JP2016195192A - Printed circuit board and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To securely fix a heat radiation member to a base material of a printed circuit board.SOLUTION: A printed circuit board 10 includes: a base material 11 which is formed into a plate shape by glass fibers being a reinforcement material and epoxy being a thermosetting resin; wiring patterns 5a to 5h provided on the base material 11; a recessed part 11k provided on a lower plate surface of the base material 11; and a metal core 3 which fits in the recessed part 11k. In a state where the metal core 3 is fitted in the recessed part 11k, contact parts 2t', at which an inner peripheral surface of the recessed part 11k and an outer peripheral surface of the metal core 3 contact with each other, and separation parts 2s, at which the inner peripheral surface of the recessed part 11k and the outer peripheral surface of the metal core 3 does not contact with each other, are formed. The epoxy of the base material 11, which is melted by heating to fill the separation parts 2s, is cured to integrate the base material 11 with the metal core 3.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a structure in which heat generated by an electronic component mounted on a printed circuit board is radiated by a heat radiating member embedded in the printed circuit board.

  In order to dissipate heat generated by electronic components mounted on a printed circuit board, various techniques for embedding a heat dissipation member in the printed circuit board have been proposed.

  For example, in Patent Document 1, an opening (through hole) is provided at a position where an electronic component on a printed circuit board is mounted, and a heat radiating member (via conductor) having a smaller area than the opening is fitted into the opening. A plurality of grooves are formed at predetermined intervals in the circumferential direction on the inner peripheral surface of the opening, and a plurality of protrusions that engage with the grooves are formed on the outer peripheral surface of the heat dissipation member. Further, a gap formed by fitting the heat dissipation member into the opening is filled with a filler made of an adhesive resin, and the heat dissipation member is fixed to the printed board.

  In Patent Document 2, a hole (through hole) is provided at a position where an electronic component of a printed circuit board is mounted, and a heat dissipation member (metal piece) is inserted into the hole, and the heat dissipation member is deformed by pressurization. The heat radiating member is fixed to the printed circuit board, and the printed circuit board and the heat radiating member have the same height. Moreover, the uneven | corrugated | grooved part is provided in the internal peripheral surface of the hole, the vertex of a convex part is made to contact with a heat radiating member, and the gap | clearance between a hole and a heat radiating member is filled up with the solder.

  On the other hand, in a multilayer printed circuit board, for example, as disclosed in Patent Document 3, a prepreg is sandwiched between a plurality of double-sided wiring boards and heated and pressurized, so that a thermosetting resin contained in the prepreg is obtained. After melting, the thermosetting resin is then cured to integrate the plurality of double-sided wiring boards and the prepreg.

JP 2010-258260 A JP 2010-205995 A JP 2003-17862 A

  As in the past, by inserting a heat dissipation member into the through hole of the printed circuit board and filling an adhesive or solder in the gap between the through hole and the heat dissipation member, heating when soldering the electronic component to the printed circuit board, Due to thermal disturbance such as heat generation when the mounted electronic component is energized, the adhesive or solder may melt and the heat dissipation member may come out of the through hole.

  The subject of this invention is fixing a heat radiating member firmly in the base material of a printed circuit board.

  The printed circuit board according to the present invention includes a base material formed of a reinforcing material and a thermosetting resin and formed in a plate shape, a wiring pattern provided on the base material, a recess provided on the plate surface of the base material, And a heat dissipating member fitted into the recess. Then, in a state where the heat dissipation member is fitted in the recess, a contact portion where the inner peripheral surface of the recess and the outer peripheral surface of the heat dissipation member are in contact with each other and a separation portion that is not in contact with each other are formed. The thermosetting resin of the filled substrate is cured, and the substrate and the heat dissipation member are integrated.

  According to the present invention, in a state where the heat dissipation member is fitted in the recess provided in the base material of the printed circuit board, the contact portion that is in contact with each other and the space that is not in contact with each other between the inner peripheral surface of the recess and the outer peripheral surface of the heat dissipation member. Part is formed. And by heating, the thermosetting resin of a base material melt | dissolves and it fills in a spacing part, and a base material and a thermal radiation member are integrated by hardening a thermosetting resin after that. For this reason, for example, even when a thermal disturbance such as heating when soldering an electronic component to a printed circuit board or heat generation when the mounted electronic component is energized acts between the base material and the heat dissipation member A certain thermosetting resin does not melt, and the heat radiating member does not come out of the recess. Therefore, the heat radiating member can be firmly fixed in the base material of the printed circuit board.

  In the present invention, in the printed circuit board, it is preferable that a plurality of contact portions and separation portions are alternately formed at predetermined intervals in the circumferential direction of the recess and the heat dissipation member.

  Further, in the present invention, in the printed circuit board, the contact portion may be configured by a convex portion formed on the inner peripheral surface of the concave portion, and the separation portion may be configured by a portion other than the convex portion on the inner peripheral surface of the concave portion. Good.

  According to the present invention, in the printed circuit board, the base material is provided on the first insulating layer having a wiring pattern on the upper surface and on the lower surface of the first insulating layer, and has a lower thermal conductivity than the first insulating layer. The second insulating layer may be provided with a recess and a heat dissipation member so as to reach the lower surface of the first insulating layer from the lower surface of the second insulating layer.

  An electronic device according to the present invention includes the printed board and an electronic component mounted on the printed board.

  In the present invention, in the electronic device, the concave portion is provided so as to be recessed in the thickness direction from the lower surface of the printed circuit board, and the heat dissipation member is exposed from the lower surface of the printed circuit board and is in contact with the exposed surface of the heat dissipation member. You may further provide the external heat radiator provided in the downward direction.

  According to the present invention, the heat dissipation member can be firmly fixed in the base material of the printed board.

It is the figure which showed the upper surface layer of the printed circuit board by embodiment of this invention. It is the figure which showed the AA cross section of FIG. It is the figure which showed the inner layer of the printed circuit board of FIG. It is the figure which showed the lower surface layer of the printed circuit board of FIG. It is the figure which showed the BB cross section of FIG. It is the figure which showed CC cross section of FIG. It is the figure which showed the recessed part and metal core which were provided in the printed circuit board of FIG. It is the figure which showed the manufacturing process of the printed circuit board of FIG. It is the figure which showed the continuation of the manufacturing process of FIG. 8A. It is the figure which showed other embodiment of this invention. It is the figure which showed other embodiment of this invention. It is the figure which showed other embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each drawing, the same reference numerals are given to the same parts and corresponding parts.

  First, the structure of the printed circuit board 10 and the electronic device 100 according to the embodiment will be described with reference to FIGS.

  FIG. 1 is a view showing the upper surface layer L1 on the upper surface of the printed circuit board 10. FIG. 2 is a diagram showing a cross section taken along the line AA of FIG. FIG. 3 is a view showing the inner layers L2, L3, and L4 inside the printed circuit board 10. As shown in FIG. FIG. 4 is a view showing the lower surface layer L5 on the lower surface of the printed circuit board 10. FIG. 5 is a view showing a BB cross section of FIG. 1. 6 is a cross-sectional view taken along the line CC in FIG. FIG. 7 is a view showing the recess 11 k and the metal core 3 provided in the printed circuit board 10.

  1 and 3 show the state viewed from above the printed circuit board 10, and FIGS. 4 and 7 show the state viewed from below the printed circuit board 10. In each figure, only a part of the printed circuit board 10 and the electronic device 100 is shown for convenience.

  The electronic device 100 includes a DC-DC converter mounted on, for example, an electric vehicle or a hybrid car. The electronic device 100 includes a printed circuit board 10, electronic components 9 a to 9 j, and a heat sink 4.

  As shown in FIG. 2, the printed circuit board 10 is a multilayer board in which surface layers L1 and L5 are provided on the upper surface and the lower surface, respectively, and a plurality of inner layers L2, L3, and L4 are provided therein. As shown in FIGS. 1-4, the printed circuit board 10 is equipped with the base material 11, the metal core 3, the wiring patterns 5a-5w, the through holes 6a-6e, etc.

  The base material 11 is composed of a first insulating layer 1 and a second insulating layer 2. The first insulating layer 1 is composed of a highly thermally conductive prepreg. The high thermal conductivity prepreg is, for example, a prepreg having high thermal conductivity and insulation produced by mixing alumina into epoxy. Alumina is a reinforcing material, and epoxy is a thermosetting resin.

  The first insulating layer 1 is formed in a flat plate shape having a predetermined thickness (about 100 μm). An upper surface layer L1 is provided on the upper surface of the first insulating layer 1 exposed to the outside. As shown in FIG. 1, electronic components 9a to 9g and wiring patterns 5a to 5i are provided on the upper surface layer L1.

  The wiring patterns 5a to 5i are made of copper foil having conductivity and thermal conductivity. A part of the wiring patterns 5a to 5i functions as a land for soldering the electronic components 9a to 9g. The electronic components 9a to 9g include FETs (field effect transistors) 9a and 9b, discrete components 9c, and chip capacitors 9d to 9g.

  The FETs 9a and 9b are surface-mounting electronic components that generate a large amount of heat. The source terminal s1 of the FET 9a is soldered on the wiring pattern 5a. The gate terminal g1 of the FET 9a is soldered on the wiring pattern 5b. The drain terminal d1 of the FET 9a is soldered on the wiring pattern 5c. The source terminal s2 of the FET 9b is soldered on the wiring pattern 5c. The gate terminal g2 of the FET 9b is soldered onto the wiring pattern 5d. The drain terminal d2 of the FET 9b is soldered to the wiring pattern 5e.

  As illustrated in FIG. 2, the discrete component 9 c is an electronic component including lead terminals t <b> 1 and t <b> 2 (FIG. 1) that penetrate the printed circuit board 10. The main body of the discrete component 9 c is mounted on the upper surface of the first insulating layer 1. The lead terminals t1 and t2 of the discrete component 9c are inserted into the through holes 6c and 6d, respectively, and then soldered.

  The chip capacitors 9d to 9g are surface mount type electronic components. As shown in FIG. 1, the chip capacitor 9d is soldered onto the wiring patterns 5b and 5h. The chip capacitor 9e is soldered on the wiring patterns 5e and 5f. The chip capacitor 9f is soldered on the wiring patterns 5d and 5i. The chip capacitor 9g is soldered on the wiring patterns 5e and 5g.

  As shown in FIG. 2, a second insulating layer 2 is provided on the lower surface of the first insulating layer 1. The second insulating layer 2 is formed in a flat plate shape thicker than the first insulating layer 1 and has a laminated structure. In detail, the 2nd insulating layer 2 is comprised by adhere | attaching the copper clad laminated board 2a on the upper and lower surfaces of the normal prepreg 2b, respectively.

  The normal prepreg 2b is a prepreg that is a material of a general printed circuit board, and is, for example, a plate material obtained by impregnating glass fibers 2d represented by a lattice pattern with epoxy as shown in FIGS. . The copper clad laminate 2a is obtained by adhering copper foil to the upper and lower surfaces of a plate-like core material 2c formed by impregnating epoxy into glass fibers 2e represented by a lattice pattern, for example. The glass fibers 2d and 2e and the epoxy constituting the normal prepreg 2b and the copper-clad laminate 2a, respectively, have different components in this example, but as another example, the components may be the same. The glass fibers 2d and 2e are reinforcing materials. In FIG. 2, illustration of the glass fibers 2d and 2e is omitted.

  As another example, instead of glass fiber, a plate material made of another reinforcing material such as carbon fiber and a thermosetting resin other than epoxy may be used as the second insulating layer 2.

  An inner layer L2 is provided between the first insulating layer 1 and the second insulating layer 2 using the copper foil portion of each copper-clad laminate 2a of the second insulating layer 2, and the inner layer L3, L4 is provided, and a lower surface layer L5 is provided on the lower surface of the second insulating layer 2.

  As shown in FIG. 3, the inner layers L2 to L4 are provided with wiring patterns 5j to 5n, 5j 'to 5n', 5j "to 5n". Each of the wiring patterns 5j to 5n, 5j 'to 5n', 5j "to 5n" is made of a copper foil having conductivity and thermal conductivity.

  In this example, the wiring patterns 5j, 5k, 5l, 5m, and 5n of the inner layer L2, the wiring patterns 5j ′, 5k ′, 5l ′, 5m ′, and 5n ′ of the inner layer L3, and the wiring patterns 5j ″ and 5k of the inner layer L4 are used. “5l”, “5m”, and “5n” have the same shape. As another example, the shapes of the wiring patterns of the inner layers L2, L3, and L4 may be different.

  As shown in FIG. 4, the lower surface layer L5 is provided with electronic components 9h to 9j and wiring patterns 5o to 5w. The wiring patterns 5o to 5w are made of copper foil having conductivity and thermal conductivity. A part of the wiring patterns 5p, 5q, 5s, 5t, 5v, and 5w functions as a land for soldering the electronic components 9h to 9j.

  The electronic components 9h to 9j are surface mount type chip capacitors. The chip capacitor 9h is soldered on the wiring patterns 5p and 5q. The chip capacitor 9i is soldered on the wiring patterns 5t and 5s. The chip capacitor 9j is soldered on the wiring patterns 5v and 5w.

  As shown in FIG. 2 and the like, a recess 11k is provided on the lower plate surface of the substrate 11. Specifically, the recess 11 k is provided in the second insulating layer 2 so as to be recessed from the lower surface of the second insulating layer 2 in the thickness direction and reach the lower surface of the first insulating layer 1. The metal core 3 is fitted into the recess 11k. The metal core 3 is also provided on the second insulating layer 2 so as to reach the lower surface of the first insulating layer 1 from the lower surface of the second insulating layer 2.

  Further, the metal core 3 is provided on the lower surface of the first insulating layer 1 so as to overlap with at least the FETs 9a and 9b. Specifically, as shown in FIG. 1, when viewed from above the printed circuit board 10, the metal core 3 includes a plurality of electronic components 9a, 9b, 9d, 9f provided on the upper surface of the first insulating layer 1 and a plurality of wiring patterns. 5a to 5e, 5h, and 5i are provided over a wide range so as to be wholly or partly overlapped.

  The metal core 3 is made of a metal plate such as copper having thermal conductivity. As shown in FIGS. 1, 4, and 7, the metal core 3 is formed in a rectangular shape when viewed from above or below. The recess 11k is formed in a substantially rectangular shape when viewed from above or below. The area of the recess 11 k is wider than the area of the metal core 3.

  As shown in FIG. 2, the upper surface of the metal core 3 is covered with the first insulating layer 1. The lower surface of the metal core 3 is exposed from the second insulating layer 2. The metal core 3 is an example of the “heat dissipating member” in the present invention.

  The thermal conductivity of the first insulating layer 1 and the metal core 3 is higher than the thermal conductivity of the second insulating layer 2. Further, the thermal conductivity of the metal core 3 is higher than the thermal conductivity of the first insulating layer 1. Specifically, for example, the thermal conductivity of the second insulating layer 2 is 0.3 to 0.5 W / mK (mK: meter · Kelvin), whereas the thermal conductivity of the first insulating layer 1 is 3 to 5 W / mK. Moreover, when the metal core 3 is made of copper, the thermal conductivity of the metal core 3 is about 400 W / mK.

  In each inner layer L2 to L4, between the wiring patterns 5j to 5n, 5j ′ to 5n ′, 5j ″ to 5n ″ and the metal core 3, an insulator (epoxy or glass fiber 2d, 2e) of the second insulating layer 2 is present. It is interposed (FIGS. 2, 3, 5, and 6). For this reason, the metal core 3 and the wiring patterns 5j to 5n, 5j 'to 5n', 5j "to 5n" are insulated.

  In the lower surface layer L5, a predetermined insulation distance is provided between the wiring patterns 5o, 5p, 5r, 5s, and 5u in the vicinity of the metal core 3 and the metal core 3 (FIGS. 2, 4, 5, and 5). 6). For this reason, the metal core 3 and each wiring pattern 5o-5w are insulated.

  In the upper surface layer L1, the first insulating layer 1 is interposed between the wiring patterns 5a to 5e, 5h immediately above the metal core 3 and the metal core 3 (FIGS. 1, 2, 5, and 6). For this reason, the metal core 3 and each wiring pattern 5a-5e, 5h are insulated.

  The through holes 6a to 6e pass through the first insulating layer 1, the second insulating layer 2, and the wiring patterns in the both insulating layers 1 and 2 (FIG. 2). The inner surfaces of the through holes 6a to 6e are plated with copper or solder. The through holes 6a to 6e connect the wiring patterns in different layers L1 to L5.

  Specifically, the plurality of through holes 6a penetrate through the insulating layers 1 and 2, the wiring pattern 5a of the upper surface layer L1, the wiring patterns 5j, 5j ', 5j "of the inner layers L2 to L4, and the wiring pattern 5o of the lower surface layer L5. Each through hole 6a connects the wiring patterns 5a, 5j, 5j ′, 5j ″, 5o.

  The plurality of through holes 6b penetrate through the insulating layers 1 and 2, the wiring pattern 5e of the upper surface layer L1, the wiring patterns 5m, 5m ', 5m "of the inner layers L2 to L4, and the wiring pattern 5s of the lower surface layer L5. Each through hole 6b connects the wiring patterns 5e, 5m, 5m ′, 5m ″, and 5s.

  The through hole 6c is provided so as to penetrate the insulating layers 1 and 2, the wiring pattern 5e of the upper surface layer L1, the wiring patterns 5m, 5m ', 5m "of the inner layers L2 to L4, and the wiring pattern 5s of the lower surface layer L5. One lead terminal t1 of the discrete component 9c is soldered to the through hole 6c, and the lead terminal t1 is connected to the wiring patterns 5e, 5m, 5m ′, 5m ″, and 5s through the through hole 6c. Has been.

  The through hole 6d is provided so as to penetrate the insulating layers 1 and 2, the wiring pattern 5f of the upper surface layer L1, the wiring patterns 5n, 5n ′, 5n ″ of the inner layers L2 to L4, and the wiring pattern 5r of the lower surface layer L5. The other lead terminal t2 of the discrete component 9c is soldered to the through hole 6d, and the lead terminal t2 is connected to the wiring patterns 5f, 5n, 5n ′, 5n ″, 5r via the through hole 6d. Has been.

  The through hole 6e is provided so as to penetrate the insulating layers 1 and 2, the wiring pattern 5h of the upper surface layer L1, the wiring patterns 5k, 5k ′, 5k ″ of the inner layers L2 to L4, and the wiring pattern 5p of the lower surface layer L5. The through holes 6e connect the wiring patterns 5h, 5k, 5k ′, 5k ″, and 5p.

  As shown in FIG. 2, a heat sink 4 is provided below the second insulating layer 2 and the metal core 3. The heat sink 4 is made of metal such as aluminum, and releases the heat generated in the printed circuit board 10 to cool the printed circuit board 10. The heat sink 4 is an example of the “external heat radiator” in the present invention.

  On the upper surface of the heat sink 4, convex portions 4 a and 4 b projecting upward are formed. The upper surfaces of the convex portions 4 a and 4 b are parallel to the plate surface of the printed circuit board 10.

  A screw hole 4h is formed in the convex portion 4b of the heat sink 4 in parallel with the thickness direction of the printed circuit board 10 (vertical direction in FIG. 2). In each of the insulating layers 1 and 2, a through hole 7 is provided at a position that does not overlap the electronic components 9a to 9j and the wiring patterns 5a to 5w. The through hole 7 communicates with the screwing hole 4 h of the heat sink 4.

  The screw 8 is passed through the through hole 7 from above the first insulating layer 1 and screwed into the screwing hole 4h of the heat sink 4, so that the heat sink 4 is attached to the lower surface of the second insulating layer 2 as shown in FIG. The convex portion 4b is fixed. The heat sink 4 is attached below the printed circuit board 10 by providing a plurality of such screwing points.

  In a state where the convex portion 4 b of the heat sink 4 is fixed to the lower surface of the second insulating layer 2, the lower surface of the metal core 3 and the upper surface of the convex portion 4 a of the heat sink 4 are in contact. In this example, the area of the upper surface of the convex portion 4a of the heat sink 4 is reduced due to a predetermined insulation distance between the wiring pattern 5o, 5p, 5r, 5s, 5u on the lower surface layer L5 and the metal core 3. It is slightly narrower than the area of the lower surface of the metal core 3.

  As another example, the area of the upper surface of the convex portion 4a of the heat sink 4 is made the same as or slightly wider than the area of the lower surface of the metal core 3 in consideration of the wiring pattern of the lower surface layer L5 and the arrangement of electronic components. May be.

  Thermal grease (not shown) having high thermal conductivity is applied to the upper surface of the convex portion 4 a of the heat sink 4. Thereby, the adhesiveness of the upper surface of the convex part 4a and the lower surface of the metal core 3 is improved, and the thermal conductivity from the metal core 3 to the heat sink 4 is improved.

  Next, a method for manufacturing the printed circuit board 10 will be described with reference to FIGS. 7, 8A, and 8B.

  8A and 8B are diagrams showing the manufacturing process of the printed circuit board 10. 8A and 8B, each part of the printed circuit board 10 is simplified and shown for convenience.

  In FIG. 8A, of the two copper-clad laminates 2a, the copper foils on the upper and lower surfaces of one copper-clad laminate 2a are subjected to etching or the like to form the wiring patterns 5j to 5n, 5j ′ to the inner layers L2, L3. 5n ′ (reference numerals omitted in FIGS. 8A and 8B). Also, the copper foil on the upper surface of the other copper-clad laminate 2a is etched to form wiring patterns 5j "to 5n" (reference numerals omitted in FIGS. 8A and 8B) of the inner layer L4 (( 1)).

  Next, a through hole 2h for fitting the metal core 3 into each copper clad laminate 2a is formed ((2) in FIG. 8A). Further, a through hole 2h ′ for fitting the metal core 3 is also formed in the normal prepreg 2b ((3) in FIG. 8A). As will be described later, the inner peripheral surfaces of the through holes 2h and 2h 'constitute the inner peripheral surface of the recess 11k.

  The through holes 2h and 2h 'are formed in a substantially rectangular shape as shown in FIG. 7A when viewed from the thickness direction of the copper-clad laminate 2a and the normal prepreg 2b. A plurality of convex portions 2t projecting inward are formed at predetermined intervals on the inner peripheral surfaces of the through holes 2h and 2h '. As shown in FIG. 7B, the protruding length of each convex portion 2t is set to a length that reaches the outer peripheral surface of the metal core 3 in a state where the metal core 3 is fitted in the through holes 2h and 2h '.

