CN105007704B - Composite radiating inhales ripple film - Google Patents
Composite radiating inhales ripple film Download PDFInfo
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- CN105007704B CN105007704B CN201410167526.9A CN201410167526A CN105007704B CN 105007704 B CN105007704 B CN 105007704B CN 201410167526 A CN201410167526 A CN 201410167526A CN 105007704 B CN105007704 B CN 105007704B
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- Prior art keywords
- film layer
- radiating
- ripple film
- hole
- suction ripple
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- 239000002131 composite material Substances 0.000 title claims abstract description 31
- 150000001875 compounds Chemical class 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 15
- 239000004575 stone Substances 0.000 claims description 15
- 229910001021 Ferroalloy Inorganic materials 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 9
- 239000002390 adhesive tape Substances 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- -1 Lauxite Polymers 0.000 claims description 6
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 6
- QHCZEKMIMJAYOR-UHFFFAOYSA-N [Fe].[Zn].[Nb] Chemical compound [Fe].[Zn].[Nb] QHCZEKMIMJAYOR-UHFFFAOYSA-N 0.000 claims description 6
- 239000006096 absorbing agent Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 6
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 5
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 229910000604 Ferrochrome Inorganic materials 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 229910000914 Mn alloy Inorganic materials 0.000 claims description 3
- 229910000676 Si alloy Inorganic materials 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- KLARSDUHONHPRF-UHFFFAOYSA-N [Li].[Mn] Chemical compound [Li].[Mn] KLARSDUHONHPRF-UHFFFAOYSA-N 0.000 claims description 3
- KSIIOJIEFUOLDP-UHFFFAOYSA-N [Si].[Fe].[Ni] Chemical compound [Si].[Fe].[Ni] KSIIOJIEFUOLDP-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 3
- NVIVJPRCKQTWLY-UHFFFAOYSA-N cobalt nickel Chemical compound [Co][Ni][Co] NVIVJPRCKQTWLY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229910001004 magnetic alloy Inorganic materials 0.000 claims description 3
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 229910000702 sendust Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 claims description 3
- NDKWCCLKSWNDBG-UHFFFAOYSA-N zinc;dioxido(dioxo)chromium Chemical compound [Zn+2].[O-][Cr]([O-])(=O)=O NDKWCCLKSWNDBG-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910001120 nichrome Inorganic materials 0.000 claims description 2
- 229910000531 Co alloy Inorganic materials 0.000 claims 1
- PUBULPPJKOUWSM-UHFFFAOYSA-N [Fe].[Cd].[Li] Chemical compound [Fe].[Cd].[Li] PUBULPPJKOUWSM-UHFFFAOYSA-N 0.000 claims 1
- QVYYOKWPCQYKEY-UHFFFAOYSA-N [Fe].[Co] Chemical compound [Fe].[Co] QVYYOKWPCQYKEY-UHFFFAOYSA-N 0.000 claims 1
- 150000002085 enols Chemical class 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 230000001629 suppression Effects 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- 229910002804 graphite Inorganic materials 0.000 description 8
- 239000010439 graphite Substances 0.000 description 8
- 239000011358 absorbing material Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- ADCXHZZSUADYMI-UHFFFAOYSA-N cadmium lithium Chemical compound [Li].[Cd] ADCXHZZSUADYMI-UHFFFAOYSA-N 0.000 description 2
- RIVZIMVWRDTIOQ-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co].[Co] RIVZIMVWRDTIOQ-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
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- 230000001788 irregular Effects 0.000 description 2
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- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a kind of composite radiating to inhale ripple film, ripple film layer is inhaled including the first compound successively suction ripple film layer, radiating film layer and second, wherein, through hole is provided with the radiating film layer, the first suction ripple film layer is linked together with the second suction ripple film layer by the through hole.The present invention can play the effect of the suppression of electromagnetic shielding and electromagnetic noise, solve the problems, such as the heat conduction of electronic equipment and electromagnetic wave shielding.
Description
Technical field
The present invention relates to a kind of composite radiating to inhale ripple film.
Background technology
With the rapid development of electronic technology, possess becoming increasingly popular for the electronic product of various personalized entertainment functions,
Electronic product is set to develop to the direction such as intelligent, integrated, lightening, multifunction rapidly.
But the increase of the speed and frequency and circuit board integrated level due to data transfer, to improving electromagnetic interference
Environment proposes higher and higher requirement to reduce the interference of adjacent component.Other smart machine at work, can constantly outward
Launch electromagnetic wave, peak power can reach 2w, and this influence to surrounding environment is very big.Therefore, to avoid it from working
When each other and the interference to surrounding environment, it is necessary to some unnecessary radiation are limited.Therefore, use can absorb simultaneously
Absorbing material the problem of can avoiding this respect of loss magnetic energy, such as proposed in patent document EP0667643B1 by magnetic
Material is formed with blend rubber inhales ripple film layer.
The principle of absorbing material shielding electromagnetic wave is that the electromagnetic wave of absorption is converted into heat energy, and this can cause electronic device temperature
The rise of degree, the wave-absorbing effect for inhaling ripple film can be not only reduced, can also reduce the power consumption and stability of electronic device.Therefore, develop
Absorbing material with heat sinking function is in intelligent electronic device with urgent demand.
And compound stone ink film（Referring to patent document JP1985181129A）Due to the thermal conductivity of its superelevation（800-2000 W/
m·k）And the characteristics of frivolous（10-50um）, the focus that is increasingly becoming in Heat Conduction Material.In patent document CN202799566U,
Graphite guide hotting mask is directly fit together by adhesive tape with inhaling ripple film.Although by using graphite heat conducting material, overall heat conduction
Performance is improved, but cause due to the thermal resistance of adhesive tape heat that absorbing material changes into electromagnetic wave can not be timely
It is transmitted on graphite film.Further, since the material of graphite film is the single-element of carbon, surface energy is than relatively low, it is not easy to and its
He bonds material.Also, compound stone ink film is made up of thousands of layers of graphitic molecules layer, between layers by Van der Waals force knot
Close, be very easy to be layered in the case where there is external force, it is compound with other materials so as to destroy it.Therefore, it is necessary to which a kind of will close
The method that is combined together stable into graphite film and absorbing material, can effectively solve absorbing material heating problem and increase it
The reliability of processing.
The content of the invention
It is an object of the invention to provide a kind of composite radiating to inhale ripple film, can solve the problem that heat conduction and the electromagnetic wave of electronic equipment
The problem of shielding.
To solve the above problems, the present invention, which provides a kind of composite radiating, inhales ripple film, including the first compound successively suction ripple film
Layer, radiating film layer and second inhale ripple film layer, wherein, it is provided with through hole in the radiating film layer, described first inhales ripple film layer and the
Two suction ripple film layers are linked together by the through hole.
Further, in above-mentioned composite radiating inhales ripple film, the material of the radiating film layer is compound stone ink film, heat dissipation film
The thickness of layer is 10um-50um, thermal conductivity 800-2000W/mk.
Further, in above-mentioned composite radiating inhales ripple film, the aperture of the through hole in the radiating film layer is 0.1-10mm,
Density is 1-10000/cm2。
Further, in above-mentioned composite radiating inhales ripple film, the aperture of the through hole in the radiating film layer is 0.2-5mm,
Density is 10-1000/cm2。
Further, in above-mentioned composite radiating inhales ripple film, the aperture of the through hole in the radiating film layer is 0.5-2mm,
Density is 50-100/cm2。
Further, in above-mentioned composite radiating inhales ripple film, being shaped as the through hole in film layer that radiates is circular, square
Shape, rectangle, ellipse, triangle, polygon or other irregular shapes.
Further, in above-mentioned composite radiating inhales ripple film, the described first and second compositions for inhaling ripple film layer are 60-90%
Wave absorbing agent and 10-40% organic binder bond, first and second inhale ripple film layers thickness be respectively 20um-1mm, 1MHz frequency
The magnetic conductivity of rate is 80-200, and average magnetic conductivity is more than 50 in the range of 1Hz-1GHz.
Further, in above-mentioned composite radiating inhales ripple film, the material of described wave absorbing agent is soft magnetic alloy powder, bag
Nickel zinc ferroalloy, ambrose alloy ferroalloy, zinc chrome ferroalloy, MnZn ferroalloy, niobium zinc-iron alloy, sendust, nickel chromium iron is included to close
Gold, niobium zinc-iron alloy, iron-nickel alloy, ferroaluminium, ferrocobalt, ferrochrome, iron silicon nickel alloy, iron, silicon, aluminum and nickel alloy, magnesium
Any of manganeisen, cobalt-nickel alloy, lithium manganese alloy and lithium cadmium ferroalloy or any combination.
Further, in above-mentioned composite radiating inhales ripple film, the organic binder bond is high polymer material, including phenolic aldehyde tree
Fat, Lauxite, epoxy resin, acrylic resin, polyvinyl butyral resin, vinyl acetate and its copolymer, organosilicon
Any of glue resinoid, polyurethane and rubber resin, or phenolic resin, Lauxite, epoxy resin, acrylic acid tree
In fat, polyvinyl butyral resin, vinyl acetate and its copolymer, organic silica gel resinoid, polyurethane and rubber resin
Appoint several polymer.
Further, in above-mentioned composite radiating inhales ripple film, described second inhales in ripple film layer away from the radiating film layer
Simultaneously with the double faced adhesive tape to be fitted with electronic device.
The present invention also provides a kind of method for manufacturing above-mentioned composite radiating and inhaling ripple film, including：
First suction ripple film layer is coated in mould release membrance surface；
The radiating film layer for being provided with through hole is compounded in the surface of the first suction ripple film layer；
Second suction ripple film layer is coated in the surface for the radiating film layer for being provided with through hole；
First suction ripple film layer, radiating film layer and the second suction ripple film layer are solidified in the presence of high temperature or catalyst.
Compared with prior art, the present invention includes the first compound successively suction ripple film layer, radiating film layer and second inhales ripple film
Layer, wherein, through hole is provided with the radiating film layer, the first suction ripple film layer is connected with the second suction ripple film layer by the through hole
It is connected together, the effect of the suppression of electromagnetic shielding and electromagnetic noise can be played, solve the heat conduction of electronic equipment and electromagnetism wave screen
The problem of covering.
Brief description of the drawings
Fig. 1 is that the composite radiating of the embodiment of the present invention 1 inhales the structure chart of ripple film；
Fig. 2 is that the composite radiating of the embodiment of the present invention 2 inhales the structure chart of ripple film；
Fig. 3 is that the composite radiating of the embodiment of the present invention 3 inhales the structure chart of ripple film；
Fig. 4 is the structure chart of the suction ripple film of the comparative example 1 of the present invention；
Fig. 5 is the schematic diagram of the disbonded test of embodiments of the invention 1；
Fig. 6 is that the composite radiating of embodiments of the invention 4 inhales the manufacturing process flow diagram of ripple film.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, it is below in conjunction with the accompanying drawings and specific real
Applying mode, the present invention is further detailed explanation.
The present invention provides a kind of composite radiating and inhales ripple film, including compound first inhales ripple film layer, radiating film layer and the successively
Two inhale ripple film layer,
Wherein, through hole is provided with the radiating film layer, the first suction ripple film layer passes through described with the second suction ripple film layer
Through hole links together.Specifically, the first suction ripple film layer is connected with the second suction ripple film layer by the through hole in film layer that radiates, can
So that the first suction ripple film layer is combined together with radiating film layer securely with the second suction ripple film layer, also, the film layer and first that radiates
Ripple film layer, the second combination for inhaling ripple film layer are inhaled not by any adhesive tape, inhale ripple so as to effectively reduce radiating film layer and first
Thermal resistance between film layer, the second suction ripple film layer.
Preferably, the material of the radiating film layer is compound stone ink film, and the thickness of the film layer that radiates is 10um-50um, heat conduction
Rate is 800-2000W/mk.Specifically, inhale ripple film layer by first by the through hole on compound stone ink film inhales ripple film layer with second
It is connected, the first suction ripple film layer can be made to inhale ripple film layer securely together with synthetic graphite film combination, also, graphite film with second
And first inhales ripple film layer, second inhales the combination of ripple film layer not by any adhesive tape, so as to effectively reduce compound stone ink film and
First inhales the thermal resistance between ripple film layer, the second suction ripple film layer.
Preferably, the aperture of the through hole in the radiating film layer is 0.1-10mm, and density is 1-10000/cm2.It is more excellent
, the aperture of the through hole in the radiating film layer is 0.2-5mm, and density is 10-1000/cm2.More excellent, the heat dissipation film
The aperture of through hole on layer is 0.5-2mm, and density is 50-100/cm2.Specifically, the through-hole aperture on described heat dissipation film
In 0.1-10mm, preferably 0.2-5mm, preferably 0.5-2mm；Its density is 1-10000/cm2, preferably 10-1000
Individual/cm2, preferably 50-100/cm2.
Preferably, it is described radiating film layer on through hole be shaped as circle, square, rectangle, ellipse, triangle,
Polygon or other irregular shapes.
Preferably, the described first and second compositions for inhaling ripple film layer are 60-90% wave absorbing agent and 10-40% organic adhesive
Agent, the first and second thickness for inhaling ripple film layer are respectively 20um-1mm, are 80-200 in the magnetic conductivity of 1MHz frequencies, in 1Hz-
Average magnetic conductivity is more than 50 in the range of 1GHz.
Preferably, the material of described wave absorbing agent is soft magnetic alloy powder, including nickel zinc ferroalloy, ambrose alloy ferroalloy,
Zinc chrome ferroalloy, MnZn ferroalloy, niobium zinc-iron alloy, sendust, nichrome, niobium zinc-iron alloy, iron-nickel alloy, iron
Aluminium alloy, ferrocobalt, ferrochrome, iron silicon nickel alloy, iron, silicon, aluminum and nickel alloy, magnesium manganeisen, cobalt-nickel alloy, lithium manganese alloy
With any of lithium cadmium ferroalloy or any combination.
Preferably, the organic binder bond is high polymer material, including phenolic resin, Lauxite, epoxy resin, propylene
Acid resin, polyvinyl butyral resin, vinyl acetate and its copolymer, organic silica gel resinoid, polyurethane and rubber-like tree
Any of fat, or phenolic resin, Lauxite, epoxy resin, acrylic resin, polyvinyl butyral resin, acetic acid
Appoint several polymer in ethene and its copolymer, organic silica gel resinoid, polyurethane and rubber resin.
Preferably, the one side away from the radiating film layer in the second suction ripple film layer has what is fitted with electronic device
Double faced adhesive tape.
The present invention also provides a kind of method for manufacturing above-mentioned composite radiating and inhaling ripple film, including：
First suction ripple film layer is coated in mould release membrance surface；Such as the organic binder bond for being mixed with soft magnetic material powder is coated
On mould release membrance surface；
The radiating film layer for being provided with through hole is compounded in the surface of the first suction ripple film layer；
Second suction ripple film layer is coated in the surface for the radiating film layer for being provided with through hole；As soft magnetic material powder will be mixed with
Organic binder bond be coated in be provided with through hole radiating film layer surface；
First suction ripple film layer, radiating film layer and the second suction ripple film layer are solidified in the presence of high temperature or catalyst.
Embodiment 1
As shown in figure 1, the structure that a kind of composite radiating inhales ripple film includes the first compound successively suction ripple film layer 11, heat dissipation film
Layer 12 and second inhales ripple film layer 13, wherein, it is provided with through hole 1 in the radiating film layer 12, described first inhales ripple film layer 11 and the
Two suction ripple film layers 13 are linked together by the through hole 1.The material for the film layer 12 that radiates is compound stone ink film, and its thickness is
0.01mm, thermal conductivity 1900W/mk.First suction ripple film layer 11 and the material of the second suction ripple film layer 13 are to contain 80% weight ratio
The epoxy resin adhesive of Fe-Ni Alloy Powder and 20% weight ratio, thickness 0.05mm, magnetic conductivity 80.On compound stone ink film
It is provided with the manhole 1 of die-cutting machine manufacture, its a diameter of 0.5 mm, 100/m of its density2。
Embodiment 2
As shown in Fig. 2 a kind of composite radiating inhales the structure of ripple film compound first inhales ripple film layer 11, radiating film layer 12 successively
Ripple film layer 13 is inhaled with second, wherein, through hole 1 is provided with the radiating film layer 12, described first, which inhales ripple film layer 11 and second, inhales
Ripple film layer 13 is linked together by the through hole 1.The material for the film layer 12 that radiates is compound stone ink film, and its thickness is 0.01mm,
Thermal conductivity is 1900W/mk.First material for inhaling the suction ripple film layer 13 of ripple film layer 11 and second is the iron nickel containing 80% weight ratio
The epoxy resin adhesive of alloy powder and 20% weight ratio, thickness 0.05mm, magnetic conductivity 80.Set on compound stone ink film
There is the square through-hole 1 manufactured by die-cutting machine, its length of side is 0.5 mm, 100/m of its density2。
Embodiment 3
As shown in figure 3, a kind of composite radiating inhales the structure of ripple film compound first inhales ripple film layer 11, radiating film layer 12 successively
Ripple film layer 13 is inhaled with second, wherein, through hole 1 is provided with the radiating film layer 12, described first, which inhales ripple film layer 11 and second, inhales
Ripple film layer 13 is linked together by the through hole 1, is covered with one-faced tapes 14 in the second suction ripple film layer 13, first inhales ripple film layer
11 are compounded on mould release membrance 16 by layers of two-sided 15.In a particular application, embodiment 3, composite radiating as shown in Figure 3 is inhaled
The mould release membrance of ripple film side is peeled off, and composite radiating suction ripple film is attached to the parts surface for needing to be electromagnetically shielded and radiate, can be with
Electromagnetic wave absorption and the temperature that can effectively reduce electronic unit.
Comparative example 1
As shown in figure 4, a kind of existing its structure of suction ripple film includes first and inhales ripple film layer 11, layers of two-sided 15 from top to bottom
With radiating film layer 12, wherein, the material of layers of two-sided 15 be acrylic acid adhesive, and radiating film layer 12 is compound stone ink film, its thickness
Spend for 0.01mm, thermal conductivity 1900W/mk.First inhale ripple film layer 11 be containing 80% weight than Fe-Ni Alloy Powder and
20% weight than epoxy resin adhesive, thickness 0.025mm.
The suction ripple film of embodiment 1 and comparative example 1 is subjected to disbonded test respectively, disbonded test is surveyed in accordance with ASTM-D3330
Test-object is accurate to be tested using 180 degree peel test force method.As shown in figure 5, in test, it will first implement the side of suction ripple membrane sample
The smooth surface of copper coin 17, opposite side and the list that peeling force is 10N/25mm are bonded in by peeling force 10N/25mm double faced adhesive tape 15
Face glue 14 is bonded together, and the length of one side glue 14 is more than sample.In test, one side glue 14 is held with 30mm/min speed
180OAngle carry out peel test.Test sample is the suction ripple membrane sample of embodiment 1 and comparative example 1, and test result is：Compare
The sample of example 1 because graphite film interior laminate layer causes compound stone ink film and inhales ripple UF membrane, this prove graphite film and inhale ripple film it
Between peeling force<10N/25mm；And the suction ripple membrane sample of embodiment 1 then together with the double faced adhesive tape 15 contacted with copper coin 17 from
The surface of copper coin 17 is stripped, it was demonstrated that the peeling force between compound stone ink film and suction ripple film in embodiment 1>10N/25mm.
Above-mentioned result of the test explanation, composite radiating can effectively be increased using the scheme that through hole is provided with radiating film layer 12 and inhale ripple film
Combined strength bination, reduce the proportion of goods damageds in use, improve its processing characteristics.
Embodiment 4
As shown in fig. 6, the manufacture method that the composite radiating of one embodiment of the invention inhales ripple film includes：
Step 1, by be mixed with 80% weight than Anhyster powder and 20% weight than epoxy resin adhesive
First, which inhales ripple film layer 11, mixes in agitator tank and using coater on mould release membrance 16；
Step 2, the radiating film layer 12 of the compound stone ink film of the 0.01mm with through hole attached in using compounding machine
One inhales in ripple film layer 11；
Step 3, it is the second suction ripple film layer 13 of the organic binder bond for being mixed with soft magnetic material powder is logical coated in being provided with
Behind the surface of the radiating film layer 12 in hole
Step 4,90oThe first suction ripple film layer 11, radiating film layer 12 and second are inhaled into ripple film layer 13 in the presence of C high temperature to enter
Row solidification.
In summary, the present invention includes the first compound successively suction ripple film layer, radiating film layer and second inhales ripple film layer, its
In, through hole is provided with the radiating film layer, the first suction ripple film layer is connected to the second suction ripple film layer by the through hole
Together, the effect of the suppression of electromagnetic shielding and electromagnetic noise can be played, solves the heat conduction of electronic equipment and electromagnetic wave shielding
Problem.
Obviously, those skilled in the art can carry out the spirit of various changes and modification without departing from the present invention to invention
And scope.So, if these modifications and variations of the present invention belong to the claims in the present invention and its equivalent technologies scope it
Interior, then the present invention is also intended to including these changes and modification.
Claims (1)
1. manufacture the method that composite radiating inhales ripple film, it is characterised in that：
The composite radiating inhales ripple film, including the first compound successively suction ripple film layer, radiating film layer and second inhale ripple film layer, its
In, through hole is provided with the radiating film layer, the first suction ripple film layer is connected to the second suction ripple film layer by the through hole
Together；
The material of the radiating film layer is compound stone ink film, and the thickness for the film layer that radiates is 10um-50um, thermal conductivity 800-
2000W/m·k；
The aperture of through hole in the radiating film layer is 0.5-2mm, and density is 50-100/cm2；
Through hole in the radiating film layer is shaped as circle, square, rectangle, ellipse or triangle；
Described first and second compositions for inhaling ripple film layer are 60-90% wave absorbing agent and 10-40% organic binder bond, first and the
Two thickness for inhaling ripple film layer are respectively 20um-1mm, are 80-200 in the magnetic conductivity of 1MHz frequencies, in the range of 1Hz-1GHz
Average magnetic conductivity is more than 50；
The material of described wave absorbing agent is soft magnetic alloy powder, including nickel zinc ferroalloy, ambrose alloy ferroalloy, zinc chrome ferroalloy,
MnZn ferroalloy, niobium zinc-iron alloy, sendust, nichrome, niobium zinc-iron alloy, iron-nickel alloy, ferroaluminium, iron cobalt
Alloy, ferrochrome, iron silicon nickel alloy, iron, silicon, aluminum and nickel alloy, magnesium manganeisen, cobalt-nickel alloy, lithium manganese alloy and lithium cadmium iron close
Any of gold or any combination；
The organic binder bond is high polymer material, including phenolic resin, Lauxite, epoxy resin, acrylic resin, poly- second
Any in enol butyral resin, vinyl acetate and its copolymer, organic silica gel resinoid, polyurethane and rubber resin
Kind, or phenolic resin, Lauxite, epoxy resin, acrylic resin, polyvinyl butyral resin, vinyl acetate and its altogether
Appoint several polymer in polymers, organic silica gel resinoid, polyurethane and rubber resin；
One side away from the radiating film layer in the second suction ripple film layer has the double faced adhesive tape to be fitted with electronic device；
The manufacture method comprises the following steps：
First suction ripple film layer is coated in mould release membrance surface；
The radiating film layer for being provided with through hole is compounded in the surface of the first suction ripple film layer；
Second suction ripple film layer is coated in the surface for the radiating film layer for being provided with through hole；
First suction ripple film layer, radiating film layer and the second suction ripple film layer are solidified in the presence of high temperature or catalyst.
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| CN201410167526.9A CN105007704B (en) | 2014-04-24 | 2014-04-24 | Composite radiating inhales ripple film |
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|---|---|---|---|
| CN201410167526.9A CN105007704B (en) | 2014-04-24 | 2014-04-24 | Composite radiating inhales ripple film |
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| CN105007704B true CN105007704B (en) | 2018-02-09 |
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| CN108074821B (en) * | 2016-11-16 | 2022-02-01 | 利诺士尖端材料有限公司 | Graphite sheet for electromagnetic wave shielding and heat dissipation composite sheet, electromagnetic wave shielding and heat dissipation composite sheet comprising same and preparation method thereof |
| CN106659104A (en) * | 2016-12-28 | 2017-05-10 | 南京南大波平电子信息有限公司 | Moisture-proof and antioxidant low-frequency electromagnetic wave absorbing materials |
| CN109207084B (en) * | 2017-06-30 | 2021-10-26 | 利诺士尖端材料有限公司 | Electromagnetic wave shielding and heat dissipation composite sheet and preparation method thereof |
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| CN110861359A (en) * | 2019-11-25 | 2020-03-06 | 苏州驭奇材料科技有限公司 | Composite heat dissipation wave absorption film |
| CN111554466B (en) * | 2020-05-18 | 2021-07-23 | 横店集团东磁股份有限公司 | Heat-conducting wave-absorbing composite magnetic sheet with periodic structure and preparation method thereof |
| CN111587061B (en) * | 2020-06-22 | 2022-04-19 | 深圳市鸿富诚新材料股份有限公司 | Preparation process and finished product of heat-conducting wave-absorbing tape |
| CN112829398A (en) * | 2021-01-18 | 2021-05-25 | 中铝材料应用研究院有限公司 | Aluminum alloy composite board with low electromagnetic shielding effectiveness |
| CN114050420A (en) * | 2021-11-29 | 2022-02-15 | 南京航空航天大学 | Heat dissipation-wave absorption integrated passive frequency selective surface wave absorber |
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