CN204721708U - A kind of two-layer printed circuit board of resistance to bending - Google Patents

A kind of two-layer printed circuit board of resistance to bending Download PDF

Info

Publication number
CN204721708U
CN204721708U CN201520301779.0U CN201520301779U CN204721708U CN 204721708 U CN204721708 U CN 204721708U CN 201520301779 U CN201520301779 U CN 201520301779U CN 204721708 U CN204721708 U CN 204721708U
Authority
CN
China
Prior art keywords
kink
layer
copper foil
foil layer
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520301779.0U
Other languages
Chinese (zh)
Inventor
刘建春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Xingzhiguang Industrial Development Co Ltd
Original Assignee
Shenzhen Xingzhiguang Industrial Development Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Xingzhiguang Industrial Development Co Ltd filed Critical Shenzhen Xingzhiguang Industrial Development Co Ltd
Priority to CN201520301779.0U priority Critical patent/CN204721708U/en
Application granted granted Critical
Publication of CN204721708U publication Critical patent/CN204721708U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

The utility model discloses a kind of two-layer printed circuit board of resistance to bending, it is specially provided with kink, and the bending structure of kink has carried out the enhancing of intensity and the optimization of conductive structure.The utility model comprises flexible circuit Slab element, and described flexible circuit Slab element is provided with kink; Be provided with the rectangle hollow-out parts of a longitudinal direction at the middle part of described kink, this rectangle hollow-out parts will be divided into internal wiring mutual independently the first wiring area and the second wiring area in kink; Described flexible circuit Slab element comprises two-layer copper foil layer, and two-layer copper foil layer is bonded in the both side surface of substrate by pure glue-line; Described substrate runs through and offers conductive through hole, in conductive through hole, rivet the metal needle of column; On described substrate, the position of corresponding kink offers kink window, and the position of the corresponding kink of described two-layer pure glue-line is provided with adhesive-free area, and the opening of adhesive-free area is greater than the opening size of described kink window.

Description

A kind of two-layer printed circuit board of resistance to bending
Technical field
The utility model relates to a kind of multilayer circuit board, particularly relates to a kind of wiring board comprising two-layer copper foil layer.
Background technology
Flexible PCB (i.e. FPC) is the printed circuit board (PCB) made with flexible insulating substrate.It can bend, winding etc., with installing space flexible topology, can not belong to the limitation of installing space, thus realize that electronic devices and components assembling and wire connect integrated, breach the limitation of traditional interconnection technique.For conventional flexible PCB, it comprises flexible circuit Slab element, flexible circuit Slab element two ends arrange golden finger, golden finger is used for being connected with other electrical component with mainboard, for example, the screen of mobile phone needs to be connected with the golden finger of flexible circuit Slab element, and the other end of this flexible circuit Slab element needs to be connected with cell phone mainboard, this connected mode is very common, but is also very easy to damage;
Occur that above-mentioned situation mainly causes because existing such flexible PCB Unit Design is unreasonable, it needs bending, but the tolerance of crooked place is very poor, bends for a long time and all can cause the premature breakdown of kink in processes such as the carrying out of bending state vibrate.
Utility model content
Technical problem to be solved in the utility model is for above-mentioned deficiency of the prior art, a kind of two-layer printed circuit board of resistance to bending is provided, it is specially provided with kink, the bending structure of kink has carried out the enhancing of intensity and the optimization of conductive structure, ensure that Long-Time Service is very reliable, and be convenient to very much bend the connection carried out between electronic component.
The utility model solves the technical scheme that its technical problem adopts: a kind of two-layer printed circuit board of resistance to bending, comprise flexible circuit Slab element, described flexible circuit Slab element is provided with kink, is respectively provided with row's golden finger at the two ends of flexible circuit Slab element; Be provided with the rectangle hollow-out parts of a longitudinal direction at the middle part of described kink, this rectangle hollow-out parts will be divided into internal wiring mutual independently two regions, i.e. the first wiring area and the second wiring area in kink; First wiring area and the second wiring area are from being electrically connected redundancy each other; Bottom surface between the upper end golden finger of described kink and flexible circuit Slab element, the surface between the lower end golden finger of described kink and flexible circuit Slab element is respectively equipped with one deck stiffening plate;
Described flexible circuit Slab element comprises two-layer copper foil layer, and two-layer copper foil layer is bonded in the both side surface of substrate by pure glue-line; Described substrate runs through and offers conductive through hole, rivet the metal needle of column in conductive through hole, this metal needle is connected with the described copper foil layer of substrate both sides; The outer surface of described two-layer copper foil layer arranges one deck screen respectively;
On described substrate, the position of corresponding kink offers kink window, and the position of the corresponding kink of described two-layer pure glue-line is provided with adhesive-free area, and the opening of adhesive-free area is greater than the opening size of described kink window.
As a kind of preferred implementation of the present utility model, in described two-layer pure glue-line, the thickness of one of them pure glue-line is greater than the thickness of another pure glue-line; The adhesive-free area of described pure glue-line and the kink window of substrate stepped.
As a kind of preferred implementation of the present utility model, all copper foil layer structures are consistent, and it comprises circuit part and wiring board ground metal portion, and this circuit part is connected with this wiring board ground metal portion, corresponding, described screen comprises shielding area and join domain, shielding area and join domain are connected to form an entirety, wherein, shielding area is located on the circuit part of copper foil layer, and join domain is located on the wiring board ground metal portion of copper foil layer, copper foil layer has and is communicated with boring, be communicated with boring and run through substrate and copper foil layer, be communicated with the wiring board ground metal portion that boring is arranged in copper foil layer, the join domain of screen offers via respectively, via is connected with connection boring, metal conduction part is arranged on via from top to bottom and is communicated with in boring.
The utility model compared with prior art has the following advantages:
A kind of two-layer printed circuit board of resistance to bending of the utility model, the rectangle hollow-out parts of a longitudinal direction is provided with at the middle part of described kink, this rectangle hollow-out parts will be divided into internal wiring mutual independently two regions, i.e. the first wiring area and the second wiring area in kink; First wiring area and the second wiring area are from being electrically connected redundancy (in fact cabling is in parallel each other) each other, once in bending process, the circuit in a region is destroyed, then another part still can work; In addition because stiffening plate is arranged on the both sides in opposite directions of kink two ends flexible circuit Slab element, not only increase the structure of flexible circuit, also make kink be more prone to bending;
Flexible circuit Slab element of the present utility model comprises two-layer copper foil layer, and two-layer copper foil layer is bonded in the both side surface of substrate by pure glue-line; Described substrate runs through and offers conductive through hole, rivet the metal needle of column in conductive through hole, this metal needle is connected with the described copper foil layer of substrate both sides; The outer surface of described two-layer copper foil layer arranges one deck screen respectively; Conductive through hole offered by the substrate of this insulation, rivets the metal needle of column in conductive through hole, structure is simple, and in processing, operation is convenient; The metal needle of riveted joint column, in conjunction with very firm, can improve flexible PCB functional reliability; The whole structure that conducts is beneficial to the manufacturing cost reducing flexible PCB;
The position of the utility model corresponding kink on the substrate offers kink window, and the position of the corresponding kink of described two-layer pure glue-line is provided with adhesive-free area, and the opening of adhesive-free area is greater than the opening size of described kink window; Adhesive-free area and kink window become a gap being convenient to reliably bend, and the stress that when can greatly reduce bending, bending part and two ends flexible circuit Slab element thereof receive, improves the life-span of whole wiring board; After the opening of adhesive-free area is greater than kink window, the gravure bit depth formed after can reducing adhesive-free area and the compacting of kink windows overlay, the phenomenon avoiding surface irregularity occurs, and ensure that product quality.
The thickness of pure glue-line is further also set to different by the utility model, so, just possesses towards the pure glue-line direction bending of thinner one deck the operating process be more prone to.
Accompanying drawing explanation
Fig. 1 is the structural representation of the main apparent direction of a kind of embodiment of the present utility model;
Fig. 2 is the partial sectional view in the side-looking direction of a kind of embodiment of the present utility model.
Description of reference numerals:
1-flexible circuit Slab element, 2-kink, 3-golden finger, 4-stiffening plate, 5-screen, the pure glue-line of 6-, 7-substrate, 8-copper foil layer, 9-adhesive-free area, 10-kink window, 11-conductive through hole, 12-metal needle; 20-rectangle hollow-out parts, 21-first wiring area, 22-second wiring area.
Embodiment
Below in conjunction with drawings and Examples, the utility model embodiment is described:
As depicted in figs. 1 and 2, it illustrates embodiment of the present utility model, as shown in the figure, a kind of two-layer printed circuit board of resistance to bending of the utility model, comprise flexible circuit Slab element 1, described flexible circuit Slab element is provided with kink 2, is respectively provided with row's golden finger 3 at the two ends of flexible circuit Slab element; Be provided with the rectangle hollow-out parts 20 of a longitudinal direction at the middle part of described kink, this rectangle hollow-out parts will be divided into internal wiring mutual independently two regions, i.e. the first wiring area 21 and the second wiring area 22 in kink; First wiring area and the second wiring area are from being electrically connected redundancy each other; Bottom surface between the upper end golden finger of described kink and flexible circuit Slab element, the surface between the lower end golden finger of described kink and flexible circuit Slab element is respectively equipped with one deck stiffening plate 4;
As shown in the figure, described flexible circuit Slab element comprises two-layer copper foil layer, and two-layer copper foil layer is bonded in the both side surface of substrate by pure glue-line; Described substrate runs through and offers conductive through hole 11, rivet the metal needle 12 of column in conductive through hole, this metal needle is connected with the described copper foil layer of substrate both sides; The outer surface of described two-layer copper foil layer arranges one deck screen 5 respectively;
As shown in the figure, on described substrate, the position of corresponding kink offers kink window 10, and the position of the corresponding kink of described two-layer pure glue-line 6 is provided with adhesive-free area 9, and the opening of adhesive-free area is greater than the opening size of described kink window.
Preferably, as shown in the figure, in described two-layer pure glue-line, the thickness of one of them pure glue-line is greater than the thickness of another pure glue-line; The adhesive-free area of described pure glue-line and the kink window of substrate stepped.
Preferably, in order to ensure reliable ground structure, above-mentioned all copper foil layer structures are consistent, and it comprises circuit part and wiring board ground metal portion, and this circuit part is connected with this wiring board ground metal portion, corresponding, described screen comprises shielding area and join domain, shielding area and join domain are connected to form an entirety, wherein, shielding area is located on the circuit part of copper foil layer, and join domain is located on the wiring board ground metal portion of copper foil layer, copper foil layer has and is communicated with boring, be communicated with boring and run through substrate and copper foil layer, be communicated with the wiring board ground metal portion that boring is arranged in copper foil layer, the join domain of screen offers via respectively, via is connected with connection boring, metal conduction part is arranged on via from top to bottom and is communicated with in boring.
By reference to the accompanying drawings the utility model preferred implementation is explained in detail above, but the utility model is not limited to above-mentioned execution mode, in the ken that those of ordinary skill in the art possess, can also make a variety of changes under the prerequisite not departing from the utility model aim.
Do not depart from design of the present utility model and scope can make many other and change and remodeling.Should be appreciated that the utility model is not limited to specific execution mode, scope of the present utility model is defined by the following claims.

Claims (3)

1. the two-layer printed circuit board of resistance to bending, is characterized in that: comprise flexible circuit Slab element, and described flexible circuit Slab element is provided with kink, is respectively provided with row's golden finger at the two ends of flexible circuit Slab element; Be provided with the rectangle hollow-out parts of a longitudinal direction at the middle part of described kink, this rectangle hollow-out parts will be divided into internal wiring mutual independently two regions, i.e. the first wiring area and the second wiring area in kink; First wiring area and the second wiring area are from being electrically connected redundancy each other; Bottom surface between the upper end golden finger of described kink and flexible circuit Slab element, the surface between the lower end golden finger of described kink and flexible circuit Slab element is respectively equipped with one deck stiffening plate;
Described flexible circuit Slab element comprises two-layer copper foil layer, and two-layer copper foil layer is bonded in the both side surface of substrate by pure glue-line; Described substrate runs through and offers conductive through hole, rivet the metal needle of column in conductive through hole, this metal needle is connected with the described copper foil layer of substrate both sides; The outer surface of described two-layer copper foil layer arranges one deck screen respectively;
On described substrate, the position of corresponding kink offers kink window, and the position of the corresponding kink of described two-layer pure glue-line is provided with adhesive-free area, and the opening of adhesive-free area is greater than the opening size of described kink window.
2. a kind of two-layer printed circuit board of resistance to bending as claimed in claim 1, is characterized in that: in described two-layer pure glue-line, the thickness of one of them pure glue-line is greater than the thickness of another pure glue-line; The adhesive-free area of described pure glue-line and the kink window of substrate stepped.
3. a kind of two-layer printed circuit board of resistance to bending as claimed in claim 1, is characterized in that: all copper foil layer structures are consistent, and it comprises circuit part and wiring board ground metal portion, and this circuit part is connected with this wiring board ground metal portion, corresponding, described screen comprises shielding area and join domain, shielding area and join domain are connected to form an entirety, wherein, shielding area is located on the circuit part of copper foil layer, and join domain is located on the wiring board ground metal portion of copper foil layer, copper foil layer has and is communicated with boring, be communicated with boring and run through substrate and copper foil layer, be communicated with the wiring board ground metal portion that boring is arranged in copper foil layer, the join domain of screen offers via respectively, via is connected with connection boring, metal conduction part is arranged on via from top to bottom and is communicated with in boring.
CN201520301779.0U 2015-05-07 2015-05-07 A kind of two-layer printed circuit board of resistance to bending Expired - Fee Related CN204721708U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520301779.0U CN204721708U (en) 2015-05-07 2015-05-07 A kind of two-layer printed circuit board of resistance to bending

