CN201657487U - Circuit board radiating structure - Google Patents
Circuit board radiating structure Download PDFInfo
- Publication number
- CN201657487U CN201657487U CN2010201592920U CN201020159292U CN201657487U CN 201657487 U CN201657487 U CN 201657487U CN 2010201592920 U CN2010201592920 U CN 2010201592920U CN 201020159292 U CN201020159292 U CN 201020159292U CN 201657487 U CN201657487 U CN 201657487U
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- CN
- China
- Prior art keywords
- insulating barrier
- copper foil
- aluminium plate
- wiring board
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a circuit board radiating structure, comprising a radiating aluminium plate, a first insulating layer and a copper foil layer, wherein the first insulating layer is arranged on the top surface and the bottom surface of the radiating aluminium plate; the copper foil layer is arranged on the first insulating layer; the corresponding positions of the radiating aluminium plate, the first insulating layer and the copper foil layer are respectively provided with element holes for inserting electronic elements, wherein the inner side wall of the element hole of the radiating aluminium plate is provided with a second insulating layer. Since the insulating layer is arranged on the inner side wall of the element hole of the radiating aluminium plate, the circuit board radiating structure solves the problem of air bubbles at plugholes, cavities in the holes and recesses of the copper foil, improves the yield of products and reduces the production cost.
Description
Technical field
The utility model relates to a kind of circuit board structure, is specifically related to the improvement to the wiring board radiator structure.
Background technology
Along with popularizing and extensive use of electronic product, the circuit of printed circuit board (PCB) is got over complicated, the element that circuit board surface is connected constantly increases, so that circuit board can produce the heating phenomenon in use, for development and the demand that adapts to different electronic products, the aluminium base with heat sinking function has also obtained utilization and development.
Aluminium base is divided into sandwich and single inclined to one side two kinds of structures, promptly increases metal aluminum sheet at the monolateral or interlayer of former PCB product and increases radiating effect.Its main purpose is exactly in order to dispel the heat, with the quality that improves electronic product and prolong product useful life.At present the inclined to one side constructed products of aluminium sheet list has in the industry cycle become ripe, but sandwich aluminium base structure still is in the development process, and how guaranteeing especially to insulate between the aluminium sheet of component hole and laminboard layer on the wiring board has become the difficult problem of industry key breakthrough.
In the prior art, the general method that adopts printing resin consent and direct pressing insulating cement consent that insulate in the aluminium sheet hole, oil is not printed in the existence of printing resin consent and there is the problem in bubble and cavity in consent, and costs an arm and a leg, and is not suitable for producing in batches; And adopt direct pressing insulating cement consent, also there is the Copper Foil depression problem on bubble and the wiring board in its consent.
Thereby the radiator structure of existing line plate is still waiting to improve and improve.
The utility model content
In view of above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide a kind of wiring board radiator structure, can prevent to produce in the consent problem of bubble and Copper Foil depression.
In order to achieve the above object, the utility model has been taked following technical scheme:
A kind of wiring board radiator structure comprises heat-dissipating aluminium plate, is arranged on first insulating barrier and the copper foil layer that is arranged on described first insulating barrier on this heat-dissipating aluminium plate end face and the bottom surface; The component hole that is provided with in the relevant position of described heat-dissipating aluminium plate, insulating barrier and copper foil layer, wherein, the madial wall of the component hole of described heat-dissipating aluminium plate is provided with second insulating barrier.
Described wiring board radiator structure, wherein, described second insulating barrier is provided with a conductive layer.
Described wiring board radiator structure, wherein, described conductive layer is the copper conductive layer.
Described wiring board radiator structure, wherein, the matsurface of described copper foil layer and described first insulating barrier are fitted.
The wiring board radiator structure that the utility model provides is provided with insulating barrier owing to adopted on the madial wall of the component hole of heat-dissipating aluminium plate, has solved the problem that consent bubble, hole in cave in cavity and Copper Foil, has improved the product yield, has reduced production cost.
Description of drawings
Fig. 1 is the structural representation of the utility model wiring board;
Fig. 2 is a heat-dissipating aluminium plate schematic top plan view of the present utility model.
Embodiment
The utility model provides a kind of wiring board radiator structure, and is clearer, clear and definite for making the purpose of this utility model, technical scheme and effect, below with reference to accompanying drawing and give an actual example the utility model is further described.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
See also Fig. 1 and Fig. 2, wiring board radiator structure of the present utility model comprises heat-dissipating aluminium plate 100, first insulating barrier 200 and copper foil layer 300, described first insulating barrier 200 is arranged on the end face and bottom surface of this heat-dissipating aluminium plate 100, this copper foil layer 300 is separately positioned on described first insulating barrier 200, and the matsurface of this copper foil layer 300 and described first insulating barrier 200 are fitted, to increase the engaging force between the copper foil layer 300 and first insulating barrier 200.
