JP2010205995A - Printed board - Google Patents

Printed board Download PDF

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Publication number
JP2010205995A
JP2010205995A JP2009050786A JP2009050786A JP2010205995A JP 2010205995 A JP2010205995 A JP 2010205995A JP 2009050786 A JP2009050786 A JP 2009050786A JP 2009050786 A JP2009050786 A JP 2009050786A JP 2010205995 A JP2010205995 A JP 2010205995A
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Japan
Prior art keywords
circuit board
printed circuit
metal piece
heat
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009050786A
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Japanese (ja)
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JP2010205995A5 (en
JP5351563B2 (en
Inventor
Kazuhiko Isshiki
Kazuyasu Kobayashi
Akihisa Miyagawa
Hiroyuki Uchida
Satoru Yokokawa
和彦 一色
広幸 内田
昭久 宮川
和康 小林
悟 横川
Original Assignee
Chino Giken:Kk
Hitachi Kokusai Electric Inc
株式会社ちの技研
株式会社日立国際電気
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Application filed by Chino Giken:Kk, Hitachi Kokusai Electric Inc, 株式会社ちの技研, 株式会社日立国際電気 filed Critical Chino Giken:Kk
Priority to JP2009050786A priority Critical patent/JP5351563B2/en
Publication of JP2010205995A publication Critical patent/JP2010205995A/en
Publication of JP2010205995A5 publication Critical patent/JP2010205995A5/ja
Application granted granted Critical
Publication of JP5351563B2 publication Critical patent/JP5351563B2/en
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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

For example, in a printed circuit board on which a surface mounting component that generates heat is mounted, heat of the surface mounting component is effectively radiated through a metal piece having excellent heat dissipation characteristics.
In a printed circuit board 1 on which a heat generating component 21 is mounted, a hole 6 is provided at a position where the heat generating component 21 is mounted on the surface of the printed circuit board 1, and a metal projecting from the surface of the printed circuit board 1 is provided in the hole 6. The printed board 1 is formed by inserting a piece and pressurizing and deforming the metal piece so that the surface of the printed board 1 and the metal piece (metal piece 13) have the same height. did. Further, an uneven portion was provided on the side surface of the hole 6.
[Selection] Figure 4

Description

  The present invention relates to, for example, a printed circuit board on which a surface-mounted component that generates heat is mounted, and more particularly to a printed circuit board that effectively dissipates heat of the surface-mounted component through a metal piece having excellent heat dissipation characteristics.

  Generally, the structure of a printed circuit board that mounts a heat-generating component that is a surface-mounted component is that heat generated from the terminals of the heat-generating component mounted on the surface of the printed circuit board is placed in the printed circuit board on the lower surface side of the heat-generating component. A structure is used in which heat is released to a heat radiating plate having a heat radiating function that is bonded to the back surface of the printed board through the metal body having good heat conduction. At this time, the metal body arranged in the printed circuit board has a good thermal resistance value (heat conduction), and heat-generating components (surface mount components) are normal (surface mount component terminals are floating, solder is not connected, and the components are tilted. From the viewpoint of mounting (mounting) on a printed circuit board, it is required that the metal body does not protrude, dent, or tilt from the front and back surfaces of the printed circuit board. Here, when the metal piece jumps out, dents, or tilts, a non-solder gap is generated between the surface mount component and the metal piece and between the metal piece and the heat sink, and the heat is generated from the heat generating component (surface mount component). The problem that heat cannot be efficiently transmitted to a heat sink will occur.

At present, in the prior art described below, it is difficult to achieve all the above-mentioned requirements, and it is necessary to improve the structure and process of the printed circuit board.
In the following, three conventional techniques (Prior Art 1) to (Prior Art 3) that are generally used will be introduced.
(Prior Art 1) The first is a structure in which heat is released to a heat radiating plate having a heat radiating function that is joined to the back surface of the printed circuit board through dense through holes formed in the printed circuit board.
(Prior Art 2) The second is a structure in which heat is released to a heat radiating plate having a heat radiating function joined to the back surface of the printed circuit board through a metal piece press-fitted into the printed circuit board.
(Prior Art 3) The third is a structure in which heat is released to a heat radiating plate having a heat radiating function through a metal piece fixed to a printed circuit board with an adhesive.
Note that the aforementioned heat generating component refers to a heat generating component such as a transistor or a light emitting diode.

The outline of the above-mentioned (conventional technology 1) to (conventional technology 3) will be described below.
(Prior art 1)
5A to 5E show an example of the structure of a printed circuit board on which the heat generating component according to the related art 1 is mounted.
In FIG. 5, (a) front surface, (b) AA ′ portion, (c) back surface, (d) BB ′ portion, (e) those provided with a heat sink 120 are shown.
In FIG. 5, reference numerals denote a printed circuit board 101, a heat generating component land 104, a pattern 105, a pattern 107, a heat generating component terminal (transistor source terminal) 116, solder 117, and a heat generating component terminal (transistor gate terminal) 118. , A heat-generating component terminal (transistor drain terminal) 119, a heat sink 120, a heat-generating component 121, a through hole 125, a space 126, a terminal surface 128, and a terminal surface 129 are shown.

  Prior art 1 has a structure in which through holes 125 are densely packed as shown in FIG. For example, when seven through holes having a diameter of 0.3 mm (thickness of inner wall copper of 0.025 mm) are densely packed on a printed board having a thickness of 0.8 mm, the thermal resistance value is about 8.8 ° C./W. . Although this value depends on the required thermal resistance value, it is difficult to say that this value is a good thermal resistance value. Further, in such a structure in which through holes are densely packed, it is necessary to increase the number of through holes in order to improve the thermal resistance value. However, as shown in FIG. 5A, the area where the through-holes 125 are arranged may be increased because the “terminal surface 128 that requires heat dissipation of the heat-generating component” and the “adjacent terminal surface 129” are restricted. Can not.

  As a result, the number of through holes cannot be increased, and the thermal resistance value cannot be improved more than that described above. Further, in the structure in which the through holes are densely packed, when the heat generated from the heat generating component 121 is released to the heat radiating plate 120 having a heat radiating function joined to the back surface of the printed circuit board 101 as shown in FIG. Ideally, the space 126 in the through hole 125 is filled with solder to improve the thermal resistance value. However, it is difficult to fill the insides of all the dense through holes 125 with solder, and some portions are not filled. This is also a factor that the thermal resistance value cannot be improved.

(Prior art 2)
FIGS. 6A and 6B and FIGS. 7A to 7D show an example of the structure of the printed circuit board on which the heat generating component according to the related art 2 is mounted.
In FIG. 6, (a) and (b) show side cross-sections.
In FIG. 7, (a) front surface, (b) AA ′ portion, (c) back surface, and (d) BB ′ portion are shown.
6A, 7 </ b> B, and 7 </ b> A to 7 </ b> D, reference numerals denote a printed board 101, a metal piece 102, a heat generating component land 104, a pattern 105, a pattern 107, and a heat generating component terminal ( A transistor source terminal 116, solder 117, a heat generating component terminal (transistor gate terminal) 118, a heat generating component terminal (transistor drain terminal) 119, a heat generating component 121, and a copper cylinder 127 are shown.

  In the conventional technique 2 in which a metal piece is press-fitted into a printed board, a cylindrical metal piece 102 is press-fitted into the printed board 101 and embedded in the printed board 101 as shown in FIG. Here, it is possible to make the metal piece 102 a cube, but there are a plurality of contact surfaces with the printed circuit board 101, and it is difficult to apply a frictional force to the contact surface uniformly. It is not generally used because it causes a dropout (see FIG. 6B) or a frictional force concentrates on a part and the printed circuit board is damaged.

  In the related art 2, for example, as shown in FIG. 7, when a copper cylinder 127 of φ1.6 mm is press-fitted into the two-printed substrate 101, the thermal resistance value is about 0.5 ° C./W. Although this value depends on the required thermal resistance value, it can be said to be a good thermal resistance value. However, in the structure of prior art 2 (FIGS. 6 and 7), the press-fitted metal piece 102 remains in the printed circuit board 102 due to frictional resistance. For this reason, when the frictional resistance is small, the metal piece 102 falls or drops (see FIG. 6B) due to an impact or the like when the printed circuit board 101 is handled. Conversely, if the frictional resistance is large, press-fitting cannot be performed or even if press-fitting is performed, a large load is applied to the printed circuit board 101 and the printed circuit board 101 is damaged.

  As described above, in the related art 2, there is a factor that the metal piece 102 moves or the position is not fixed, and the metal piece 102 protrudes, dents, or tilts from the front and back surfaces of the printed circuit board 101. In this case, as described above, the surface mount component cannot be normally mounted (mounted) on the printed circuit board. Further, when the structure of prior art 2 is applied to each sub-board in a split board (a board that is assumed to be divided into two or more sub-boards after component mounting), the above-mentioned metal piece drops / Problems such as dropping off and damage to the substrate occur in the child substrate, and the split substrate itself is treated as a defective product.

(Prior art 3)
FIGS. 8A and 8B show an example of the structure of a printed circuit board on which the heat generating component according to Conventional Technology 3 is mounted.
In FIG. 8, (a) and (b) show side cross-sections.
In FIG. 8, reference numerals are printed circuit board 101, metal piece 102, pattern 105, heat generating component terminal (transistor source terminal) 116, solder 117, heat generating component terminal (transistor gate terminal) 118, and heat generating component terminal. (Drain terminal of transistor) 119, heat sink 120, heat generating component 121, solder 122, adhesive 123, and gap 124 are shown.

In the prior art 3, as shown in FIG. 8, the metal piece 102 is fixed to the printed circuit board 101 with an adhesive 123. In this case, the adhesive 123 melts when it is put into the reflow furnace, and a defect such as the metal piece 102 tilting or dropping / dropping occurs.
As shown in FIG. 8B, when the metal piece 102 is tilted, a gap 124 that is not connected to solder is generated between the heat radiating plate 120 and the metal piece 102, and the heat generated from the heat generating component 121 is dissipated. It cannot be efficiently transmitted to the plate 120. As described above, also in the prior art 3, the metal piece 102 moves due to the melting of the adhesive 123, and the metal piece 102 protrudes, dents, or tilts from the front and back surfaces of the printed board 101. Therefore, the surface mounting component cannot be normally mounted (mounted).

JP 2004-179309 A Japanese Patent Laid-Open No. 8-153943

A problem is shown about (conventional technology 1)-(conventional technology 3) mentioned above.
(Problems of prior art 1)
In the structure in which the through holes according to the related art 1 are densely packed, for example, when seven through holes having a diameter of 0.3 mm (the inner wall copper thickness of the through hole are 0.025 mm) are densely packed on a printed board having a thickness of 0.8 mm. The thermal resistance value is about 8.8 ° C./W. Although this value depends on the required thermal resistance value, it cannot be said to be a good thermal resistance value. In addition, in the structure in which through holes are densely packed in this way, the number of through holes that are densely packed is limited by the “terminal surface that requires heat dissipation from the heat-generating component” and the “adjacent terminal surface”, so the area where the through holes are arranged Cannot be increased. As a result, there is a problem that the number of through holes cannot be increased and the thermal resistance value cannot be improved more than the above. Furthermore, when releasing heat from a heat-generating component to a heat sink with a heat dissipation function that is bonded to the back side of the printed circuit board, the space in the through hole is filled with solder to improve the thermal resistance value. Although it is ideal to use, it is difficult to fill all of the dense through holes with solder, and some unfilled portions are generated. In this case, there is a problem that the thermal resistance value varies and it cannot be determined whether a required thermal resistance value is obtained.

(Problem of the prior art 2)
In the prior art 2 described above, a good thermal resistance value can be obtained, but since the press-fitted metal piece remains on the printed circuit board due to the frictional resistance, when the frictional resistance is small, the printed circuit board is handled. There is a problem that the metal piece falls or drops due to an impact or the like, and conversely, if the frictional resistance is large, press-fitting cannot be performed, or even if the press-fitting is applied, a large load is applied to the printed circuit board, causing damage to the printed circuit board. Further, in the prior art 2, there is a problem that the metal piece moves or the position is not fixed, and the metal piece jumps out, dents or tilts from the front and back surfaces of the printed board. In this case, as described above, the surface mount component cannot be normally mounted (mounted) on the printed circuit board. Furthermore, when the structure of the prior art 2 is applied to each sub-board in the split board (a board that is assumed to be divided into two or more sub-boards after component mounting), the above-described drop / drop of the metal piece There is a problem that defects such as breakage of the substrate occur in the child substrate, and the split substrate itself is handled as a defective product.

