JP6252871B2 - Circuit structure and electrical junction box - Google Patents

Circuit structure and electrical junction box Download PDF

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Publication number
JP6252871B2
JP6252871B2 JP2015006685A JP2015006685A JP6252871B2 JP 6252871 B2 JP6252871 B2 JP 6252871B2 JP 2015006685 A JP2015006685 A JP 2015006685A JP 2015006685 A JP2015006685 A JP 2015006685A JP 6252871 B2 JP6252871 B2 JP 6252871B2
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Japan
Prior art keywords
circuit board
insulating layer
heat
circuit structure
structure according
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JP2015006685A
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JP2016134957A (en
Inventor
角田　達哉
達哉 角田
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Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2015006685A priority Critical patent/JP6252871B2/en
Priority to DE112015004024.2T priority patent/DE112015004024B4/en
Priority to CN201580032261.4A priority patent/CN106463933B/en
Priority to PCT/JP2015/086479 priority patent/WO2016114099A1/en
Priority to US15/543,585 priority patent/US10038315B2/en
Publication of JP2016134957A publication Critical patent/JP2016134957A/en
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Publication of JP6252871B2 publication Critical patent/JP6252871B2/en
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Or Junction Boxes (AREA)

Description

本発明は、回路構成体及び電気接続箱に関する。   The present invention relates to a circuit structure and an electrical junction box.

従来、絶縁板に導電路が形成された基板とバスバーとを接着して放熱部材に重ねた回路構成体が知られている。特許文献１の回路構成体は、複数本のバスバーと制御回路基板とを接着し、電子部品を実装して形成された回路体を放熱部材の上に接着剤を塗布した状態で回路体を接着剤の上から放熱部材に押し付けて接着している。   2. Description of the Related Art Conventionally, there has been known a circuit configuration body in which a substrate having a conductive path formed on an insulating plate and a bus bar are bonded and overlapped with a heat radiating member. The circuit configuration body of Patent Document 1 bonds a circuit body in a state where a plurality of bus bars and a control circuit board are bonded, and a circuit body formed by mounting electronic components is coated on a heat dissipation member. The adhesive is pressed against the heat dissipation member from above the agent.

特開２００５−１５１６１７号公報JP 2005-151617 A

ところで、特許文献１では、回路体を放熱部材に接着する際に回路体を放熱部材側に押し付けているが、この押し付けの際に、回路体を介して接着剤に生じる圧力が不均一になると、接着剤の接着が不十分な箇所が生じ、放熱性が低下するという問題がある。   By the way, in Patent Document 1, when the circuit body is bonded to the heat radiating member, the circuit body is pressed against the heat radiating member, but when the pressure generated in the adhesive through the circuit body becomes nonuniform during the pressing. There is a problem that a portion where the adhesive is insufficiently bonded occurs and heat dissipation is reduced.

本発明は上記のような事情に基づいて完成されたものであって、放熱性の低下を抑制することが可能な回路構成体を提供することを目的とする。   This invention is completed based on the above situations, Comprising: It aims at providing the circuit structure which can suppress the fall of heat dissipation.

本発明の回路構成体は、導電路を有する回路基板と、前記回路基板が重ねられ、前記回路基板側の面が粗く形成された粗面を有する放熱部材と、前記粗面上で固化して形成される絶縁層と、を備え、前記回路基板は、前記絶縁層に重ねられて固定される。   The circuit structure of the present invention includes a circuit board having a conductive path, a heat dissipation member having a rough surface in which the circuit board is overlapped and a surface on the circuit board side is formed rough, and is solidified on the rough surface. An insulating layer to be formed, and the circuit board is stacked and fixed on the insulating layer.

本構成によれば、放熱部材の粗面上で絶縁層が固化することにより絶縁層が粗面の凹凸に入り込んで放熱部材の上に固着する。この絶縁層の上に回路基板が重ねられて固定されるため、回路基板と放熱部材との間を絶縁層を介して固定することができる。これにより、接着剤を用いなくても回路基板と放熱部材との間を固定することが可能になるため、接着剤で接着する場合のように、回路基板と放熱部材との間に接着剤の接着が不十分な箇所が生じることによる放熱性の低下を抑制することができる。   According to this structure, when an insulating layer solidifies on the rough surface of a heat radiating member, an insulating layer enters the unevenness | corrugation of a rough surface, and adheres on a heat radiating member. Since the circuit board is overlaid and fixed on the insulating layer, the circuit board and the heat dissipation member can be fixed via the insulating layer. This makes it possible to fix the circuit board and the heat radiating member without using an adhesive. Therefore, as in the case of bonding with an adhesive, the adhesive between the circuit board and the heat radiating member It is possible to suppress a decrease in heat dissipation due to the occurrence of insufficient adhesion.

本発明の実施態様としては以下の態様が好ましい。
・前記粗面は、化学処理又はレーザー処理によって形成されている。
このようにすれば、絶縁層を固着できる程度の凹凸を有する粗面を形成することが可能になる。 As embodiments of the present invention, the following embodiments are preferable.
The rough surface is formed by chemical treatment or laser treatment.
In this way, it is possible to form a rough surface having unevenness enough to fix the insulating layer.

・前記回路基板は、前記絶縁層に固定部材で留められている。
回路基板を放熱部材に直接固定する場合と比較して、固定部材を小型化できるとともに、固定部材による固定の際に回路基板に生じる応力を小さくすることができるため、固定時の応力が半田付けした箇所に及ぶことによる半田付け不良を抑制することができる。 The circuit board is fixed to the insulating layer with a fixing member.
Compared with the case where the circuit board is directly fixed to the heat radiating member, the fixing member can be reduced in size and the stress generated in the circuit board during fixing by the fixing member can be reduced. It is possible to suppress soldering defects due to reaching the locations.

・前記絶縁層には、前記回路基板の端子を前記固定部材で固定するための被固定部が形成されている。
このようにすれば、絶縁性が必要な被固定部を絶縁層に形成することで、被固定部を別体で形成する場合と比較して、部品点数を削減することができる。 A fixed portion for fixing the terminal of the circuit board with the fixing member is formed in the insulating layer.
In this way, the number of parts can be reduced by forming the fixed portion that needs insulation in the insulating layer as compared with the case where the fixed portion is formed separately.

