CN108807292B8 - Intelligent power module and manufacturing method thereof - Google Patents

Intelligent power module and manufacturing method thereof Download PDF

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Publication number
CN108807292B8
CN108807292B8 CN201810618254.8A CN201810618254A CN108807292B8 CN 108807292 B8 CN108807292 B8 CN 108807292B8 CN 201810618254 A CN201810618254 A CN 201810618254A CN 108807292 B8 CN108807292 B8 CN 108807292B8
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CN
China
Prior art keywords
power module
intelligent power
forming
manufacturing
resin plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810618254.8A
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Chinese (zh)
Other versions
CN108807292A (en
CN108807292B (en
Inventor
戴世元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nantong Hongtu Health Technology Co ltd
Original Assignee
Nantong Hongtu Health Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nantong Hongtu Health Technology Co ltd filed Critical Nantong Hongtu Health Technology Co ltd
Priority to CN201810618254.8A priority Critical patent/CN108807292B8/en
Publication of CN108807292A publication Critical patent/CN108807292A/en
Publication of CN108807292B publication Critical patent/CN108807292B/en
Application granted granted Critical
Publication of CN108807292B8 publication Critical patent/CN108807292B8/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The invention provides an intelligent power module and a manufacturing method thereof, wherein the manufacturing method of the intelligent power module comprises the following steps: forming a composite resin plate, forming a plurality of strip-shaped grooves which are arranged in parallel in the composite resin plate, embedding a strip-shaped metal block, bonding a metal substrate and a silicon carbide insulating layer on the surface of the composite resin plate, then forming a circuit wiring layer, assembling a plurality of electronic components and a plurality of pins on the circuit wiring layer, and finally forming a resin sealing layer. The intelligent power module has excellent sealing performance, shock resistance, heat conduction performance and stability, and the service life of the intelligent power module is prolonged.
CN201810618254.8A 2018-06-15 2018-06-15 Intelligent power module and manufacturing method thereof Active CN108807292B8 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810618254.8A CN108807292B8 (en) 2018-06-15 2018-06-15 Intelligent power module and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810618254.8A CN108807292B8 (en) 2018-06-15 2018-06-15 Intelligent power module and manufacturing method thereof

Publications (3)

Publication Number Publication Date
CN108807292A CN108807292A (en) 2018-11-13
CN108807292B CN108807292B (en) 2019-11-01
CN108807292B8 true CN108807292B8 (en) 2020-01-14

Family

ID=64086157

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810618254.8A Active CN108807292B8 (en) 2018-06-15 2018-06-15 Intelligent power module and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN108807292B8 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109546871B (en) * 2018-12-29 2020-12-22 广东美的制冷设备有限公司 Power integration module for air conditioner and method of manufacturing the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101082414B (en) * 2006-05-30 2011-08-17 新灯源科技有限公司 Luminous diode lighting apparatus with high power and high heat sinking efficiency
JP2012191155A (en) * 2011-02-22 2012-10-04 Yazaki Corp Wiring board, and manufacturing method thereof
JP5807801B2 (en) * 2011-04-20 2015-11-10 トヨタ自動車株式会社 Semiconductor module
CN104113978B (en) * 2013-08-23 2017-06-09 广东美的制冷设备有限公司 Aluminum-based circuit board and preparation method thereof, electronic component are encapsulated entirely
CN106024651A (en) * 2016-07-29 2016-10-12 广东美的制冷设备有限公司 Intelligent power module and manufacturing method thereof
CN107301979A (en) * 2017-06-21 2017-10-27 广东美的制冷设备有限公司 SPM and the air conditioner with it

Also Published As

Publication number Publication date
CN108807292A (en) 2018-11-13
CN108807292B (en) 2019-11-01

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Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20190919

Address after: 226600 169 Li Fa FA Road, Chengdong Town, Haian City, Nantong, Jiangsu.

Applicant after: Nantong Ji Zhi Intellectual Property Service Co.,Ltd.

Address before: 226300 No. 266 Century Avenue, hi tech Zone, Jiangsu, Nantong

Applicant before: NANTONG WOTE OPTOELECTRONICS TECHNOLOGY CO.,LTD.

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant
TA01 Transfer of patent application right

Effective date of registration: 20191015

Address after: 226300 Southern District of Tongzhou District Industrial Park, Tongzhou District, Nantong, Jiangsu

Applicant after: Nantong Hongtu Health Technology Co.,Ltd.

Address before: 226600 169 Li Fa FA Road, Chengdong Town, Haian City, Nantong, Jiangsu.

Applicant before: Nantong Ji Zhi Intellectual Property Service Co.,Ltd.

TA01 Transfer of patent application right
CI03 Correction of invention patent

Correction item: Patentee|Address|Patent agency|Agent

Correct: Nantong Hongtu Health Technology Co.,Ltd.|226300 Southern District of Tongzhou District Industrial Park, Tongzhou District, Nantong, Jiangsu|Hangzhou Jubang Intellectual Property Agency Co., ltd.33269|Zhou Meifeng

False: Nantong Ji Zhi Intellectual Property Service Co.,Ltd.|226600 169 Li Fa FA Road, Chengdong Town, Haian City, Nantong, Jiangsu.|None

Number: 44-02

Page: The title page

Volume: 35

Correction item: Patentee|Address|Patent agency|Agent

Correct: Nantong Hongtu Health Technology Co.,Ltd.|226300 Southern District of Tongzhou District Industrial Park, Tongzhou District, Nantong, Jiangsu|Hangzhou Jubang Intellectual Property Agency Co., ltd.33269|Zhou Meifeng

False: Nantong Ji Zhi Intellectual Property Service Co.,Ltd.|226600 169 Li Fa FA Road, Chengdong Town, Haian City, Nantong, Jiangsu.|None

Number: 44-02

Volume: 35

CI03 Correction of invention patent
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: An intelligent power module and its manufacturing method

Effective date of registration: 20231020

Granted publication date: 20191101

Pledgee: Nantong Jiangsu rural commercial bank Limited by Share Ltd.

Pledgor: Nantong Hongtu Health Technology Co.,Ltd.

Registration number: Y2023980061700

PE01 Entry into force of the registration of the contract for pledge of patent right