(Problems of prior art 3)
In the method of fixing the metal piece according to the above-described prior art 3 with the adhesive, when the printed circuit board is put into the reflow furnace, the adhesive melts and the metal piece is inclined, or in the worst case, it is dropped / dropped off. Will be. When the metal piece is tilted, a gap that is not connected to the solder is generated between the heat sink and the metal piece, and the heat generated from the heat generating component cannot be efficiently transmitted to the heat sink. Become. Also in the prior art 3, there is a problem that the metal piece moves due to melting of the adhesive, and the metal piece protrudes, dents or tilts from the front and back surfaces of the printed board.

  As described above, according to the conventional technique, in a printed circuit board on which a surface mounting component that generates heat is mounted, a metal that conducts heat such as a through hole or a metal piece is disposed on the printed circuit board on the lower surface side of the surface mounting component. For example, it is impossible to improve the thermal resistance value of the metal piece, the metal piece jumps out, dents or tilts, the thermal resistance value varies, the metal piece falls or drops, the printed circuit board is damaged, etc. The problem was occurring.

The present invention has been made to solve such a conventional problem. For example, when mounting a surface-mounted component that generates heat, the heat of the surface-mounted component is reduced through a metal piece having excellent heat dissipation characteristics. An object of the present invention is to provide a printed circuit board that can effectively dissipate heat.
Specifically, for example, the above-mentioned problem that could not be achieved by the prior art “The thermal resistance value cannot be improved, the metal piece jumps out, dents or tilts, the thermal resistance value varies, the metal The problem of falling or falling off of the piece, breakage of the printed circuit board, etc. "is solved by improving the structure and process of the printed circuit board. It is possible to efficiently transfer the heat generated from the components to the heat sink bonded to the back surface of the printed circuit board.

In order to achieve the above object, in the present invention, a printed circuit board on which a heat generating component is mounted has the following configuration.
That is, the printed circuit board is provided with a hole at a position where the heat generating component is mounted on the surface of the printed circuit board, and metal pieces protruding from the surface of the printed circuit board in the hole (for example, each of the front surface and the back surface of the printed circuit board) A metal piece protruding from the surface, and pressurizing and deforming the metal piece, the surface of the printed circuit board and the metal piece (for example, each of the front and back surfaces of the printed circuit board and the deformed metal piece) Each of the front surface and the back surface was formed to have the same height.

Therefore, for example, when embedding a metal piece in the substrate, by making the thickness of the metal piece larger than the thickness of the hole in the substrate, applying a pressing process to the metal piece from above and below, The metal piece can be spread laterally and fixed to the substrate at a fixed position. For example, when mounting a surface-mount component that generates heat, the surface-mount component is provided via a metal piece with excellent heat dissipation characteristics. It is possible to realize a printed circuit board that can effectively dissipate the heat.
In the present application, the height of “same” includes not only a completely identical height but also a “substantially identical” to some extent that is practically effective.

Here, various substrates may be used as the printed circuit board. For example, if the present invention is applicable, the name may be another name.
Also, various types of heat generating components may be used. For example, this is suitable when surface mounting components are used.
Moreover, various things may be used as the relationship between the size of the surface of the heat generating component and the size of the surface of the metal piece (the size of the hole for inserting the metal piece).

The printed circuit board according to the present invention has the following configuration as one configuration example.
That is, an uneven portion was provided on the side surface (inner side) of the hole.
Therefore, for example, the fixed state of the metal piece to the printed circuit board can be further strengthened.
Here, various shapes may be used as the shape of the uneven portion.

The present invention can also provide a method of forming a printed circuit board as described above.
As an example, in a method of forming a printed circuit board on which a heat generating component is mounted, a hole is provided at a position where the heat generating component is mounted on the surface of the printed circuit board, and a metal piece protruding from the surface of the printed circuit board is placed in the hole. By pressing and deforming the metal piece, the surface of the printed board and the metal piece are processed to have the same height, thereby forming the printed board.

  As described above, according to the printed circuit board or the like according to the present invention, for example, when mounting a surface-mounted component that generates heat, the heat of the surface-mounted component is effectively radiated through the metal piece having excellent heat dissipation characteristics. be able to.

(A)-(c) is a figure which shows the structural example of the printed circuit board which embedded the metal piece which concerns on one Example of this invention. (A)-(g) is a figure which shows an example of the process until it obtains the printed circuit board which embedded the metal piece which concerns on one Example of this invention. (H)-(o) is a figure which shows an example of the process until it obtains the printed circuit board which embedded the metal piece which concerns on one Example of this invention. (A)-(e) is a figure which shows an example which employ | adopted the printed circuit board which embedded the metal piece which concerns on one Example of this invention, and mounted the heat generating member. (A)-(e) is a figure which shows an example of the structure of the printed circuit board which mounts the heat-emitting component based on the prior art 1. FIG. (A)-(b) is a figure which shows an example of the structure of the printed circuit board which mounts the heat-emitting component based on the prior art 2. FIG. (A)-(d) is a figure which shows an example of the structure of the printed circuit board which mounts the heat-emitting component based on the prior art 2. FIG. (A)-(b) is a figure which shows an example of the structure of the printed circuit board which mounts the heat-emitting component which concerns on the prior art 3. FIG.

Embodiments according to the present invention will be described with reference to the drawings.
1A to 1C show an example of the structure of a printed board in which a metal piece according to an embodiment of the present invention is embedded.
FIGS. 2A to 2G and FIGS. 3H to 3O show an example of a process for obtaining a printed circuit board embedded with a metal piece according to an embodiment of the present invention.
4A to 4E show an example in which a heat generating member is mounted using a printed circuit board in which a metal piece according to one embodiment of the present invention is embedded.

In FIG. 1, (a) front surface, (b) AA ′ portion, (c) back surface are shown.
2, (a) front surface, (b) AA ′ portion, (c) back surface, (d) BB ′ portion, (e) surface, (f) AA ′ portion, (g) back surface , Shows.
In FIG. 3, (h) BB ′ portion, (i) one provided with a pedestal 15, (j) surface, (k) AA ′ portion, (l) back surface, (m) surface, (n ) AA ′ portion, (o) back side.
In FIG. 4, (a) front surface, (b) AA ′ portion, (c) back surface, (d) BB ′ portion, (e) those provided with a heat sink 20 are shown.

  In FIG. 1 to FIG. 4, reference numerals are printed circuit board 1, metal piece 2, long hole through hole land 3, heat generating component land 4, pattern 5, long hole through hole 6, pattern 7, solder 8, long hole. Through hole convex portion 9, plated portion 10, drill hole 11, gap 12, and metal piece 13 spread laterally by pressing (metal piece 2 is pressed and the same as metal piece 2) , Metal 14 of press machine, pedestal 15 of press machine, terminal of heat generating component (transistor source terminal) 16, solder 17, terminal of heat generating component (gate terminal of transistor) 18, terminal of heat generating component (drain of transistor) A terminal 19, a heat radiating plate 20, for example, a heat generating component 21 which is a surface mounting component that generates heat, solder 22, a terminal surface 28, and a terminal surface 29 are shown.

First, an example of a process until the structure shown in FIG. 1 is formed will be described with reference to FIGS.
A plurality of drill holes 11 are formed in a linear direction at a pitch of about 0.7 mm using a drill having a diameter of 1.7 mm on a printed circuit board (double-sided board) before pattern formation. Thereby, a plurality of convex portions 9 having a height of about 80 μm formed by the drill holes 11 are formed on the side surface of the elliptical hole on the printed board. Next, in the same manner as in a normal printed circuit board manufacturing process, through-hole plating is performed to complete the long hole through-hole 6 in which the convex portion 9 is formed.

When the patterns 5 and 7 are formed on the printed circuit board in the subsequent steps, the printed circuit board 1 shown in FIGS. 2A to 2C is completed.
As shown in FIG. 2D, the metal piece 2 is inserted into the long hole through hole 6 in which the convex portion 9 shown in FIGS. 2A to 2C is formed. The shape and area of the front and back surfaces of the metal piece 2 to be used is a rectangle that is very similar to the shape of the terminal surface 28 of the surface mount component connected to the metal piece 2 (see FIG. 4A) in order to transfer heat most efficiently. Alternatively, an elliptical shape is used so as to obtain the maximum area.
Here, for example, when a copper piece (width 1.6 mm, length 7 mm, thickness 0.8 mm) having a rectangular shape is used as the metal piece 2, the thermal resistance value is about 0.18 ° C./W. As compared with the prior arts 1 and 2, the best value is obtained, and the thermal resistance value can be improved.

