CN106341941A - Manufacturing method for locally burying copper block and conducting internal-layer lead wire - Google Patents
Manufacturing method for locally burying copper block and conducting internal-layer lead wire Download PDFInfo
- Publication number
- CN106341941A CN106341941A CN201610905178.XA CN201610905178A CN106341941A CN 106341941 A CN106341941 A CN 106341941A CN 201610905178 A CN201610905178 A CN 201610905178A CN 106341941 A CN106341941 A CN 106341941A
- Authority
- CN
- China
- Prior art keywords
- copper
- copper billet
- layer
- motherboard
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing method for locally burying a copper block and conducting an internal-layer lead wire. The method comprises the following steps: 1, arranging a groove and burying copper; 2, filling; 3, pressing; 4, boring; 5, metallization; and 6, subsequent processing. By use of high pressure in a lamination process and heat curing of prepreg scaled resin flow glue, the copper block or other heat dissipation conductors are fixed in a through groove of a motherboard substrate layer, the problem of poor binding force of the copper block or the heat dissipation conductors is solved, a through hole is drilled at a junction of the copper block and a motherboard printed circuit board (PCB) by use of a drilling machine tool, the aperture size is designed according to the interval between the copper block and an internal layer of the motherboard PCB, it is ensured that the copper block is connected with an internal-layer design copper lead wire, the drilled through hole is plated with a layer of copper with a thickness of 30[mu]m by use of an electroplating flow, and the copper block and the internal-layer copper lead wire are conducted. A PCB manufactured by use of the manufacturing method solves the problem of incapability of conducting the copper block with the buried motherboard internal layer and has the advantages of good heat dissipation effect, huge market potential and wide prospect.
Description
Technical field
The invention belongs to building materials field, it is more particularly related to copper billet is imbedded in a kind of local lead with inner conductor
Logical manufacture method.
Background technology
With the development of electronics industry, electronic product volume is less and less, and power density is increasing, how to seek to radiate
And the best approach of structure design, just become a huge challenge of current electronics industry design.The radiating side commonly using at present
Method typically has using two kinds of welding metal substrate on metal basal board making circuit board, circuit board, but both technique all exists
Metal material consumes shortcoming big, that complex manufacturing technology, high cost, volume are heavy.Some heat radiation powers are required relatively
Low occasion, the complicated technology of higher processing cost and welding metal substrate cannot meet the market demand, current circuit
Plate manufacturing still has a kind of newer method to solve radiating and Cost Problems local embedment copper billet pcb plate, but embedment copper billet
Circuit board is to be insulated by insulating resin glue it is impossible to turn on internal layer, the method can effectively solve because of the copper billet of embedment with motherboard
The certainly making bottleneck of such circuit board.
Content of the invention
Problem to be solved by this invention is to provide a kind of local to imbed copper billet to turn on manufacture method with inner conductor.
To achieve these goals, the technical scheme that the present invention takes is:
A kind of local is imbedded copper billet and is turned on manufacture method with inner conductor, comprises the steps:
(1) fluting buries copper
First on central layer with solidification bury copper region mill out bigger than copper billet size bury copper groove, slotted, after fluting
Embedment metal copper billet；
(2) fill
By pp cured sheets under high temperature, high pressure, it is changed into the space between liquid filler metal copper billet and motherboard pcb of flowing；
(3) press
By metal copper billet, central layer, pp solidification glue passes through high temperature, high pressure is imbedded in motherboard pcb；
(4) hole
Using drilling hole machine tool by copper billet and motherboard pcb intersection holes drilled through, described boring size be 0.2-2.0mm it is ensured that
Metal copper billet is connected with pcb motherboard by internal layer copper conductor；
(5) metallize
By the borehole wall metallization of printed wiring board, plate last layer copper, make conducting between embedment copper billet and pcb；
(6) following process
Printed wiring board following process, is fabricated to circuit board finished product.
Preferably, described step (1) buries copper groove 0.1mm-0.2mm bigger than metal copper billet.
Preferably, described step (1) metal copper billet needs to carry out brown to copper billet before burying copper.
Preferably, described step (2) pp cured sheets are made up of fr4 material.
Preferably, described step (5) printed wiring board first passes through pretreatment before metallization.
Preferably, the pretreatment of described step (5) includes alkaline degreasing, roughening, preimpregnation and activates.
Preferably, described step (5) plates a layer thickness 10-50um copper in holes drilled through.
Beneficial effect: the invention provides copper billet is imbedded in a kind of local turns on manufacture method with inner conductor, open including (1)
Groove buries copper；(2) fill；(3) press；(4) hole；(5) metallize；(6) following process, using the high pressure and half of lamination process
The resin gummosis of cured sheets is heated to solidify and copper billet or other heat dissipation conductors is fixed in motherboard substrate layer groove, solves copper billet
Or the adhesion problem of heat dissipation conductor, using drilling hole machine tool by copper billet and motherboard pcb intersection holes drilled through, pore size according to
Copper billet is with motherboard pcb internal layer line space design it is ensured that copper billet is connected with internal layer design copper conductor, using plating flow process in holes drilled through
Plating a layer thickness 30um copper, conducting copper billet and internal layer copper conductor, the printed wiring board solution made using this kind of manufacture method
Determined copper billet with embedment motherboard internal layer cannot conduction problem, there is good heat dissipation effect, market potential is huge, and prospect is wide
Wealthy.
Specific embodiment
Embodiment 1:
A kind of local is imbedded copper billet and is turned on manufacture method with inner conductor, comprises the steps:
(1) fluting buries copper
First on central layer with solidification bury copper region mill out bigger than copper billet size bury copper groove, slotted, after fluting
Embedment metal copper billet, described bury copper groove 0.1mm bigger than metal copper billet, described metal copper billet needs to carry out palm fibre to copper billet before burying copper
Change；
(2) fill
By pp cured sheets under high temperature, high pressure, it is changed into the space between liquid filler metal copper billet and motherboard pcb of flowing,
Described pp cured sheets are made up of fr4 material；
(3) press
By metal copper billet, central layer, pp solidification glue passes through high temperature, high pressure is imbedded in motherboard pcb；
(4) hole
Using drilling hole machine tool by copper billet and motherboard pcb intersection holes drilled through, described boring size is 0.2mm it is ensured that metal
Copper billet is connected with pcb motherboard by internal layer copper conductor；
(5) metallize
By the borehole wall metallization of printed wiring board, plate last layer copper, make conducting between embedment copper billet and pcb, described
Printed wiring board first passes through pretreatment before metallization, and described pretreatment includes alkaline degreasing, roughening, preimpregnation and activates, described
In holes drilled through, copper thickness is 10um；
(6) following process
Printed wiring board following process, is fabricated to circuit board finished product.
Embodiment 2:
A kind of local is imbedded copper billet and is turned on manufacture method with inner conductor, comprises the steps:
(1) fluting buries copper
First on central layer with solidification bury copper region mill out bigger than copper billet size bury copper groove, slotted, after fluting
Embedment metal copper billet, described bury copper groove 0.15mm bigger than metal copper billet, described metal copper billet needs to carry out palm fibre to copper billet before burying copper
Change；
(2) fill
By pp cured sheets under high temperature, high pressure, it is changed into the space between liquid filler metal copper billet and motherboard pcb of flowing,
Described pp cured sheets are made up of fr4 material；
(3) press
By metal copper billet, central layer, pp solidification glue passes through high temperature, high pressure is imbedded in motherboard pcb；
(4) hole
Using drilling hole machine tool by copper billet and motherboard pcb intersection holes drilled through, described boring size is 1.1mm it is ensured that metal
Copper billet is connected with pcb motherboard by internal layer copper conductor；
(5) metallize
By the borehole wall metallization of printed wiring board, plate last layer copper, make conducting between embedment copper billet and pcb, described
Printed wiring board first passes through pretreatment before metallization, and described pretreatment includes alkaline degreasing, roughening, preimpregnation and activates, described
In holes drilled through, copper thickness is 10-50um；
(6) following process
Printed wiring board following process, is fabricated to circuit board finished product.
Embodiment 3:
A kind of local is imbedded copper billet and is turned on manufacture method with inner conductor, comprises the steps:
(1) fluting buries copper
First on central layer with solidification bury copper region mill out bigger than copper billet size bury copper groove, slotted, after fluting
Embedment metal copper billet, described bury copper groove 0.2mm bigger than metal copper billet, described metal copper billet needs to carry out palm fibre to copper billet before burying copper
Change；
(2) fill
By pp cured sheets under high temperature, high pressure, it is changed into the space between liquid filler metal copper billet and motherboard pcb of flowing,
Described pp cured sheets are made up of fr4 material；
(3) press
By metal copper billet, central layer, pp solidification glue passes through high temperature, high pressure is imbedded in motherboard pcb；
(4) hole
Using drilling hole machine tool by copper billet and motherboard pcb intersection holes drilled through, described boring size is 2.0mm it is ensured that metal
Copper billet is connected with pcb motherboard by internal layer copper conductor；
(5) metallize
By the borehole wall metallization of printed wiring board, plate last layer copper, make conducting between embedment copper billet and pcb, described
Printed wiring board first passes through pretreatment before metallization, and described pretreatment includes alkaline degreasing, roughening, preimpregnation and activates, described
In holes drilled through, copper thickness is 50um；
(6) following process
Printed wiring board following process, is fabricated to circuit board finished product.
After process above, take out sample respectively, measurement result is as follows:
| Detection project | Embodiment 1 | Embodiment 2 | Embodiment 3 | Prior art index |
| Thermal diffusivity | Typically | Good | Good | Difference |
| Yields/% | 93 | 95 | 92 | 90 |
| Cost | Low | Low | Medium | High |
Can be drawn according to above table data, when embodiment 2 parameter, printed wiring board is than the thermal diffusivity of existing process
Energy is good and yields, also above prior art index, overcomes high cost, the existing process bottleneck such as complex manufacturing technology.
The invention provides copper billet is imbedded in a kind of local turns on manufacture method with inner conductor, bury copper including (1) fluting；
(2) fill；(3) press；(4) hole；(5) metallize；(6) following process, using high pressure and the prepreg of lamination process
Resin gummosis be heated solidification copper billet or other heat dissipation conductors are fixed in motherboard substrate layer groove, solve copper billet or dissipate
The adhesion problem of heat conductor, using drilling hole machine tool by copper billet and motherboard pcb intersection holes drilled through, pore size according to copper billet with
Motherboard pcb internal layer line space design, it is ensured that copper billet is connected with internal layer design copper conductor, plates one layer using plating flow process in holes drilled through
Thickness 30um copper, conducting copper billet and internal layer copper conductor, solve copper using the printed wiring board that this kind of manufacture method is made
Block with embedment motherboard internal layer cannot conduction problem, there is good heat dissipation effect, market potential is huge, has a extensive future.
Above-described is only the preferred embodiment of the present invention it is noted that for those of ordinary skill in the art
For, without departing from the concept of the premise of the invention, some deformation can also be made and improve, these broadly fall into the present invention
Protection domain.
Claims (7)
1. a kind of local imbed copper billet with inner conductor conducting manufacture method it is characterised in that: comprise the steps:
(1) fluting buries copper
First on central layer with solidification bury copper region mill out bigger than copper billet size bury copper groove, slotted, imbedded after fluting
Metal copper billet；
(2) fill
By pp cured sheets under high temperature, high pressure, it is changed into the space between liquid filler metal copper billet and motherboard pcb of flowing；
(3) press
By metal copper billet, central layer, pp solidification glue passes through high temperature, high pressure is imbedded in motherboard pcb；
(4) hole
Using drilling hole machine tool by copper billet and motherboard pcb intersection holes drilled through, described boring size is 0.2-2.0mm it is ensured that metal
Copper billet is connected with pcb motherboard by internal layer copper conductor；
(5) metallize
By the borehole wall metallization of printed wiring board, plate last layer copper, make conducting between embedment copper billet and pcb；
(6) following process
Printed wiring board following process, is fabricated to circuit board finished product.
2. according to a kind of local described in claim 1 imbed copper billet with inner conductor conducting manufacture method it is characterised in that: institute
State step (1) and bury copper groove 0.1mm-0.2mm bigger than metal copper billet.
3. according to a kind of local described in claim 1 imbed copper billet with inner conductor conducting manufacture method it is characterised in that: institute
Stating step (1) metal copper billet needs to carry out brown to copper billet before burying copper.
4. according to a kind of local described in claim 3 imbed copper billet with inner conductor conducting manufacture method it is characterised in that: institute
State step (2) pp cured sheets to be made up of fr4 material.
5. according to a kind of local described in claim 1 imbed copper billet with inner conductor conducting manufacture method it is characterised in that: institute
State step (5) printed wiring board and first pass through pretreatment before metallization.
6. according to a kind of local described in claim 5 imbed copper billet with inner conductor conducting manufacture method it is characterised in that: institute
State step (5) pretreatment to include alkaline degreasing, roughening, preimpregnation and activate.
7. according to a kind of local described in claim 1 imbed copper billet with inner conductor conducting manufacture method it is characterised in that: institute
State step (5) and a layer thickness 10-50um copper is plated on holes drilled through.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610905178.XA CN106341941A (en) | 2016-10-17 | 2016-10-17 | Manufacturing method for locally burying copper block and conducting internal-layer lead wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610905178.XA CN106341941A (en) | 2016-10-17 | 2016-10-17 | Manufacturing method for locally burying copper block and conducting internal-layer lead wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106341941A true CN106341941A (en) | 2017-01-18 |
Family
ID=57839991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610905178.XA Pending CN106341941A (en) | 2016-10-17 | 2016-10-17 | Manufacturing method for locally burying copper block and conducting internal-layer lead wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106341941A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107592725A (en) * | 2017-08-31 | 2018-01-16 | 深圳崇达多层线路板有限公司 | A kind of method that copper billet is buried on high multilayer printed circuit board |
| CN108987658A (en) * | 2018-03-20 | 2018-12-11 | 东莞市若美电子科技有限公司 | Complex copper aluminium double-side cell protection board manufacture craft |
| CN112719514A (en) * | 2020-11-17 | 2021-04-30 | 十四冶建设集团云南安装工程有限公司 | Method for welding red copper plate and red copper stranded wire by adopting carbon arc welding |
| CN112867286A (en) * | 2020-12-28 | 2021-05-28 | 珠海市深联电路有限公司 | Preparation method of embedded large copper plate back plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040155356A1 (en) * | 2001-09-27 | 2004-08-12 | Kyocera Corporation. | Ceramic circuit board and method for manufacturing the same |
| CN101257770B (en) * | 2008-04-16 | 2011-06-22 | 汕头超声印制板公司 | Manufacturing method for embedding heat radiating fin on printed circuit board |
| CN102625563A (en) * | 2011-01-31 | 2012-08-01 | 华通电脑股份有限公司 | Multilayer circuit board embedded with heat-conducting metal block and manufacturing method thereof |
| CN103402331A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
-
2016
- 2016-10-17 CN CN201610905178.XA patent/CN106341941A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040155356A1 (en) * | 2001-09-27 | 2004-08-12 | Kyocera Corporation. | Ceramic circuit board and method for manufacturing the same |
| CN101257770B (en) * | 2008-04-16 | 2011-06-22 | 汕头超声印制板公司 | Manufacturing method for embedding heat radiating fin on printed circuit board |
| CN102625563A (en) * | 2011-01-31 | 2012-08-01 | 华通电脑股份有限公司 | Multilayer circuit board embedded with heat-conducting metal block and manufacturing method thereof |
| CN103402331A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107592725A (en) * | 2017-08-31 | 2018-01-16 | 深圳崇达多层线路板有限公司 | A kind of method that copper billet is buried on high multilayer printed circuit board |
| CN108987658A (en) * | 2018-03-20 | 2018-12-11 | 东莞市若美电子科技有限公司 | Complex copper aluminium double-side cell protection board manufacture craft |
| CN112719514A (en) * | 2020-11-17 | 2021-04-30 | 十四冶建设集团云南安装工程有限公司 | Method for welding red copper plate and red copper stranded wire by adopting carbon arc welding |
| CN112867286A (en) * | 2020-12-28 | 2021-05-28 | 珠海市深联电路有限公司 | Preparation method of embedded large copper plate back plate |
| CN112867286B (en) * | 2020-12-28 | 2023-09-08 | 珠海市深联电路有限公司 | Preparation method of backboard embedded with large copper plate |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20170118 |