・前記絶縁層には、前記回路基板の端子が収容されるコネクタハウジングが形成されている。
このようにすれば、絶縁性が必要なコネクタハウジングを絶縁層に形成することで、コネクタハウジングを別体で形成する場合と比較して、部品点数を削減することができる。 A connector housing that accommodates the terminals of the circuit board is formed on the insulating layer.
In this way, the number of parts can be reduced by forming the connector housing that requires insulation in the insulating layer, compared to the case where the connector housing is formed separately.

・前記回路基板には、複数の低発熱部品と前記複数の低発熱部品よりも発熱する複数の高発熱部品とからなる電子部品が実装され、前記回路基板及び前記絶縁層には、前記複数の低発熱部品と前記複数の高発熱部品との間に、前記回路基板及び前記絶縁層を貫通する断熱溝が形成されている。
このようにすれば、断熱溝により、高発熱部品の熱が回路基板や絶縁層を介して低発熱部品側に伝達されることを抑制することができる。 The electronic component comprising a plurality of low heat generation components and a plurality of high heat generation components that generate heat more than the plurality of low heat generation components is mounted on the circuit board, and the circuit board and the insulating layer include the plurality of the heat generation components. A heat insulating groove penetrating the circuit board and the insulating layer is formed between the low heat generating component and the plurality of high heat generating components.
If it does in this way, it can control that the heat of a high exothermic component is transmitted to the low exothermic component side via a circuit board or an insulating layer by a heat insulation groove.

・前記回路基板と前記絶縁層との間における前記複数の高発熱部品の少なくとも１つが重なる領域には放熱グリスが配されている。
このようにすれば、放熱グリスにより、回路基板と絶縁層との間の熱伝導性を高めることができるため、高発熱部品の熱を効率的に放熱部材に伝えることができる。 A heat dissipating grease is arranged in a region where at least one of the plurality of high heat generating components overlaps between the circuit board and the insulating layer.
If it does in this way, since thermal conductivity between a circuit board and an insulating layer can be raised by thermal radiation grease, the heat of a high exothermic part can be efficiently transmitted to a thermal radiation member.

・前記放熱部材は、前記複数の高発熱部品が実装される領域に形成され、前記複数の低発熱部品が実装される領域には重ねられていない。
このようにすれば、放熱部材が小さくなって回路構成体の構成を簡素化できるとともに、高発熱部品側の発熱が大きい領域の熱は、放熱部材から放熱性させることができる。 The heat radiating member is formed in a region where the plurality of high heat generating components are mounted, and is not overlaid on a region where the plurality of low heat generating components are mounted.
If it does in this way, while the heat dissipation member becomes small and the structure of a circuit structure body can be simplified, the heat | fever of the area | region where the heat_generation | fever of the high heat-emitting component side is large can be made to radiate from a heat dissipation member.

・前記回路構成体と、前記回路構成体を収容するケースとを備えた電気接続箱とする。 -It is set as the electrical junction box provided with the said circuit structure and the case which accommodates the said circuit structure.

実施形態１の電気接続箱を示す縦断面図1 is a longitudinal sectional view showing an electrical junction box according to a first embodiment. 粗面を拡大した縦断面図Longitudinal cross section with enlarged rough surface 放熱部材を示す縦断面図Longitudinal cross section showing heat dissipation member 樹脂成形金型と放熱部材との間に樹脂が充填された状態を示す縦断面図Longitudinal sectional view showing a state in which resin is filled between the resin mold and the heat dissipation member 放熱部材の上に絶縁層が形成された状態を示す斜視図The perspective view which shows the state in which the insulating layer was formed on the heat radiating member 放熱部材の上に絶縁層が形成された状態を示す縦断面図A longitudinal sectional view showing a state in which an insulating layer is formed on the heat dissipation member 回路基板に電子部品が実装された状態を示す縦断面図A longitudinal sectional view showing a state where electronic components are mounted on a circuit board 回路構成体を示す縦断面図Longitudinal section showing the circuit structure 実施形態２の電気接続箱を示す縦断面図The longitudinal cross-sectional view which shows the electrical junction box of Embodiment 2 樹脂成形金型と放熱部材の間に樹脂が充填された状態を示す縦断面図Longitudinal sectional view showing a state where the resin is filled between the resin mold and the heat dissipation member 放熱部材の上に絶縁層が形成された状態を示す縦断面図A longitudinal sectional view showing a state in which an insulating layer is formed on the heat dissipation member 回路構成体を示す縦断面図Longitudinal section showing the circuit structure

本実施形態を図１ないし図８を参照しつつ説明する。
電気接続箱１０は、例えば車両のバッテリ等の電源と、ランプ、ワイパー等の車載電装品やモータ等からなる負荷との間の電力供給経路に配され、例えばＤＣ−ＤＣコンバータやインバータ等に用いることができる。以下では、上下方向及び左右方向については、図１の方向を基準として説明する。 The present embodiment will be described with reference to FIGS.
The electric junction box 10 is arranged in a power supply path between a power source such as a battery of a vehicle and a load composed of an on-vehicle electrical component such as a lamp and a wiper or a motor, and is used for, for example, a DC-DC converter or an inverter. be able to. Hereinafter, the vertical direction and the horizontal direction will be described with reference to the direction of FIG.

（電気接続箱１０）
電気接続箱１０は、図１に示すように、回路構成体２０と、回路構成体２０を覆うケース１１とを備えている。ケース１１は、箱形であって、例えばアルミニウム等の金属や合成樹脂等で形成することができる。 (Electric junction box 10)
As shown in FIG. 1, the electrical junction box 10 includes a circuit structure 20 and a case 11 that covers the circuit structure 20. The case 11 has a box shape, and can be formed of a metal such as aluminum or a synthetic resin, for example.

（回路構成体２０）
回路構成体２０は、複数の電子部品２１Ａ，２１Ｂが実装される回路基板２４と、回路基板２４の下に重ねられる放熱部材３０と、放熱部材３０の上面（回路基板２４側の面）に固着した状態で回路基板２４と放熱部材３０との間に挟まれた絶縁層４０とを備える。 (Circuit structure 20)
The circuit structure 20 is fixed to the circuit board 24 on which the plurality of electronic components 21A and 21B are mounted, the heat dissipation member 30 superimposed under the circuit board 24, and the upper surface (surface on the circuit board 24 side) of the heat dissipation member 30. In this state, the insulating layer 40 is sandwiched between the circuit board 24 and the heat dissipation member 30.

複数の電子部品２１Ａ，２１Ｂは、低発熱部品２１Ｂと、低発熱部品２１Ｂよりも発熱が大きい高発熱部品２１Ａとを有する。低発熱部品２１Ｂは、例えば、コンデンサ（アルミ電解コンデンサ等）からなる。高発熱部品２１Ａは、例えば、スイッチング素子（ＦＥＴ（Field Effect Transistor）等）、抵抗、コイル等からなる。各電子部品２１Ａ，２１Ｂは、本体２２と、本体２２から導出された複数のリード端子２３とを有する。なお、電子部品２１Ａ，２１Ｂは、上記以外の電子部品としてもよい。また、例えば、本体２２からリード端子２３が導出されるものに限られず、リード端子２３を有さないリードレス端子であってもよい。例えば、全ての端子が本体２２の面上に形成されていてもよい。   The plurality of electronic components 21A and 21B include a low heat generating component 21B and a high heat generating component 21A that generates more heat than the low heat generating component 21B. The low heat generating component 21B is made of, for example, a capacitor (such as an aluminum electrolytic capacitor). The high heat generating component 21A includes, for example, a switching element (FET (Field Effect Transistor) or the like), a resistor, a coil, or the like. Each electronic component 21 </ b> A, 21 </ b> B has a main body 22 and a plurality of lead terminals 23 led out from the main body 22. The electronic components 21A and 21B may be electronic components other than those described above. Further, for example, the lead terminal 23 is not limited to the lead terminal 23 derived from the main body 22, and a leadless terminal without the lead terminal 23 may be used. For example, all the terminals may be formed on the surface of the main body 22.

（回路基板２４）
回路基板２４は、例えば長方形状であって、絶縁基板２５とバスバー基板２６とを接着部材等（例えば、粘着テープ、接着シート、接着剤等）を用いて貼り合わせて構成されている。絶縁基板２５は、絶縁材料からなる厚みの薄い絶縁板に銅箔からなる導電路（図示しない）がプリント配線技術により形成されている。 (Circuit board 24)
The circuit board 24 has, for example, a rectangular shape, and is configured by bonding the insulating substrate 25 and the bus bar substrate 26 using an adhesive member or the like (for example, an adhesive tape, an adhesive sheet, an adhesive, or the like). In the insulating substrate 25, a conductive path (not shown) made of copper foil is formed on a thin insulating plate made of an insulating material by a printed wiring technique.

絶縁基板２５には、絶縁層４０にネジ５１でネジ留めするための円形状の複数の通し孔２５Ａが貫通形成されている。複数の通し孔２５Ａは、例えば、回路基板２４の周縁部寄り（電子部品２１Ａ，２１Ｂの外側）の位置（四隅の位置等）に形成されるが、これに限られず、他の位置に形成してもよい。   The insulating substrate 25 is formed with a plurality of circular through holes 25 </ b> A for screwing the insulating layer 40 with screws 51. The plurality of through holes 25A are formed, for example, at positions near the periphery of the circuit board 24 (outside the electronic components 21A and 21B) (positions at the four corners, etc.), but are not limited to this, and are formed at other positions. May be.

バスバー基板２６は、同一平面上に互いに間隔を空けて配置された複数のバスバー２７から構成され、銅や銅合金等の金属板材を導電路に応じた形状に打ち抜いて形成されている。バスバー基板２６には、ネジ留めのための円形状の複数の通し孔２７Ａが絶縁基板２５の通し孔２５Ａに連なる位置に貫通形成されている。複数のバスバー２７の端部には、外部の端子等と接続可能な端子２８が絶縁基板２５の周縁から外方に突出している。端子２８は、バスバー基板２６の面に面一に延びており、外部の電源側の電線の端末部の端子Ｔに接続される電源入力部２８Ａと、コネクタハウジング４８に導出されるコネクタ端子２８Ｂと、コイルの巻き線に接続される端子（図示しない）とを有する。   The bus bar substrate 26 includes a plurality of bus bars 27 arranged on the same plane and spaced from each other, and is formed by punching a metal plate material such as copper or copper alloy into a shape corresponding to a conductive path. A plurality of circular through holes 27 </ b> A for screwing are formed through the bus bar substrate 26 at positions that are continuous with the through holes 25 </ b> A of the insulating substrate 25. At end portions of the plurality of bus bars 27, terminals 28 that can be connected to external terminals or the like protrude outward from the peripheral edge of the insulating substrate 25. The terminal 28 extends flush with the surface of the bus bar substrate 26, and includes a power input portion 28 </ b> A connected to the terminal T of the terminal portion of the external power supply side electric wire, and a connector terminal 28 </ b> B led out to the connector housing 48. And a terminal (not shown) connected to the coil winding.

絶縁基板２５及び複数のバスバー２７における高発熱部品２１Ａと低発熱部品２１Ｂとの間には、断熱溝２９Ａ，２９Ｂがそれぞれ貫通形成されている。断熱溝２９Ａ，２９Ｂは、低発熱部品２１Ｂと高発熱部品２１Ａとを結ぶ方向と直交する方向に一定の長さで延びている。断熱溝２９Ａ，２９Ｂの長さ及び幅は、高発熱部品２１Ａから低発熱部品２１Ｂへの熱の伝達を抑制できる寸法が設定される。本実施形態では、断熱溝２９Ａ，２９Ｂの長さは、例えば、本体２２における断熱溝２９Ａ，２９Ｂに沿う方向の側面の長さよりも大きくすることで、本体２２の側面の全面からの熱の伝達を抑制することができる。高発熱部品２１Ａは、リード端子２３が絶縁基板２５の導電路に半田付けされるとともに、同じ電子部品２１Ａの本体２２の底面の端子（図示しない）がバスバー２７の上面に半田付けされている。低発熱部品２１Ｂは、底面の一対の端子（図示しない）がバスバー２７の上面に半田付けされて隣り合うバスバー２７間を接続している。   Heat insulation grooves 29A and 29B are formed through the insulating substrate 25 and the plurality of bus bars 27 between the high heat generating component 21A and the low heat generating component 21B, respectively. The heat insulating grooves 29A and 29B extend with a certain length in a direction orthogonal to the direction connecting the low heat generating component 21B and the high heat generating component 21A. The length and width of the heat insulating grooves 29A and 29B are set to dimensions that can suppress the transfer of heat from the high heat generating component 21A to the low heat generating component 21B. In the present embodiment, the length of the heat insulating grooves 29A and 29B is larger than the length of the side surface of the main body 22 in the direction along the heat insulating grooves 29A and 29B, for example, so that heat is transmitted from the entire side surface of the main body 22. Can be suppressed. In the high heat generating component 21 </ b> A, the lead terminal 23 is soldered to the conductive path of the insulating substrate 25, and the terminal (not shown) on the bottom surface of the main body 22 of the same electronic component 21 </ b> A is soldered to the upper surface of the bus bar 27. In the low heat generating component 21 </ b> B, a pair of terminals (not shown) on the bottom surface are soldered to the upper surface of the bus bar 27 to connect the adjacent bus bars 27.

（放熱部材３０）
放熱部材３０は、例えば、アルミダイカスト等で成形されるアルミニウム、アルミニウム合金等の熱伝導性が高い金属類製であって、図３に示すように、下面側に複数の放熱フィン３２が櫛刃状に並んで配された本体部３１と、本体部３１の左右の両側に形成され、上面側が窪んだ窪み部３３とを有する。 (Heat dissipation member 30)
The heat dissipating member 30 is made of a metal having high thermal conductivity such as aluminum or aluminum alloy formed by aluminum die casting or the like, and as shown in FIG. The main body 31 is arranged side by side, and the hollow 33 is formed on both the left and right sides of the main body 31 and the upper surface is recessed.

放熱部材３０の上面（本体部３１の上面３１Ａ及び窪み部３３の上面３３Ａ）は、図２に示すように、全面に亘って多数の凹凸によって粗く形成された粗面３６とされている。粗面３６は、例えば、突出寸法（高さ）が２〜４μｍのオーバーハング状の凹凸であって、基端側より先端側が太径の先太り状に形成された凸を含んで構成されている。   As shown in FIG. 2, the upper surface of the heat dissipation member 30 (the upper surface 31 </ b> A of the main body 31 and the upper surface 33 </ b> A of the recessed portion 33) is a rough surface 36 that is roughly formed by a large number of irregularities over the entire surface. The rough surface 36 is, for example, an overhang-shaped unevenness having a protruding dimension (height) of 2 to 4 μm, and includes a protrusion that is formed in a tapered shape with a larger diameter on the distal end side than the proximal end side. Yes.

この粗面３６は、例えば、レーザー処理、化学処理、サンドブラスト等で行われる。レーザー処理としては、例えば、ＹＡＧレーザー等の固定レーザーや、炭酸ガスレーザ等のガスレーザや、半導体レーザー等とすることができる。化学処理は、例えば、塩酸、硝酸、フッ酸等によるエッチングで行うことができる。なお、粗面の形成方法は、上記に限られず、他の公知の方法を用いるようにしてもよい。   The rough surface 36 is performed by, for example, laser processing, chemical processing, sand blasting, or the like. As the laser treatment, for example, a fixed laser such as a YAG laser, a gas laser such as a carbon dioxide gas laser, or a semiconductor laser can be used. The chemical treatment can be performed by etching with hydrochloric acid, nitric acid, hydrofluoric acid, or the like, for example. The method for forming the rough surface is not limited to the above, and other known methods may be used.

窪み部３３は、上面側が本体部３１から段差状に窪んで形成されている。窪み部３３には、図５に示すように、巻き線とコアとを有するコイルのコアを嵌め込む嵌込凹部３３Ｂが形成されている。窪み部３３の上の絶縁層４０には、後述する留め部４４Ａ，４４Ｂやコネクタハウジング４８が配される。   The recess 33 is formed such that the upper surface side is recessed from the main body 31 in a stepped shape. As shown in FIG. 5, the recess 33 B is formed with an insertion recess 33 B into which a core of a coil having a winding and a core is fitted. Fastening portions 44A and 44B and a connector housing 48, which will be described later, are disposed on the insulating layer 40 above the recess portion 33.

（絶縁層４０）
絶縁層４０は、粘土状又は液状の接着剤等の樹脂が硬化することで形成され、熱伝導性が高く、絶縁性を有する材料が用いられる。例えば常温で硬化するエポキシ系の接着剤を用いることができる。なお、絶縁層は、これに限られず、種々の材料を用いることができ、例えば、熱硬化性樹脂、熱可塑性樹脂等を用いてもよい。 (Insulating layer 40)
The insulating layer 40 is formed by curing a resin such as a clay-like or liquid adhesive, and a material having a high thermal conductivity and an insulating property is used. For example, an epoxy adhesive that cures at room temperature can be used. Note that the insulating layer is not limited to this, and various materials can be used. For example, a thermosetting resin, a thermoplastic resin, or the like may be used.

絶縁層４０は、放熱部材３０の粗面３６上に密着して形成されており、本体部３１の上にほぼ一定の厚みで形成された主絶縁部４１と、端子２８側に形成された留め部４４Ａ，４４Ｂ及びコネクタハウジング４８とを備える。主絶縁部４１には、回路基板２４が積層されるとともに、高発熱部品２１Ａと低発熱部品２１Ｂとの間の位置には、断熱溝４２が凹み形成されている。断熱溝４２は、断熱溝２９Ａ，２９Ｂの下に連なる位置に断熱溝２９Ａ，２９Ｂとほぼ同じ長さで形成されている。   The insulating layer 40 is formed in close contact with the rough surface 36 of the heat radiating member 30, the main insulating portion 41 formed with a substantially constant thickness on the main body portion 31, and the fastening formed on the terminal 28 side. Parts 44A, 44B and a connector housing 48 are provided. The circuit board 24 is laminated on the main insulating portion 41, and a heat insulating groove 42 is formed in a recessed position at a position between the high heat generating component 21A and the low heat generating component 21B. The heat insulating groove 42 is formed at a position that is continuous with the heat insulating grooves 29A and 29B and has substantially the same length as the heat insulating grooves 29A and 29B.

絶縁層４０には、図８に示すように、ネジ５１でネジ留めされる複数の留め孔４３が通し孔２５Ａ，２７Ａの下に連なる位置に形成されている。留め孔４３は、ネジ留めの前には形成されておらず、ネジ留めの際にネジ５１の先端部で穿設により形成されるようになっているが、これに限られず、ネジ溝を形成しておき、ネジ５１の軸部をネジ山に螺合させてネジ留めするようにしてもよい。なお、ネジ５１は、回路基板２４と絶縁層４０をネジ留めするものであり、回路基板２４と放熱部材３０とはネジ留めしない。   In the insulating layer 40, as shown in FIG. 8, a plurality of retaining holes 43 that are screwed with screws 51 are formed at positions that continue below the through holes 25A and 27A. The fastening hole 43 is not formed before screwing, and is formed by drilling at the tip of the screw 51 when screwing, but is not limited thereto, and a screw groove is formed. In addition, the shaft portion of the screw 51 may be screwed into the screw thread and screwed. The screw 51 is used to screw the circuit board 24 and the insulating layer 40, and the circuit board 24 and the heat dissipation member 30 are not screwed.

留め部４４Ａ，４４Ｂは、回路基板２４の端子２８をネジ留めするためのものであり、端子２８とコイルの巻き線の端末部をネジ留めする留め部４４Ａと、外部の電線の端末部に接続された端子と接続する留め部４４Ｂとを有する。留め部４４Ａ，４４Ｂは、絶縁層４０の上面に形成されたナット４７が圧入される凹部であり、ナット４７の回転が規制されるとともに、ネジ５２（ボルト）の軸部の先端を逃げる形状とされている。   The fastening portions 44A and 44B are for fastening the terminal 28 of the circuit board 24 with screws, and are connected to the fastening portion 44A for fastening the terminal 28 and the terminal portion of the coil winding with the terminal portion of the external electric wire. And a fastening portion 44B connected to the terminal. The fastening portions 44A and 44B are concave portions into which the nut 47 formed on the upper surface of the insulating layer 40 is press-fitted, and the shape of the nut 47 is restricted from rotating and the tip of the shaft portion of the screw 52 (bolt) escapes. Has been.

留め部４４Ａに収容されたナット４７の上には、回路基板２４の端子である電源入力部２８Ａが配され、ネジ５２の軸部が端子２８の貫通孔に挿通されてナット４７にネジ留めされることで、電源入力部２８Ａが固定される。コネクタハウジング４８は、フード状のフード部４８Ａと、フード部を閉鎖する奥壁４８Ｂとを有する。奥壁４８Ｂには、コネクタ端子２８Ｂが挿通される端子挿通孔４９が貫通形成されている。   On the nut 47 accommodated in the fastening portion 44A, a power input portion 28A that is a terminal of the circuit board 24 is disposed, and the shaft portion of the screw 52 is inserted into the through hole of the terminal 28 and screwed to the nut 47. Thus, the power input unit 28A is fixed. The connector housing 48 includes a hood-shaped hood portion 48A and a back wall 48B that closes the hood portion. A terminal insertion hole 49 through which the connector terminal 28B is inserted is formed through the back wall 48B.

回路構成体２０の製造方法について説明する。
（粗面化工程）
放熱部材３０の上面３１Ａ，３３Ａにレーザー処理又は化学処理等を行って、放熱部材３０の上面３１Ａ，３３Ａに粗面３６を形成する（図３）。
（絶縁層形成工程）
次に、図４に示すように、樹脂成形金型５５，５６を装着して、放熱部材３０と樹脂成形金型５５，５６との間に樹脂を注入する。樹脂が固化して絶縁層４０が形成されると、樹脂成形金型５５，５６を取り外す。これにより、放熱部材３０の上に絶縁層４０が固着した状態となる（図６）。 A method for manufacturing the circuit structure 20 will be described.
(Roughening process)
Laser treatment or chemical treatment is performed on the upper surfaces 31A and 33A of the heat radiating member 30 to form rough surfaces 36 on the upper surfaces 31A and 33A of the heat radiating member 30 (FIG. 3).
(Insulating layer forming process)
Next, as shown in FIG. 4, resin molding dies 55 and 56 are mounted, and resin is injected between the heat dissipation member 30 and the resin molding dies 55 and 56. When the resin is solidified and the insulating layer 40 is formed, the resin molding dies 55 and 56 are removed. Thereby, the insulating layer 40 is fixed on the heat dissipation member 30 (FIG. 6).

（基板形成工程）
金属板材を打ち抜いてバスバー基板２６を形成し、絶縁基板２５とバスバー基板２６とを接着部材で貼り合わせて回路基板２４を形成する。また、回路基板２４の導電路と電子部品２１Ａ，２１Ｂのリード端子２３とを例えばリフロー半田付けして回路基板２４に電子部品２１Ａ，２１Ｂを実装する（図７）。 (Substrate formation process)
The metal plate material is punched to form the bus bar substrate 26, and the circuit board 24 is formed by bonding the insulating substrate 25 and the bus bar substrate 26 together with an adhesive member. Further, the conductive paths of the circuit board 24 and the lead terminals 23 of the electronic components 21A and 21B are, for example, reflow soldered to mount the electronic components 21A and 21B on the circuit board 24 (FIG. 7).

（基板組付工程）
次に、放熱部材３０の上面３１Ａ，３３Ａにおける高発熱部品２１Ａの領域を含む位置に放熱グリス５０を塗布し、回路基板２４のコネクタ端子２８を端子挿通孔４９に横から通して回路基板２４をスライドさせて絶縁層４０の上に配する。そして、ネジ５１を通し孔２５Ａ，２７Ａに通して留め孔４３にネジ留めすることで回路基板２４と放熱部材３０の間に絶縁層４０が挟まれた状態となる。また、図示しないコイルを嵌込凹部３３Ｂに嵌め込み、コイルの巻き線の端部を端子２８にネジ留めする。これにより、回路構成体２０が形成される（図８）。 (Board assembly process)
Next, the heat radiation grease 50 is applied to the positions including the region of the high heat generating component 21A on the upper surfaces 31A and 33A of the heat radiation member 30, and the connector terminals 28 of the circuit board 24 are passed through the terminal insertion holes 49 from the side so Slide on the insulating layer 40. Then, the insulating layer 40 is sandwiched between the circuit board 24 and the heat radiating member 30 by passing the screws 51 through the holes 25 </ b> A and 27 </ b> A and screwing into the retaining holes 43. Further, a coil (not shown) is fitted into the fitting recess 33 </ b> B, and the end of the coil winding is screwed to the terminal 28. Thereby, the circuit structure 20 is formed (FIG. 8).

回路構成体２０の上にケース１１を被せて図示しないネジでケース１１を放熱部材３０にネジ留めすることで電気接続箱１０が形成される（図１）。電気接続箱１０は、車両の電源から負荷に至る経路に配される。   The case 11 is put on the circuit structure 20, and the case 11 is screwed to the heat dissipation member 30 with screws (not shown) to form the electrical junction box 10 (FIG. 1). The electric junction box 10 is arranged on a route from the power source of the vehicle to the load.

上記実施形態によれば、以下の作用、効果を奏する。
本実施形態によれば、放熱部材３０の粗面３６上で絶縁層４０が固化することにより絶縁層４０が、粗面３６の凹凸に入り込んで放熱部材３０の上に固着する。この絶縁層４０の上に回路基板２４が重ねられて固定されるため、回路基板２４と放熱部材３０との間を絶縁層４０を介して固定することができる。これにより、接着剤を用いなくても回路基板２４と放熱部材３０との間を固定することが可能になるため、接着剤で接着する場合のように、回路基板２４と放熱部材３０との間に接着剤の接着が不十分な箇所が生じることによる放熱性の低下を抑制することができる。 According to the said embodiment, there exist the following effects | actions and effects.
According to the present embodiment, the insulating layer 40 solidifies on the rough surface 36 of the heat radiating member 30, so that the insulating layer 40 enters the irregularities of the rough surface 36 and is fixed on the heat radiating member 30. Since the circuit board 24 is overlaid and fixed on the insulating layer 40, the space between the circuit board 24 and the heat dissipation member 30 can be fixed via the insulating layer 40. Accordingly, since it is possible to fix the circuit board 24 and the heat dissipation member 30 without using an adhesive, between the circuit board 24 and the heat dissipation member 30 as in the case of bonding with an adhesive. Therefore, it is possible to suppress a decrease in heat dissipation due to the occurrence of an insufficiently bonded adhesive.

また、粗面３６は、化学処理又はレーザー処理によって形成されている。
このようにすれば、絶縁層４０を固着できる程度の凹凸を有する粗面３６を形成することが可能になる。 The rough surface 36 is formed by chemical treatment or laser treatment.
In this way, it is possible to form the rough surface 36 having unevenness enough to fix the insulating layer 40.

また、回路基板２４は、絶縁層４０にネジ５１，５２でネジ留めされている。
回路基板２４を放熱部材３０に直接ネジ留めする場合と比較してネジ５１，５２を小型化できるとともに、ネジ留めの際に回路基板２４に生じる応力を小さくすることができるため、ネジ留め時の応力が半田付けした箇所に及ぶことによる半田付け不良を抑制することができる。 The circuit board 24 is screwed to the insulating layer 40 with screws 51 and 52.
Compared with the case where the circuit board 24 is directly screwed to the heat radiating member 30, the screws 51 and 52 can be reduced in size, and the stress generated in the circuit board 24 during screwing can be reduced. It is possible to suppress soldering failure due to the stress reaching the soldered portion.

また、絶縁層４０には、回路基板２４の端子２８をネジ留めするための留め部４４Ａ，４４Ｂが形成されている。
このようにすれば、絶縁性が必要な留め部４４Ａ，４４Ｂを絶縁層４０に形成することで、留め部４４Ａ，４４Ｂを別体で形成する場合と比較して、部品点数を削減することができる。 The insulating layer 40 is formed with fastening portions 44A and 44B for fastening the terminals 28 of the circuit board 24 with screws.
In this way, the number of parts can be reduced by forming the fastening portions 44A and 44B that require insulation in the insulating layer 40 as compared with the case where the fastening portions 44A and 44B are formed separately. it can.

また、絶縁層４０には、回路基板２４のコネクタ端子２８Ｂ（端子）が収容されるコネクタハウジング４８が形成されている。
このようにすれば、絶縁性が必要なコネクタハウジング４８を絶縁層４０に形成することで、コネクタハウジング４８を別体で形成する場合と比較して、部品点数を削減することができる。 The insulating layer 40 is formed with a connector housing 48 in which the connector terminals 28B (terminals) of the circuit board 24 are accommodated.
In this case, the number of parts can be reduced by forming the connector housing 48 that requires insulation in the insulating layer 40 as compared with the case where the connector housing 48 is formed separately.

また、回路基板２４には、複数の低発熱部品２１Ｂと複数の低発熱部品２１Ｂよりも発熱する複数の高発熱部品２１Ａとからなる複数の電子部品が実装され、回路基板２４及び絶縁層４０には、複数の低発熱部品２１Ｂと複数の高発熱部品２１Ａとの間に、回路基板２４及び絶縁層４０を貫通する断熱溝２９Ａ，２９Ｂ，７５が形成されている。
このようにすれば、断熱溝２９Ａ，２９Ｂ，７５により、高発熱部品２１Ａの熱が回路基板２４や絶縁層４０を介して低発熱部品２１Ｂ側に伝達されることを抑制することができる。 A plurality of electronic components including a plurality of low heat generation components 21B and a plurality of high heat generation components 21A that generate heat more than the plurality of low heat generation components 21B are mounted on the circuit board 24. Are formed with heat insulating grooves 29A, 29B, 75 penetrating the circuit board 24 and the insulating layer 40 between the plurality of low heat generating components 21B and the plurality of high heat generating components 21A.
In this way, the heat insulating grooves 29A, 29B, and 75 can suppress the heat of the high heat generating component 21A from being transmitted to the low heat generating component 21B via the circuit board 24 and the insulating layer 40.

また、回路基板２４と絶縁層４０との間における複数の高発熱部品２１Ａの少なくとも１つが重なる領域には放熱グリス５０が配されている。
このようにすれば、放熱グリス５０により、回路基板２４と絶縁層４０との間の熱伝導性を高めることができるため、高発熱部品２１Ａの熱を効率的に放熱部材３０に伝えることができる。 In addition, heat radiation grease 50 is disposed in a region where at least one of the plurality of high heat generating components 21A overlaps between the circuit board 24 and the insulating layer 40.
In this manner, the heat dissipation grease 50 can increase the thermal conductivity between the circuit board 24 and the insulating layer 40, so that the heat of the high heat generating component 21 </ b> A can be efficiently transmitted to the heat dissipation member 30. .

＜実施形態２＞
実施形態２を図９ないし図１２を参照して説明する。実施形態２の電気接続箱６０及び回路構成体６１は、回路基板２４の高発熱部品２１Ａ側に放熱部材６３を配し、低発熱部品２１Ｂ側に放熱部材を配さないものである。実施形態１と同一の構成については同一の符号を付して説明を省略する。
図９に示すように、回路基板２４とケース１１は、実施形態１と同一である。なお、ケース１１を金属とする場合には、絶縁層７０の底面側における放熱部材のない領域を金属で覆ってシールド性を生じさせるようにしてもよい。 <Embodiment 2>
A second embodiment will be described with reference to FIGS. The electrical junction box 60 and the circuit configuration body 61 according to the second embodiment are configured such that the heat dissipation member 63 is disposed on the high heat generating component 21A side of the circuit board 24 and the heat dissipating member is not disposed on the low heat generating component 21B side. The same components as those of the first embodiment are denoted by the same reference numerals and description thereof is omitted.
As shown in FIG. 9, the circuit board 24 and the case 11 are the same as those in the first embodiment. When the case 11 is made of metal, the region without the heat radiating member on the bottom surface side of the insulating layer 70 may be covered with metal to produce a shielding property.

放熱部材６３は、アルミニウム、アルミニウム合金等の熱伝導性が高い金属類製であって、アルミダイカスト等で成形され、平坦な上面を有し、下面側に櫛刃状に並んで配された複数の放熱フィン６５を有している。放熱部材６３は、回路基板２４における高発熱部品２１Ａ側の領域に重ねられる大きさであり、図９の左右方向における放熱部材６３の長さが実施形態１の放熱部材３０の約半分とされている。放熱部材６３の上面は、実施形態１と同様に全面に亘って多数の凹凸によって粗く形成された粗面３６とされている。   The heat radiating member 63 is made of a metal having high thermal conductivity such as aluminum or aluminum alloy, and is formed by aluminum die casting or the like, has a flat upper surface, and is arranged in a comb blade shape on the lower surface side. The heat radiation fin 65 is provided. The heat dissipating member 63 is sized to overlap the region of the circuit board 24 on the high heat generating component 21A side, and the length of the heat dissipating member 63 in the left-right direction in FIG. 9 is about half that of the heat dissipating member 30 of the first embodiment. Yes. The upper surface of the heat dissipating member 63 is a rough surface 36 that is roughly formed by a large number of irregularities over the entire surface as in the first embodiment.

絶縁層７０は、粘土状又は液状の樹脂が硬化することで形成され、放熱部材６３の粗面３６上にほぼ一定の厚みで形成される板状の主絶縁部７１と、主絶縁部７１よりも厚く形成された厚肉部７２と、厚肉部７２に形成された留め部４４Ａ，４４Ｂ及びコネクタハウジング４８とを備える。主絶縁部７１における高発熱部品２１Ａと低発熱部品２１Ｂとの間には、上面側に断熱溝７５が凹設されている。断熱溝７５は、断熱溝２９Ａ，２９Ｂの下に連なる位置に形成されている。   The insulating layer 70 is formed by curing a clay-like or liquid resin, and includes a plate-like main insulating portion 71 formed on the rough surface 36 of the heat radiating member 63 with a substantially constant thickness, and the main insulating portion 71. A thick portion 72 formed thick, and fastening portions 44A and 44B and a connector housing 48 formed in the thick portion 72. Between the high heat generating component 21A and the low heat generating component 21B in the main insulating portion 71, a heat insulating groove 75 is recessed on the upper surface side. The heat insulating groove 75 is formed at a position continuous below the heat insulating grooves 29A and 29B.

絶縁層７０の形成は、放熱部材６３の上面にレーザー処理又は化学処理等を行って、粗面３６を形成し、図１０に示すように、樹脂成形金型８０〜８２の内側に放熱部材６３を保持して、樹脂成形金型８０〜８２の内部に樹脂を注入する。樹脂が固化して絶縁層７０が形成されると、樹脂成形金型８０〜８２を取り外す。これにより、放熱部材６３の上に絶縁層７０が固着した状態となる（図１１）。   The insulating layer 70 is formed by performing laser treatment or chemical treatment on the upper surface of the heat dissipating member 63 to form the rough surface 36, and as shown in FIG. The resin is injected into the resin molding dies 80 to 82. When the resin is solidified and the insulating layer 70 is formed, the resin molding dies 80 to 82 are removed. As a result, the insulating layer 70 is fixed on the heat dissipation member 63 (FIG. 11).

実施形態２によれば、放熱部材６３は、複数の高発熱部品２１Ａが実装される領域に形成され、複数の低発熱部品２１Ｂが実装される領域には重ねられていないため、放熱部材６３が小さくなって回路構成体６１の構成を簡素化できるとともに、高発熱部品２１Ａ側の発熱が大きい領域の熱は、放熱部材６３から放熱することができる。   According to the second embodiment, the heat radiating member 63 is formed in the region where the plurality of high heat generating components 21A are mounted, and is not overlaid on the region where the plurality of low heat generating components 21B are mounted. The circuit structure 61 can be reduced in size and the configuration of the circuit component 61 can be simplified, and heat in a region where heat generation on the high heat generating component 21 </ b> A side is large can be radiated from the heat radiating member 63.

＜他の実施形態＞
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
（１）粗面３６は、絶縁層４０，７０が形成される領域の全体に形成されていたが、これに限られず、絶縁層４０，７０が形成される領域の一部に粗面３６が形成されていてもよい。 <Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) The rough surface 36 is formed in the entire region where the insulating layers 40 and 70 are formed. However, the present invention is not limited to this, and the rough surface 36 is formed in a part of the region where the insulating layers 40 and 70 are formed. It may be formed.

（２）粗面３６は、絶縁層４０，７０を固着できる程度の多数の凹凸が形成されるのであれば、種々の形状が可能であり、粗面の形成方法についても上記実施形態の方法に限られない。 (2) The rough surface 36 can have various shapes as long as a large number of irregularities that can fix the insulating layers 40 and 70 are formed, and the rough surface forming method is the same as that of the above embodiment. Not limited.

（３）電子部品２１Ａの領域の全体に放熱グリス５０が配される構成としたが、これに限られず、例えば、電子部品２１Ａの少なくとも一部の領域に放熱グリス５０が配されるようにしてもよい。 (3) Although the heat dissipation grease 50 is arranged in the entire area of the electronic component 21A, the present invention is not limited to this. For example, the heat dissipation grease 50 is arranged in at least a part of the area of the electronic component 21A. Also good.

１０，６０： 電気接続箱
１１： ケース
２０，６１： 回路構成体
２１Ａ： 高発熱部品（電子部品）
２１Ｂ： 低発熱部品（電子部品）
２４： 回路基板
２５： 絶縁基板
２７： バスバー基板
２８：端子
２８Ａ： 電源入力部
２８Ｂ： コネクタ端子
２９Ａ，２９Ｂ，４２，７５： 断熱溝
３０，６３： 放熱部材
３６： 粗面
４０，７０： 絶縁層
４１： 板状部
４４Ａ，４４Ｂ： 留め部（被固定部）
４８： コネクタハウジング
５０： 放熱グリス
５１，５２： ネジ（固定部材） 10, 60: Electrical connection box 11: Case 20, 61: Circuit component 21A: High heat generation component (electronic component)
21B: Low heat generation parts (electronic parts)
24: Circuit board 25: Insulating board 27: Bus bar board 28: Terminal 28A: Power supply input part 28B: Connector terminals 29A, 29B, 42, 75: Heat insulating grooves 30, 63: Heat radiation member 36: Rough surface 40, 70: Insulating layer 41: Plate-like parts 44A, 44B: Fastening part (fixed part)
48: Connector housing 50: Radiation grease 51, 52: Screw (fixing member)

Claims (9)

導電路を有する回路基板と、
前記回路基板が重ねられ、前記回路基板側の面が粗く形成された粗面を有する放熱部材と、
前記粗面上で固化して形成される絶縁層と、を備え、
前記回路基板は、前記絶縁層に重ねられて固定される回路構成体。 A circuit board having a conductive path;
The heat dissipating member having a rough surface on which the circuit board is stacked and the surface on the circuit board side is formed rough,
An insulating layer formed by solidifying on the rough surface,
The circuit board is a circuit structure that is fixed by being overlaid on the insulating layer. 前記粗面は、化学処理又はレーザー処理によって形成されている請求項１に記載の回路構成体。 The circuit structure according to claim 1, wherein the rough surface is formed by chemical treatment or laser treatment. 前記回路基板は、前記絶縁層に固定部材で留められている請求項１又は請求項２に記載の回路構成体。 The circuit structure according to claim 1, wherein the circuit board is fixed to the insulating layer with a fixing member. 前記絶縁層には、前記回路基板の端子を前記固定部材で固定するための被固定部が形成されている請求項３に記載の回路構成体。 The circuit structure according to claim 3, wherein a fixed portion for fixing a terminal of the circuit board with the fixing member is formed in the insulating layer. 前記絶縁層には、前記回路基板の端子が収容されるコネクタハウジングが形成されている請求項１から請求項４のいずれか一項に記載の回路構成体。 5. The circuit structure according to claim 1, wherein a connector housing that accommodates a terminal of the circuit board is formed in the insulating layer. 6. 前記回路基板には、複数の低発熱部品と前記複数の低発熱部品よりも発熱する複数の高発熱部品とからなる電子部品が実装され、
前記回路基板及び前記絶縁層には、前記複数の低発熱部品と前記複数の高発熱部品との間に、前記回路基板及び前記絶縁層を貫通する断熱溝が形成されている請求項１から請求項５のいずれか一項に記載の回路構成体。 The circuit board is mounted with electronic components composed of a plurality of low heat generation components and a plurality of high heat generation components that generate heat more than the plurality of low heat generation components,
The heat insulation groove which penetrates the circuit board and the insulating layer is formed in the circuit board and the insulating layer between the plurality of low heat generation components and the plurality of high heat generation components. Item 6. The circuit structure according to any one of Items 5 to 6. 前記回路基板と前記絶縁層との間における前記複数の高発熱部品の少なくとも１つが重なる領域には放熱グリスが配されている請求項６に記載の回路構成体。 The circuit structure according to claim 6, wherein heat dissipating grease is disposed in a region where at least one of the plurality of high heat generating components overlaps between the circuit board and the insulating layer. 前記放熱部材は、前記複数の高発熱部品が実装される領域に形成され、前記複数の低発熱部品が実装される領域には重ねられていない請求項６又は請求項７に記載の回路構成体。 The circuit structure according to claim 6 or 7, wherein the heat dissipating member is formed in a region where the plurality of high heat generating components are mounted and is not overlapped with a region where the plurality of low heat generating components are mounted. . 請求項１から請求項８のいずれか一項に記載の回路構成体と、前記回路構成体を収容するケースとを備えた電気接続箱。 An electrical junction box comprising: the circuit structure according to any one of claims 1 to 8; and a case that accommodates the circuit structure.
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