  Next, as shown in FIGS. 2E to 2G, the metal piece 2 comes into contact with each vertex of the convex portion 9 and remains on the printed circuit board 1 due to frictional resistance generated by the contact. At this time, the insertion position accuracy (vertical direction) of the metal piece 2 fastened to the printed board 1 may be such that it does not fall off. Further, as shown in FIG. 3H, the thickness of the metal piece 2 is set to 0.8 mm, which is larger than the thickness 0.7 mm of the printed circuit board 1.

  Next, as shown in FIG. 3 (i), the metal piece 2 is compressed together with the printed board 1 by a press machine. The compressing strength of the press work is about 12t. At this time, since the metal piece 2 is previously thicker (0.8 mm) than the thickness 0.7 mm of the printed circuit board 1, the metal piece 2 has a thickness of the printed circuit board 1 due to the compression pressure from the vertical direction of the press working. It is crushed to 0.7 mm. Here, the crushed metal piece 13 spreads in the lateral direction, but the apex of the convex portion 9 formed on the printed circuit board 1 is crushed, so that this acts as a cushion, and an excessive load (force) is applied to the printed circuit board 1. Never give to. Thereby, the force which the metal piece 2 added to the printed circuit board 1 spreads in a horizontal direction is reduced, and damage to the printed circuit board 1 can be prevented.

Here, three maximum effects (advantages 1 to 3) obtained by compressing the metal piece 2 together with the printed circuit board 1 by pressing are described.
(Advantage 1) The first is that the front and back surfaces of the metal piece 13 compressed by pressing are in the same position as the front and back surfaces of the printed circuit board 1, and the front and back surfaces are uniform. As a result, the metal piece 13 does not protrude, dent, or tilt, and the heat generating component 21 mounted on the printed circuit board 1 is normal (the terminal of the surface mount component is floated, the solder is not connected, and the component is tilted. The mounting failure due to the unevenness and inclination of the metal piece 13 can be prevented.

  (Advantage 2) Secondly, even if the position of the metal piece 2 inserted into the printed circuit board 1 is slightly shifted up and down, the metal piece 2 can be placed and fixed at the center position of the printed circuit board 1 by pressing. it can. As a result, as shown in FIGS. 2E to 2G, the insertion position accuracy (vertical direction) of the metal piece 2 fastened to the printed circuit board 1 does not fall off.

  (Advantage 3) Third, when pressing is performed, the force with which the metal piece 13 is fixed to the printed board 1 shown in FIG. 3J is the force (friction) shown in FIG. It becomes larger than the resistance. Thereby, even if the solder melts when air is blown in the solder leveler process performed in the next process or when reflow is performed after mounting the parts, it is possible to prevent the metal piece 13 from being inclined and dropped or dropped.

  A state in which the solder leveler process is performed after the above-described press working and the gap 12 shown in FIGS. 3J to 3L is filled with solder becomes the state shown in FIGS. This is the structure of the printed circuit board 1 of this example shown in FIGS. 1A to 1C, which is completed by the above-described novel process.

Next, referring to FIG. 4, an example of a more specific embodiment using the printed circuit board 1 of this example is shown.
FIG. 4 shows a state where the heat generating component 21 is mounted on the printed circuit board 1 in which the metal piece 13 employed in this example is embedded.
The assembly process for obtaining the states shown in FIGS. 4 (a) to 4 (d) will be described.
The paste-like cream solder is printed on the lands 4 and the metal pieces 13 formed on the printed circuit board 1. A heat-generating component 21 is mounted thereon and put into a reflow furnace. At this time, due to the effect of pressing the metal piece 13 together with the printed circuit board 1 (first effect described above), the heat generating component 21 is normal (the terminal of the surface mount component is floated, the solder is not connected, and the component is not connected). It is mounted in a state where there is no inclination, and mounting defects due to the unevenness of the metal piece 13 can be prevented.

FIG. 4 (e) shows a state in which the heat sink 20 is connected after the heat generating component 21 is mounted on the printed circuit board 1 after being put into the reflow furnace.
As shown in FIG. 4 (e), the metal piece 13 is fixed by the effect of press working (the third effect described above). It does not occur.

  As described above, due to the effect of the press work described above, the connection surfaces of the printed circuit board 1, the metal piece 13, and the heat sink 20 can be closely connected with the solders 17 and 22 without any gaps, and solder unconnected. Can be prevented. As a result, the heat generated from the heat generating component 21 can be efficiently transmitted to the heat sink 20 via the metal piece 13. It should be noted that the occurrence of the variation in the thermal resistance value due to the variation in the shape of the metal piece 13 can be solved by suppressing the variation in the shape by manufacturing the metal piece 13 with a mold and the variation in the thermal resistance value. it can.

As described above, in the present example, in the printed circuit board 1 on which the heat-generating surface-mounted component is mounted, the metal piece 2 is arranged in the printed board 1 on the lower surface side of the surface-mounted component, and the metal piece 2 is inserted. The convex part 9 was provided in the side surface of 1 hole (elongate through hole 6).
In this example, a step of compressing the metal piece 2 together with the printed circuit board 1 by press working is added.
Moreover, in this example, the front and back shape of the metal piece 2 described above was a rectangle or an ellipse that closely resembled the shape of the terminal of the surface mount component connected to the metal piece 2.
In this example, as a preferred embodiment, the metal of the metal piece 2 described above is copper or a metal having good solder wettability.
Moreover, in this example, the base material of the printed circuit board 1 was made into the glass epoxy material, the composite material, or the paper phenol material as a preferable aspect.

As a specific example, in the printed circuit board 1 of this example, it arrange | positions so that the metal piece 2 may protrude from a board | substrate, pressurizes the metal piece 2 which protruded, the metal piece 2 is deformed by the said pressurization, and this metal piece 2 Due to this deformation, the substrate surface and the metal piece 2 are made to have the same height (flat), thereby increasing the friction coefficient. Furthermore, when the metal piece 2 is deformed by press work by providing an uneven shape (in this example, the convex portion 9) on the side surface of the through hole (in this example, the long hole through hole 6), The friction coefficient is further increased by bringing the substrate into close contact. In addition, the present applicant (inventor) has confirmed that the frictional force is improved after the press work than before the press work.
In this way, in this example, when the metal piece 2 for heat dissipation is embedded in the substrate, the metal piece 2 is fixed by the uneven portion by providing the unevenness inside the through hole of the substrate and embedding the metal piece 2 by pressing. To do.

  For example, in the conventional technique, when a metal piece is embedded in a printed board, a gap is generated between the heat radiating plate and the metal piece, resulting in a problem that heat dissipation is not performed efficiently. On the other hand, in this example, when the metal piece 2 is embedded in the printed circuit board 1, it can be inserted so that the surface of the printed circuit board 1 and the surface of the metal piece 2 are flat. There is no gap between 20 and the metal piece 2 (metal piece 13), and the heat dissipation efficiency can be improved.

  As described above, by using the printed circuit board 1 of this example, for example, “the thermal resistance value can be improved, the unevenness and inclination of the metal piece 13 with respect to the front and back surfaces of the printed circuit board 1 can be prevented. It is possible to obtain effects such as “variation of values can be suppressed, falling and dropping of the metal pieces 13 can be prevented, and damage to the printed circuit board 1 can be prevented”. Furthermore, in this example, since the heat generating component 21, the printed circuit board 1, and the heat radiating plate 20 can be in close contact with each other, the heat generated from the heat generating component 21 is bonded to the back surface of the printed circuit board 1. Can be transmitted efficiently.

  In this example, in the printed circuit board 1 on which the heat generating component 21 is mounted, a hole (in this example, a long hole through hole 6) is provided in the position where the heat generating component 21 is mounted on the surface of the printed circuit board 1. By inserting a metal piece 2 protruding from the surface of the printed board 1 and pressurizing and deforming the metal piece 2, the surface of the printed board 1 and the metal piece 2 (deformed metal piece 13) have the same height. It is formed by processing. Moreover, the uneven | corrugated shaped part (in this example, the convex part 9) was provided in the side surface of the above-mentioned hole 6. FIG.

