CN205793635U - The attachment structure of pcb board - Google Patents
The attachment structure of pcb board Download PDFInfo
- Publication number
- CN205793635U CN205793635U CN201620267980.6U CN201620267980U CN205793635U CN 205793635 U CN205793635 U CN 205793635U CN 201620267980 U CN201620267980 U CN 201620267980U CN 205793635 U CN205793635 U CN 205793635U
- Authority
- CN
- China
- Prior art keywords
- pcb
- pad
- subplate
- main board
- plumb joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 claims abstract description 52
- 241000309551 Arthraxon hispidus Species 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 210000002421 cell wall Anatomy 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 5
- 239000002356 single layer Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
This utility model provides the attachment structure of a kind of pcb board, including PCB main board and PCB subplate, PCB subplate arranges pad at plumb joint, PCB main board arranges pad at welding groove, wiring in PCB subplate is electrically connected to the pad of PCB subplate, being connected with the pad of PCB main board, the pad on described PCB main board electrically connects with the circuit line in this plate again；Plumb joint is made in one end of PCB subplate, described plumb joint includes the port concave surface between multiple head and head, pad at plumb joint includes the first pad being in plumb joint one or both sides and is in the concave surface pad of described plumb joint port concave surface, and described plumb joint is inserted in described welding groove and by being welded to connect the pad at plumb joint and the pad at welding groove.Pcb board attachment structure of the present utility model need not by terminal, can reduce again the area of pcb board, reduce simultaneously and produce and cost of labor.
Description
Technical field
This utility model relates to the attachment structure between a kind of two pieces of pcb boards.
Background technology
The most rare along with resource, the requirement to space availability ratio also gradually steps up, the gradually lifting to cost consciousness,
More and more higher to the power density requirements of electronic product, so more having focused on the miniaturization of electronic product, the area of PCB is big
The little important factor having become constraint electronic product volume size.
On the one hand the size reducing pcb board can reduce area by increasing the number of plies, and PCB is from initial list
Laminate has developed into tens present laminates.On the other hand will according to different functional devices or concrete components and parts shape and arrangement
Pcb board is divided into multiple fritter PCB, then is attached by one piece of mainboard by each pcb board, improves pcb board and space utilization
Rate.So the height of the different utilization rates that may result in pcb board of connected mode between pcb board from mainboard is the most different.
Summary of the invention:
Relative to traditional by the way of terminal is attached, the purpose of this utility model is to provide a kind of pcb board
Attachment structure, it is not necessary to by terminal, can reduce again the area of pcb board, reduce simultaneously and produce and cost of labor.To this end, this reality
With novel by the following technical solutions:
The attachment structure of pcb board, including PCB main board and PCB subplate, its character is: PCB subplate is at plumb joint
Arranging pad, PCB main board arranges pad at welding groove, and the wiring in PCB subplate is electrically connected to the pad of PCB subplate, then with
The pad of PCB main board connects, and the pad on described PCB main board electrically connects with the circuit line in this plate；One end of PCB subplate is made
Plumb joint, described plumb joint includes the port concave surface between multiple head and head, and the pad at plumb joint includes being in welding
First pad of head one or both sides and be in the concave surface pad of described plumb joint port concave surface, described plumb joint is inserted into
In described welding groove and by being welded to connect the pad at plumb joint and the pad at welding groove.
Further, if PCB subplate is multi-layer sheet, the wiring on the plank of equivalent layer and this layer of pad electricity in PCB subplate
Connect.
Further, PCB main board domestic demand link the circuit on PCB subplate be electrically connected on the pad of PCB main board again with
The pad electrical connection of PCB subplate.
Further, if PCB main board is multi-layer sheet, in PCB main board on the wiring on the plank of equivalent layer and this laminate
Pad electrical connection, then be connected to form entirety by the pad of via Yu PCB main board surface.
