CN101841976A - Method for manufacturing circuit board with high thermal conductivity by oil printing method and circuit board with high thermal conductivity - Google Patents
Method for manufacturing circuit board with high thermal conductivity by oil printing method and circuit board with high thermal conductivity Download PDFInfo
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- CN101841976A CN101841976A CN 201010177622 CN201010177622A CN101841976A CN 101841976 A CN101841976 A CN 101841976A CN 201010177622 CN201010177622 CN 201010177622 CN 201010177622 A CN201010177622 A CN 201010177622A CN 101841976 A CN101841976 A CN 101841976A
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Abstract
The invention relates to a method for manufacturing a circuit board with high thermal conductivity by an oil printing method and the circuit board with high thermal conductivity and aims to solve the radiating problem of a heating element on the circuit board. The assembling process of a heat-conducting post is integrated into the manufacturing process of the circuit board per se comprehensively according to the realizing process of the circuit board with high thermal conductivity and overall arrangement. The method is mainly characterized in that: before an electrically-connected circuit is formed, the heat-conducting post is assembled on a predetermined position in the circuit board, a conducting layer is printed by stencil and an electric circuit is etched, so retreatment after the circuit board is molded is avoided. An arranged metal layer can further dissipate heat on the heat-conducting post. The circuit board has the advantages of better radiating effect, simple and convenient operation, simple structure and low cost.
Description
[technical field]
The present invention relates to the Printed circuit board and manufacturing methods of electricity field.
[background technology]
Power device generates heat obviously in the course of the work, if can not in time dispel the heat, may damage power device, even causes whole electronic product operation irregularity.With the LED luminous product is example, and it normally is arranged in a large amount of LED concentrated area on the circuit board, and when LED worked long hours, the savings of heat will cause the lost of life of LED, makes the product performance instability.
No. 200810241905.2 applications for a patent for invention of China disclose a kind of radiating circuit substrate that assembles heat sink method and the making of this method at wiring board.The heat sink method of its assembling may further comprise the steps: make at least one through hole in the circuit board; Make cooperate with via clearance heat sink; In heat sink through hole of inserting wiring board; And utilize mould to exert pressure to heat sink, fix in the circuit board until heat sink extrusion.Its radiating circuit substrate that provides comprises wiring board, through hole and heat sink, heat sink being assemblied in the through hole.
Yet only at the heat sink installation on the wiring board of finishing behind the electric wiring, its defective is above-mentioned patented technology: at first, heat sink operation is installed is the independent process after wiring board is finished, increased workload; Secondly, push when heat sink, may damage the electric wiring on the wiring board by mould.We can say that above-mentioned patented technology is fit to the installation of indivedual power devices, is not suitable for the installation of a large amount of power devices of high density, array distribution.In addition, heat heat sink in the above-mentioned patented technology does not further conduct, and radiating effect is limited.
Along with further developing and the development of the Highgrade integration of electronic product of semiconductor industry, the heat radiation solution of heater element is still waiting further lifting on the circuit board.
[summary of the invention]
The objective of the invention is, take all factors into consideration the realization operation of high-thermal conductivity circuit board, heat sink assembly process is integrated in the production process of wiring board, with the manufacture method of simplifying high-thermal conductivity circuit board and obtain corresponding high-thermal conductivity circuit board.
For achieving the above object, the present invention has adopted following technical scheme:
The method of high-thermal conductivity circuit board is made in a kind of oil printing, it is characterized in that, may further comprise the steps:
(1) provides insulated base material layer;
(2) or a: on insulated base material layer, offer some through holes, in through hole, insert the metal heat-conducting post, and hot pressing, curing, at insulated base material layer upper surface mimeograph conductive layer, lower surface mimeograph heat-conducting layer;
Perhaps b: at the insulated base material layer lower surface metal heat-conducting layer that is sticked, constitute one-side band metal level sheet material earlier, on one-side band metal level sheet material, offer some through holes, in through hole, insert the metal heat-conducting post, and hot pressing, curing, at insulated base material layer upper surface mimeograph conductive layer;
Perhaps c: at the insulated base material layer upper surface metal conducting layer that is sticked, the lower surface metal heat-conducting layer that is sticked, on double-sided metallic sheet material, offer some through holes, in through hole, insert the metal heat-conducting post, and hot pressing, curing, at metal conducting layer and then mimeograph conductive layer, at metal heat-conducting laminar surface and then mimeograph heat-conducting layer;
(3), form and be electrically connected circuit at the unnecessary electric conducting material of insulated base material layer upper surface etching.
A kind of high-thermal conductivity circuit board is characterized in that: comprise the electric wiring layer of insulated base material layer, insulated base material layer upper surface, the mimeograph heat-conducting layer and the metal heat-conducting post of insulated base material layer lower surface; The electric wiring layer is that the mimeograph conductive layer forms through etching; Insulated base material layer is offered through hole pre-seting the heater element place, and described metal heat-conducting post is arranged in the through hole, and its upper end is used for cooperating with the heater element heat conduction that pre-sets, and the lower end cooperates with the heat conduction of mimeograph heat-conducting layer.
A kind of high-thermal conductivity circuit board is characterized in that: comprise the electric wiring layer of insulated base material layer, insulated base material layer upper surface, the heat-conducting layer and the metal heat-conducting post of insulated base material layer lower surface; The electric wiring layer forms through etching for the mimeograph conductive layer on metal conducting layer and surface thereof, and heat-conducting layer comprises the mimeograph heat-conducting layer on metal heat-conducting layer and surface thereof; Insulated base material layer is offered through hole pre-seting the heater element place, and described metal heat-conducting post is arranged in the through hole, and its upper end is used for cooperating with the heater element heat conduction that pre-sets, and the lower end cooperates with metal heat-conducting layer and the heat conduction of mimeograph heat-conducting layer.
The method of making high-thermal conductivity circuit board provided by the invention, pass through general arrangement, before formation is electrically connected circuit, heating column is assemblied in precalculated position in the circuit board, do not influence subsequent handling (etching), avoid the processing once more behind the circuit board molding, the metal heat-conducting layer that is provided with can further leave the heat on the heating column, and radiating effect is better, and easy and simple to handle, simple in structure, cost is low.
[description of drawings]
Figure 1A-Fig. 1 F is the embodiment one that the present invention makes high-thermal conductivity circuit board.
Fig. 2 A-Fig. 2 F is the embodiment two that the present invention makes high-thermal conductivity circuit board.
Fig. 3 A-Fig. 3 E is the embodiment three that the present invention makes high-thermal conductivity circuit board.
Fig. 4 is the embodiment four that the present invention makes high-thermal conductivity circuit board.
[embodiment]
Embodiment one
See also Figure 1A-Fig. 1 F, the method that high-thermal conductivity circuit board is made in the oil printing that present embodiment provides comprises the steps:
(1) on insulated base material layer 1 (can be FR4 sheet material or BT sheet material), offers some through holes 11; (2) make some metal heat-conducting posts 4 that cooperate with through hole; (3) with in metal heat-conducting post 4 receiving through-holes 11, and hot pressing, curing; (4) insulated base material layer 1 upper surface mimeograph conductive layer 2, lower surface mimeograph heat-conducting layer 3, conductive layer 2 and heat-conducting layer 3 are silver oil, copper is oily or material such as carbon oil; (5), form and be electrically connected circuit and some pads 22 (pad only is shown among Fig. 1 E) at the unnecessary electric conducting material of insulated base material layer 1 upper surface etching; The method that present embodiment provides can further include step (6): to being electrically connected circuit and some pads select plating, gold-plated, silver-plated, spray tin or other solderability metal 5 are to form the contact of good whole metal homogeneity; And, step (7): wiring board front silk-screen character or mark.
It should be noted that the described circuit that is electrically connected is used to electrically connect heater members, also can play certain mechanical support effect simultaneously; Described pad 22 is used for the mechanical connection heater members, and is used for indirect thermal conduction, so during etching, pad 22 is not necessary reservation, can an etching formation be electrically connected circuit, and make heater members be set directly at metal heat-conducting post top, form heat conduction and connect.Certain formation of etching simultaneously is electrically connected circuit and pad is a preferred plan.
The high-thermal conductivity circuit board that embodiment 1 makes is shown in Fig. 1 F, and it comprises: insulated base material layer 1, the mimeograph conductive layer 2 that is positioned at the insulated base material layer upper surface, the mimeograph heat-conducting layer 3 that is positioned at the insulated base material layer lower surface and metal heat-conducting post 4; Insulated base material layer 1 is offered through hole 11 pre-seting the heater element place; Described metal heat-conducting post 4 is arranged in the through hole 11, and its upper end is used for cooperating with the heater element (not shown) heat conduction that pre-sets, and the lower end cooperates with 3 heat conduction of mimeograph heat-conducting layer.Comprise the electric wiring layer of insulated base material layer 1, insulated base material layer upper surface, the mimeograph heat-conducting layer 3 and the metal heat-conducting post 4 of insulated base material layer lower surface; The electric wiring layer is that mimeograph conductive layer 2 forms through etching; Insulated base material layer 1 is offered through hole 11 pre-seting the heater element place, and metal heat-conducting post 4 is arranged in the through hole 11, and its upper end is used for cooperating with the heater element heat conduction that pre-sets, and the lower end cooperates with 3 heat conduction of mimeograph heat-conducting layer.
Embodiment two
See also Fig. 2 A-Fig. 2 F, the method for the making high-thermal conductivity circuit board that present embodiment provides comprises the steps:
(1) provides insulated base material layer 1 (can be FR4 sheet material or BT sheet material),, thereby constitute one-side band metal level sheet material at the insulated base material layer 1 lower surface metal heat-conducting layer 3 that is sticked; (2) on one-side band metal level sheet material, offer some through holes 11; (3) make some metal heat-conducting posts 4 that cooperate with through hole; (4) with in metal heat-conducting post 4 receiving through-holes 11, hot pressing, curing; (5) at insulated base material layer 1 upper surface mimeograph conductive layer 2, conductive layer 2 is a silver oil, copper is oily or material such as carbon oil; (6) the unnecessary electric conducting material of insulated base material layer 1 upper surface etching forms and is electrically connected circuit and some pads 22 (pad only is shown among Fig. 2 E); The method that present embodiment provides can further include step (7): to being electrically connected circuit and some pads select plating, gold-plated, silver-plated, spray tin or other solderability metal 5 are to form the contact of good whole metal homogeneity; And, step (8): wiring board front silk-screen character or mark.
The high-thermal conductivity circuit board that embodiment two makes has identical structure with embodiment one, repeats no more herein.
Embodiment three
See also Fig. 3 A-Fig. 3 E, the method for the making high-thermal conductivity circuit board that present embodiment provides comprises the steps:
(1) provide insulated base material layer 1 (can be FR4 sheet material or BT sheet material), at the insulated base material layer 1 upper surface metal conducting layer 51 that is sticked, the lower surface metal heat-conducting layer 61 that is sticked, thus constitute double-sided belt metal level sheet material; (2) on double-sided belt metal level sheet material, bore some through holes 11; (3) make some metal heat-conducting posts 4 that cooperate with through hole; (4) with in metal heat-conducting post 4 receiving through-holes 11, hot pressing, curing; (5),, make the contact of metal heat-conducting post and metal level tightr at metal heat-conducting laminar surface and then mimeograph heat-conducting layer 62 at metal conducting layer and then mimeograph conductive layer 52; (6), form and be electrically connected circuit and some pads 22 (pad only is shown among Fig. 1 C) at the unnecessary electric conducting material of insulated base material layer 1 upper surface etching; The method that present embodiment provides can further include step (7): to being electrically connected circuit and some pads select plating, gold-plated, silver-plated, spray tin or other solderability metal are to form the contact of good whole metal homogeneity; And, step (8): wiring board front silk-screen character or mark.
The high-thermal conductivity circuit board that embodiment three makes shown in Fig. 3 E, its: comprise insulated base material layer 1, be attached at the metal conducting layer 51 of insulated base material layer upper surface, the mimeograph conductive layer 52 that is positioned at metal conducting layer 51 surfaces, the metal heat-conducting layer 61 that is attached at the insulated base material layer lower surface, the mimeograph heat-conducting layer 3 that is positioned at metal heat-conducting layer 61 surface and metal heat-conducting post 4; Insulated base material layer 1 is offered through hole 11 pre-seting the heater element place; Described metal heat-conducting post 4 is arranged in the through hole 11, and its upper end is used for cooperating with the heater element (not shown) heat conduction that pre-sets, and the lower end cooperates with metal heat-conducting layer 61 and 62 heat conduction of mimeograph heat-conducting layer.Comprise the electric wiring layer of insulated base material layer 1, insulated base material layer upper surface, the heat-conducting layer and the metal heat-conducting post 4 of insulated base material layer lower surface; The electric wiring layer forms through etching for the mimeograph conductive layer 52 on metal conducting layer 51 and surface thereof, and heat-conducting layer comprises the mimeograph heat-conducting layer 62 on metal heat-conducting layer 61 and surface thereof; Insulated base material layer 1 is offered through hole 11 pre-seting the heater element place, and metal heat-conducting post 4 is arranged in the through hole 11, and its upper end is used for cooperating with the heater element heat conduction that pre-sets, and the lower end cooperates with metal heat-conducting layer 61 and 62 heat conduction of mimeograph heat-conducting layer.
Embodiment four
See also Fig. 4, the difference of the method for the making high-thermal conductivity circuit board that embodiment four provides and embodiment one, embodiment two or embodiment three is: insulated base material layer is to contain glue non conductive substrate 33 lamination riveteds by some epoxy prepregs (PP sheet), glued membrane or other to form.
Above embodiment only for fully open unrestricted the present invention, is understandable that except that LED, other heater elements exist heat dissipation problem to need to solve equally, for example high power transistor, thyristor, bidirectional thyristor, GTO, MOSFET, IGBT etc.And the metal of being mentioned in the present embodiment is preferably copper, certainly, also can be other metal materials.Described metal heat-conducting post is before hot pressing, and its diameter is less than described through-hole diameter, and length is greater than described through hole length; After hot pressing, its volume is filled described through hole volume just.
Claims (10)
1. the method that high-thermal conductivity circuit board is made in oil printing is characterized in that, may further comprise the steps:
(1) provides insulated base material layer;
(2) or a: on insulated base material layer, offer some through holes, in through hole, insert the metal heat-conducting post, and hot pressing, curing, at insulated base material layer upper surface mimeograph conductive layer, lower surface mimeograph heat-conducting layer;
Perhaps b: at the insulated base material layer lower surface metal heat-conducting layer that is sticked, constitute one-side band metal level sheet material earlier, on one-side band metal level sheet material, offer some through holes, in through hole, insert the metal heat-conducting post, and hot pressing, curing, at insulated base material layer upper surface mimeograph conductive layer;
Perhaps c: at the insulated base material layer upper surface metal conducting layer that is sticked, the lower surface metal heat-conducting layer that is sticked, on double-sided metallic sheet material, offer some through holes, in through hole, insert the metal heat-conducting post, and hot pressing, curing, at metal conducting layer and then mimeograph conductive layer, at metal heat-conducting laminar surface and then mimeograph heat-conducting layer;
(3), form and be electrically connected circuit at the unnecessary electric conducting material of insulated base material layer upper surface etching.
2. the method for high-thermal conductivity circuit board is made in oil printing according to claim 1, and it is characterized in that: described insulated base material layer can be FR4 sheet material or BT sheet material.
3. the method for high-thermal conductivity circuit board is made in oil printing according to claim 1, it is characterized in that: described insulated base material layer is to contain glue non conductive substrate lamination riveted by some epoxy prepregs, glued membrane or other to form.
4. the method for high-thermal conductivity circuit board is made in oil printing according to claim 1, it is characterized in that: described conductive layer for silver oil, copper is oily or material such as carbon oil.
5. the method for high-thermal conductivity circuit board is made in oil printing according to claim 1, it is characterized in that: during the unnecessary electric conducting material of etching, form electric wiring and some pads simultaneously in the step (three); Described pad is positioned at metal heat-conducting post top.
6. the method for high-thermal conductivity circuit board is made in oil printing according to claim 5, it is characterized in that: further comprise step (four): to being electrically connected circuit and some pads select plating, and gold-plated, silver-plated, spray tin or other solderability metal.
7. a high-thermal conductivity circuit board is characterized in that: comprise the electric wiring layer of insulated base material layer, insulated base material layer upper surface, the mimeograph heat-conducting layer and the metal heat-conducting post of insulated base material layer lower surface; The electric wiring layer is that the mimeograph conductive layer forms through etching; Insulated base material layer is offered through hole pre-seting the heater element place, and described metal heat-conducting post is arranged in the through hole, and its upper end is used for cooperating with the heater element heat conduction that pre-sets, and the lower end cooperates with the heat conduction of mimeograph heat-conducting layer.
8. high-thermal conductivity circuit board according to claim 7 is characterized in that: the insulated base material layer upper surface is provided with pad, and this pad is that described mimeograph conductive layer forms through etching, is positioned at metal heat-conducting post top.
9. a high-thermal conductivity circuit board is characterized in that: comprise the electric wiring layer of insulated base material layer, insulated base material layer upper surface, the heat-conducting layer and the metal heat-conducting post of insulated base material layer lower surface; The electric wiring layer forms through etching for the mimeograph conductive layer on metal conducting layer and surface thereof, and heat-conducting layer comprises the mimeograph heat-conducting layer on metal heat-conducting layer and surface thereof; Insulated base material layer is offered through hole pre-seting the heater element place, and described metal heat-conducting post is arranged in the through hole, and its upper end is used for cooperating with the heater element heat conduction that pre-sets, and the lower end cooperates with metal heat-conducting layer and the heat conduction of mimeograph heat-conducting layer.
10. high-thermal conductivity circuit board according to claim 9 is characterized in that: the insulated base material layer upper surface is provided with pad, and this pad is that the mimeograph conductive layer on metal conducting layer and surface thereof forms through etching, is positioned at metal heat-conducting post top.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010177622 CN101841976A (en) | 2010-05-12 | 2010-05-12 | Method for manufacturing circuit board with high thermal conductivity by oil printing method and circuit board with high thermal conductivity |
| PCT/CN2010/001939 WO2011140692A1 (en) | 2010-05-12 | 2010-12-01 | High thermal conductivity pcb and the making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010177622 CN101841976A (en) | 2010-05-12 | 2010-05-12 | Method for manufacturing circuit board with high thermal conductivity by oil printing method and circuit board with high thermal conductivity |
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| CN101841976A true CN101841976A (en) | 2010-09-22 |
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| CN 201010177622 Pending CN101841976A (en) | 2010-05-12 | 2010-05-12 | Method for manufacturing circuit board with high thermal conductivity by oil printing method and circuit board with high thermal conductivity |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102209429A (en) * | 2010-10-29 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Heat radiation type flexible circuit board |
| WO2011140692A1 (en) * | 2010-05-12 | 2011-11-17 | 珠海市荣盈电子科技有限公司 | High thermal conductivity pcb and the making method thereof |
| CN105407630A (en) * | 2015-12-29 | 2016-03-16 | 上海摩软通讯技术有限公司 | Pcb and manufacturing method thereof |
| CN109769344A (en) * | 2017-11-10 | 2019-05-17 | 鹏鼎控股(深圳)股份有限公司 | The manufacturing method of circuit board and the circuit board |
| CN110324980A (en) * | 2019-05-02 | 2019-10-11 | 深圳市星河电路股份有限公司 | A kind of turmeric adds the processing method of spray two kinds of different surface treatment pcb boards of tin finger |
| CN113163576A (en) * | 2021-03-03 | 2021-07-23 | 徐伟文 | Flexible printed circuit board |
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| US6453549B1 (en) * | 1999-12-13 | 2002-09-24 | International Business Machines Corporation | Method of filling plated through holes |
| CN1484854A (en) * | 2000-12-29 | 2004-03-24 | 艾利森电话股份有限公司 | A method and an arrangement for providing vias in printed circuit boards |
| CN101389180A (en) * | 2007-09-10 | 2009-03-18 | 景硕科技股份有限公司 | Double surface soft board having heat conductive design |
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2010
- 2010-05-12 CN CN 201010177622 patent/CN101841976A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6453549B1 (en) * | 1999-12-13 | 2002-09-24 | International Business Machines Corporation | Method of filling plated through holes |
| CN1484854A (en) * | 2000-12-29 | 2004-03-24 | 艾利森电话股份有限公司 | A method and an arrangement for providing vias in printed circuit boards |
| CN101389180A (en) * | 2007-09-10 | 2009-03-18 | 景硕科技股份有限公司 | Double surface soft board having heat conductive design |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011140692A1 (en) * | 2010-05-12 | 2011-11-17 | 珠海市荣盈电子科技有限公司 | High thermal conductivity pcb and the making method thereof |
| CN102209429A (en) * | 2010-10-29 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Heat radiation type flexible circuit board |
| CN102209429B (en) * | 2010-10-29 | 2013-05-29 | 博罗县精汇电子科技有限公司 | Heat radiation type flexible circuit board |
| CN105407630A (en) * | 2015-12-29 | 2016-03-16 | 上海摩软通讯技术有限公司 | Pcb and manufacturing method thereof |
| CN109769344A (en) * | 2017-11-10 | 2019-05-17 | 鹏鼎控股(深圳)股份有限公司 | The manufacturing method of circuit board and the circuit board |
| CN109769344B (en) * | 2017-11-10 | 2021-07-20 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
| CN110324980A (en) * | 2019-05-02 | 2019-10-11 | 深圳市星河电路股份有限公司 | A kind of turmeric adds the processing method of spray two kinds of different surface treatment pcb boards of tin finger |
| CN110324980B (en) * | 2019-05-02 | 2021-06-01 | 深圳市星河电路股份有限公司 | Processing method for PCB with gold immersion and tin spraying fingers through two different surface treatments |
| CN113163576A (en) * | 2021-03-03 | 2021-07-23 | 徐伟文 | Flexible printed circuit board |
| CN113163576B (en) * | 2021-03-03 | 2022-10-21 | 莆田市超威电子科技有限公司 | Flexible printed circuit board |
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Application publication date: 20100922 |