CN203057695U - Ceramic circuit board - Google Patents
Ceramic circuit board Download PDFInfo
- Publication number
- CN203057695U CN203057695U CN 201320039908 CN201320039908U CN203057695U CN 203057695 U CN203057695 U CN 203057695U CN 201320039908 CN201320039908 CN 201320039908 CN 201320039908 U CN201320039908 U CN 201320039908U CN 203057695 U CN203057695 U CN 203057695U
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- CN
- China
- Prior art keywords
- circuit board
- aluminium nitride
- nitride chip
- layer
- ceramic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model discloses a ceramic circuit board, which comprises an aluminum nitride substrate and an aluminum oxide substrate, wherein the lower surface of the aluminum nitride substrate and the upper surface of the aluminum oxide substrate are provided with a metal pattern layer therebetween; the aluminum nitride substrate is provided with a plurality of connecting holes penetrating the upper and lower surfaces thereof, and the connecting holes are filled with metal columns; a silver paste welding layer is covered on the upper surface of the aluminum nitride substrate and located right above the connecting holes; and a copper circuit layer used for being electrically contacted with components is fixed on the surface, which is opposite to the connecting holes, of the silver paste welding layer. The ceramic circuit board disclosed by the utility model greatly reduces the occurrence probability that the metal surface inside the connecting hole sinks, thereby avoiding occurrence of holes effectively, and improving the reliability and the yield of products.
Description
Technical field
The utility model relates to a kind of ceramic circuit board, belongs to the circuit board technology field.
Background technology
Ceramic substrate is applied in the electronic industry at present at large, as a kind of important circuit board plate material, and LED ceramic substrate for example, it sees through can further do layings, configuration circuit etc. in electroplating surface and move on the two sides of substrate.Existing ceramic substrate have high-cooling property and corrosion-resistant, have higher insulation property and excellent high frequency characteristics, the coefficient of expansion low, stable chemical performance and thermal conductivity height, advantage such as nontoxic; But there is following technical problem:
On the ceramic substrate circuit manufacture procedure in the prior art, need with on the substrate two sides be separated from each other that circuit point does that conducting connects or when doing heat conduction between the substrate two sides and handling, betide easily and do not fill up fully in the connecting hole and hole is arranged, thereby at the yield keyholed back plate of product its bottleneck is arranged.
Secondly, the conventional ceramic circuit board has the characteristic of high rigidity simultaneously owing to it, so matter is crisp, the machine work difficulty is big, simultaneously owing to its surfacing, is difficult for also being difficult to other layer effective in forming multilayer circuit board by electroplating the realization interlayer conduction; Again, traditional circuit board advantage is single, can not have functions such as high thermal conductivity, high integration simultaneously, can not satisfy market circuit board is had high connectivity, high density, the demand that thermal conductivity is good.Therefore, how to solve the problems of the technologies described above, become the direction that those of ordinary skills make great efforts.
Summary of the invention
The utility model purpose provides a kind of ceramic circuit board, and the metal surface that this ceramic circuit board has fallen in the connecting hole greatly produces the probability of depression, thereby has effectively avoided empty generation, has improved reliability of products and yield.
For achieving the above object, the technical solution adopted in the utility model is: a kind of ceramic circuit board, comprise aluminium nitride chip and alumina substrate, has a metal pattern layer between the lower surface of this aluminium nitride chip and the upper surface of alumina substrate, have the intercommunicating pore that several connect its upper and lower surface in the described aluminium nitride chip, be filled with metal column in this intercommunicating pore; One silver medal slurry weld layer is covered in described aluminium nitride chip upper surface and is positioned at directly over the intercommunicating pore, and a copper circuit layer that is used for electrically contacting with components and parts is fixed in the opposing surface of described silver slurry weld layer and intercommunicating pore.
Further improved technical scheme is as follows in the technique scheme:
As preferably, the thickness of described aluminium nitride chip and alumina substrate is than being 1:1.2 ~ 1.5.
Because technique scheme is used, the utility model compared with prior art has following advantage and effect:
The utility model ceramic circuit board, its silver slurry weld layer is covered in described aluminium nitride chip upper surface and is positioned at directly over the intercommunicating pore, one copper circuit layer that is used for electrically contacting with components and parts is fixed in the opposing surface of described silver slurry weld layer and intercommunicating pore, because curtain coating was good before the silver slurry was uncured, the metal surface that has fallen greatly in the connecting hole produces the probability that caves in, thereby effectively avoided empty generation, improved reliability of products and yield; Secondly, ceramic sintered bodies is made up of aluminium nitride chip and alumina substrate, has a metal pattern layer between the lower surface of this aluminium nitride chip and the upper surface of alumina substrate, has high quality factor, thereby reduced high-frequency loss, and had stable temperature coefficients.
Description of drawings
Accompanying drawing 1 is the utility model ceramic circuit board structural representation.
In the above accompanying drawing: 1, aluminium nitride chip; 2, alumina substrate; 3, metal pattern layer; 4, intercommunicating pore; 5, metal column; 6, silver slurry weld layer; 7, copper circuit layer.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment 1: a kind of ceramic circuit board, comprise aluminium nitride chip 1 and alumina substrate 2, has a metal pattern layer 3 between the upper surface of the lower surface of this aluminium nitride chip 1 and alumina substrate 2, have several intercommunicating pores that connects its upper and lower surface 4 in the described aluminium nitride chip 1, be filled with metal column 5 in this intercommunicating pore 4; One silver medal slurry weld layer 6 is covered in described aluminium nitride chip 1 upper surface and is positioned at directly over the intercommunicating pore 4, and a copper circuit layer 7 that is used for electrically contacting with components and parts is fixed in the opposing surface of described silver slurry weld layer 6 and intercommunicating pore 4.
The thickness of above-mentioned aluminium nitride chip 1 and alumina substrate 2 is than being 1:1.4.
Embodiment 2: a kind of ceramic circuit board, comprise aluminium nitride chip 1 and alumina substrate 2, has a metal pattern layer 3 between the upper surface of the lower surface of this aluminium nitride chip 1 and alumina substrate 2, have several intercommunicating pores that connects its upper and lower surface 4 in the described aluminium nitride chip 1, be filled with metal column 5 in this intercommunicating pore 4; One silver medal slurry weld layer 6 is covered in described aluminium nitride chip 1 upper surface and is positioned at directly over the intercommunicating pore 4, and a copper circuit layer 7 that is used for electrically contacting with components and parts is fixed in the opposing surface of described silver slurry weld layer 6 and intercommunicating pore 4.
The thickness of above-mentioned aluminium nitride chip 1 and alumina substrate 2 is than being 1:1.3.
When adopting above-mentioned ceramic circuit board, its silver slurry weld layer is covered in described aluminium nitride chip upper surface and is positioned at directly over the intercommunicating pore, one copper circuit layer that is used for electrically contacting with components and parts is fixed in the opposing surface of described silver slurry weld layer and intercommunicating pore, because curtain coating was good before the silver slurry was uncured, the metal surface that has fallen greatly in the connecting hole produces the probability that caves in, thereby effectively avoided empty generation, improved reliability of products and yield; Secondly, ceramic sintered bodies is made up of aluminium nitride chip and alumina substrate, has a metal pattern layer between the lower surface of this aluminium nitride chip and the upper surface of alumina substrate, has high quality factor, thereby reduced high-frequency loss, and had stable temperature coefficients.
Above-described embodiment only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present utility model and enforcement according to this, can not limit protection range of the present utility model with this.All equivalences of doing according to the utility model spirit essence change or modify, and all should be encompassed within the protection range of the present utility model.
Claims (2)
1. ceramic circuit board, it is characterized in that: comprise aluminium nitride chip (1) and alumina substrate (2), has a metal pattern layer (3) between the upper surface of the lower surface of this aluminium nitride chip (1) and alumina substrate (2), have several intercommunicating pores that connects its upper and lower surface (4) in the described aluminium nitride chip (1), be filled with metal column (5) in this intercommunicating pore (4); One silver medal slurry weld layer (6) is covered in described aluminium nitride chip (1) upper surface and is positioned at directly over the intercommunicating pore (4), and a copper circuit layer (7) that is used for electrically contacting with components and parts is fixed in the opposing surface of described silver slurry weld layer (6) and intercommunicating pore (4).
2. ceramic circuit board according to claim 1 is characterized in that: the thickness of described aluminium nitride chip (1) and alumina substrate (2) is than being 1:1.2 ~ 1.5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320039908 CN203057695U (en) | 2013-01-25 | 2013-01-25 | Ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320039908 CN203057695U (en) | 2013-01-25 | 2013-01-25 | Ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203057695U true CN203057695U (en) | 2013-07-10 |
Family
ID=48740605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320039908 Expired - Fee Related CN203057695U (en) | 2013-01-25 | 2013-01-25 | Ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203057695U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105163488A (en) * | 2015-08-31 | 2015-12-16 | 苏州斯尔特微电子有限公司 | Ceramic circuit substrate |
| CN107484330A (en) * | 2016-06-07 | 2017-12-15 | 鹏鼎控股(深圳)股份有限公司 | High-frequency copper silver hybrid conductive line construction and preparation method thereof |
-
2013
- 2013-01-25 CN CN 201320039908 patent/CN203057695U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105163488A (en) * | 2015-08-31 | 2015-12-16 | 苏州斯尔特微电子有限公司 | Ceramic circuit substrate |
| CN105163488B (en) * | 2015-08-31 | 2018-03-30 | 苏州斯尔特微电子有限公司 | A kind of ceramic circuit board |
| CN107484330A (en) * | 2016-06-07 | 2017-12-15 | 鹏鼎控股(深圳)股份有限公司 | High-frequency copper silver hybrid conductive line construction and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130710 Termination date: 20160125 |
|
| EXPY | Termination of patent right or utility model |