CN202059671U - Novel LED circuit board - Google Patents
Novel LED circuit board Download PDFInfo
- Publication number
- CN202059671U CN202059671U CN2011201020042U CN201120102004U CN202059671U CN 202059671 U CN202059671 U CN 202059671U CN 2011201020042 U CN2011201020042 U CN 2011201020042U CN 201120102004 U CN201120102004 U CN 201120102004U CN 202059671 U CN202059671 U CN 202059671U
- Authority
- CN
- China
- Prior art keywords
- layer
- line layer
- wiring board
- insulating barrier
- new led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a novel LED circuit board comprising a substrate layer, and an upper circuit layer and a lower circuit layer, which are integrally adhered on the upper surface and the lower surface of the substrate layer through glue layers. An insulating layer is arranged on the outer surface of the upper circuit layer, wherein: conduction holes are arranged between the upper insulating layer and the surface of the lower circuit layer, the diameter of the conduction holes on the insulating layer is larger than that of the conduction holes on the upper circuit layer, and solder paste is coated on the conduction holes to conduct the upper circuit layer and the lower circuit layer. The utility model aims to provide a novel LED circuit board, with simple structure, good conductivity and environmental friendliness..
Description
Technical field
The utility model relates to a kind of LED wiring board, more particularly, relates in particular to a kind of New LED wiring board.
Background technology
In traditional wiring board production technology, general machine drilling or the laser drill form of adopting, on double face copper, get out via, impose again by melanism or electroless copper plating etc. then and electroplate that to increase through-hole wall copper thick in to finish the conducting effect, the technology of this kind method is big for environment pollution, traditional heavy copper-plated double-sided wiring board of copper that need not adopts the electric conductive carbon printing grout usually, conductive silver, forms such as copper slurry grout are finished the conducting effect, but, though electric conductive carbon printing grout cost is low, but resistance is big, conductive effect is not good, the scope of using is also limited, conductive silver, the price of copper slurry is also relatively more expensive, also is difficult for preserving, though so its electric conductivity is good, it involves great expense and is not suitable for a large amount of production; Other has the double-sided wiring board structure, adopt the concordant after-applied tin cream of die drawn bottom line layer to reach the effect of conducting with the top line layer, it needs the bottom line layer is stretched in process of production, its complex process, and stretching can cause phenomenons such as material is crisp, sclerosis, distortion, sometimes even material is damaged, have a strong impact on the performance and the useful life of conducting; Therefore after need improving traditional board structure of circuit, the led circuit plate is better used.
The utility model content
The technical problems to be solved in the utility model is the above-mentioned deficiency at prior art, provide a kind of simple in structure, conduction property good, the New LED wiring board of environmental protection.
The technical solution of the utility model is such: a kind of New LED wiring board, comprise that substrate layer and top and bottom thereof are bonded as the line layer up and down of one respectively by adhesive-layer, last line layer outer surface is provided with insulating barrier, wherein: be provided with via between the circuit deck sections extremely down from last insulating barrier, described via the aperture at insulating barrier place greater than on line layer, described via is provided with tin cream conducting line layer up and down.
Above-mentioned a kind of New LED wiring board, described via is the big 0.5～2.0mm of line layer on the ratio of the aperture at last insulating barrier place.
Above-mentioned a kind of New LED wiring board, described line layer outer surface down is provided with insulating barrier.
Above-mentioned a kind of New LED wiring board, described substrate layer are glass fabric or aluminium or iron or polyimides or Merlon or polyester material.
Above-mentioned a kind of New LED wiring board, line layer are pure copper foil or alloy Copper Foil.
Above-mentioned a kind of New LED wiring board, the thickness of described adhesive-layer is 10～30 microns.
Above-mentioned a kind of New LED wiring board, described substrate layer thickness is 10～70 microns.
Above-mentioned a kind of New LED wiring board, described via the diameter at insulating barrier place greater than on line layer.
Above-mentioned a kind of New LED wiring board, insulating barrier are anti-solder ink or polyimides coverlay.
Above-mentioned a kind of New LED wiring board, described via is the big 0.5～2.0mm of line layer on the diameter ratio at insulating barrier place.
After the utility model adopts said structure, by between the circuit deck sections via being set extremely down at last line layer, print solder paste or other tinworks fill up tin or tin cream with shrinkage pool electronic devices and components are attached in the circuit board on the position, hole of via, through technologies such as peak weldering or Reflow Solderings, tin is solidified, the effect of line layer and following line layer in the realization conducting, so simple production method can be enhanced productivity, reduce energy resource consumption, strengthen electric conductivity; Via the diameter at insulating barrier place greater than on line layer, can increase the conducting sectional area, guarantee line layer and following line layer in the tin cream conducting, have the better technique effect of conduction; Outer surface at last line layer and following line layer is respectively equipped with insulating barrier, also can reach the anti-creeping effect of waterproof, has increased the useful life of wiring board simultaneously; Insulating layer material is set to anti-solder ink or PI coverlay, and it is full to reach consent, light tight, not sticking tin, and effects such as surfacing have also increased the attractive in appearance and anti-creeping technique effect of waterproof simultaneously.
Description of drawings
The utility model is described in further detail below in conjunction with the embodiment in the accompanying drawing, but do not constitute any restriction of the present utility model.
Fig. 1 is a cross-sectional view of the present utility model;
Fig. 2 is that the utility model is not provided with tin cream structural representation before.
Among the figure: substrate layer 1, adhesive-layer 2, last line layer 3, via 8, following line layer 4, tin cream 5, insulating barrier 6,7.
Embodiment
As Fig. 1～shown in Figure 2, a kind of New LED wiring board of the present utility model, comprise that substrate layer 1 and top and bottom thereof are bonded as the line layer up and down 3,4 of one respectively by adhesive-layer 2, last line layer 3 outer surfaces are provided with insulating barrier 6, between following line layer 4 faces, be provided with via 8 from last insulating barrier 6, via 8 the aperture at insulating barrier 6 places greater than on line layer, tin cream 5 conductings line layer 3,43 up and down is set in the via 8.
Via 8 is line layer 3 big 0.5～2.0mm on the ratio of the aperture at insulating barrier 6 places.
Following line layer 4 outer surfaces are provided with insulating barrier 7.
Substrate layer 1 is glass fabric or aluminium or iron or polyimides or Merlon or polyester material.
Line layer is pure copper foil or alloy Copper Foil.
The thickness of adhesive-layer 2 is 10～30 microns.
Substrate layer 1 thickness is 10～70 microns.
Via 8 the diameter at insulating barrier 6 places greater than on line layer 3.
Insulating barrier is anti-solder ink or PI coverlay.
Via 8 is line layer 3 big 0.5～2.0mm on the diameter ratio at insulating barrier 6 places.
The utility model is when concrete production, by between following line layer 4 faces, via 8 being set at insulating barrier 6, in via 8, fill tin cream 5 conductings line layer 3,4 up and down, simple method for designing reaches enhances productivity, reduce energy resource consumption, reduce the effect of environmental pollution; Can reach the anti-creeping effect of waterproof by insulating barrier 6 being set at last line layer 3 upper surfaces and following line layer 4 lower surfaces.
Adopt numerical control to bore location hole and via 8, its boring coordinate is consistent with substrate layer 1 boring coordinate, the material of line layer is that pure copper foil or its preferred thickness of alloy Copper Foil are 10～80 microns, to be stacked in together by adhesive-layer 2 with hole-drilled line layer 3,4 of numerical control and substrate layer 1, put into traditional pressing machine or fast press pressing and forming, pressing time is 30-80 second, and the pressing rear curing time is 165 ℃ ± 10 ℃ * 60min, and then makes circuit and processing insulating barrier 6,7.
Wiring board is made the company's of employing plug band impression method; with the anti-etching printing ink of tradition or wet film with the base material two-face printing or coat circuit printing ink; carry out circuit etching again; produce the backing material plate of band circuit; and then making two sides insulating barrier; print character; surface protection is handled; technologies such as moulding; promptly produce the wiring board of two sides not conducting of copper; the line layer conducting is to need on the position, hole of conducting print solder paste or other tinwork that shrinkage pool is filled out tin or tin cream 5; electronic devices and components are attached on the above-mentioned wiring board again; through technologies such as wave-soldering or Reflow Solderings, tin is solidified, can draw the double-sided wiring board of conducting.
In sum, the utility model is as specification and diagramatic content, makes actual sample and through repeatedly use test, from the effect of use test, provable the utility model can reach the purpose that it is expected, practical value is unquestionable.Above illustrated embodiment only is used for conveniently illustrating the utility model, be not that the utility model is done any pro forma restriction, have in the technical field under any and know the knowledgeable usually, if in the scope that does not break away from technical characterictic that the utility model is carried, utilize technology contents that the utility model discloses to do the local equivalent embodiment that changes or modify, and do not break away from technical characterictic content of the present utility model, all still belong in the scope of the utility model technical characterictic.
Claims (8)
1. New LED wiring board, comprise that substrate layer (1) and top and bottom thereof are bonded as the line layer up and down (3,4) of one respectively by adhesive-layer (2), last line layer (3) outer surface is provided with insulating barrier (6), it is characterized in that: be provided with via (8) between line layer (4) face extremely down from last insulating barrier (6), greater than last line layer (3), described via (8) is provided with tin cream (5) conducting line layer (3,4) up and down to described via (8) in aperture that insulating barrier (6) is located.
2. a kind of New LED wiring board according to claim 1 is characterized in that: described via (8) in aperture that insulating barrier (6) is located than the big 0.5～2.0mm of last line layer (3).
3. a kind of New LED wiring board according to claim 1 is characterized in that: described line layer (4) outer surface down is provided with insulating barrier (7).
4. a kind of New LED wiring board according to claim 1 is characterized in that: described substrate layer (1) is glass fabric or aluminium or iron or polyimides or Merlon or polyester material.
5. a kind of New LED wiring board according to claim 1 is characterized in that: described line layer is pure copper foil or alloy Copper Foil.
6. a kind of New LED wiring board according to claim 1 is characterized in that: the thickness of described adhesive-layer (2) is 10～30 microns.
7. a kind of New LED wiring board according to claim 1 is characterized in that: described substrate layer (1) thickness is 10～70 microns.
8. according to claim 1 or 3 described a kind of New LED wiring boards, it is characterized in that: insulating barrier is anti-solder ink or polyimides coverlay.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201020042U CN202059671U (en) | 2011-04-07 | 2011-04-07 | Novel LED circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201020042U CN202059671U (en) | 2011-04-07 | 2011-04-07 | Novel LED circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202059671U true CN202059671U (en) | 2011-11-30 |
Family
ID=45019634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201020042U Expired - Fee Related CN202059671U (en) | 2011-04-07 | 2011-04-07 | Novel LED circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202059671U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
| CN103687284A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigidity-flexibility combined circuit board of flying-tail structure and manufacturing method thereof |
| CN105118627A (en) * | 2015-09-15 | 2015-12-02 | 东莞市龙谊电子科技有限公司 | Power module circuit and manufacturing method thereof |
| CN109413892A (en) * | 2018-12-17 | 2019-03-01 | 盐城维信电子有限公司 | A kind of via hole parcel plating copper method of flexible circuit board |
| CN110505757A (en) * | 2019-08-19 | 2019-11-26 | 广德鼎星电子科技有限公司 | A kind of production method of the non-porous conducting of FPC |
| CN113905511A (en) * | 2021-10-12 | 2022-01-07 | 深圳市静宇鑫照明科技有限公司 | Mixed conductive material circuit board and soldering conduction method |
-
2011
- 2011-04-07 CN CN2011201020042U patent/CN202059671U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
| CN103687284A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigidity-flexibility combined circuit board of flying-tail structure and manufacturing method thereof |
| CN103687284B (en) * | 2013-12-11 | 2017-02-15 | 广州兴森快捷电路科技有限公司 | Rigidity-flexibility combined circuit board of flying-tail structure and manufacturing method thereof |
| US9706669B2 (en) | 2013-12-11 | 2017-07-11 | Guangzhou Fastprint Circuit Tech Co., Ltd. | Rigid-flexible circuit board having flying-tail structure and method for manufacturing same |
| CN105118627A (en) * | 2015-09-15 | 2015-12-02 | 东莞市龙谊电子科技有限公司 | Power module circuit and manufacturing method thereof |
| CN109413892A (en) * | 2018-12-17 | 2019-03-01 | 盐城维信电子有限公司 | A kind of via hole parcel plating copper method of flexible circuit board |
| WO2020124955A1 (en) * | 2018-12-17 | 2020-06-25 | 盐城维信电子有限公司 | Method for partially electrocoppering via hole of flexible circuit board |
| CN110505757A (en) * | 2019-08-19 | 2019-11-26 | 广德鼎星电子科技有限公司 | A kind of production method of the non-porous conducting of FPC |
| CN113905511A (en) * | 2021-10-12 | 2022-01-07 | 深圳市静宇鑫照明科技有限公司 | Mixed conductive material circuit board and soldering conduction method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202059671U (en) | Novel LED circuit board | |
| CN103188875B (en) | Super-thick copper pattern-producing method and there is the pcb board of super-thick copper figure | |
| CN201639856U (en) | Double-sided circuit board with element | |
| CN201383900Y (en) | Blind hole type circuit board | |
| CN102858087A (en) | Blind-hole-conduction double-sided circuit board and processing method thereof | |
| WO2011060604A1 (en) | Double-side wiring board and method for interconnecting and conducting | |
| CN110099523A (en) | A kind of manufacture craft of multilayer circuit board | |
| CN104378931A (en) | Method for manufacturing metallized counterbore in PCB | |
| CN103260350A (en) | Blind buried orifice plate laminating method and blind buried orifice plate manufactured with blind buried orifice plate laminating method | |
| CN102883524A (en) | Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method | |
| CN104320909A (en) | High-step copper circuit board and manufacturing method thereof | |
| CN205005345U (en) | Circuit board that epoxy and metal base combine | |
| CN102883519A (en) | Blind-hole type two-sided thermal-conduction circuit board and manufacturing process thereof | |
| CN202068676U (en) | Novel circuit board of light-emitting diode (LED) lamp | |
| CN203984767U (en) | A kind of high capacity aluminum-based circuit board | |
| CN202190454U (en) | Interconnected conducting and heat-conducting structure of double-sided circuit board | |
| CN202178915U (en) | Blind hole double-face heat conducting circuit board | |
| CN207744233U (en) | A kind of pcb board of special blind hole | |
| CN201563285U (en) | Novel ceramic circuit board | |
| CN216291577U (en) | Multilayer circuit board | |
| CN205987540U (en) | Pressfitting structure of metal substrate resin consent | |
| CN202857141U (en) | Blind hole conduction double-face circuit board | |
| CN202050591U (en) | Double-sided filled aluminium base PCB board | |
| CN203167427U (en) | Plated-through hole carbon film plate of paper base material | |
| CN201616952U (en) | Double-faced circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111130 Termination date: 20200407 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |