CN201758486U - Metal base high conductivity circuit board - Google Patents
Metal base high conductivity circuit board Download PDFInfo
- Publication number
- CN201758486U CN201758486U CN 201020197659 CN201020197659U CN201758486U CN 201758486 U CN201758486 U CN 201758486U CN 201020197659 CN201020197659 CN 201020197659 CN 201020197659 U CN201020197659 U CN 201020197659U CN 201758486 U CN201758486 U CN 201758486U
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- CN
- China
- Prior art keywords
- circuit board
- metal
- metal base
- heat
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model relates to a metal base high conductivity circuit board, which is used for solving a problem of heat dissipation of a heating element on the circuit board. The high conductivity circuit board is formed by providing a heat conducting metal column on the metal base in advance, then adding an insulating layer and a conducting layer and forming an electrical line through etching. A radiating mechanism avoids being processed again after the circuit board is molded. The metal base itself can quickly dissipate the heat on the heat conducting column, so the circuit board has better cooling effect, easy operation, simple structure and low cost.
Description
[technical field]
The utility model relates to the printed circuit board (PCB) of electricity field.
[background technology]
Power device generates heat obviously in the course of the work, if can not in time dispel the heat, may damage power device, even causes whole electronic product operation irregularity.With the LED luminous product is example, and it normally is arranged in a large amount of LED concentrated area on the circuit board, and when LED worked long hours, the savings of heat will cause the lost of life of LED, makes the product performance instability.
No. 200810241905.2 applications for a patent for invention of China disclose a kind of radiating circuit substrate that assembles heat sink method and the making of this method at wiring board.The heat sink method of its assembling may further comprise the steps: make at least one through hole in the circuit board; Make cooperate with via clearance heat sink; In heat sink through hole of inserting wiring board; And utilize mould to exert pressure to heat sink, fix in the circuit board until heat sink extrusion.Its radiating circuit substrate that provides comprises wiring board, through hole and heat sink, heat sink being assemblied in the through hole.
Yet only at the heat sink installation on the wiring board of finishing behind the electric wiring, its defective is above-mentioned patented technology: at first, heat sink operation is installed is the independent process after wiring board is finished, increased workload; Secondly, push when heat sink, may damage the electric wiring on the wiring board by mould.We can say that above-mentioned patented technology is fit to the installation of indivedual power devices, is not suitable for the installation of a large amount of power devices of high density, array distribution.In addition, heat heat sink in the above-mentioned patented technology does not further conduct, and radiating effect is limited.
Along with further developing and the development of the Highgrade integration of electronic product of semiconductor industry, the heat radiation solution of heater element is still waiting further lifting on the circuit board.
[utility model content]
The purpose of this utility model is to simplify the manufacture method of thermal conductivity circuit board and obtain corresponding high-thermal conductivity circuit board.
For achieving the above object, the utility model has adopted following technical scheme:
A kind of high-thermal conductivity circuit board based on Metal Substrate, it is characterized in that: comprise metal base, insulating barrier and electric wiring layer, the etching of described metal base upper surface is formed with the metal heat-conducting post, insulating barrier is avoided the upper surface that the metal heat-conducting post is attached to metal base, and the electric wiring layer is positioned at insulating barrier and metal heat-conducting post top.
Described circuit layer is that the metal level, electroplated conductive layer or the mimeograph conductive layer that are sticked form after etching.
The making high-thermal conductivity circuit board that the utility model provides, the heat-conducting metal post is provided on Metal Substrate in advance, and then adding insulating barrier and conductive layer, etching afterwards forms electric wiring, avoids processing cooling mechanism once more behind the circuit board molding, and Metal Substrate itself can leave the heat on the heating column apace, radiating effect is better, and easy and simple to handle, simple in structure, cost is low.
[description of drawings]
Figure 1A-Fig. 1 E is the embodiment one that makes the utility model high-thermal conductivity circuit board.
[embodiment]
Embodiment one
See also Figure 1A-Fig. 1 E, the high-thermal conductivity circuit board based on Metal Substrate that present embodiment provides is made as follows:
(1) provides metal base 1 (certain thickness is arranged); (2) the upper surface etching (can be additive method processing) at metal base 1 forms metal heat-conducting post 11; (3) avoid metal heat-conducting post 11 at the upper surface of metal base 1 and stick insulating barrier 2, and cover metal level 3, carry out hot pressing then; (4) the unnecessary electric conducting material of etching metal base 1 upper surface forms and is electrically connected circuit and some pads 32 (pad only is shown among Fig. 1 D); The method that present embodiment provides can further include step (5): to being electrically connected circuit and some pads select plating, gold-plated, silver-plated, spray tin or other solderability metal 5 are to form the contact of good whole metal homogeneity; And, step (6): wiring board front silk-screen character or mark.
It should be noted that the described circuit that is electrically connected is used to electrically connect heater members, also can play certain mechanical support effect simultaneously; Described pad 32 is used for the mechanical connection heater members, and is used for indirect thermal conduction, so during etching, pad 32 is not necessary reservation, can an etching formation be electrically connected circuit, and make heater members be set directly at metal heat-conducting post top, form heat conduction and connect.Certain formation of etching simultaneously is electrically connected circuit and pad is a preferred plan.
The high-thermal conductivity circuit board that embodiment 1 makes is shown in Fig. 1 E, it comprises metal base 1, insulating barrier 2 and electric wiring layer, described metal base 1 upper surface etching is formed with metal heat-conducting post 11, insulating barrier 2 is avoided the upper surface that metal heat-conducting post 11 is attached to metal base 1, the electric wiring layer is that the metal level, electroplated conductive layer or the mimeograph conductive layer that are sticked form after etching, is positioned at insulating barrier 2 and metal heat-conducting post 11 tops.
Embodiment two
Embodiment two is with the difference of embodiment one: promptly carry out hot pressing after the upper surface of metal base is avoided the metal heat-conducting post to stick insulating barrier, do not cover metal level, but electroplate its upper surface, again electrodeposited coating is carried out etching afterwards.
High-thermal conductivity circuit board and embodiment one that embodiment two makes have similar structure, repeat no more herein.
Embodiment three
Embodiment three is with the difference of embodiment two: the mode that is used in its upper surface mimeograph conductive materials substitutes plating mode; The conductive materials of mimeograph can be a silver oil, copper is oily or carbon oil.
Above embodiment only for fully open unrestricted the utility model, is understandable that except that LED, other heater elements exist heat dissipation problem to need to solve equally, for example high power transistor, thyristor, bidirectional thyristor, GTO, MOSFET, IGBT etc.And the Metal Substrate of being mentioned in the present embodiment is preferably copper, certainly, also can be other metal materials.
Claims (3)
1. high-thermal conductivity circuit board based on Metal Substrate, it is characterized in that: comprise metal base, insulating barrier and electric wiring layer, the etching of described metal base upper surface is formed with the metal heat-conducting post, insulating barrier is avoided the upper surface that the metal heat-conducting post is attached to metal base, and the electric wiring layer is positioned at insulating barrier and metal heat-conducting post top.
2. the high-thermal conductivity circuit board based on Metal Substrate according to claim 1 is characterized in that: described electric wiring layer is that the metal level, electroplated conductive layer or the mimeograph conductive layer that are sticked form after etching.
3. the high-thermal conductivity circuit board based on Metal Substrate according to claim 2 is characterized in that: also comprise pad, this pad is that the metal level, electroplated conductive layer or the mimeograph conductive layer that are sticked form after etching, is positioned at metal heat-conducting post top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020197659 CN201758486U (en) | 2010-05-12 | 2010-05-12 | Metal base high conductivity circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020197659 CN201758486U (en) | 2010-05-12 | 2010-05-12 | Metal base high conductivity circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201758486U true CN201758486U (en) | 2011-03-09 |
Family
ID=43645774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020197659 Expired - Fee Related CN201758486U (en) | 2010-05-12 | 2010-05-12 | Metal base high conductivity circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201758486U (en) |
-
2010
- 2010-05-12 CN CN 201020197659 patent/CN201758486U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20130131 Granted publication date: 20110309 |
|
| RINS | Preservation of patent right or utility model and its discharge | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20130731 Granted publication date: 20110309 |
|
| PP01 | Preservation of patent right |
Effective date of registration: 20130731 Granted publication date: 20110309 |
|
| RINS | Preservation of patent right or utility model and its discharge | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20140131 Granted publication date: 20110309 |
|
| PD01 | Discharge of preservation of patent | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110309 Termination date: 20130512 |