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520301779.0U CN204721708U (en) 2015-05-07 2015-05-07 A kind of two-layer printed circuit board of resistance to bending

Publications (1)

Publication Number Publication Date
CN204721708U true CN204721708U (en) 2015-10-21

Family

ID=54320664

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520301779.0U Expired - Fee Related CN204721708U (en) 2015-05-07 2015-05-07 A kind of two-layer printed circuit board of resistance to bending

Country Status (1)

Country Link
CN (1) CN204721708U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105472868A (en) * 2015-11-20 2016-04-06 广东欧珀移动通信有限公司 Flexible printed circuit board and mobile terminal
CN105578724A (en) * 2015-12-29 2016-05-11 广东欧珀移动通信有限公司 Flexible printed circuit board and mobile terminal
CN109275263A (en) * 2018-11-23 2019-01-25 威创集团股份有限公司 A kind of preparation method and FPC plate of FPC plate
WO2024011719A1 (en) * 2022-07-11 2024-01-18 武汉华星光电半导体显示技术有限公司 Display apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105472868A (en) * 2015-11-20 2016-04-06 广东欧珀移动通信有限公司 Flexible printed circuit board and mobile terminal
CN105472868B (en) * 2015-11-20 2019-02-12 Oppo广东移动通信有限公司 A kind of flexible circuit board and mobile terminal
CN105578724A (en) * 2015-12-29 2016-05-11 广东欧珀移动通信有限公司 Flexible printed circuit board and mobile terminal
CN105578724B (en) * 2015-12-29 2018-09-04 广东欧珀移动通信有限公司 Flexible PCB and mobile terminal
CN109275263A (en) * 2018-11-23 2019-01-25 威创集团股份有限公司 A kind of preparation method and FPC plate of FPC plate
WO2024011719A1 (en) * 2022-07-11 2024-01-18 武汉华星光电半导体显示技术有限公司 Display apparatus

Similar Documents

Publication Publication Date Title
CN103906372B (en) There is circuit board of embedded element and preparation method thereof
CN204721708U (en) A kind of two-layer printed circuit board of resistance to bending
JP2011003888A (en) Multilayer printed circuit board and perforating method for the same
CN103906371B (en) Circuit board with embedded element and preparation method thereof
CN104681531B (en) Package substrate and method for fabricating the same
CN103260350B (en) Blind buried via hole plate compression method
CN204721710U (en) A kind of multi-layer flexible circuit board
CN105228343A (en) A kind of Rigid Flex and preparation method thereof
CN201234406Y (en) Flexible printed circuit board
CN203482483U (en) Circuit board
CN204721722U (en) A kind of easily extensible multi-layer flexible circuit board
CN202121857U (en) Multilayer flexible printed circuit
CN105578749A (en) Circuit board connecting assembly and mobile terminal
CN104968138A (en) Printed circuit board
CN102365006B (en) Processing method of multi-layer circuit board
CN202206659U (en) Double-layered circuit board with buried element
TW201345327A (en) Structure of conductive through hole of electrical circuit board
US11307706B2 (en) FPC connector, touch-sensitive screen and display device
CN205793635U (en) The attachment structure of pcb board
CN105376962A (en) Method for improving circuit board structure
US20090255723A1 (en) Printed circuit board with ground grid
CN110278659B (en) Composite circuit board and method for manufacturing the same
CN102378489B (en) Soft and hard circuit board and manufacturing method thereof
TWI526908B (en) Capacitive touch panel and manufacturing method thereof
CN204361089U (en) A kind of via hole electric connection structure, array base palte and display unit

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151021

Termination date: 20180507

CF01 Termination of patent right due to non-payment of annual fee