Relevant position at described heat-dissipating aluminium plate 100, first insulating barrier 200, copper foil layer 300 is provided with the component hole 400 that is used to insert electronic component, and the madial wall of the component hole 400 of described heat-dissipating aluminium plate 100 is provided with second insulating barrier 500.This second insulating barrier 500 make heat-dissipating aluminium plate 100 and the electronic component that inserts between isolate, thereby play insulating effect.
Wherein, described first insulating barrier 200 is PP sheet (prepreg, an epoxy resin), and described second insulating barrier 500 is made up of the PP powder.Also be provided with a conductive layer 600 on described second insulating barrier 500, this conductive layer 600 makes conducting between electronic component and each layer of the wiring board copper foil layer, and in the present embodiment, described conductive layer 600 is copper conductive layer or other electric conductivity good metal.
The manufacture method of the utility model wiring board is as follows:
On operating desk, place a copper foil layer 300 earlier, and the matsurface of this copper foil layer 300 is made progress, place one first insulating barrier 200 afterwards, aluminium sheet 100 is placed on first insulating barrier 200 then, in component hole, fill with second insulating barrier (being the PP powder) again, place first insulating barrier 200 and copper foil layer 300 afterwards successively, and make the matsurface of this copper foil layer downward, afterwards with this heating panel 100, first insulating barrier 200 and copper foil layer 300 pressings, after treating that first insulating barrier 200 and second insulating barrier 500 solidify, utilize drilling machine to bore component hole on second insulating barrier, copper facing on this component hole at last makes the sidewall and the conducting of each layer of wiring board Copper Foil of this component hole.
Wiring board radiator structure of the present utility model, owing to adopted elder generation on the madial wall of the component hole of heat-dissipating aluminium plate, insulating barrier to be set, isolate this heat-dissipating aluminium plate, solved and had bubble in the consent, reach the problem in cavity in the hole, then with this heat-dissipating aluminium plate and first insulating barrier and copper foil layer pressing, because first insulating barrier and second insulating barrier all adopt PP material (being insulation rubber), make between first insulating barrier and second insulating barrier and have adhesion strength, solved the problem of Copper Foil depression, thereby improved the product yield, reduced production cost.
More than the utility model is described in detail, for those of ordinary skills, can be improved according to the above description or conversion, and all these improve and conversion all should belong to the protection range of the utility model claims.
Claims (4)
1. a wiring board radiator structure comprises heat-dissipating aluminium plate, is arranged on first insulating barrier and the copper foil layer that is arranged on described first insulating barrier on this heat-dissipating aluminium plate end face and the bottom surface; Relevant position at described heat-dissipating aluminium plate, insulating barrier and copper foil layer is provided with component hole, it is characterized in that, the madial wall of the component hole of described heat-dissipating aluminium plate is provided with second insulating barrier.
2. according to the described wiring board radiator structure of claim 1, it is characterized in that described second insulating barrier is provided with a conductive layer.
3. according to the described wiring board radiator structure of claim 2, it is characterized in that described conductive layer is the copper conductive layer.
4. according to the described wiring board radiator structure of claim 1, it is characterized in that the matsurface of described copper foil layer and described first insulating barrier are fitted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201592920U CN201657487U (en) | 2010-04-08 | 2010-04-08 | Circuit board radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201592920U CN201657487U (en) | 2010-04-08 | 2010-04-08 | Circuit board radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201657487U true CN201657487U (en) | 2010-11-24 |
Family
ID=43122714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201592920U Expired - Fee Related CN201657487U (en) | 2010-04-08 | 2010-04-08 | Circuit board radiating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201657487U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104812167A (en) * | 2015-03-01 | 2015-07-29 | 四会富士电子科技有限公司 | High-reliability double-sided aluminum substrate and production method thereof |
| CN105764240A (en) * | 2016-01-12 | 2016-07-13 | 大连崇达电路有限公司 | Printed circuit board with double-side windowing and oil filling in holes in resistance welding ring disc and production process |
| CN106463933A (en) * | 2015-01-16 | 2017-02-22 | 株式会社自动网络技术研究所 | Circuit assembly and electrical junction box |
-
2010
- 2010-04-08 CN CN2010201592920U patent/CN201657487U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106463933A (en) * | 2015-01-16 | 2017-02-22 | 株式会社自动网络技术研究所 | Circuit assembly and electrical junction box |
| CN106463933B (en) * | 2015-01-16 | 2018-06-19 | 株式会社自动网络技术研究所 | circuit structure and electric connection box |
| CN104812167A (en) * | 2015-03-01 | 2015-07-29 | 四会富士电子科技有限公司 | High-reliability double-sided aluminum substrate and production method thereof |
| CN105764240A (en) * | 2016-01-12 | 2016-07-13 | 大连崇达电路有限公司 | Printed circuit board with double-side windowing and oil filling in holes in resistance welding ring disc and production process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101124 Termination date: 20190408 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |