an IGBT or a MOSFET, since these are heating elements, they generate a lot of heat, but this heat is transmitted to the heat sink 50, so that the semiconductor elements 20 and the passive elements 30 High temperature is suppressed. In the case of the present embodiment, the heat sink 50 is thermally connected to the lid 70 via the heat radiating gel 80, and heat transferred from the back surface of the substrate 10 is further transmitted to the lid 70 through the heat radiating gel 80. Heat is radiated from 70 to the outside.
　ケース６０は、基板１０の一面１１側に電子部品２０、３０を実装してモールド樹脂４０で封止したものを収容する長方体形状の筐体となるものである。本実施形態の場合、ケース６０は、底面６１の周囲を側壁面６２によって覆った収容凹部６３を構成する部材とされ、電子部品２０、３０を実装してモールド樹脂４０で封止した基板１０を、一面１１側が底面６１側を向くようにして収容凹部６３内に収容している。 The case 60 is a rectangular housing that accommodates the electronic components 20 and 30 mounted on the one surface 11 side of the substrate 10 and sealed with the mold resin 40. In the case of the present embodiment, the case 60 is a member constituting the housing recess 63 in which the periphery of the bottom surface 61 is covered by the side wall surface 62, and the substrate 10 mounted with the electronic components 20 and 30 and sealed with the mold resin 40 is used. In the housing recess 63, the one surface 11 side faces the bottom surface 61 side.
　ケース６０の底面６１には、上記したように基板１０を支持する機械的接続部６４が形成されている。機械的接続部６４は、底面６１から垂直方向に突出し、部分的に断面寸法が変化させられた段付き棒状部材とされている。具体的には、機械的接続部６４は、基板１０を固定する前の状態では、底面側の断面寸法が基板１０に形成した固定用孔１４より大きく、先端側の断面寸法が固定用孔１４とほぼ同じもしくは若干小さくされている。このような寸法とされているため、機械的接続部６４は、先端側が固定用孔１４に挿入されつつ、先端側と底面側との段差部にて基板１０を保持する。そして、機械的接続部６４の先端側が固定用孔１４内に嵌め込まれてから熱かしめされることで、基板１０から突き出した部分が固定用孔１４よりも断面寸法が大きくされ、その部分と段差部との間に基板１０が挟み込まれて支持されている。 As described above, the mechanical connection portion 64 that supports the substrate 10 is formed on the bottom surface 61 of the case 60. The mechanical connection portion 64 is a stepped rod-like member that protrudes in the vertical direction from the bottom surface 61 and whose sectional dimensions are partially changed. Specifically, in the state before the substrate 10 is fixed, the mechanical connection portion 64 has a cross-sectional dimension on the bottom side larger than that of the fixing hole 14 formed in the substrate 10, and a cross-sectional dimension on the tip side is larger than the fixing hole 14. Is almost the same or slightly smaller. Because of such dimensions, the mechanical connection portion 64 holds the substrate 10 at the stepped portion between the front end side and the bottom surface side while the front end side is inserted into the fixing hole 14. Then, the front end side of the mechanical connection portion 64 is fitted into the fixing hole 14 and then heat caulked, so that a portion protruding from the substrate 10 has a cross-sectional dimension larger than that of the fixing hole 14 and a step difference from that portion. The substrate 10 is sandwiched between and supported.
　なお、機械的接続部６４の突き出し量は、側壁面６２の高さよりも低くされており、基板１０が側壁面６２の先端よりも収容凹部６３の内側に入り込むようにしてある。 Note that the protruding amount of the mechanical connection portion 64 is set lower than the height of the side wall surface 62 so that the substrate 10 enters the inside of the accommodating recess 63 rather than the tip of the side wall surface 62.
