CN204119650U - A kind of three-dimensional conducting wiring board - Google Patents
A kind of three-dimensional conducting wiring board Download PDFInfo
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- CN204119650U CN204119650U CN201420589776.7U CN201420589776U CN204119650U CN 204119650 U CN204119650 U CN 204119650U CN 201420589776 U CN201420589776 U CN 201420589776U CN 204119650 U CN204119650 U CN 204119650U
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Abstract
The three-dimensional conducting wiring board of one of the present utility model; comprise substrate layer; line layer and insulating protective layer is set gradually respectively on the upper and lower surface of insulated base material layer; wherein: the substrate layer surface corresponding with the pad position of line layer circuit soldering of electronic components is provided with pit; be provided with in pit and be filled with the laminating layer of metal; the laminating layer of metal is corresponding with the pad position of line layer circuit soldering of electronic components, and metal laminating layer upper surface is connected with the laminating conducting of line layer.The utility model provides the three-dimensional conducting wiring board of one making the three-dimensional between layers conducting of integrated circuit board and ensure to stablize the pad position soldering of electronic components of conducting circuit sandwich circuit.The utility model has the technique effect of signal transmission and heat conduction, heat radiation effectively.
Description
Technical field
The utility model relates to a kind of wiring board, more particularly, particularly relates to a kind of three-dimensional conducting wiring board.
Background technology
In traditional wiring board production technology, line layer after-applied tin cream concordant with top line layer bottom die drawn is adopted to reach the effect of conducting, need in process of production to carry out stretching conducting to bottom line layer, and when the surface mounted electronic component of circuit sandwich circuit its high-temperature soldering, it stretches and the subsides of high temperature dress can cause the phenomenons such as the material of line layer is crisp, sclerosis, distortion, sometimes even can drawing crack be damaged by material, have a strong impact on the performance and used life of conducting.Therefore, the problem that must solve is how at surface mounted electronic devices and components with allow the three-dimensional between layers conducting of integrated circuit board.
Utility model content
The technical problems to be solved in the utility model is the above-mentioned deficiency for prior art, provides the three-dimensional conducting wiring board of one making the three-dimensional between layers conducting of integrated circuit board and ensure to stablize the pad position soldering of electronic components of conducting circuit sandwich circuit.The utility model has the technique effect of signal transmission and heat conduction, heat radiation effectively.
The technical solution of the utility model is such: a kind of three-dimensional conducting wiring board; comprise substrate layer; line layer and insulating protective layer is set gradually respectively on the upper and lower surface of insulated base material layer; wherein: the substrate layer surface corresponding with the pad position of line layer circuit soldering of electronic components is provided with pit; be provided with in pit and be filled with the laminating layer of metal; the laminating layer of metal is corresponding with the pad position of line layer circuit soldering of electronic components, and metal laminating layer upper surface is connected with the laminating conducting of line layer.
Above-mentioned three-dimensional conducting wiring board, pit and the laminating layer surface area of metal are wherein greater than pad position.
Above-mentioned three-dimensional conducting wiring board, the connection bit of the vertical conducting between upper and lower line layer circuit is arranged in the laminating layer of metal, pit diapire corresponding to connection bit is provided with via, the line layer of upper surface stretches downwards along via and contacts the line layer of lower surface, in the pit that areal stretch is formed, fill welding medium conducting when filling and pasting electronic component.
Above-mentioned three-dimensional conducting wiring board, via is to the line layer below downward-extension penetrates, and the line layer of upper surface pulls down in the via of the line layer extending lower surface, and its bottom contacts with the sidewalls of the line layer of lower surface and connects.
Adopt the utility model of technique scheme, pit is provided with by needing to fill the substrate layer surface of pasting electronics unit device position also right on integrated circuit, and the laminating layer of the metal arranged in pit and the laminating conducting of corresponding line layer are formed as one expanding built-in pedestal, line layer is allowed when filling and pasting electronic component, the laminating layer of metal forms permanent conducting body together with electronic component permanent weld, prevent from causing damage to line layer pad position during high-temperature soldering electronic component, and then produce the sound integrated circuit board of conduction property, effectively extend the useful life of wiring board.Meanwhile, realize that there is good heat-conducting effect by the laminating layer of built-in metal.Meanwhile, pit diapire corresponding to connection bit is provided with via, combines to stretch downwards along via to form three-dimensional conducting with the line layer physical contact of lower surface by the laminating layer of line layer and metal making upper surface.The upper and lower surface of effective conducting production method can enhance productivity, reduce energy resource consumption, strengthen electric conductivity.
Accompanying drawing explanation
Below in conjunction with the embodiment in accompanying drawing, the utility model is described in further detail, but do not form any restriction of the present utility model.
Fig. 1 is the cross-sectional view of the utility model specific embodiment 1;
Fig. 2 is the cross-sectional view of the utility model specific embodiment 2;
Fig. 3 is the cross-sectional view of the utility model specific embodiment 3;
Fig. 4 is the planar line structural representation of the utility model specific embodiment.
Embodiment
Embodiment 1; as shown in Figure 1; the three-dimensional conducting wiring board of one of the present utility model; comprise substrate layer 1; set gradually line layer 2 and insulating protective layer 3 respectively on the upper and lower surface of insulated base material layer 1, substrate layer 1 surface is provided with pit 11, is provided with and is filled with the laminating layer 4 of metal in pit 11; the laminating layer of metal 4 is corresponding with the pad position of line layer circuit soldering of electronic components 5, and metal laminating layer 4 upper surface is connected with the laminating conducting of line layer 2.
Pit 11 and the laminating layer 4 of metal wherein surface area are greater than pad position.
Embodiment 2, when as shown in Figure 2, Figure 4 shows, on the basis of embodiment 1, the connection bit A of the vertical conducting between upper and lower line layer 2 circuit is arranged in the laminating layer 4 of metal, pit 11 diapire corresponding to connection bit is provided with via 12, the line layer 2 of upper surface stretches downwards along via 12 and contacts the line layer 2 of lower surface, and in the pit that areal stretch is formed, fill welding medium 6 conducting when filling and pasting electronic component, welding medium 6 is scolding tin.
Embodiment 3, as shown in Figure 3, on the basis of embodiment 2, via 12 is to the line layer 2 below downward-extension penetrates, the line layer 2 of upper surface pulls down in the via 12 of the line layer 2 extending lower surface, and its bottom is connected with via 12 sidewall contact of the line layer 2 of lower surface.
The utility model is at concrete production stage:
(1) according to the design data of double-sided wiring board, substrate layer 1 adopt digital control drilling machine get out pit 11 and via 12;
(2) same data are adopted to get out location hole on the aluminium foil 2 of top and bottom;
(3) by bore pit 11 substrate layer 1 on the laminating layer 4 of laminating metal;
(4) will bore the substrate layer 1 of via and bore the aluminium foil 2 of location hole, location be placed on pressing and forming on traditional pressing machine or fast press in order.
(5) according to the design data of double-sided wiring board, known method integration circuit in industry is adopted;
(6) combine to stretch downwards along via by the laminating layer of line layer and metal that makes upper surface and form three-dimensional conducting with the line layer physical contact of lower surface.
(7) according to the design data of double-sided wiring board and the location hole laminating protective layer of outer surface at double-deck integrated circuit layer, soldering of electronic components position is reserved in pad position.
(8) reference lamina of double-sided wiring board makes.
(9) soldering-tin layer soldering of electronic components is set on pad position.
(10) double-sided wiring board is shaping, shipment.
In sum, the utility model, as specification and diagramatic content, makes actual sample and through repeatedly use test, from the effect of use test, provable the utility model can reach its desired object, and practical value is unquestionable.Above illustrated embodiment is only used for conveniently illustrating the utility model, not any pro forma restriction is done to the utility model, have in any art and usually know the knowledgeable, if do not depart from the utility model carry in the scope of technical characteristic, utilize the utility model disclose the Equivalent embodiments changing or modify in the done local of technology contents, and do not depart from technical characteristic content of the present utility model, all still belong in the scope of the utility model technical characteristic.
Claims (4)
1. a three-dimensional conducting wiring board, comprise substrate layer (1), upper in insulated base material layer (1), lower surface sets gradually line layer (2) and insulating protective layer (3) respectively, it is characterized in that: substrate layer (1) surface corresponding with the pad position of line layer circuit soldering of electronic components is provided with pit (11), be provided with in pit (11) and be filled with the laminating layer of metal (4), the laminating layer of metal (4) is corresponding with the pad position of line layer circuit soldering of electronic components, the laminating layer of metal (4) upper surface is connected with line layer (2) laminating conducting.
2. three-dimensional conducting wiring board according to claim 1, is characterized in that: pit (11) and the laminating layer of metal wherein (4) surface area are greater than pad position.
3. three-dimensional conducting wiring board according to claim 1, it is characterized in that: the connection bit of the vertical conducting between upper and lower line layer (2) circuit is arranged in the laminating layer of metal (4), pit (11) diapire corresponding to connection bit is provided with via (12), the line layer (2) of upper surface stretches downwards along via (12) and contacts the line layer (2) of lower surface, in the pit that areal stretch is formed, fill welding medium conducting when filling and pasting electronic component.
4. three-dimensional conducting wiring board according to claim 3, it is characterized in that: via (12) is to the line layer (2) below downward-extension penetrates, the line layer (2) of upper surface pulls down in the via (12) of the line layer (2) extending lower surface, and its bottom is connected with via (12) sidewall contact of the line layer (2) of lower surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420589776.7U CN204119650U (en) | 2014-10-13 | 2014-10-13 | A kind of three-dimensional conducting wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420589776.7U CN204119650U (en) | 2014-10-13 | 2014-10-13 | A kind of three-dimensional conducting wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204119650U true CN204119650U (en) | 2015-01-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420589776.7U Active CN204119650U (en) | 2014-10-13 | 2014-10-13 | A kind of three-dimensional conducting wiring board |
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| Country | Link |
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| CN (1) | CN204119650U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113316306A (en) * | 2020-02-26 | 2021-08-27 | 颀邦科技股份有限公司 | Circuit board |
-
2014
- 2014-10-13 CN CN201420589776.7U patent/CN204119650U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113316306A (en) * | 2020-02-26 | 2021-08-27 | 颀邦科技股份有限公司 | Circuit board |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |