CN104113978B - Aluminum-based circuit board and preparation method thereof, electronic component are encapsulated entirely - Google Patents
Aluminum-based circuit board and preparation method thereof, electronic component are encapsulated entirely Download PDFInfo
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- CN104113978B CN104113978B CN201310377533.7A CN201310377533A CN104113978B CN 104113978 B CN104113978 B CN 104113978B CN 201310377533 A CN201310377533 A CN 201310377533A CN 104113978 B CN104113978 B CN 104113978B
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- aluminum
- circuit board
- based circuit
- alumina layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
Encapsulated entirely for preparing aluminum-based circuit board that electronic component is sealed entirely and preparation method thereof and electronic component the invention discloses a kind of.The aluminum-based circuit board includes stacking gradually first anode alumina layer, aluminum layer, second plate alumina layer, thermally conductive insulating layer and the line layer of combination, wherein, the first anode alumina layer has the outer surface that the roughness formed using laser ablation is 0.5~9.5 μm, for strengthening the adhesion between the encapsulated layer that itself and electronic component are encapsulated entirely.Encapsulation includes the aluminum-based circuit board and the encapsulated layer of total incapsulation is carried out to the aluminum-based circuit board electronic component entirely.The above-mentioned adhesion for preparing between the encapsulated layer that the aluminum-based circuit board and electronic component of the full encapsulation of electronic component are encapsulated entirely, so that the above-mentioned full encapsulating structure stabilization of the electronic component containing the aluminum-based circuit board, and the adhesion high also significantly improves the heat dispersion that electronic component is encapsulated entirely, the combined reliability for making electronic component encapsulate entirely is lifted.
Description
Technical field
The invention belongs to technical field of electronic devices, and in particular to a kind of aluminum-based circuit board and preparation method thereof and one kind electricity
Subcomponent is encapsulated entirely.
Background technology
SPM heating is larger, it is therefore desirable to which good heat dissipation design is normal in industry to solve integrity problem
The way seen is fin to be set on packaging body and by radiating fin exposed outside, belongs to half encapsulating structure.At present, metal base circuit board
Widely used as power device insulating radiation component, these wiring board plates are general by metal substrate, insulating barrier, three layers of Copper Foil
Structure composition, wherein in the majority with inexpensive, light weight aluminium base.
Existing half envelop power module integrated level is not high, it is therefore desirable to increases peripheral circuit element, causes small product size
It is larger, it is unfavorable for the miniaturization of product；Peripheral circuit is integrated in device inside, and makes device miniaturization be a kind of trend, so
And it is highly integrated after half packaged products be easier integrity problem, therefore have device made into total incapsulation structure（That is electronics
Element is encapsulated entirely）, but be encapsulated in the aluminum-based circuit board of inside modules be easily subject in a humidity environment from plastic packaging material from
The corrosion of son, makes to be layered between wiring board and plastic packaging material, causes integrity problem.
For solving aluminium base etching problem, circuit board industry is used after generally oxygenizing aluminium base plate is processed, but after oxidation
Aluminium base and plastic packaging material between still suffer from adhesion difference problem.At present, there is the way to the roughening of fine aluminium substrate in industry, such as draw
Silk, sandblasting.But for the aluminium base with alumina layer, these methods are not applied to simultaneously.Wire drawing destroys oxidation Rotating fields, have impact on
Anticorrosion ability；Sandblasting is difficult to be roughened hardness alumina layer higher.
The content of the invention
The above-mentioned deficiency for aiming to overcome that prior art of the embodiment of the present invention, there is provided one kind is for preparing electronic component
Aluminum-based circuit board of full encapsulation and preparation method thereof, it is intended to overcome existing aluminium base alumina layer be roughened it is difficult, aluminium base with
The technical problem of adhesion difference between plastic packaging material.
The another object of the embodiment of the present invention is to provide a kind of reliability electronic component high to encapsulate entirely.
In order to realize foregoing invention purpose, the technical scheme of the embodiment of the present invention is as follows：
A kind of aluminum-based circuit board, it is used to preparing electronic component and encapsulates entirely, and the aluminum-based circuit board includes stacking gradually knot
The first anode alumina layer of conjunction, aluminum layer, second plate alumina layer, thermally conductive insulating layer and line layer, wherein, described first
Anodic aluminum oxide layer has the outer surface that the roughness formed using laser ablation is 0.5~9.5 μm, for strengthening itself and electronics
Adhesion between the encapsulated layer that element is encapsulated entirely.
And, a kind of method for preparing the aluminum-based circuit board encapsulated entirely for electronic component comprises the following steps：
Preparation includes first anode alumina layer, aluminum layer, second plate alumina layer, the heat conduction for stacking gradually combination
The aluminum-based circuit board semi-finished product of insulating barrier and line layer；
It is 8.5~9.5A that the first anode alumina layer outer surface of the aluminum-based circuit board semi-finished product is used into current strength
Laser ablation so that the roughness of first anode alumina layer outer surface be 0.5~9.5 μm.
And, a kind of electronic component is encapsulated entirely, including aluminum-based circuit board and the encapsulation of total incapsulation is carried out to aluminum-based circuit board
Layer, the aluminum-based circuit board is above-mentioned aluminum-based circuit board or the aluminium base prepared by the method for above-mentioned aluminum-based circuit board
Wiring board.
The above-mentioned first anode alumina layer outer surface for preparing the aluminum-based circuit board that electronic component is encapsulated entirely is using sharp
Photoengraving so that first anode alumina layer outer surface has specific roughness, so as to significantly improve the aluminum-based circuit board
Adhesion between the encapsulated layer encapsulated entirely with electronic component, so that the above-mentioned electronic component containing the aluminum-based circuit board is complete
Encapsulating structure stabilization, it is not stratified, do not ftracture, and the adhesion high also significantly improves the thermal diffusivity that electronic component is encapsulated entirely
Can, the combined reliability for making electronic component encapsulate entirely is lifted.
The preparation method of above-mentioned aluminum-based circuit board is carried out using the laser of specific currents intensity to first anode alumina layer
Etching, it is breakdown to be effectively ensured first anode alumina layer, and can be so that its surface has specific roughness, effective gram
Take and be roughened difficult or easily destroyed technical problem present in existing alumina layer lithographic method.In addition, using laser ablation,
Its condition is easy to control, and production efficiency is high.
Brief description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing：
Accompanying drawing 1 is the structural representation of embodiment of the present invention aluminum-based circuit board；
Accompanying drawing 2 is the cross-sectional view that embodiment of the present invention electronic component is encapsulated entirely；
Accompanying drawing 3 is the technique signal that the embodiment of the present invention is used for the aluminum-based circuit board preparation method that electronic component is encapsulated entirely
Figure；
Accompanying drawing 4 is the process schematic representation that embodiment of the present invention electronic component encapsulates preparation method entirely；
The ultrasonic scanning picture of substrate drop impact of the accompanying drawing 5 without laser ablation；
The ultrasonic scanning picture of the substrate drop impact after the laser ablation of accompanying drawing 6.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Present example provides a kind of for preparing electronic component encapsulation entirely, and adhesion is high between plastic packaging material, energy
Effectively solve the aluminum-based circuit board of etching problem.The aluminum-based circuit board structure as shown in Figure 1, 2, the aluminum-based circuit board 1 include according to
First anode alumina layer 11, aluminum layer 12, second plate alumina layer 13, thermally conductive insulating layer 14 and circuit that secondary stacking is combined
Layer 15.
Wherein, the first anode alumina layer 11 in Fig. 1,2 have the roughness formed using laser ablation for 0.5~
9.5 μm of outer surface 110.Use laser ablation and so that the roughness of outer surface 110 is for 0.5~9.5 μm can significantly improve
The adhesion between encapsulated layer 2 in the first anode alumina layer 11 and Fig. 2, so as to ensure that first anode alumina layer 11
It is not stratified between the encapsulated layer 2 in Fig. 2, do not ftracture, that is to say between the encapsulated layer 2 that improve in aluminum-based circuit board 1 and Fig. 2
Adhesion；Simultaneously as the presence of the first anode alumina layer 11, also acts the work for preventing aluminum-based circuit board from corroding
With so that the reliability that the electronic component described in Fig. 2 is encapsulated entirely is high.
In a preferred embodiment, the roughness of the outer surface of first anode alumina layer 1 is 4~9.5 μm.This is preferred coarse
Degree when both can guarantee that laser ablation first anode alumina layer 1 be not destroyed, and can so that its with Fig. 2 in encapsulated layer 2 between
Adhesion it is stronger, with reference to rear not stratified, do not ftracture so that the reliability of electronic component described in Fig. 2 encapsulation entirely is higher.
Or in further preferred embodiments, the roughness of the outer surface 110 of first anode alumina layer 11 in Fig. 1, Fig. 2
（I.e. 0.5~9.5 μm or 4~9.5 μm of roughness）It is by intensive point-like hole, point-like projection or/and groove（Point-like hole, point
Shape is raised, groove is not shown）Formed.
As in a particular embodiment, the roughness is to be cheated to be formed by intensive point-like.In another specific embodiment, this is thick
Rugosity is convexed to form by intensive point-like.In still another embodiment, the roughness is by intensive coarse ditch flute profile
Into.Or in still another embodiment, the roughness is two kinds or three by intensive shape hole, point-like be raised, in coarse groove
Random combination is planted to be formed.In each specific embodiment, the pattern of the outer surface 110 of first anode alumina layer 11 is without special
Rule is distributed, and such as when the pattern that outer surface 110 is made up of intensive point-like hole, point-like projection or groove, point-like hole, point-like are convex
Rise or the distribution of groove is random distribution；When outer surface 110 two kinds by intensive point-like hole, point-like be raised, in groove or
During the pattern that three kinds of combinations are constituted, point-like hole, point-like are raised, two or three in groove of distribution is also random distribution,
That is, as long as it is 0.5~9.5 μm that laser ablation can be utilized to control the roughness of outer surface 110, be preferably 4~9.5 μm i.e.
Can.
In a particular embodiment, the size for constituting the point-like hole of the pattern of outer surface 110 is 1~3 μm, such as the size in point-like hole
It is 1 μm, 2 μm, 3 μm.In another specific embodiment, the size for constituting the point-like projection of the pattern of outer surface 110 is 1~3 μm, such as
The raised size of point-like is 1 μm, 2 μm, 3 μm.In still another embodiment, the intensive coarse of the pattern of outer surface 110 is constituted
Groove dimensions be 1~10 μm, such as groove size be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm.
The above-mentioned each preferred specific embodiment on the pattern of outer surface 110 is for improving first anode alumina layer
The combination force intensity between encapsulated layer 2 in 11 outer surfaces 110 and Fig. 2, and can cause that combination force intensity between the two is higher.
Through laser ablation and cause that the outer surface 110 of above-mentioned first anode alumina layer 11 has above-mentioned each preferred embodiment
After pattern, the thickness of first anode alumina layer 11 is preferably 0.5~9.5 μm.The energy of first anode alumina layer 11 of the thickness
Such as aluminum layer 12 of aluminum-based circuit board 1 is effectively protected not to be corroded.Accordingly, in a preferred embodiment, first anode alumina layer 11
The roughness of 0.5~9.5 μm of outer surface 110 is raised by intensive point-like or/and groove is formed, now, first anode oxygen
The thickness for changing the outer surface 110 of aluminium lamination 11 is 0.5~6 μm.
In another preferred embodiment, the roughness of 0.5~9.5 μm of the outer surface 110 of first anode alumina layer 11 is
Cheated by intensive point-like and formed, now, the thickness of the outer surface 110 of first anode alumina layer 11 is 1~10 μm.
Second plate alumina layer 13 in Fig. 1,2 can cause to be insulated between aluminum layer 12 and line layer 15, particularly weld
It is connected on the insulation between the electronic component 16 on line layer 15 and aluminum layer 12.In order that obtaining between aluminum layer 12 and line layer 15
Insulation effect of the insulation particularly between electronic component 16 and aluminum layer 12 is more preferable, in a preferred embodiment, the second plate oxygen
The thickness for changing aluminium lamination 13 is 1~10 μm, more preferably 10 μm.The second plate alumina layer 13 of the preferred thickness enables to electricity
Subcomponent 16 is up to 300 volts with the insulation proof voltage of aluminum layer 12.
Aluminum layer 12, thermally conductive insulating layer 14 in Fig. 1,2, line layer 15 may each be the conventional structure in this area, at this
Do not required particularly in inventive embodiments.Be welded on electronic component 16 on line layer 15 can according to actual application or
The full encapsulated type of electronic component in Fig. 2 is selected.
From the foregoing, the above-mentioned first anode alumina layer for preparing the aluminum-based circuit board 1 that electronic component is encapsulated entirely
11 outer surfaces 110 use laser ablation so that the outer surface 110 of first anode alumina layer 11 has specific roughness and can protect
Card first anode alumina layer 11 is not destroyed, so as to significantly improve the envelope that the aluminum-based circuit board 1 is encapsulated entirely with electronic component
Adhesion between dress layer, with reference to both rear not stratified, does not ftracture, it is ensured that aluminum-based circuit board 1 is not corroded so that electronic component
The reliability of full encapsulation is higher.
Correspondingly.Present invention also offers a kind of condition is easily-controllable, accuracy is high for preparing electronic component encapsulation entirely
Aluminum-based circuit board preparation method.The method can be used to prepare aluminum-based circuit board 1 as shown in Figure 1 above, the technique of the method
As shown in figure 3, refer to Fig. 2 simultaneously, it comprises the following steps：
Step S01. prepares the aluminum-based circuit board semi-finished product encapsulated entirely for electronic component：Preparation is included and stacks gradually knot
The aluminium base of the first anode alumina layer of conjunction, aluminum layer 12, second plate alumina layer 13, thermally conductive insulating layer 14 and line layer 15
Circuit boards half-finished product；Wherein, it is welded with corresponding electronic component 16 on line layer 15；
Step S02. is performed etching the outer surface 110 of first anode alumina layer 11 using laser：It is prepared by step S01
To use current strength be the laser incising of 8.5~9.5A the first anode alumina layer outer surface 110 of aluminum-based circuit board semi-finished product
Erosion, forms first anode alumina layer 11, and the roughness of its outer surface 110 is 0.5~9.5 μm, obtains aluminum-based circuit board 1；
Specifically, in above-mentioned steps S01 aluminum layer 12, second plate alumina layer 13, thermally conductive insulating layer 14 and circuit
Each parts such as layer 15, electronic component 16 as described above, in order to save length, will not be repeated here.Wherein, first anode oxygen
Changing aluminium lamination should meet the requirement of the first anode alumina layer 11 for forming mentioned above after the laser ablation in step S02.Respectively
Part can be prepared according to this area conventional method.
In above-mentioned steps S02, the first anode alumina layer in step S01 is etched using the laser of above-mentioned current strength
Afterwards so that first anode alumina layer turns into first anode alumina layer 11 mentioned above.Specifically, the first of etching formation
The pattern and roughness of anodic aluminum oxide layer 11 as described above, in order to save length, will not be repeated here.
In a preferred embodiment, when the pattern that the first anode alumina layer 11 to be formed is etched through this step is intensive point
During the pattern of shape hole, the laser ablation is 8.5~9.0 Ampere currents intensity.
In another preferred embodiment, when the pattern that the first anode alumina layer 11 to be formed is etched through this step is intensive
Point-like projection pattern when, the laser ablation is 9.0~9.5 Ampere currents intensity.
In a further preferred embodiment, when the pattern that the first anode alumina layer 11 to be formed is etched through this step is intensive
Groove pattern when, the laser ablation is 9.0~9.5 Ampere currents intensity.
In a further preferred embodiment, when the pattern that the first anode alumina layer 11 to be formed is etched through this step is for above
Described intensive point-like hole, point-like are raised, two or three random composition features in groove when, the technique of the laser ablation
Condition can be set using according to the process conditions random combine of etching point-like hole, point-like projection, the respective etching of groove pattern.
The preparation method of above-mentioned aluminum-based circuit board is carried out using the laser of specific currents intensity to first anode alumina layer
Etching, it is breakdown to be effectively ensured first anode alumina layer, and can be so that its surface has specific roughness, effective gram
Take and be roughened difficult or easily destroyed technical problem present in existing alumina layer lithographic method.In addition, using laser ablation,
Its condition is easy to control, and production efficiency is high.
Further, embodiment is encapsulated entirely present invention also offers a kind of reliability electronic component high, the electronic component
The structure of full encapsulation is as shown in Figure 2.In fig. 2, encapsulation includes aluminum-based circuit board 1 and to aluminum-based circuit board 1 to the electronic component entirely
Carry out the encapsulated layer 2 of total incapsulation.
Specifically, shown in the Fig. 2 electronic component aluminum-based circuit board 1 entirely in encapsulation for as described above with shown in Fig. 1
Aluminum-based circuit board 1 or as described above with shown in Fig. 3 be used for electronic component full encapsulation aluminum-based circuit board preparation method
The aluminum-based circuit board being prepared from.Therefore, in order to save length, the concrete structure no longer to aluminum-based circuit board 1 is gone to live in the household of one's in-laws on getting married herein
State, can directly see above.
The material of encapsulated layer 2 during electronic component shown in the Fig. 2 is encapsulated entirely is preferably epoxy-plastic packaging material.It is of course also possible to
The need for according to actual production, from this area, other plastic packaging materials carry out total incapsulation to aluminum-based circuit board 1.In addition, encapsulated layer 2
Thickness can also be according to being adjusted flexibly and setting the need for actual production.
Encapsulation can be prepared as follows electronic component shown in Fig. 2 entirely, while electronics unit shown in Figure 5
Part encapsulates the process schematic representation of preparation method entirely：
S03. aluminum-based circuit board 1 is prepared；
S04. aluminum-based circuit board is encapsulated using encapsulating material：Aluminum-based circuit board 1 prepared by step S03 is carried out using encapsulating material
Encapsulation.
Specifically, in above-mentioned steps S03 aluminum-based circuit board 1 preparation method such as aluminum-based circuit board preparation method and figure above
Technique is prepared shown in 3.
The encapsulating material of above-mentioned steps S04 is it is preferable to be epoxy-plastic packaging material.It is of course also possible to according to actual life
The need for product, from other plastic packaging materials of this area.
The method for carrying out total incapsulation in step S04 to aluminum-based circuit board 1 can be according to the conventional encapsulating in this area or envelope
Dress method is carried out.
The electronic component is encapsulated due to selecting aluminum-based circuit board 1 mentioned above as aluminum-based circuit board entirely, therefore, the aluminium
Adhesion between base circuit board 1 and encapsulated layer 2 is strong, with reference to both rear not stratified, does not ftracture, exactly both excellent adhesions
Make the heat dispersion of electronic component encapsulation entirely more excellent, in addition, the first anode alumina layer 11 of aluminum-based circuit board 1 it is complete not by
Destruction, therefore, the corrosion resistance of aluminum-based circuit board 1 is strong.Exactly have the adhesion between aluminum-based circuit board 1 and encapsulated layer 2 strong, dissipate
Hot property is excellent, and the corrosion resistance of aluminum-based circuit board 1 is strong so that the combined reliability of the full encapsulation of electronic component is relatively existing to be shown
Write lifting.
Illustrated below by way of multiple embodiments and further illustrate above-mentioned aluminum-based circuit board and preparation method thereof, electronic component
The aspects such as the correlated performance of full encapsulation.
Embodiment 1
A kind of aluminum-based circuit board encapsulated entirely for electronic component, encapsulated entirely and complete for electronic component for electronic component
The preparation method of encapsulation.
The structure of the aluminum-based circuit board is as shown in figure 1, its first anode alumina layer, fine aluminium for including stacking gradually combination
Layer, second plate alumina layer, thermally conductive insulating layer and line layer and the electronic component being welded on line layer.Wherein, first
The thickness of anodic aluminum oxide layer is 9.9 μm, and its appearance roughness is 0.1 μm, and its configuration of surface is the intensive circle of random distribution
Point-like dell, embodiment 1 in the table 1 that sees below.
The electronic component is encapsulated as shown in Fig. 2 its structure is to include aluminum-based circuit board and aluminum-based circuit board is carried out entirely entirely
The encapsulated layer of encapsulating.
It is as follows that above-mentioned aluminum-based circuit board and electronic component encapsulate preparation method entirely：
（1）Preparation includes first anode aluminum oxide original layers, aluminum layer, the second plate aluminum oxide for stacking gradually combination
The aluminum-based circuit board semi-finished product of layer, thermally conductive insulating layer and line layer；Wherein, corresponding electronic component is welded with line layer；
（2）By the laser diode current intensity selection of laser marking machine at 8 amperes, laser parameter is set：Mark speed
3000mm/s, empty hop rate degree 2000mm/s, Q frequency 20KHz, aluminum-based circuit board semi-finished product are placed on the operating desk of laser marking machine
On face, and cause that first anode alumina layer is relative with light source, focus on laser, selection laser scanning area is slightly larger than the first anode
The area of alumina layer, carries out laser ablation, is then packaged with plastic packaging material.
Embodiment 2
A kind of aluminum-based circuit board encapsulated entirely for electronic component, encapsulated entirely and complete for electronic component for electronic component
The preparation method of encapsulation.
The aluminum-based circuit board and the full encapsulating structure of electronic component are as complete in the aluminum-based circuit board and electronic component in embodiment 1
Encapsulation.Difference is that the thickness of first anode alumina layer is 9.5 μm, and its appearance roughness is 0.5 μm, and its configuration of surface is also
The intensive round point shape dell being arbitrarily distributed, embodiment 2 in the table 1 that sees below.
It is as follows that above-mentioned aluminum-based circuit board and electronic component encapsulate preparation method entirely：
（1）With reference to step in embodiment 1（1）；
（2）By the laser diode current intensity selection of laser marking machine at 8.5 amperes, laser parameter is set：Mark speed
3000mm/s, empty hop rate degree 2000mm/s, Q frequency 20KHz, aluminum-based circuit board semi-finished product are placed on the operating desk of laser marking machine
On face, and cause that first anode alumina layer is relative with light source, focus on laser, selection laser scanning area is slightly larger than the first anode
The area of alumina layer, carries out laser ablation, is then packaged with plastic packaging material.
Embodiment 3
A kind of aluminum-based circuit board encapsulated entirely for electronic component, encapsulated entirely and complete for electronic component for electronic component
The preparation method of encapsulation.
The aluminum-based circuit board and the full encapsulating structure of electronic component are as complete in the aluminum-based circuit board and electronic component in embodiment 1
Encapsulation.Difference is that the thickness of first anode alumina layer is 6 μm, and its appearance roughness is 4 μm, and its configuration of surface is random point
The intensive coarse groove and point-like of cloth are raised, embodiment 3 in the table 1 that sees below.
It is as follows that above-mentioned aluminum-based circuit board and electronic component encapsulate preparation method entirely：
（1）With reference to step in embodiment 1（1）；
（2）By the laser diode current intensity selection of laser marking machine at 9 amperes, laser parameter is set：Mark speed
3000mm/s, empty hop rate degree 2000mm/s, Q frequency 20KHz, aluminum-based circuit board semi-finished product are placed on the operating desk of laser marking machine
On face, and cause that first anode alumina layer is relative with light source, focus on laser, selection laser scanning area is slightly larger than the first anode
The area of alumina layer, carries out laser ablation, is then packaged with plastic packaging material.
Embodiment 4
A kind of aluminum-based circuit board encapsulated entirely for electronic component, encapsulated entirely and complete for electronic component for electronic component
The preparation method of encapsulation.
The aluminum-based circuit board and the full encapsulating structure of electronic component are as complete in the aluminum-based circuit board and electronic component in embodiment 1
Encapsulation.Difference be the thickness of first anode alumina layer for 0.5 μm, its appearance roughness is 9.5 μm, its configuration of surface be with
The intensive coarse groove and point-like of meaning distribution are raised, embodiment 4 in the table 1 that sees below.
It is as follows that above-mentioned aluminum-based circuit board and electronic component encapsulate preparation method entirely：
（1）With reference to step in embodiment 1（1）；
（2）By the laser diode current intensity selection of laser marking machine at 9.5 amperes, laser parameter is set：Mark speed
3000mm/s, empty hop rate degree 2000mm/s, Q frequency 20KHz, aluminum-based circuit board semi-finished product are placed on the operating desk of laser marking machine
On face, and cause that first anode alumina layer is relative with light source, focus on laser, selection laser scanning area is slightly larger than the first anode
The area of alumina layer, carries out laser ablation, is then packaged with plastic packaging material.
Embodiment 5
A kind of aluminum-based circuit board encapsulated entirely for electronic component, encapsulated entirely and complete for electronic component for electronic component
The preparation method of encapsulation.
The aluminum-based circuit board and the full encapsulating structure of electronic component are as complete in the aluminum-based circuit board and electronic component in embodiment 1
Encapsulation.Difference is that intensive coarse groove and point-like that its configuration of surface is random distribution are raised, and the first anode is aoxidized
Aluminium lamination is destroyed, embodiment 5 in the table 1 that sees below.
It is as follows that above-mentioned aluminum-based circuit board and electronic component encapsulate preparation method entirely：
（1）With reference to step in embodiment 1（1）；
（2）By the laser diode current intensity selection of laser marking machine at 10 amperes, laser parameter is set：Mark speed
3000mm/s, empty hop rate degree 2000mm/s, Q frequency 20KHz, aluminum-based circuit board semi-finished product are placed on the operating desk of laser marking machine
On face, and cause that first anode alumina layer is relative with light source, focus on laser, selection laser scanning area is slightly larger than the first anode
The area of alumina layer, carries out laser ablation, is then packaged with plastic packaging material.
Embodiment 6
A kind of aluminum-based circuit board encapsulated entirely for electronic component, encapsulated entirely and complete for electronic component for electronic component
The preparation method of encapsulation.
The aluminum-based circuit board and the full encapsulating structure of electronic component are as complete in the aluminum-based circuit board and electronic component in embodiment 1
Encapsulation.Difference is that intensive coarse groove and point-like that its configuration of surface is random distribution are raised, and the first anode is aoxidized
Aluminium lamination is destroyed, embodiment 6 in the table 1 that sees below.
It is as follows that above-mentioned aluminum-based circuit board and electronic component encapsulate preparation method entirely：
（1）With reference to step in embodiment 1（1）；
（2）By the laser diode current intensity selection of laser marking machine at 10.5 amperes, laser parameter is set：Mark speed
3000mm/s, empty hop rate degree 2000mm/s, Q frequency 20KHz, aluminum-based circuit board semi-finished product are placed on the operating desk of laser marking machine
On face, and cause that first anode alumina layer is relative with light source, focus on laser, selection laser scanning area is slightly larger than the first anode
The area of alumina layer, carries out laser ablation, is then packaged with plastic packaging material.
Embodiment 7
A kind of aluminum-based circuit board encapsulated entirely for electronic component, encapsulated entirely and complete for electronic component for electronic component
The preparation method of encapsulation.
The aluminum-based circuit board and the full encapsulating structure of electronic component are as complete in the aluminum-based circuit board and electronic component in embodiment 1
Encapsulation.Difference is the intensive coarse groove that its configuration of surface is random distribution, and first anode alumina layer is destroyed,
See below embodiment 6 in table 1.
It is as follows that above-mentioned aluminum-based circuit board and electronic component encapsulate preparation method entirely：
（1）With reference to step in embodiment 1（1）；
（2）By the laser diode current intensity selection of laser marking machine at 11 amperes, laser parameter is set：Mark speed
3000mm/s, empty hop rate degree 2000mm/s, Q frequency 20KHz, aluminum-based circuit board semi-finished product are placed on the operating desk of laser marking machine
On face, and cause that first anode alumina layer is relative with light source, focus on laser, selection laser scanning area is slightly larger than the first anode
The area of alumina layer, carries out laser ablation, is then packaged with plastic packaging material.
Comparative example 1：
The step of aluminum-based circuit board and electronic component according to embodiment 1 encapsulate preparation method entirely（1）Prepare aluminium base circuit
Boards half-finished product, then direct aluminum-based circuit board semi-finished product without it is any treatment be directly packaged with plastic packaging material.
Comparative example 2：
The step of aluminum-based circuit board and electronic component according to embodiment 1 encapsulate preparation method entirely（1）Prepare aluminium base circuit
Boards half-finished product, then the first anode alumina layer to aluminum-based circuit board semi-finished product do wire drawing process, then carried out with plastic packaging material
Encapsulation.
Comparative example 3：
The step of aluminum-based circuit board and electronic component according to embodiment 1 encapsulate preparation method entirely（1）Prepare aluminium base circuit
Boards half-finished product, then the first anode alumina layer to aluminum-based circuit board semi-finished product do blasting treatment, then carried out with plastic packaging material
Encapsulation.
Performance test：
First anode alumina layer outward appearance, the thickness of aluminum-based circuit board prepared by above-described embodiment 1-7 and comparative example 1-3
Degree, roughness, pattern are observed and determined, while prepare electronic component to above-described embodiment 1-7 and comparative example 1-3 encapsulating entirely
Test of dropping hammer is carried out, properties test result is shown in Table 1：
Table 1
Be can be seen that from the embodiment 1-7 of upper table 1, it is ensured that the roughness of anodic oxide coating is aoxidized in the range of 0.5-9.5
Layer pattern is that round point shape dell or coarse groove and point-like are raised, meets the full encapsulating products plastic packaging material of electronic component after encapsulation
Adhesion with aluminum-based circuit board anodic oxide coating is required, while ensure that the anodic oxide coating of aluminum-based circuit board is not destroyed,
Reduce risk of the aluminum-based circuit board fine aluminium layer segment by plastic packaging material corrosion.Comparative example is then unsatisfactory for requiring that contrast is real
Example 1 is applied, the anodic oxide coating layering without any treatment is serious；Comparative example 2, and wire drawing then destroys oxide layer completely,
It is difficult to meet the reliability requirement of encapsulation；Comparative example 3, and sandblasting lifts no positive effect to adhesion.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Any modification, equivalent and improvement made within god and principle etc., all should be included within protection scope of the present invention.
Claims (12)
1. a kind of aluminum-based circuit board, it is used to preparing electronic component and encapsulates entirely, and the aluminum-based circuit board includes stacking gradually combination
First anode alumina layer, aluminum layer, second plate alumina layer, thermally conductive insulating layer and line layer, it is characterised in that：It is described
It is 0.5~9.5 μm that first anode alumina layer has the roughness formed using the laser ablation that current strength is 8.5~9.5A
Outer surface, for strengthening the adhesion between the encapsulated layer that itself and electronic component are encapsulated entirely；The first anode alumina layer
The roughness of outer surface is formed by intensive point-like hole, point-like projection or/and groove.
2. aluminum-based circuit board as claimed in claim 1, it is characterised in that：The first anode alumina layer outer surface it is coarse
Spend is 4~9.5 μm.
3. aluminum-based circuit board as claimed in claim 1, it is characterised in that：The size in the point-like hole is 1~3 μm, and/or point
The raised size of shape is 1~3 μm, and/or the size of groove is 1~10 μm.
4. aluminum-based circuit board as claimed in claim 1 or 2, it is characterised in that：The thickness of the first anode alumina layer is
0.5~9.5 μm.
5. aluminum-based circuit board as claimed in claim 1 or 2, it is characterised in that：The first anode alumina layer outer surface
0.5~9.5 μm of roughness is raised by intensive point-like or/and groove is formed, and the first anode alumina layer appearance
The thickness in face is 0.5~6 μm.
6. aluminum-based circuit board as claimed in claim 1 or 2, it is characterised in that：The first anode alumina layer outer surface
0.5~9.5 μm of roughness is to be cheated to be formed by intensive point-like, and the thickness of the first anode alumina layer outer surface is 1
~10 μm.
7. aluminum-based circuit board as claimed in claim 1 or 2, it is characterised in that：The thickness of the second plate alumina layer is 1
~10 μm.
8. aluminum-based circuit board as claimed in claim 7, it is characterised in that：The thickness of the second plate alumina layer is 10 μ
m。
9. a kind of method for preparing the aluminum-based circuit board encapsulated entirely for electronic component, comprises the following steps：
Preparation includes first anode alumina layer, aluminum layer, second plate alumina layer, the heat conductive insulating for stacking gradually combination
The aluminum-based circuit board semi-finished product of layer and line layer；
The first anode alumina layer outer surface of the aluminum-based circuit board semi-finished product is used into current strength swashing for 8.5~9.5A
Photoengraving so that the roughness of first anode alumina layer outer surface is 0.5~9.5 μm；And；The first anode alumina layer
The roughness of outer surface is raised by intensive point-like hole or/and point-like, or by point-like hole or/and point-like projection and ditch flute profile
Into.
10. the method for aluminum-based circuit board as claimed in claim 9, it is characterised in that：The laser ablation is 8.5~9.0 peaces
Training amperage conditions form intensive point-like hole pattern on first anode alumina layer outer surface so that the first anode
The roughness of alumina layer outer surface is 0.5~9.5 μm.
The method of 11. aluminum-based circuit boards as claimed in claim 9, it is characterised in that：The laser ablation is 9.0~9.5 peaces
Training amperage conditions form intensive point-like projection or/and groove pattern on first anode alumina layer outer surface so that
The roughness of the first anode alumina layer outer surface is 0.5~9.5 μm.
A kind of 12. electronic components are encapsulated entirely, including aluminum-based circuit board and the encapsulated layer of total incapsulation are carried out to aluminum-based circuit board, and it is special
Levy and be：The aluminum-based circuit board is aluminum-based circuit board as described in any one of claim 1~8 or by such as claim 9
The aluminum-based circuit board that the method for the aluminum-based circuit board described in~11 any one is prepared.
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| JP6252871B2 (en) * | 2015-01-16 | 2017-12-27 | 株式会社オートネットワーク技術研究所 | Circuit structure and electrical junction box |
| CN106384731A (en) * | 2016-11-24 | 2017-02-08 | 广东美的制冷设备有限公司 | Substrate, method for manufacturing substrate and smart power module |
| US10180247B1 (en) * | 2017-07-03 | 2019-01-15 | Valeo North America, Inc. | Device and method for placement of light source on a heat sink |
| CN108807292B8 (en) * | 2018-06-15 | 2020-01-14 | 南通鸿图健康科技有限公司 | Intelligent power module and manufacturing method thereof |
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