Further, PCB subplate needs and the welded head of wiring portion of PCB main board electrical connection and welding of PCB main board
Pad at groove is connected, and part is connected with PCB main board by the terminal of band contact pin
Further, PCB subplate needs and the welded head of wiring portion of PCB main board electrical connection and welding of PCB main board
Pad at groove is connected, and part is connected with connecting line and PCB main board by terminal.
Further, the first pad is connected with concave surface pad, thus forms one and connect pad；If PCB subplate is
Multi-layer sheet, in PCB subplate, the plank of equivalent layer is provided with pad, and the pad of each layer is connected with concave surface pad one by one, thus
Form one and connect pad.
Further, the pad on two sides is done in the position corresponding with the pad on PCB subplate plumb joint, welding groove groove both sides, and
By via, two sides pad is connected, forms one and connect pad, connect at adjacent two and there is between pads inner fovea part, formed every
Stannum gap.
Further, when PCB subplate plumb joint inserts PCB main board welding groove, the indent pad inner concave of PCB subplate is worn
Cross the upper surface of PCB main board welding groove, be not passed through the lower surface of PCB main board welding groove, and plumb joint head exceedes PCB main board weldering
The lower surface of access slot, forms weldpool between concave surface pad and the cell wall of welding groove.
Further, described inner fovea part is circular arc indent, and described concave surface pad is also circular arc concave surface.
This utility model owing to being directly to be connected with plank by plank, as long as so do on PCB subplate one less
Plumb joint, it may not be necessary to additionally with contact pin, saves the cost of contact pin, and plumb joint area occupied is big with contact pin welding position area
It is little quite, so PCB subplate area is essentially unchanged；Welds suitable with subplate thickness of width is had only to out on PCB main board
Groove, so saving again the area that pin holes is corresponding, and then reduces the area of PCB main board；Because need not by contact pin or leading
Lines etc. connect, so also reducing the step of weldering contact pin when producing, thus save production hour and human cost further；Secondary
Plate be by plumb joint insert mainboard welding groove in weld again, mounting means inherently has been able to well carry out structure
Fixing, so also ensure that the physical reliability of the connection of two boards.And by plumb joint head, concave surface pad and inserting groove
Cooperation, it is possible to make to weld fastness, reliability and be further enhanced.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of this utility model PCB subplate plumb joint, and PCB subplate is single layer structure.
Fig. 2 is the schematic diagram of this utility model PCB subplate plumb joint, and PCB subplate is multiple structure.
Fig. 3 is the schematic diagram of this utility model mainboard welding groove.
Fig. 4 a, 4b, 4c, 4d are this utility model pcb board attachment structure embodiment front view, side view, top view respectively
And axonometric chart.
Specific embodiments
The plumb joint structure of monolayer PCB subplate as it is shown in figure 1, the plumb joint of PCB subplate includes surface 2a and head 2b,
Wiring 2 c needing welded head to electrically connect with PCB main board on PCB subplate extends at the plumb joint of this wiring aspect, with
The first pad 2d on plumb joint surface connects.Another side at PCB subplate has the first pad corresponding to surface 2a, at head 2b
Between do a semi arch concave surface, deposit on semi arch concave surface by metallized mode or electroplate formation connect two first pads
Concave surface pad 2e make three pads be electrically connected to form one connect pad,
The plumb joint structure of multi-layer PCB subplate is as in figure 2 it is shown, form concave surface pad 2e in half round concave deposition or plating
Time the surface pads of internal layer being connected with PCB main board by plumb joint will be needed to be connected with the first pad 2d of outer surface, formed
One connection pad of electrical connection.
The welding groove structure of monolayer PCB main board is as it is shown on figure 3, the welding groove of described PCB main board includes surface 1a and end face
1b, PCB main board needs the wiring 1c being connected with PCB subplate through welding groove extend to welding groove, with surface, welding groove both sides
Pad 1d connect, the another side at PCB main board has the surface pads corresponding to surface 1a, two surface pads via 1f phase
Even, forms one solder joint, then in the shallower semi arch indent process formation one of two solder joint catch cropping every stannum gap 1g.
Multi-layer PCB mainboard is needing the internal layer wiring 1c being connected with PCB subplate through welding groove to extend when doing welding groove
To welding groove, and do pad in the aspect that welding groove is corresponding, then pad is done in the position corresponding on PCB main board two sides, and pass through
Between via 1f each pad is electrically connected formation one solder joint.
This utility model pcb board shown in Fig. 4 a, 4b, 4c, 4d connects embodiment, including veneer PCB subplate and PCB master
Plate, PCB subplate inserts in the welding groove of PCB main board by plumb joint, and the first pad 2d Yu PCB on PCB subplate plumb joint is secondary
Extending to the wiring 2c electrical connection at plumb joint in plate, PCB subplate plumb joint passes through the first pad 2d and semi arch indent pad
Pad 1d corresponding with both sides in PCB main board welding groove for 2e welds, the pad 1d on PCB main board welding groove both sides and PCB master
Extend to the wiring 1c electrical connection at welding groove in plate, thus realize wiring 2c and PCB extended on PCB subplate at plumb joint
Mainboard extends to the wiring 1c electrical connection at welding groove.When PCB subplate plumb joint inserts PCB main board welding groove, the half of PCB subplate
Circular arc indent pad 2e inner concave should be through the upper surface 1a of PCB main board welding groove, the most another close to PCB main board welding groove
Simultaneously it is not passed through, and head 2b exceedes lower surface, between concave surface pad and the cell wall of welding groove, form weldpool, so that
The pad that when crossing wave-soldering, scolding tin can be paved with on the semi arch indent of PCB subplate the PCB main board welding groove corresponding with side is non-
The most effective welding, further such that the attachment structure of two pieces of pcb boards is firm.PCB subplate plumb joint head is connecting weldering simultaneously
Buffer action is served so that two connect the problem not havinging even weldering between pad between dish.Between the pad of PCB main board welding groove
Indent also can play buffer action, further avoid two pcb boards and plug part connects the phenomenon occurring even weldering between pad.
The processing technique explanation of PCB subplate: as a example by multilamellar subplate, the processing of n-layer plate is all to process the most respectively
, wiring and the pad of the first laminate to n-th layer plate are made by etching, first, in the welding of every monolayer pcb board
Head two sides etches corresponding pad, then needs to extend to the wiring electricity of plumb joint in pad and this layer according to practical wiring
Connect, then carry out pressure viscosity after the insulating barrier of requirement being added between the first laminate to n-th layer plate and form a monoblock PCB subplate.Exist again
Mill out semi arch indent at inserted terminal, it is ensured that the Copper Foil of every layer all on end face, then with deposition or electric plating method at end face
Forming concave surface pad makes the pad of each layer connect.
PCB subplate and the welding procedure of PCB main board: first for PCB subplate device own is all welded, then PCB subplate picture is inserted
Plumb joint is equally inserted in the welding groove of PCB main board by part devices, directly crosses ripple together with other plug-in units on PCB main board
Peak welds, during wiring the pad of PCB subplate just with the pad one_to_one corresponding of PAB mainboard, so phase on two boards after mistake wave-soldering
Corresponding pad all can reliably electrically connect.Can also the most manually weld when connecting pad and being less.
The foregoing is only specific embodiment of the utility model, but architectural feature of the present utility model is not limited to
This, any those skilled in the art is in the field of the invention, and change or the modification made all are contained of the present utility model
Among protection domain.
Claims (10)
- The attachment structure of 1.PCB plate, including PCB main board and PCB subplate, its character is: PCB subplate sets at plumb joint Putting pad, PCB main board arranges pad at welding groove, and the wiring in PCB subplate is electrically connected to the pad of PCB subplate, then with PCB The pad of mainboard connects, and the pad on described PCB main board electrically connects with the circuit line in this plate；Weldering is made in one end of PCB subplate Joint, described plumb joint includes the port concave surface between multiple head and head, and the pad at plumb joint includes being in plumb joint First pad of one or both sides and be in the concave surface pad of described plumb joint port concave surface, described plumb joint is inserted into institute State in welding groove and by being welded to connect the pad at plumb joint and the pad at welding groove.
- The attachment structure of pcb board the most according to claim 1, it is characterised in that if PCB subplate is multi-layer sheet, PCB subplate Wiring on the plank of middle equivalent layer electrically connects with the pad on this laminate.
- The attachment structure of pcb board the most according to claim 1, it is characterised in that PCB main board domestic demand is linked on PCB subplate Circuit be electrically connected on the pad of PCB main board pad with PCB subplate again and electrically connect.
- The attachment structure of pcb board the most according to claim 1, it is characterised in that if PCB main board is multi-layer sheet, PCB main board Wiring on the plank of middle equivalent layer electrically connects with the pad on this laminate, then the pad phase by via with PCB main board surface Even form entirety.
- 5. according to the attachment structure of the arbitrary described pcb board of Claims 1-4, it is characterised in that need and PCB master on PCB subplate The welded head of wiring portion of plate electrical connection is connected with the pad at the welding groove of PCB main board, and part is by the terminal of band contact pin It is connected with PCB main board.
- 6. according to the attachment structure of the arbitrary described pcb board of Claims 1-4, it is characterised in that need and PCB master on PCB subplate The welded head of wiring portion of plate electrical connection is connected with the pad at the welding groove of PCB main board, and part is by terminal and connecting line It is connected with PCB main board.
- 7. according to the attachment structure of the arbitrary described pcb board of Claims 1-4, it is characterised in that the first pad and concave surface pad It is connected, thus forms one and connect pad；If PCB subplate is multi-layer sheet, in PCB subplate, the plank of equivalent layer is provided with weldering Dish, the pad of each layer is connected with concave surface pad one by one, thus forms one and connect pad.
- 8. according to the attachment structure of the arbitrary described pcb board of Claims 1-4, it is characterised in that welding groove groove both sides and PCB The pad on two sides is done in the position that pad on subplate plumb joint is corresponding, and is connected by two sides pad by via, forms a company Connect pad, connect at adjacent two and there is between pad inner fovea part, formed every stannum gap.
- 9. according to the attachment structure of the arbitrary described pcb board of Claims 1-4, it is characterised in that PCB subplate plumb joint inserts During PCB main board welding groove, the indent pad of PCB subplate inner concave, through the upper surface of PCB main board welding groove, is not passed through PCB The lower surface of mainboard welding groove, and plumb joint head exceedes the lower surface of PCB main board welding groove, at concave surface pad and welding groove Weldpool is formed between cell wall.
- The attachment structure of pcb board the most according to claim 8, it is characterised in that described inner fovea part is circular arc indent, institute State concave surface pad also for circular arc concave surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620267980.6U CN205793635U (en) | 2016-04-01 | 2016-04-01 | The attachment structure of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620267980.6U CN205793635U (en) | 2016-04-01 | 2016-04-01 | The attachment structure of pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205793635U true CN205793635U (en) | 2016-12-07 |
Family
ID=57413854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620267980.6U Expired - Fee Related CN205793635U (en) | 2016-04-01 | 2016-04-01 | The attachment structure of pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205793635U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107017209A (en) * | 2017-04-01 | 2017-08-04 | 深圳振华富电子有限公司 | Winding-type electronic component and its ceramic bottom board |
| CN110312363A (en) * | 2019-06-24 | 2019-10-08 | 维沃移动通信有限公司 | A kind of printed circuit-board assembly and terminal |
-
2016
- 2016-04-01 CN CN201620267980.6U patent/CN205793635U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107017209A (en) * | 2017-04-01 | 2017-08-04 | 深圳振华富电子有限公司 | Winding-type electronic component and its ceramic bottom board |
| CN110312363A (en) * | 2019-06-24 | 2019-10-08 | 维沃移动通信有限公司 | A kind of printed circuit-board assembly and terminal |
| US11778744B2 (en) | 2019-06-24 | 2023-10-03 | Vivo Mobile Communication Co., Ltd. | Printed circuit board assembly and terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161207 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |