CN101841975B - Method for manufacturing high-thermal conductivity circuit board by hot-pressing method and high-thermal conductivity circuit board - Google Patents
Method for manufacturing high-thermal conductivity circuit board by hot-pressing method and high-thermal conductivity circuit board Download PDFInfo
- Publication number
- CN101841975B CN101841975B CN 201010177431 CN201010177431A CN101841975B CN 101841975 B CN101841975 B CN 101841975B CN 201010177431 CN201010177431 CN 201010177431 CN 201010177431 A CN201010177431 A CN 201010177431A CN 101841975 B CN101841975 B CN 101841975B
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- Prior art keywords
- circuit board
- thermal conductivity
- metal
- layer
- base material
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000007731 hot pressing Methods 0.000 title claims description 15
- 238000004519 manufacturing process Methods 0.000 title abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 82
- 229910052751 metal Inorganic materials 0.000 claims abstract description 82
- 239000000463 material Substances 0.000 claims description 57
- 238000005530 etching Methods 0.000 claims description 10
- 238000005245 sintering Methods 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a method for manufacturing a high-thermal conductivity circuit board and the high-thermal conductivity circuit board, which aim to solve the heat dissipation problem of heating elements on the circuit board. In the invention, by means of comprehensive consideration and overall arrangement of the implementation procedures of the high-thermal conductivity circuit board, the assembly procedures of a heat conducting column is integrated into the making process of the circuit board, which is implemented mainly as follows: before forming an electrical connecting line, the heat conducting column is assembled in a preset position of the circuit board; the method does not affect subsequent procedures and avoids reworking after the circuit board is formed; and a metal heat conducting layer can further dissipate heat on the heat conducting column, thus achieving better heat dissipation effect and having simple operation, simple structure and low cost.
Description
[technical field]
The present invention relates to the Printed circuit board and manufacturing methods of electricity field.
[background technology]
Power device generates heat obviously in the course of the work, if can not in time dispel the heat, possibly damage power device, even causes whole electronic product operation irregularity.With the LED luminous product is example, and it normally is arranged in a large amount of LED concentrated area on the circuit board, and when LED worked long hours, the savings of heat will cause the lost of life of LED, makes product performance unstable.
No. 200810241905.2 applications for a patent for invention of China disclose a kind of radiating circuit substrate that assembles heat sink method and the making of this method at wiring board.The heat sink method of its assembling may further comprise the steps: make at least one through hole in the circuit board; Make cooperate with via clearance heat sink; In heat sink through hole of inserting wiring board; And utilize mould to exert pressure to heat sink, fix in the circuit board until heat sink extrusion.Its radiating circuit substrate that provides comprises wiring board, through hole and heat sink, heat sink being assemblied in the through hole.
Yet only to the heat sink installation on the wiring board of having accomplished behind the electric wiring, its defective is: at first, it is the independent process after the wiring board completion that heat sink operation is installed to above-mentioned patented technology, has increased workload; Secondly, push when heat sink, may damage the electric wiring on the wiring board through mould.We can say that above-mentioned patented technology is fit to the installation of indivedual power devices, is not suitable for the installation of a large amount of power devices of high density, array distribution.In addition, heat heat sink in the above-mentioned patented technology does not further conduct, and radiating effect is limited.
Along with further developing and the development of the Highgrade integration of electronic product of semiconductor industry, the heat radiation solution of heater element is still waiting further lifting on the circuit board.
[summary of the invention]
The objective of the invention is, take all factors into consideration the realization operation of high-thermal conductivity circuit board, heat sink assembly process is integrated in the production process of wiring board, with the manufacture method of simplifying high-thermal conductivity circuit board and obtain corresponding high-thermal conductivity circuit board.
For realizing above-mentioned purpose, the present invention has adopted following technical scheme:
A kind of pressure sintering is made the method for high-thermal conductivity circuit board, it is characterized in that, may further comprise the steps:
(1) insulated base material layer is provided;
(2) or a: on insulated base material layer, offer some through holes, in through hole, insert the metal heat-conducting post, at the insulated base material layer upper surface metal conducting layer that is sticked, the lower surface metal heat-conducting layer that is sticked, and hot pressing, curing;
Perhaps b: at the insulated base material layer lower surface metal heat-conducting layer that is sticked; Thereby constitute one-side band metal level sheet material, on one-side band metal level sheet material, offer some through holes, in through hole, insert the metal heat-conducting post; Stick metal conducting layer at the insulated base material layer upper surface, hot pressing, curing;
Perhaps c: at the insulated base material layer upper surface metal conducting layer that is sticked, the lower surface metal heat-conducting layer that is sticked is offered some through holes on double-sided metallic sheet material, in through hole, insert the metal heat-conducting post, and hot pressing, curing;
(3) insulated base material layer upper surface etching excess metal layer forms electric wiring and some pads simultaneously; Said pad is positioned at metal heat-conducting post top.
A kind of high-thermal conductivity circuit board; It is characterized in that: comprise insulated base material layer, electric wiring layer, metal heat-conducting layer and metal heat-conducting post; The electric wiring layer is arranged on the insulated base material layer upper surface; The metal heat-conducting layer is arranged on the insulated base material layer lower surface, and double-sided belt metal level sheet material is offered through hole pre-seting the heater element place; Said metal heat-conducting post is arranged in the through hole, and its upper end cooperates with the heater element heat conduction that pre-sets, and the lower end cooperates with the heat conduction of metal heat-conducting layer; This high-thermal conductivity circuit board also comprises the pad that is used for the said heater element of mechanical connection, and this pad is positioned at metal heat-conducting post top.
The method of making high-thermal conductivity circuit board provided by the invention is through general arrangement, before formation is electrically connected circuit; Heating column is assemblied in precalculated position in the circuit board, does not influence subsequent handling (etching), avoid the processing once more behind the circuit board molding; The metal heat-conducting layer that is provided with can further leave the heat on the heating column, and radiating effect is better, and easy and simple to handle; Simple in structure, cost is low.
[description of drawings]
Figure 1A-Fig. 1 D is the embodiment one that the present invention makes high-thermal conductivity circuit board.
Fig. 2 A-Fig. 2 E is the embodiment two that the present invention makes high-thermal conductivity circuit board.
Fig. 3 A-Fig. 3 E is the embodiment three that the present invention makes high-thermal conductivity circuit board.
Fig. 4 is the embodiment four that the present invention makes high-thermal conductivity circuit board.
[embodiment]
Embodiment one
See also Figure 1A-Fig. 1 D, the method for the making high-thermal conductivity circuit board that present embodiment provides comprises the steps:
(1) insulated base material layer 1 (can be FR4 sheet material or BT sheet material) is provided, at the insulated base material layer 1 upper surface metal conducting layer 2 that is sticked, the lower surface metal heat-conducting layer 3 that is sticked, thus constitute double-sided belt metal level sheet material; (2) on double-sided belt metal level sheet material, bore some through holes 11; (3) make some metal heat-conducting posts 4 that cooperate with through hole; (4) with in metal heat-conducting post 4 receiving through-holes 11; (5) utilize hot press hot pressing metal heating column 4, it is assemblied in the through hole 11, metal heat-conducting post 4 is after hot pressing in the present embodiment, and its volume is filled said through hole 11 volumes just; (6) supplying insulated base material layer 1 upper surface etching excess metal layer, forming and be electrically connected circuit and some pads 22 (pad only is shown among Fig. 1 C); The method that present embodiment provides can further include step (7): to being electrically connected circuit and some pads select plating, gold-plated, silver-plated, spray tin or other solderability metal 5 are to form the contact of good whole metal homogeneity; And, step (8): wiring board front silk-screen character or mark.
It should be noted that the said circuit that is electrically connected is used to electrically connect heater members, also can play certain mechanical support effect simultaneously; Said pad 22 is used for the mechanical connection heater members, and is used for indirect thermal conduction, so during etching; Pad 22 is not necessary reservation; Can an etching formation be electrically connected circuit, and make heater members be set directly at metal heat-conducting post top, form heat conduction and connect.Certain formation of etching simultaneously is electrically connected circuit and pad is a preferred plan.
The high-thermal conductivity circuit board that embodiment 1 makes is shown in Fig. 1 D; It comprises that insulated base material layer 1, electric wiring layer are (not shown in the figures; But those skilled in the art know), metal heat-conducting layer 3 and metal heat-conducting post 4; The electric wiring layer is arranged on insulated base material layer 1 upper surface, and metal heat-conducting layer 3 is arranged on insulated base material layer 1 lower surface, and double-sided belt metal level sheet material is offered through hole 11 pre-seting the heater element place; Said metal heat-conducting post 4 is arranged in the through hole 11, and its upper end is used for cooperating with the heater element (not shown) heat conduction that pre-sets, and the lower end cooperates with 3 heat conduction of metal heat-conducting layer.
Embodiment two
See also Fig. 2 A-Fig. 2 E, the method for the making high-thermal conductivity circuit board that present embodiment provides comprises the steps:
(1) on insulated base material layer 1 (can be FR4 sheet material or BT sheet material), offers some through holes 11; (2) make some metal heat-conducting posts 4 that cooperate with through hole; (3) with in metal heat-conducting post 4 receiving through-holes 11; (4) the insulated base material layer 1 upper surface metal conducting layer 2 that is sticked, the lower surface metal heat-conducting layer 3 that is sticked, and hot pressing, curing; (5) supplying insulated base material layer 1 upper surface etching excess metal layer, forming and be electrically connected circuit and some pads 22 (pad only is shown among Fig. 2 D); The method that present embodiment provides can further include step (6): to being electrically connected circuit and some pads select plating, gold-plated, silver-plated, spray tin or other solderability metal 5 are to form the contact of good whole metal homogeneity; And, step (7): wiring board front silk-screen character or mark.
The high-thermal conductivity circuit board that embodiment two makes has identical structure with embodiment one, repeats no more here.
Embodiment three
See also Fig. 3 A-Fig. 3 E, the method for the making high-thermal conductivity circuit board that present embodiment provides comprises the steps:
(1) insulated base material layer 1 (can be FR4 sheet material or BT sheet material) is provided,, thereby constitutes one-side band metal level sheet material at the insulated base material layer 1 lower surface metal heat-conducting layer 3 that is sticked; (2) on one-side band metal level sheet material, offer some through holes 11; (3) make some metal heat-conducting posts 4 that cooperate with through hole; (4) with in metal heat-conducting post 4 receiving through-holes 11; (5) stick metal conducting layer 2 at insulated base material layer 1 upper surface, hot pressing, curing; (6) insulated base material layer 1 upper surface etching excess metal layer forms and is electrically connected circuit and some pads 22 (pad only is shown among Fig. 3 D); The method that present embodiment provides can further include step (7): to being electrically connected circuit and some pads select plating, gold-plated, silver-plated, spray tin or other solderability metal 5 are to form the contact of good whole metal homogeneity; And, step (8): wiring board front silk-screen character or mark.
The high-thermal conductivity circuit board that embodiment three makes has identical structure with embodiment one, repeats no more here.
Embodiment four
See also Fig. 4, the difference of the method for the making high-thermal conductivity circuit board that embodiment four provides and embodiment one, embodiment two or embodiment three is: insulated base material layer is to contain glue non conductive substrate 33 lamination riveteds by some epoxy prepregs (PP sheet), glued membrane or other to form.
Above embodiment is merely fully open and unrestricted the present invention it is understandable that, except that LED, other heater elements exist heat dissipation problem to need to solve equally, for example high power transistor, thyristor, bidirectional thyristor, GTO, MOSFET, IGBT etc.And the metal of being mentioned in the present embodiment is preferably copper, certainly, also can be other metal materials.Said metal heat-conducting post is before hot pressing, and its diameter is less than said through-hole diameter, and length is greater than said through hole length; After hot pressing, its volume is filled said through hole volume just.
Claims (8)
1. the method that pressure sintering is made high-thermal conductivity circuit board is characterized in that, may further comprise the steps:
(1) insulated base material layer is provided;
(2) or a: on insulated base material layer, offer some through holes, in through hole, insert the metal heat-conducting post, at the insulated base material layer upper surface metal conducting layer that is sticked, the lower surface metal heat-conducting layer that is sticked, and hot pressing, curing;
Perhaps b: at the insulated base material layer lower surface metal heat-conducting layer that is sticked; Thereby constitute one-side band metal level sheet material, on one-side band metal level sheet material, offer some through holes, in through hole, insert the metal heat-conducting post; Stick metal conducting layer at the insulated base material layer upper surface, hot pressing, curing;
Perhaps c: at the insulated base material layer upper surface metal conducting layer that is sticked, the lower surface metal heat-conducting layer that is sticked is offered some through holes on double-sided metallic sheet material, in through hole, insert the metal heat-conducting post, and hot pressing, curing;
(3) insulated base material layer upper surface etching excess metal layer forms electric wiring and some pads simultaneously; Said pad is positioned at metal heat-conducting post top.
2. pressure sintering according to claim 1 is made the method for high-thermal conductivity circuit board, and it is characterized in that: said insulated base material layer can be FR4 sheet material or BT sheet material.
3. pressure sintering according to claim 1 is made the method for high-thermal conductivity circuit board, it is characterized in that: said insulated base material layer is to contain glue non conductive substrate lamination riveted by some epoxy prepregs, glued membrane or other to form.
4. pressure sintering according to claim 1 is made the method for high-thermal conductivity circuit board, and it is characterized in that: said metal heat-conducting post is before hot pressing, and its diameter is less than said through-hole diameter, and length is greater than said through hole length; Said metal heat-conducting post is after hot pressing, and its volume is filled said through hole volume just.
5. pressure sintering according to claim 1 is made the method for high-thermal conductivity circuit board, it is characterized in that: further comprise step (four): to being electrically connected circuit and some pads select plating, and gold-plated, silver-plated, spray tin or other solderability metal.
6. pressure sintering according to claim 5 is made the method for high-thermal conductivity circuit board, it is characterized in that: further comprise step (five): wiring board front silk-screen character or mark.
7. high-thermal conductivity circuit board; It is characterized in that: comprise insulated base material layer, electric wiring layer, metal heat-conducting layer and metal heat-conducting post; The electric wiring layer is arranged on the insulated base material layer upper surface; The metal heat-conducting layer is arranged on the insulated base material layer lower surface, and double-sided belt metal level sheet material is offered through hole pre-seting the heater element place; Said metal heat-conducting post is arranged in the through hole, and its upper end cooperates with the heater element heat conduction that pre-sets, and the lower end cooperates with the heat conduction of metal heat-conducting layer; This high-thermal conductivity circuit board also comprises the pad that is used for the said heater element of mechanical connection, and this pad is positioned at metal heat-conducting post top.
8. high-thermal conductivity circuit board according to claim 7 is characterized in that: said pad and said electric wiring layer are formed by same metal conducting layer etching with layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010177431 CN101841975B (en) | 2010-05-12 | 2010-05-12 | Method for manufacturing high-thermal conductivity circuit board by hot-pressing method and high-thermal conductivity circuit board |
| PCT/CN2010/001939 WO2011140692A1 (en) | 2010-05-12 | 2010-12-01 | High thermal conductivity pcb and the making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010177431 CN101841975B (en) | 2010-05-12 | 2010-05-12 | Method for manufacturing high-thermal conductivity circuit board by hot-pressing method and high-thermal conductivity circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101841975A CN101841975A (en) | 2010-09-22 |
| CN101841975B true CN101841975B (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010177431 Expired - Fee Related CN101841975B (en) | 2010-05-12 | 2010-05-12 | Method for manufacturing high-thermal conductivity circuit board by hot-pressing method and high-thermal conductivity circuit board |
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| Country | Link |
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| CN (1) | CN101841975B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011140692A1 (en) * | 2010-05-12 | 2011-11-17 | 珠海市荣盈电子科技有限公司 | High thermal conductivity pcb and the making method thereof |
| CN103069936B (en) * | 2010-11-30 | 2016-04-27 | 乐健科技（珠海）有限公司 | With the printed circuit board (PCB) of insulation micro heat radiator |
| CN102333414B (en) * | 2011-09-02 | 2014-03-12 | 深圳创动科技有限公司 | Heat dissipation structure, manufacturing method for same and electronic device with same |
| CN102711367B (en) * | 2012-05-14 | 2015-10-21 | 深圳市景旺电子股份有限公司 | A kind of heat conduction aluminum substrate and preparation method thereof |
| CN102853407A (en) * | 2012-09-10 | 2013-01-02 | 深圳市科普达光电有限公司 | Efficient LED lamp radiator |
| CN103079364B (en) * | 2012-12-27 | 2015-09-16 | 深圳市五株科技股份有限公司 | A kind of manufacture craft of local pressing copper billet height heat radiating metal base circuit board |
| CN105007704B (en) * | 2014-04-24 | 2018-02-09 | 苏州驭奇材料科技有限公司 | Composite radiating inhales ripple film |
| CN104994682B (en) * | 2015-07-14 | 2018-07-13 | 广东欧珀移动通信有限公司 | A kind of PCB with heat dissipation performance and apply its mobile terminal |
| CN106793458B (en) * | 2016-12-15 | 2023-11-24 | 北京小鸟看看科技有限公司 | Printed circuit board, printed assembly board and electronic equipment for heating element |
| CN110139461A (en) * | 2018-02-02 | 2019-08-16 | 三赢科技（深圳）有限公司 | Circuit board, the forming method of circuit board and camera mould group |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359606A (en) * | 1999-06-30 | 2002-07-17 | 艾利森电话股份有限公司 | Printed circuit board |
| CN1386045A (en) * | 2001-05-01 | 2002-12-18 | 日东电工株式会社 | Wiring board and making method thereof |
| US6691409B2 (en) * | 2000-08-21 | 2004-02-17 | Matsushita Electric Industrial Co., Ltd. | Method of producing a circuit board |
| CN1561155A (en) * | 2004-02-26 | 2005-01-05 | 友达光电股份有限公司 | Flexible circuit board |
| CN1624906A (en) * | 2003-12-04 | 2005-06-08 | 松下电器产业株式会社 | Circuit board and method for manufacturing the same, semiconductor package, component built-in module |
| JP2006176677A (en) * | 2004-12-22 | 2006-07-06 | Hitachi Chem Co Ltd | Composite, prepreg using the same, metallic foil lined laminate, printed wiring substrate and method for manufacturing printed wiring substrate |
| JP2008218875A (en) * | 2007-03-07 | 2008-09-18 | Matsushita Electric Ind Co Ltd | Method for manufacturing printed wiring board |
-
2010
- 2010-05-12 CN CN 201010177431 patent/CN101841975B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359606A (en) * | 1999-06-30 | 2002-07-17 | 艾利森电话股份有限公司 | Printed circuit board |
| US6691409B2 (en) * | 2000-08-21 | 2004-02-17 | Matsushita Electric Industrial Co., Ltd. | Method of producing a circuit board |
| CN1386045A (en) * | 2001-05-01 | 2002-12-18 | 日东电工株式会社 | Wiring board and making method thereof |
| CN1624906A (en) * | 2003-12-04 | 2005-06-08 | 松下电器产业株式会社 | Circuit board and method for manufacturing the same, semiconductor package, component built-in module |
| CN1561155A (en) * | 2004-02-26 | 2005-01-05 | 友达光电股份有限公司 | Flexible circuit board |
| JP2006176677A (en) * | 2004-12-22 | 2006-07-06 | Hitachi Chem Co Ltd | Composite, prepreg using the same, metallic foil lined laminate, printed wiring substrate and method for manufacturing printed wiring substrate |
| JP2008218875A (en) * | 2007-03-07 | 2008-09-18 | Matsushita Electric Ind Co Ltd | Method for manufacturing printed wiring board |
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| Publication number | Publication date |
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| CN101841975A (en) | 2010-09-22 |
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