  1, 101 ... Printed circuit board, 2, 102 ... Metal piece, 3. Long hole through hole land, 4, 104 ... Heat generating component land, 5, 105 ... Pattern, 6 ... Long hole through hole 7, 107 ... Pattern, 8. Solder, 9. Throw hole through-hole, 10 .... Plated part, 11 .... Drill hole, 12 .... Gap, 13 .... Lateral by pressing Expanded metal piece, 14 .... Metal of press machine, 15 .... Base of press machine, 16, 116 ... Terminal of heat-generating component (transistor source terminal), 17, 117 ... Solder, 18, 118 ..Heat-generating component terminals (transistor gate terminals) 19, 119.-Heat-generating component terminals (transistor drain terminals) 20, 120.-Heat sinks 21, 121.-Heat-generating components, 2, 122 ... Solder 123 ... Glue 124 ... Gap 125 ... Through hole 126 ... Space 127 ... Copper cylinder 28/128 ... Terminal surface 29/129 ... Terminal surface,

Claims (3)

  1. In a printed circuit board that mounts heat-generating components,
    A hole is provided at a position where the heat generating component is mounted on the surface of the printed circuit board, a metal piece protruding from the surface of the printed circuit board is inserted into the hole, and the metal piece is pressed and deformed, thereby Formed by processing so that the surface and the metal piece have the same height,
    A printed circuit board characterized by that.
  2. The printed circuit board according to claim 1,
    An uneven shape portion was provided on the side surface of the hole,
    A printed circuit board characterized by that.
  3. In a method of forming a printed circuit board on which a heat generating component is mounted,
    A hole is provided at a position where the heat generating component is mounted on the surface of the printed circuit board, a metal piece protruding from the surface of the printed circuit board is inserted into the hole, and the metal piece is pressed and deformed, thereby Process the surface and the metal piece to the same height,
    Forming the printed circuit board.
JP2009050786A 2009-03-04 2009-03-04 Printed circuit board and printed circuit board manufacturing method Active JP5351563B2 (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102781158A (en) * 2011-05-09 2012-11-14 代芳 PCB (Printed Circuit Board) technology capable of increasing heat dissipation effect
CN103096638A (en) * 2011-10-27 2013-05-08 北大方正集团有限公司 Press-in type high thermal conductive printed circuit board (PCB) and manufacture method thereof
WO2013179527A1 (en) * 2012-06-01 2013-12-05 日本電気株式会社 Electronic component having shield case
JP2015018857A (en) * 2013-07-09 2015-01-29 三菱電機株式会社 High heat dissipation substrate, heat dissipation structure of component
JP2016195192A (en) * 2015-04-01 2016-11-17 オムロンオートモーティブエレクトロニクス株式会社 Printed circuit board and electronic device
DE102016208557A1 (en) 2015-05-19 2016-11-24 Omron Automotive Electronics Co., Ltd. Printed circuit board and electronic device

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JPS5544747A (en) * 1978-09-26 1980-03-29 Fujitsu Ltd Manufacture of dielectric substrate
JPH0697331A (en) * 1992-07-15 1994-04-08 Motorola Inc Pad-array semiconductor provided with heat conductor and its manufacture

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544747A (en) * 1978-09-26 1980-03-29 Fujitsu Ltd Manufacture of dielectric substrate
JPH0697331A (en) * 1992-07-15 1994-04-08 Motorola Inc Pad-array semiconductor provided with heat conductor and its manufacture

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102781158A (en) * 2011-05-09 2012-11-14 代芳 PCB (Printed Circuit Board) technology capable of increasing heat dissipation effect
CN103096638A (en) * 2011-10-27 2013-05-08 北大方正集团有限公司 Press-in type high thermal conductive printed circuit board (PCB) and manufacture method thereof
WO2013179527A1 (en) * 2012-06-01 2013-12-05 日本電気株式会社 Electronic component having shield case
JP2015018857A (en) * 2013-07-09 2015-01-29 三菱電機株式会社 High heat dissipation substrate, heat dissipation structure of component
JP2016195192A (en) * 2015-04-01 2016-11-17 オムロンオートモーティブエレクトロニクス株式会社 Printed circuit board and electronic device
DE102016208557A1 (en) 2015-05-19 2016-11-24 Omron Automotive Electronics Co., Ltd. Printed circuit board and electronic device
JP2016219562A (en) * 2015-05-19 2016-12-22 オムロンオートモーティブエレクトロニクス株式会社 Printed board and electronic system
US9924590B2 (en) 2015-05-19 2018-03-20 Omron Automotive Electronics Co., Ltd. Printed board and electronic apparatus

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