　さらに、ケース６０の底面６１には、複数本の接続端子６５が底面６１に対して垂直方向に立設されている。例えば、各接続端子６５は、銅合金に錫メッキやニッケルメッキが施されたものにより構成されている。複数本の接続端子６５は、それぞれ、基板１０に形成されたスルーホール１３に挿通させられており、はんだ等の接続部材１５を介してスルーホール１３に電気的に接続されている。ケース６０は、基本的にはＰＰＳ（ポリフェニレンサルファイド）、ＰＢＴ（ポリブチレンテレフタレート）等の樹脂をベースとした絶縁体によって構成されているが、ケース６０の外部まで延設された配線パターンを備えている。この配線パターンに対して複数本の接続端子６５が接続され、各接続端子６５および配線パターンを通じて、各電子部品２０、３０が実装された基板１０の配線パターンと外部との電気的接続がなされている。 Furthermore, a plurality of connection terminals 65 are erected on the bottom surface 61 of the case 60 in a direction perpendicular to the bottom surface 61. For example, each connection terminal 65 is made of a copper alloy that is tin-plated or nickel-plated. Each of the plurality of connection terminals 65 is inserted through a through hole 13 formed in the substrate 10 and is electrically connected to the through hole 13 via a connection member 15 such as solder. The case 60 is basically made of an insulator based on a resin such as PPS (polyphenylene sulfide) or PBT (polybutylene terephthalate), but includes a wiring pattern extending to the outside of the case 60. Yes. A plurality of connection terminals 65 are connected to the wiring pattern, and the wiring pattern of the substrate 10 on which the electronic components 20 and 30 are mounted is electrically connected to the outside through the connection terminals 65 and the wiring pattern. Yes.
　蓋７０は、ケース６０の開口端、つまり側壁面６２の先端に接続されることで、ケース６０内を密閉するものである。蓋７０は、例えば接着剤などを介してケース６０に固定される。本実施形態の場合、蓋７０は、熱伝達率の高い金属材料、例えばアルミニウムや銅によって構成されており、矩形板状部材によって構成されている。 The lid 70 seals the inside of the case 60 by being connected to the opening end of the case 60, that is, the tip of the side wall surface 62. The lid 70 is fixed to the case 60 via an adhesive or the like, for example. In the case of this embodiment, the lid 70 is made of a metal material having a high heat transfer coefficient, such as aluminum or copper, and is made of a rectangular plate-like member.
　放熱ゲル８０は、ヒートシンク５０と蓋７０との間に配置されており、これら両方に接するように配置されることで、ヒートシンク５０から蓋７０への伝熱を行う。例えば、放熱ゲル８０は、熱伝導率の高いシリコーンオイルコンパウンドなどによって構成されている。放熱ゲル８０をなくしてヒートシンク５０と蓋７０とが直接接する構造とすることもできるが、ヒートシンク５０の高さ合わせなどが難しく、蓋７０を固定する際にヒートシンク５０を押圧してしまう可能性があることから、変形自在な放熱ゲル８０を備えると好ましい。 The heat dissipating gel 80 is disposed between the heat sink 50 and the lid 70, and is disposed so as to be in contact with both, thereby transferring heat from the heat sink 50 to the lid 70. For example, the heat radiating gel 80 is made of a silicone oil compound having a high thermal conductivity. Although it is possible to eliminate the heat-dissipating gel 80 and make the structure in which the heat sink 50 and the lid 70 are in direct contact with each other, it is difficult to adjust the height of the heat sink 50 and the heat sink 50 may be pressed when the lid 70 is fixed. For this reason, it is preferable to provide a heat-dissipating gel 80 that can be deformed.
　以上のようにして、本実施形態にかかる電子装置Ｓ１が構成されている。このような電子装置Ｓ１は、次のような製造方法により製造される。 As described above, the electronic device S1 according to the present embodiment is configured. Such an electronic device S1 is manufactured by the following manufacturing method.
　まず、配線パターンおよびスルーホール１３などが形成された基板１０を用意したのち、基板１０の一面１１上に電子部品２０、３０を実装する。次に、電子部品２０、３０が実装された基板１０を、トランスファーモールド法やコンプレッションモールド法によってモールド樹脂４０で封止する。 First, after preparing the substrate 10 on which the wiring pattern and the through hole 13 are formed, the electronic components 20 and 30 are mounted on the one surface 11 of the substrate 10. Next, the substrate 10 on which the electronic components 20 and 30 are mounted is sealed with a mold resin 40 by a transfer molding method or a compression molding method.
　図４は、例えばコンプレッション成形によってモールド樹脂４０による樹脂封止を行う場合の様子を示している。この図に示すように、成形型となる金型９０として、下型（第１型）９１と上型（第２型）９２およびプランジャ９３を用いる。まず、下型９１の上に基板１０を配置する。下型９１側に他面１２側が向くようにして配置する。続いて、上型９２を配置したのち、コンプレッション成形に用いる樹脂粉末を上型９２の開口部９２ａ内に充填してから、プランジャ９３を開口部９２ａ内において摺動させ、加熱加圧することで樹脂成形を行う。これにより、モールド樹脂４０が形成される。 FIG. 4 shows a state in which the resin sealing with the mold resin 40 is performed by, for example, compression molding. As shown in this figure, a lower mold (first mold) 91, an upper mold (second mold) 92, and a plunger 93 are used as a mold 90 serving as a mold. First, the substrate 10 is placed on the lower mold 91. It arrange | positions so that the other surface 12 side may face the lower mold | type 91 side. Subsequently, after the upper die 92 is arranged, the resin powder used for compression molding is filled in the opening 92a of the upper die 92, and then the plunger 93 is slid in the opening 92a and heated and pressurized. Perform molding. Thereby, the mold resin 40 is formed.
　このとき、上型９２のうち基板１０の一面１１と接する側において、一面１１に向かってキャビティが徐々に広がるように内壁面をテーパ状にしている。このため、モールド樹脂４０の側面のうち一面１１側の部分について、モールド樹脂４０の厚みがモールド樹脂４０の外方に向かうに連れて徐々に薄くなるようなテーパ部４１が形成される。 At this time, on the side of the upper mold 92 in contact with the one surface 11 of the substrate 10, the inner wall surface is tapered so that the cavity gradually expands toward the one surface 11. For this reason, a tapered portion 41 is formed in a portion of the side surface of the mold resin 40 on the one surface 11 side so that the thickness of the mold resin 40 gradually decreases as the mold resin 40 moves outward.
　そして、基板１０の他面１２側に接合部材５１を介してヒートシンク５０を接合したのち、基板１０をケース６０の収容凹部６３内に、一面１１側が底面６１側を向くようにして配置する。このとき、スルーホール１３に複数の接続端子６５が挿入され、固定用孔１４内に機械的接続部６４の先端が嵌め込まれるようにする。 Then, after the heat sink 50 is bonded to the other surface 12 side of the substrate 10 via the bonding member 51, the substrate 10 is disposed in the housing recess 63 of the case 60 with the one surface 11 side facing the bottom surface 61 side. At this time, the plurality of connection terminals 65 are inserted into the through holes 13 so that the tips of the mechanical connection portions 64 are fitted into the fixing holes 14.
　その後、機械的接続部６４の先端を熱かしめすると共に、はんだ付けなどによりスルーホール１３と複数の接続端子６５とを接続部材１５にて接続する。最後に、ヒートシンク５０の表面に放熱ゲル８０を配置したのち、その上に蓋７０を配置し、蓋７０とケース６０の側壁面６２との間を接着剤などによって固定することで、本実施形態にかかる電子装置Ｓ１が完成する。 Thereafter, the tip of the mechanical connection portion 64 is heat caulked, and the through hole 13 and the plurality of connection terminals 65 are connected by the connection member 15 by soldering or the like. Finally, after disposing the heat radiating gel 80 on the surface of the heat sink 50, the lid 70 is disposed thereon, and the space between the lid 70 and the side wall surface 62 of the case 60 is fixed with an adhesive or the like. The electronic device S1 is completed.
　なお、従来のように、モールド樹脂４０の上面から基板１０と密着させられる面にかけてモールド樹脂４０の側面全域をテーパ状にする場合、モールド樹脂４０をコンプレッション成形によって形成するのであれば、プランジャ９３の押し込み量の調整が難しい。すなわち、プランジャ９３が押し込まれ過ぎたり、逆にプランジャ９３の押し込み量が足りないという状態になり得る。このため、プランジャ９３の押し込み量に応じてモールド樹脂４０の上面形状が変化してしまい、安定して断面台形状にすることが難しく、モールド樹脂４０の上面から基板１０と接する面にかけてモールド樹脂４０の側面全域をテーパ状にするのが困難である。そして、プランジャ９３が押し込まれ過ぎた場合にはモールド樹脂４０の上面側の外縁部において、樹脂の尖ったバリが形成され、それが後工程で欠けてしまうといった問題を発生させる。このため、モールド樹脂４０の上面から基板１０と密着させられる面にかけてモールド樹脂４０の側面全域をテーパ状にするという構造は、コンプレッション成形には向かない構造であると言える。 If the entire side surface of the mold resin 40 is tapered from the upper surface of the mold resin 40 to the surface to be brought into close contact with the substrate 10 as in the prior art, if the mold resin 40 is formed by compression molding, the plunger 93 It is difficult to adjust the push-in amount. That is, the plunger 93 may be pushed too much, or conversely, the pushing amount of the plunger 93 may be insufficient. For this reason, the shape of the upper surface of the mold resin 40 changes according to the pushing amount of the plunger 93, and it is difficult to stably form a trapezoidal cross section, and the mold resin 40 extends from the upper surface of the mold resin 40 to the surface in contact with the substrate 10. It is difficult to taper the entire side surface. When the plunger 93 is pushed too much, a resin-pointed burr is formed at the outer edge portion of the upper surface side of the mold resin 40, which causes a problem that it is chipped in a subsequent process. Therefore, it can be said that the structure in which the entire side surface of the mold resin 40 is tapered from the upper surface of the mold resin 40 to the surface to be brought into close contact with the substrate 10 is not suitable for compression molding.
　これに対して、本実施形態では、モールド樹脂４０の側面のうち一面１１側の部分のみをテーパ形状にしている。このため、プランジャ９３の押し込み量にかかわらず、モールド樹脂４０の上面形状が変化しないし、プランジャ９３が押し込まれすぎることによるバリの発生もない。したがって、モールド樹脂４０を安定して同じ形状で形成できるし、バリが後工程で欠けてしまうといった問題を発生させることもない。 In contrast, in the present embodiment, only the portion on the one surface 11 side of the side surface of the mold resin 40 is tapered. For this reason, regardless of the pushing amount of the plunger 93, the shape of the upper surface of the mold resin 40 does not change, and no burrs are generated due to the plunger 93 being pushed too much. Therefore, the mold resin 40 can be stably formed in the same shape, and the problem that burrs are lost in a subsequent process does not occur.
　以上説明したように、本実施形態にかかる電子装置Ｓ１では、モールド樹脂４０の端部において、モールド樹脂４０の厚みを薄くした部分を備えるようにしつつ、モールド樹脂４０の外方に向かうに連れて徐々に薄くなるようにすることでテーパ部４１としている。このため、モールド樹脂４０の終端部において、厚いモールド樹脂４０が形成されている領域から形成されていない領域に急に変化するのではないため、モールド樹脂４０と基板１０との熱膨張係数差に起因する応力を緩和できる。これにより、モールド樹脂４０と基板１０との間の剥離を抑制することが可能となる。また、テーパ部４１をモールド樹脂４０の上面から基板１０の一面１１に掛けて形成していないため、テーパ部４１となる領域が少ない。このため、超音波探傷装置による内部観察をモールド樹脂４０の殆どの領域で良好に行える。よって、モールド樹脂の内部観察をより良好に行うことが可能となる。 As described above, in the electronic device S <b> 1 according to the present embodiment, the end portion of the mold resin 40 is provided with a portion in which the thickness of the mold resin 40 is reduced, and as it goes outward of the mold resin 40. The taper portion 41 is formed by gradually reducing the thickness. For this reason, in the terminal part of mold resin 40, since it does not change suddenly from the area where thick mold resin 40 is formed to the area where it is not formed, the difference in thermal expansion coefficient between mold resin 40 and substrate 10 occurs. The resulting stress can be relaxed. Thereby, peeling between the mold resin 40 and the substrate 10 can be suppressed. Further, since the tapered portion 41 is not formed so as to extend from the upper surface of the mold resin 40 to the one surface 11 of the substrate 10, there are few regions that become the tapered portion 41. For this reason, the internal observation by the ultrasonic flaw detector can be satisfactorily performed in most regions of the mold resin 40. Therefore, it becomes possible to better observe the inside of the mold resin.
　また、テーパ部４１をモールド樹脂４０の上面から基板１０の一面１１に至る全域に形成しておらず、モールド樹脂４０の上面よりも下方から形成しているため、モールド樹脂４０のうちテーパ部４１となる領域を限定的にできる。このため、モールド樹脂４０の外縁部の近傍まで電子部品２０、３０を配置することが可能となり、デッドスペースを縮小できて、電子装置Ｓ１の大型化を抑制することが可能となる。 Further, the tapered portion 41 is not formed in the entire region from the upper surface of the mold resin 40 to the one surface 11 of the substrate 10, and is formed from below the upper surface of the mold resin 40. Can be limited. For this reason, the electronic components 20 and 30 can be disposed up to the vicinity of the outer edge portion of the mold resin 40, the dead space can be reduced, and the enlargement of the electronic device S1 can be suppressed.
　（第２実施形態）
　本開示の第２実施形態について説明する。本実施形態は、第１実施形態に対してテーパ部４１の形状を変更したものであり、その他については第１実施形態と同様であるため、第１実施形態と異なる部分についてのみ説明する。 (Second Embodiment)
A second embodiment of the present disclosure will be described. In the present embodiment, the shape of the tapered portion 41 is changed with respect to the first embodiment, and the other parts are the same as those in the first embodiment. Therefore, only the parts different from the first embodiment will be described.
　図５に示すように、本実施形態では、モールド樹脂４０の側面のうちテーパ部４１以外の部分とテーパ部４１との境界位置およびテーパ部４１と基板１０の一面との境界位置がＲ形状の曲面となるようにしている。このように、テーパ部４１の表面を曲面にしても、第１実施形態と同様の効果を得ることができる。また、テーパ部４１の表面を曲面にすることで、各境界位置でのモールド樹脂４０と基板１０との熱膨張係数差に起因する応力が滑らかに変化するようにできる。これにより、よりモールド樹脂４０と基板１０との間の剥離を抑制することが可能となる。 As shown in FIG. 5, in this embodiment, the boundary position between the portion other than the taper portion 41 and the taper portion 41 in the side surface of the mold resin 40 and the boundary position between the taper portion 41 and one surface of the substrate 10 are R-shaped. It is designed to be a curved surface. Thus, even if the surface of the taper portion 41 is curved, the same effect as that of the first embodiment can be obtained. In addition, by making the surface of the tapered portion 41 a curved surface, the stress caused by the difference in thermal expansion coefficient between the mold resin 40 and the substrate 10 at each boundary position can be changed smoothly. Thereby, it becomes possible to further suppress peeling between the mold resin 40 and the substrate 10.
　（第３実施形態）
　本開示の第３実施形態について説明する。本実施形態も、第１実施形態に対してテーパ部４１の形状を変更したものであり、その他については第１実施形態と同様であるため、第１実施形態と異なる部分についてのみ説明する。 (Third embodiment)
A third embodiment of the present disclosure will be described. In the present embodiment, the shape of the taper portion 41 is changed with respect to the first embodiment, and the other parts are the same as those in the first embodiment. Therefore, only different portions from the first embodiment will be described.
　図６に示すように、本実施形態では、モールド樹脂４０の側面のうちテーパ部４１以外の部分とテーパ部４１との境界位置がＲ形状の曲面となるようにしている。このように、モールド樹脂４０の側面のうちテーパ部４１以外の部分とテーパ部４１との境界位置を曲面にしても、第１実施形態と同様の効果を得ることができる。また、この境界位置でのモールド樹脂４０と基板１０との熱膨張係数差に起因する応力が滑らかに変化するようにできる。これにより、よりモールド樹脂４０と基板１０との間の剥離を抑制することが可能となる。 As shown in FIG. 6, in this embodiment, the boundary position between the taper portion 41 and the portion other than the taper portion 41 on the side surface of the mold resin 40 is an R-shaped curved surface. As described above, even if the boundary position between the taper portion 41 and the portion other than the taper portion 41 on the side surface of the mold resin 40 is curved, the same effect as that of the first embodiment can be obtained. Moreover, the stress resulting from the difference in thermal expansion coefficient between the mold resin 40 and the substrate 10 at the boundary position can be changed smoothly. Thereby, it becomes possible to further suppress peeling between the mold resin 40 and the substrate 10.
　（他の実施形態）
　例えば、上記各実施形態では、基板１０の一面１１上に電子部品２０、３０を実装したのち、電子部品２０、３０をモールド樹脂４０で樹脂封止する形態が適用された電子装置Ｓ１の一例を示したが、上記各実施形態で説明した構造でなくても良い。例えば、基板１０の一面１１側、つまりモールド樹脂４０側がケース６０の底面６１側に向けられるように配置しているが、他面１２側、つまりモールド樹脂４０と反対側が底面６１側に向けられるように配置しても良い。 (Other embodiments)
For example, in each of the embodiments described above, an example of the electronic device S1 to which the electronic components 20 and 30 are mounted on the one surface 11 of the substrate 10 and then the electronic components 20 and 30 are sealed with the mold resin 40 is applied. Although shown, it does not have to be the structure described in the above embodiments. For example, the one surface 11 side of the substrate 10, that is, the mold resin 40 side is arranged to face the bottom surface 61 side of the case 60, but the other surface 12 side, that is, the side opposite to the mold resin 40 is directed to the bottom surface 61 side. You may arrange in.
　また、テーパ部４１の形成位置についても、モールド樹脂４０の上面よりも下方位置から形成されていれば良いし、上記各実施形態で説明した形状に限るものではない。例えば、上記各実施形態では、デッドスペースをより縮小できるようにするために、電子部品２０、３０のうち最も高さの高いものよりも低い位置からテーパ部４１を備えるようにしたが、それよりも上の位置からテーパ部４１を形成しても良い。さらに、第３実施形態では、モールド樹脂４０の側面のうちテーパ部４１以外の部分とテーパ部４１との境界位置のみを曲面としたが、テーパ部４１と基板１０の一面との境界位置のみを曲面としても良い。 Further, the formation position of the taper portion 41 is not limited to the shape described in each of the above embodiments as long as it is formed from a position below the upper surface of the mold resin 40. For example, in each of the above embodiments, in order to further reduce the dead space, the tapered portion 41 is provided from a position lower than the highest one of the electronic components 20 and 30. Alternatively, the tapered portion 41 may be formed from the upper position. Furthermore, in the third embodiment, only the boundary position between the taper portion 41 and the portion other than the taper portion 41 of the side surface of the mold resin 40 is a curved surface, but only the boundary position between the taper portion 41 and one surface of the substrate 10 is used. It may be a curved surface.
　さらに、多連基板、つまり１枚の母材から基板１０を複数枚製造するような場合において、モールド樹脂４０も複数枚同時に形成することがある。この場合、複数枚の基板１０に跨るようにモールド樹脂４０を形成しておき、モールド樹脂４０と共に多連基板を切断することで複数枚の基板１０を形成することができるが、その切断面において、モールド樹脂４０の側面と基板１０の側面とが同一平面になる。したがって、このように多連基板を用いて複数枚の基板１０を形成する場合にも、上記した各実施形態で説明した構造の基板１０およびモールド樹脂４０を製造できる。なお、この場合には、切断前の状態において、モールド樹脂４０のすべての辺にテーパ部４１を形成できることから、さらに成形時の型抜き性を良好にすることが可能となる。 Furthermore, in the case where a plurality of substrates 10 are manufactured from a multiple substrate, that is, a single base material, a plurality of mold resins 40 may be formed simultaneously. In this case, it is possible to form the plurality of substrates 10 by forming the mold resin 40 so as to straddle the plurality of substrates 10 and cutting the multiple substrate together with the mold resin 40. The side surface of the mold resin 40 and the side surface of the substrate 10 are flush with each other. Therefore, even when a plurality of substrates 10 are formed using a multiple substrate in this way, the substrate 10 and the mold resin 40 having the structure described in the above embodiments can be manufactured. In this case, since the taper portions 41 can be formed on all sides of the mold resin 40 in a state before cutting, it is possible to further improve the mold release properties at the time of molding.
　また、機械的接続部６４による基板１０の固定手法も、熱かしめに限らず、圧入やネジ締め固定などであっても良い。また、接続端子６５とスルーホール１３との接続も、はんだ付けに限らず、プレスフィットなどであっても良い。 Further, the fixing method of the substrate 10 by the mechanical connection portion 64 is not limited to heat caulking, and may be press-fitting or screw-fixing. Further, the connection between the connection terminal 65 and the through hole 13 is not limited to soldering, and may be a press fit or the like.
　本開示は、実施例に準拠して記述されたが、本開示は当該実施例や構造に限定されるものではないと理解される。本開示は、様々な変形例や均等範囲内の変形をも包含する。加えて、様々な組み合わせや形態、さらには、それらに一要素のみ、それ以上、あるいはそれ以下、を含む他の組み合わせや形態をも、本開示の範疇や思想範囲に入るものである。 Although the present disclosure has been described based on the embodiments, it is understood that the present disclosure is not limited to the embodiments and structures. The present disclosure includes various modifications and modifications within the equivalent range. In addition, various combinations and forms, as well as other combinations and forms including only one element, more or less, are within the scope and spirit of the present disclosure.

Claims (7)

  1. 　第一面（１１）および前記第一面の反対の第二面（１２）とを有する基板（１０）と、
    　前記基板の第一面側に実装された電子部品（２０、３０）と、
    　前記基板の第一面側に設けられ、前記電子部品を封止するモールド樹脂（４０）と、を備え、
    　前記基板のうちの少なくとも一部が前記モールド樹脂の外側まで配置されており、
    　前記モールド樹脂は、テーパ部（４１）を備え、
    　前記モールド樹脂は、前記基板の第一面に対向する下面と、該下面と反対の上面、および、下面と上面に挟まれた側面を有し、
    　テーパ部（４１）は、該モールド樹脂の側面に配置され、前記上面よりも前記下面側の位置から外方に向かって突き出し、
    　テーパ部（４１）は、前記モールド樹脂の外側に配置された前記基板の一部において、前記第一面に対して傾斜しており、
    　テーパ部（４１）は、該モールド樹脂の外方に向かうに連れて徐々に前記第一面からの高さが低くなる電子装置。     A substrate (10) having a first surface (11) and a second surface (12) opposite the first surface;
    Electronic components (20, 30) mounted on the first surface side of the substrate;
    A mold resin (40) provided on the first surface side of the substrate and sealing the electronic component;
    At least a portion of the substrate is disposed to the outside of the mold resin;
    The mold resin includes a tapered portion (41),
    The mold resin has a lower surface facing the first surface of the substrate, an upper surface opposite to the lower surface, and a side surface sandwiched between the lower surface and the upper surface,
    The taper portion (41) is disposed on the side surface of the mold resin and protrudes outward from the position on the lower surface side than the upper surface,
    The taper part (41) is inclined with respect to the first surface in a part of the substrate disposed outside the mold resin,
    The taper portion (41) is an electronic device in which the height from the first surface gradually decreases as it goes outward of the mold resin.
  2. 　前記テーパ部以外の前記モールド樹脂の側面は、前記基板の第一面に対して垂直である請求項１に記載の電子装置。 2. The electronic device according to claim 1, wherein the side surfaces of the mold resin other than the tapered portion are perpendicular to the first surface of the substrate.
  3. 　前記テーパ部は、前記テーパ部以外の前記モールド樹脂の側面と該テーパ部との境界位置および該テーパ部と前記基板の第一面との境界位置の少なくとも一方において、湾曲している請求項１または２に記載の電子装置。 The tapered portion is curved at at least one of a boundary position between the side surface of the mold resin other than the tapered portion and the tapered portion and a boundary position between the tapered portion and the first surface of the substrate. Or the electronic device of 2.
  4. 　前記テーパ部以外の前記モールド樹脂の側面と該テーパ部との境界位置は、前記基板の第一面から最も離れている前記電子部品の一部よりも、第一面に近い請求項１ないし３のいずれか１つに記載の電子装置。 The boundary position between the side surface of the mold resin other than the taper portion and the taper portion is closer to the first surface than a part of the electronic component farthest from the first surface of the substrate. The electronic device according to any one of the above.
  5. 　前記モールド樹脂の側面と該テーパ部との境界位置は、前記基板の第一面から最も近くにある前記電子部品の一部と同じか、それよりも第一面に近い請求項４に記載の電子装置。 The boundary position between the side surface of the mold resin and the tapered portion is the same as a part of the electronic component closest to the first surface of the substrate or closer to the first surface than the first surface. Electronic equipment.
  6. 　モールド樹脂は、4つの側面を有する直方体形をしており、
    　お互いに対向する二つの側面は、テーパ部を有し、
    　他の二つの側面は、テーパ部を有さず、基板の側面と同一平面上にある請求項５に記載の電子装置。     The mold resin has a rectangular parallelepiped shape with four sides,
    Two side surfaces facing each other have a tapered portion,
    6. The electronic device according to claim 5, wherein the other two side surfaces do not have a tapered portion and are flush with the side surface of the substrate.
  7. 　第一面（１１）および前記第一面の反対となる第二面（１２）とを有する基板（１０）と、前記基板の第一面側に実装された電子部品（２０、３０）と、前記基板の第一面側に設けられ、前記電子部品を封止するモールド樹脂（４０）とを備える電子装置の製造方法であって、
    　前記基板を用意し、該基板の第一面に前記電子部品を実装し、
    　前記電子部品が実装された前記基板の第二面側において第１金型（９１）を接触させ、前記基板の第一面側にキャビティが設けられた第２金型（９２）を配置し、前記キャビティ内に樹脂材料を充填すると共に、該キャビティと前記第１金型の開口部内にプランジャを摺動させて加熱加圧を行うことで、モールド成形により前記モールド樹脂を形成することを備え、
    　前記第２金型として、該第２金型のうち前記キャビティを構成する内壁面が、前記基板の第一面側に向かって前記キャビティが徐々に広がるテーパ状とされており、
    　前記モールド樹脂は、前記基板の第一面に対向する下面と、該下面と反対の上面、および、下面と上面に挟まれた側面を有し、
    　前記モールド樹脂の形成では、該モールド樹脂の側面に配置され、前記上面よりも前記下面側の位置から外方に向かって突き出す、テーパ部（４１）を形成し、
    　テーパ部（４１）は、前記モールド樹脂の外側に配置された前記基板の一部において、前記第一面に対して傾斜しており、
    　テーパ部（４１）は、該モールド樹脂の外方に向かうに連れて徐々に前記第一面からの高さが低くなる電子装置の製造方法。     A substrate (10) having a first surface (11) and a second surface (12) opposite to the first surface; and electronic components (20, 30) mounted on the first surface side of the substrate; An electronic device manufacturing method comprising: a mold resin (40) provided on the first surface side of the substrate and sealing the electronic component,
    Preparing the substrate, mounting the electronic component on the first surface of the substrate,
    The first mold (91) is brought into contact with the second surface side of the substrate on which the electronic component is mounted, and the second mold (92) provided with a cavity on the first surface side of the substrate is disposed, Filling the cavity with a resin material, and sliding the plunger into the cavity and the opening of the first mold to perform heating and pressurization, thereby forming the mold resin by molding,
    As the second mold, an inner wall surface constituting the cavity of the second mold is tapered so that the cavity gradually spreads toward the first surface side of the substrate,
    The mold resin has a lower surface facing the first surface of the substrate, an upper surface opposite to the lower surface, and a side surface sandwiched between the lower surface and the upper surface,
    In the formation of the mold resin, a taper portion (41) that is disposed on the side surface of the mold resin and protrudes outward from the position on the lower surface side than the upper surface is formed.
    The taper part (41) is inclined with respect to the first surface in a part of the substrate disposed outside the mold resin,
    The taper portion (41) is a method of manufacturing an electronic device in which the height from the first surface gradually decreases as it goes outward of the mold resin.
PCT/JP2014/002917 2013-06-28 2014-06-03 Electronic device and method for manufacturing said electronic device WO2014208006A1 (en)

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