  Thereby, in a state where the metal core 3 is fitted in the through holes 2h and 2h ′, the contact portion 2t ′ (the tip of the convex portion 2t) where the outer peripheral surface of the metal core 3 and the inner peripheral surface of the through holes 2h and 2h ′ are in contact with each other. Portion) and a separation portion 2s that does not come into contact with each other (portion without the protrusion 2t) are formed. Here, a plurality of contact portions 2t 'and separation portions 2s are alternately formed at predetermined intervals in the circumferential direction of the metal core 3 and the through holes 2h, 2h'. For this reason, the contact area between the metal core 3 and the inner peripheral surfaces of the through holes 2h and 2h 'is reduced, and the metal core 3 is easily fitted into the through holes 2h and 2h'.

  Moreover, the highly heat conductive prepreg 1a which has predetermined | prescribed thickness, and the copper foil 5 which has predetermined | prescribed thickness for affixing on the upper surface of this prepreg 1a are prepared ((4) of FIG. 8A). Further, the metal core 3 having a predetermined shape is formed by processing a metal plate such as copper ((5) in FIG. 8A).

  Then, from the bottom, one copper-clad laminate 2a, a normal prepreg 2b, the other copper-clad laminate 2a, a highly thermally conductive prepreg 1a, and a copper foil 5 are sequentially stacked, and metal cores are formed in the through holes 2h, 2h ′. After inserting 3, pressurize in the up-down direction (thickness direction of each member) while heating them ((6) in FIG. 8B).

  Thereby, the epoxy of each prepreg 2b, 1a and the copper clad laminated board 2a melt | dissolves, and it penetrates into the clearance gap between these members 1a, 2a, 2b. Thereafter, the epoxy is cured, so that the members 1a, 2a, and 2b are bonded to each other, and the first insulating layer 1, the second insulating layer 2, the inner layers L2 to L4, and the recess 11k of the base material 11 are configured ( (6 ') of FIG. 8B). The inner peripheral surface of the recess 11k is formed by the inner peripheral surfaces of the through holes 2h and 2h ', and the bottom surface of the recess 11k is formed by the lower surface of the prepreg 1a having high thermal conductivity.

  Further, the melted epoxy of each prepreg 2b, 1a and the copper clad laminate 2a is filled in the gap between the metal core 3 and the recess 11k or the separation portion 2s. Thereafter, the base material 11 and the metal core 3 are integrated by curing the epoxy. That is, at the contact portion 2t 'between the metal core 3 and the recess 11k, the metal core 3 is held by the glass fibers 2d and 2e of the copper-clad laminate 2a and the prepreg 2b and epoxy as shown in FIG. Moreover, in the space | interval part 2s of the metal core 3 and the recessed part 11k, as shown in FIG. 6, the metal core 3 is hold | maintained by the epoxy 2j after hardening of the copper clad laminated board 2a and the prepreg 2b. The upper surface of the metal core 3 is held by the first insulating layer 1.

  Next, through holes are formed in predetermined locations of the copper foil 5 and the base material 11, and plating is performed on the inner surfaces of the through holes to form through holes 6a to 6e (portion 6 in FIG. 8B) (see FIG. 8). 8B (7)). Next, the uppermost copper foil 5 is etched to form wiring patterns 5a to 5i (not shown in FIG. 8B) of the upper surface layer L1 on the upper surface of the first insulating layer 1. Further, the copper foil at the lowermost part is etched to form wiring patterns 5o to 5w (reference numerals omitted in FIG. 8B) of the lower surface layer L5 on the lower surface of the second insulating layer 2. ((8) in FIG. 8B).

  Thereafter, the exposed upper surface of the first insulating layer 1, the wiring patterns 5a to 5i, the lower surface of the second insulating layer 2, the wiring patterns 5o to 5w, and the like are subjected to a surface treatment such as resist or silk. (9) of FIG. 8B). Then, the outer shape is processed by cutting excess ends of the insulating layers 1 and 2 ((10) in FIG. 8B). Thus, the printed circuit board 10 is formed.

  According to the above-described embodiment, the contact portion 2t that is in contact with each other between the inner peripheral surface of the recess 11k and the outer peripheral surface of the metal core 3 in a state where the metal core 3 is fitted in the recess 11k provided in the base material 11 of the printed circuit board 10. 'And a separation portion 2s that do not contact each other are formed. And by heating and pressurizing the laminated body of each member 5, 1a, 2a, 2b, the epoxy which is the thermosetting resin of the members 1a, 2a, 2b is melted and filled in the separating portion 2s, and then The base material 11 and the metal core 3 are integrated by the epoxy being hardened. For this reason, for example, even when a thermal disturbance such as heating when soldering the electronic components 9a to 9j on the printed board 10 or heat generation when the mounted electronic components 9a to 9j are energized acts on the base material The epoxy between 11 and the metal core 3 does not melt, and the metal core 3 does not come out from the recess 11k. Therefore, the metal core 3 can be firmly fixed in the base material 11 of the printed circuit board 10.

  In the above-described embodiment, the contact portions 2t ′ and the separation portions 2s are provided alternately at predetermined intervals in the circumferential direction of the recesses 11k and the metal core 3. For this reason, when the metal core 3 is inserted into the recess 11k, the metal core 3 is difficult to come out of the recess 11k due to the frictional resistance of each contact portion 2t 'between the inner peripheral surface of the recess 11k and the outer peripheral surface of the metal core 3. For this reason, the laminated body of the members 5, 1 a, 2 a, 2 b, and 3 is heated and pressurized to facilitate the integration of the base material 11 and the metal core 3, thereby facilitating the production of the printed circuit board 10. .

  Moreover, in the said embodiment, when forming the through-holes 2h and 2h 'in the copper clad laminated board 2a and the prepreg 2b of the base material 11, the convex part 2t is set to predetermined intervals on the inner peripheral surface of the through-holes 2h and 2h'. By providing a plurality of contact portions 2 t ′, a plurality of contact portions 2 t ′ and separation portions 2 s can be easily provided between the recess 11 k and the metal core 3. Moreover, since it is not necessary to process the outer peripheral surface of the metal core 3 in a complicated manner, the formation of the metal core 3 can be facilitated.

  Moreover, in the said embodiment, the base material 11 is comprised from the 1st insulating layer 1 and the 2nd insulating layer 2 whose heat conductivity is lower than the 1st insulating layer 1, and is the 1st insulation from the lower surface of the 2nd insulating layer 2. The second insulating layer 2 is provided with a recess 11k and a metal core 3 so as to reach the lower surface of the layer 1. For this reason, the recessed part 11k does not penetrate the base material 11, it becomes easy to position the metal core 3 with respect to the thickness direction of the base material 11, and manufacture of the printed circuit board 10 can be facilitated. In addition, since the upper surface of the metal core 3 is in contact with the lower surface of the first insulating layer 1, heat generated by the electronic components 9 a, 9 b, 9 d, 9 f mounted on the upper surface of the first insulating layer 1 is transferred to the first insulating layer 1. The heat can be easily transmitted to the metal core 3 through the heat dissipation.

  Furthermore, in the above-described embodiment, the printed circuit board is provided such that the recess 11k is provided so as to be recessed in the thickness direction from the lower surface of the printed circuit board 10, and the metal core 3 is exposed from the lower surface of the printed circuit board 10 and is in contact with the exposed surface of the metal core 3. A heat sink 4 is attached below 10. For this reason, the heat generated by the electronic components 9a, 9b, 9d, and 9f mounted on the upper surface of the printed circuit board 10 and the heat transmitted to the printed circuit board 10 are transmitted from the metal core 3 to the heat sink 4 to efficiently dissipate the heat to the outside. can do.

  In the present invention, various embodiments other than those described above can be adopted. For example, in the above embodiment, the example in which the convex portions 2t are respectively formed on the inner peripheral surfaces of the through-holes 2h and 2h ′ of the copper clad laminate 2a and the prepreg 2b constituting the concave portion 11k has been shown. It is not limited to this. In addition to this, for example, the convex portion 2t shown in FIG. 7 is formed only on the inner peripheral surface of the through hole 2h of the copper-clad laminate 2a, and the normal prepreg 2b has an inner peripheral surface as shown in FIG. A through hole 2h ″ having no irregularities on the surface may be formed.

  In the above embodiment, the example in which the shape of the metal core 3 is rectangular when viewed from above or below is shown, but not limited to this, according to the arrangement and shape of electronic components on the printed circuit board, The shape of the metal core when viewed from above may be any shape. For example, as shown in FIG. 10, the metal core 3 ′ may be formed in a shape having a plurality of corners and sides when viewed from above. In this case, the concave portion 11k 'of the base material 11' may be formed in a shape having a plurality of corners and sides irregularly as viewed from above and larger than the outer diameter of the metal core 3 '. Further, as shown in FIG. 10, by providing a plurality of convex portions 3t at predetermined intervals only on the outer peripheral surface of the metal core 3 ′, the contact portion is provided between the metal core 3 ′, the outer peripheral surface, and the inner peripheral surface of the concave portion 11k ′. 2t ′ and a separation portion 2s may be provided.

  Moreover, a convex part is provided in both the outer peripheral surface of a metal core, and the internal peripheral surface of a recessed part, and it is good also considering the part which convex parts contact as a contact part, and making a part other than a convex part into a separation part.

  Further, as shown in FIG. 11, the metal core 3 ″ is formed in a cylindrical shape so that the outer peripheral surface of the metal core 3 ″ is a curved surface, and the concave portion 11k ″ of the base material 11 ″ is viewed from above, and the metal core 3 ″ is It may be formed in a rectangular shape that can be inserted. In this case, the inner width of the recess 11k ″ can be set to the metal core 3 ″ without providing an uneven portion on the outer peripheral surface of the metal core 3 ″ or the inner periphery of the recess 11k ″. The contact portion 2t ′ where the outer peripheral surface of the metal core 3 ″ and the inner peripheral surface of the recess 11k ″ are in contact with each other and the separation portion 2s which are not in contact with each other can be formed.

  In the above embodiment, the heat sink 4 is used as the external radiator, but an air-cooled or water-cooled radiator or a radiator using a refrigerant may be used instead. Good. Moreover, you may use not only a metal external heat radiator but the external heat radiator formed with resin with high heat conductivity.

  In the above embodiment, the example in which the present invention is applied to the printed circuit board 10 provided with the two surface layers L1 and L5 and the three inner layers L2 to L4 has been described. The present invention can also be applied to a single-layer printed circuit board provided with a single conductor or a printed circuit board provided with conductors in two or more layers.

  Furthermore, in the above embodiment, although the DC-DC converter mounted in an electric vehicle or a hybrid car was mentioned as an example as the electronic apparatus 100, this invention is a printed circuit board, the electronic component which generate | occur | produces, and a heat radiator. It is applicable also to other electronic devices provided with.

DESCRIPTION OF SYMBOLS 1 1st insulating layer 2 2nd insulating layer 2t Convex part 2t 'contact part 2s Separation part 3, 3', 3 "Metal core (heat dissipation member)
4 Heat sink (external heat radiator)
5a to 5i Upper surface wiring pattern 5j to 5n, 5j 'to 5n', 5j "to 5n" Inner layer wiring pattern 5o to 5w Lower surface layer wiring pattern 9a, 9b FET (electronic parts)
9c Discrete parts (electronic parts)
9d-9j Chip capacitors (electronic components)
10 Printed Circuit Board 11, 11 ′, 11 ″ Base Material 11k, 11k ′, 11k ″ Recess 100 Electronic Device

Claims (6)

A base material formed of a reinforcing material and a thermosetting resin and formed into a plate shape;
A wiring pattern provided on the substrate;
A recess provided on the plate surface of the substrate;
In a printed circuit board comprising a heat radiating member fitted into the recess,
In a state where the heat radiating member is inserted into the concave portion, a contact portion where the inner peripheral surface of the concave portion and the outer peripheral surface of the heat radiating member are in contact with each other, and a separation portion that is not in contact with each other are formed,
A printed circuit board, wherein the thermosetting resin of the base material, which is melted by heating and filled in the separated portion, is cured, and the base material and the heat dissipation member are integrated. The printed circuit board according to claim 1,
The printed circuit board, wherein a plurality of the contact portions and the separation portions are alternately formed at predetermined intervals in the circumferential direction of the recesses and the heat dissipation member. The printed circuit board according to claim 1 or 2,
The contact portion comprises a convex portion formed on the inner peripheral surface of the concave portion,
The printed circuit board according to claim 1, wherein the spacing portion is a portion other than the convex portion on the inner peripheral surface of the concave portion. In the printed circuit board in any one of Claim 1 thru | or 3,
The substrate is
A first insulating layer provided with the wiring pattern on an upper surface;
A second insulating layer provided on a lower surface of the first insulating layer and having a thermal conductivity lower than that of the first insulating layer;
The printed circuit board, wherein the recess and the heat dissipation member are provided in the second insulating layer so as to reach the lower surface of the first insulating layer from the lower surface of the second insulating layer. A printed circuit board according to any one of claims 1 to 4,
And an electronic component mounted on the printed circuit board. The electronic device according to claim 5.
The recess is provided so as to be recessed in the thickness direction from the lower surface of the printed circuit board,
The heat dissipation member is exposed from the lower surface of the printed circuit board,
An electronic device, further comprising an external heat dissipating member provided below the printed circuit board so as to come into contact with an exposed surface of the heat dissipating member.

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